CN110306155A - The manufacturing method of deposition mask - Google Patents
The manufacturing method of deposition mask Download PDFInfo
- Publication number
- CN110306155A CN110306155A CN201910715831.XA CN201910715831A CN110306155A CN 110306155 A CN110306155 A CN 110306155A CN 201910715831 A CN201910715831 A CN 201910715831A CN 110306155 A CN110306155 A CN 110306155A
- Authority
- CN
- China
- Prior art keywords
- deposition mask
- metal plate
- metal sheet
- mentioned
- long metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000008021 deposition Effects 0.000 title claims abstract description 200
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 80
- 239000002184 metal Substances 0.000 claims abstract description 317
- 229910052751 metal Inorganic materials 0.000 claims abstract description 317
- 238000000034 method Methods 0.000 claims description 64
- 238000005530 etching Methods 0.000 claims description 30
- 230000015572 biosynthetic process Effects 0.000 claims description 12
- 238000000151 deposition Methods 0.000 description 196
- 239000000463 material Substances 0.000 description 74
- 239000000758 substrate Substances 0.000 description 49
- 230000008020 evaporation Effects 0.000 description 41
- 238000001704 evaporation Methods 0.000 description 41
- 238000005096 rolling process Methods 0.000 description 32
- 238000007740 vapor deposition Methods 0.000 description 25
- 239000002585 base Substances 0.000 description 22
- 239000011521 glass Substances 0.000 description 18
- 238000000137 annealing Methods 0.000 description 16
- 238000005520 cutting process Methods 0.000 description 14
- 238000005259 measurement Methods 0.000 description 13
- 230000002093 peripheral effect Effects 0.000 description 10
- 239000011162 core material Substances 0.000 description 8
- 239000011368 organic material Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 229910001374 Invar Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 238000012216 screening Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 230000003628 erosive effect Effects 0.000 description 4
- 238000010025 steaming Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 235000013399 edible fruits Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007261 regionalization Effects 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 210000002027 skeletal muscle Anatomy 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B1/00—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
- B21B1/22—Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling plates, strips, bands or sheets of indefinite length
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/26—Methods of annealing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5806—Thermal treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
- C23F1/04—Chemical milling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
- H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention relates to the manufacturing methods of deposition mask.The object of the present invention is to provide a kind of metal plates that extension rate is small.The extension rate of the center portion of the width direction of metal plate is 10 × 10‑5Below.In addition, the extension rate of the end of the width direction of metal plate is 20 × 10‑5Below.In addition, the end of the width direction of metal plate extends maximum value of the rate greater than the extension rate of the center portion of the width direction of metal plate.
Description
It is December 05, entitled " metal in 2017 that the application, which is application No. is 201711266191.6, date of filing,
The divisional application of the application for a patent for invention of plate, the manufacturing method of metal plate and the method using metal plate manufacture deposition mask ".
It and is (international application No. is 201480003445.3 application No. is 201711266191.6 application for a patent for invention
Application No. is PCT/JP2014/050345), international filing date be on 01 10th, 2014, entitled " metal plate, metal
The divisional application of the application for a patent for invention of the manufacturing method of plate and the method for manufacturing deposition mask using metal plate ".
Technical field
The present invention relates to the metal plates for being used to manufacture deposition mask by forming 2 or more through holes.The present invention also relates to
And the manufacturing method of metal plate.Moreover, it relates to be manufactured using metal plate for being deposited with desired pattern
Deposition mask method.
Background technique
In recent years, for display device used in the portable devices such as smart phone and tablet computer, it is desirable that fine,
Such as pixel density is 300ppi or more.In addition, need improving on correspondence is full HD in portable device, it is this
In the case of, the pixel density of display device requires to be such as 450ppi or more.
Since responsiveness is good, power consumption is low, organic EL display device is attracted attention.Pixel shape as organic EL display device
At method, it is known that method be, using the deposition mask of the through hole comprising being arranged with desired pattern, with desired figure
Case forms pixel.Specifically, firstly, so that deposition mask is sealed at the substrate of organic EL display device then will be closely sealed
Deposition mask and substrate put into evaporation coating device together, carry out the vapor deposition of organic material etc..Generally manufacture obtains deposition mask as follows:
Through hole is formed in metal plate and being utilized the etching of photolithographic techniques, to manufacture above-mentioned vapor deposition exposure mask (example
Such as patent document 1).For example, then exposed mask is made to be sealed at resist film firstly, form resist film on a metal plate
In the state of by resist film expose to form resist pattern, thereafter, using resist pattern as mask to metal plate progress
Etching, to form through hole.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2004-39319 bulletin
Summary of the invention
Using deposition mask in the case where carrying out the film forming of evaporation material on substrate, not only substrate, deposition mask are also attached
Have evaporation material.For example, there is also along the substantially inclined direction of the normal direction relative to deposition mask in evaporation material
And fly to the evaporation material of substrate, such evaporation material can be reached before reaching substrate the wall surface of the through hole of deposition mask from
And adhere to.In this case, it is believed that evaporation material is difficult to adhere to the wall of the through hole positioned at deposition mask in a substrate
Region near face, as a result, the thickness of the evaporation material of attachment is smaller than other parts or generates unattached evaporation material
Part.That is, it is considered that the vapor deposition of the near wall of the through hole of deposition mask is unstable.Therefore, in order to form organic EL
The pixel of display device and in the case where using deposition mask, the dimensional accuracy and position precision of pixel reduce, as a result, causing
The luminous efficiency of organic EL display device reduces.
In order to solve the problems, consider for the thickness for the metal plate for being used to manufacture deposition mask to be thinned.This is because
By reducing the thickness of metal plate, the height of the wall surface of the through hole of deposition mask can be made to become smaller, evaporation material can be reduced as a result,
In be attached to perforation wall surface of the hole on evaporation material ratio.But the small metal plate of thickness in order to obtain, in rolling base material
To need to increase rolling rate when manufacturing metal plate.Here, rolling rate refers to utilization (thickness-metal plate of base material)/(thickness of base material
Degree) calculate value.In the case where implementing the heat treatment such as annealing after rolling, usual rolling rate is bigger, the deformation based on rolling
Degree of irregularity is also bigger.For example, according to the position in width direction (direction orthogonal with the direction of transfer of base material), metal plate
Elongation percentage is different, as a result, undulations occurs in metal plate, this is well-known.Specifically, can enumerate: in width
The shape of the fluctuating of the end in direction, is referred to as rippled edge；In the undulations of the central portion of width direction, it is referred to as
Between ripple.If there are such undulations, exposed mask cannot be made sufficiently to be sealed at the resist film on metal plate, tied
Fruit, it is believed that the position precision and dimensional accuracy of the through hole formed on a metal plate can reduce.If the position essence of through hole
Degree and dimensional accuracy reduce, then the dimensional accuracy by using the pixel of organic EL display device obtained from deposition mask and position
Setting precision can reduce.
In addition, in order to cut down the manufacturing cost of deposition mask, first, it is also well known that in the whole region of metal plate
The effective coverage that 2 or more corresponding with an organic EL display device includes 2 or more through holes is formed, thereafter, along
Metal plate is cut to 2 or more by the length direction of metal plate, 2 or more the elongate deposition masks of producing once out as a result,.
But the elongation percentage of metal plate is according to the position of width direction and in the case where difference, 2 or more the elongates obtained after cutting
The length of deposition mask is different.In this case, the spacing of each through hole of the effective coverage of deposition mask is in each deposition mask
In it is also different, as a result, it can also be expected that the size of the pixel by using organic EL display device obtained from deposition mask
There is deviation because of the difference of individual with position.
The object of the present invention is to provide can effectively solve the metal plate of such problems, the manufacturing method and vapor deposition of metal plate
The manufacturing method of mask.
1st present invention is related to a kind of manufacturing method of metal plate, which is used and forming 2 or more through holes
In manufacture deposition mask, wherein the above-mentioned through hole of above-mentioned deposition mask is formed and being etched to above-mentioned metal plate,
The manufacturing method of above-mentioned metal plate has following processes: rolling process, in this process, base material is rolled and
Obtain above-mentioned metal plate；And cut off operation cuts away the two of the width direction of above-mentioned metal plate with preset range in this process
It holds, the above-mentioned metal plate after above-mentioned cut off operation at least locally has undulations, length of the undulations due to the metal plate
The length in degree direction corresponds to the position of its width direction and different；By the above-mentioned of the above-mentioned metal plate after above-mentioned cut off operation
The minimum value of length is known as datum length, by the upper of the position of the width direction of the above-mentioned metal plate after above-mentioned cut off operation
It is full when the difference of the above-mentioned length and said reference length of stating metal plate is known as extending rate relative to the ratio of said reference length
Sufficient the following conditions (1)~(3),
(1) the above-mentioned extension rate of the center portion of the width direction of the above-mentioned metal plate after above-mentioned cut off operation be 10 ×
10-5Below；
(2) the above-mentioned extension rate of the end of the width direction of the above-mentioned metal plate after above-mentioned cut off operation is 20 × 10-5
Below；With
(3) the above-mentioned extension rate of above-mentioned end is greater than the maximum value of the above-mentioned extension rate of above-mentioned center portion；
Above-mentioned center portion includes the central portion of the width direction of the above-mentioned metal plate after above-mentioned cut off operation, is to account for
State 40% part of the width of metal plate.
Manufacturing method based on metal plate of the invention can be further equipped with annealing operation, in this process, will pass through
The obtained above-mentioned metal plate annealing of the rolling process, to remove the internal stress of above-mentioned metal plate.
In the manufacturing method based on metal plate of the invention, above-mentioned annealing operation can be on one side in length direction stretching
Metal plate is stated to implement on one side.
In the manufacturing method based on metal plate of the invention, above-mentioned annealing operation can be taken at core in above-mentioned metal plate coils
Implement in the state of on material.
In the manufacturing method based on metal plate of the invention, the thermal expansion coefficient of preferably above-mentioned base material and the heat of substrate are swollen
Swollen coefficient is same, on the substrate across the deposition mask manufactured by above-mentioned metal plate and forming a film has evaporation material.
In the manufacturing method based on metal plate of the invention, above-mentioned base material can contain invar alloy material.
2nd present invention is related to a kind of metal plate, which is to be used to manufacture steaming by forming 2 or more through holes
Plate the metal plate of mask, wherein above-mentioned metal plate at least locally has undulations, length of the undulations due to the metal plate
The length in degree direction corresponds to the position of its width direction and different, and the minimum value of the above-mentioned length of above-mentioned metal plate is known as
Datum length, by the above-mentioned length of the above-mentioned metal plate of the position of the width direction of above-mentioned metal plate and said reference length
Difference relative to said reference length ratio be known as extend rate when, meet the following conditions (1)~(3),
(1) the above-mentioned extension rate of the center portion of the width direction of above-mentioned metal plate is 10 × 10-5Below；
(2) the above-mentioned extension rate of the end of the width direction of above-mentioned metal plate is 20 × 10-5Below；With
(3) the above-mentioned extension rate of above-mentioned end is greater than the maximum value of the above-mentioned extension rate of above-mentioned center portion；
Above-mentioned center portion includes the central portion of the width direction of above-mentioned metal plate, is the width for accounting for above-mentioned metal plate
40% part.
Thermal expansion coefficient based on metal plate of the invention is preferably same value, the substrate with the thermal expansion coefficient of substrate
On across the deposition mask manufactured by above-mentioned metal plate and forming a film has evaporation material.
Invar alloy material can be contained based on metal plate of the invention.
3rd present invention is related to a kind of manufacturing method of deposition mask, which, which has, is formed with 2 or more and penetrates through
The effective coverage in hole and the peripheral region around above-mentioned effective coverage, wherein the manufacturing method includes following processes:
Prepare the process of metal plate, which at least locally has undulations, and the undulations are due to the metal plate
The length of length direction correspond to the position of its width direction and different；
Resist pattern formation process in the process, forms resist pattern on above-mentioned metal plate；With
Etching work procedure in the process, is etched above-mentioned metal plate using above-mentioned resist pattern as mask, is being used for
The recess portion formed for marking above-mentioned through hole is formed in the region of the above-mentioned metal plate of above-mentioned effective coverage；
The minimum value of the above-mentioned length of above-mentioned metal plate is known as datum length, by each of the width direction of above-mentioned metal plate
The above-mentioned length of above-mentioned metal plate at position and the difference of said reference length are known as prolonging relative to the ratio of said reference length
When stretching rate, meet the following conditions (1)~(3),
(1) the above-mentioned extension rate of the center portion of the width direction of above-mentioned metal plate is 10 × 10-5Below；
(2) the above-mentioned extension rate of the end of the width direction of above-mentioned metal plate is 20 × 10-5Below；With
(3) the above-mentioned extension rate of above-mentioned end is greater than the maximum value of the above-mentioned extension rate of above-mentioned center portion；
Above-mentioned center portion includes the central portion of the width direction of above-mentioned metal plate, is the width for accounting for above-mentioned metal plate
40% part.
In the manufacturing method based on deposition mask of the invention, wherein above-mentioned resist pattern formation process can have
Have: the process of resist film is formed on above-mentioned metal plate, make exposed mask and the closely sealed process of above-mentioned resist film vacuum and
The process for exposing above-mentioned resist film in a predetermined pattern across above-mentioned exposed mask.
In the manufacturing method based on deposition mask of the invention, the thermal expansion coefficient of preferably above-mentioned metal plate and substrate
Thermal expansion coefficient is same value, on the substrate across the deposition mask manufactured by above-mentioned metal plate and forming a film has evaporation material.
In the manufacturing method based on deposition mask of the invention, above-mentioned metal plate can contain invar alloy material.
According to the present invention, can be obtained undulations degree is small and the deviation of each perforation pitch of holes of effective coverage is also small
Deposition mask.Therefore, the dimensional accuracy and position precision of the evaporation material being attached on substrate can be improved.
Detailed description of the invention
Fig. 1 is the figure for illustrating one embodiment of the present invention, to show the deposition mask device comprising deposition mask
An example schematic plan.
Fig. 2 is the figure of the method for illustrating to be deposited using deposition mask device shown in FIG. 1.
Fig. 3 is the top partial view diagram for showing deposition mask shown in FIG. 1.
Fig. 4 is the sectional view along the IV-IV line of Fig. 3.
Fig. 5 is the sectional view along the V-V line of Fig. 3.
Fig. 6 is the sectional view along the line VI -- VI of Fig. 3.
Fig. 7 (a) is to show to obtain the figure with the process of the metal plate of desired thickness, Fig. 7 by rolling base material
(b) figure to show the process annealed to the metal plate as obtained from rolling.
Fig. 8 is the perspective view for showing the metal plate obtained by process shown in Fig. 7 (a), (b).
Fig. 9 (a), (b), (c), (d) be respectively along the a-a line of Fig. 8, b-b line, c-c line and d-d line sectional view.
Figure 10 is the figure of the extension rate of the position for the width direction for showing metal plate.
Figure 11 is the schematic diagram that overall description is carried out for an example of the manufacturing method to deposition mask shown in FIG. 1.
Figure 12 is the figure for illustrating an example of the manufacturing method of deposition mask, forms resist on a metal plate to show
The sectional view of the process of film.
Figure 13 is the figure for illustrating an example of the manufacturing method of deposition mask, to show the closely sealed exposure on resist film
The sectional view of the process of mask.
Figure 14 is the figure for illustrating an example of the manufacturing method of deposition mask, to show in the section along normal direction
The figure of long metal sheet out.
Figure 15 is the figure for illustrating an example of the manufacturing method of deposition mask, to show in the section along normal direction
The figure of long metal sheet out.
Figure 16 is the figure for illustrating an example of the manufacturing method of deposition mask, to show in the section along normal direction
The figure of long metal sheet out.
Figure 17 is the figure for illustrating an example of the manufacturing method of deposition mask, to show in the section along normal direction
The figure of long metal sheet out.
Figure 18 is the figure for illustrating an example of the manufacturing method of deposition mask, to show in the section along normal direction
The figure of long metal sheet out.
Figure 19 is the figure for illustrating an example of the manufacturing method of deposition mask, to show in the section along normal direction
The figure of long metal sheet out.
Figure 20 is the figure for illustrating an example of the manufacturing method of deposition mask, to show in the section along normal direction
The figure of long metal sheet out.
Figure 21 is the top view for showing the 1st sample being placed on platform.
Specific embodiment
One embodiment of the present invention is illustrated referring to the drawings.It should be noted that appended in this specification
Attached drawing in, for the ease of illustration and it can be readily appreciated that in kind scale bar and size ratio of length and width etc., suitably comparative example
The size of ruler and length and width ratio etc. is changed and has been exaggerated.
FIG. 1 to FIG. 20 is for illustrating the figure based on one embodiment of the present invention.In the following embodiments and the accompanying drawings and its change
It in shape example, is illustrated by taking the manufacturing method of deposition mask as an example, which is used for when manufacturing organic EL display device
Organic material is patterned on substrate with desired pattern.But, however it is not limited to such application, for being used for various use
The manufacturing method of the deposition mask on way, the applicable present invention.
It should be noted that in this specification, " plate ", " piece ", " film " term be not only based on the difference in address
It can mutually distinguish.For example, " plate " is also comprising the concept that can be described as component as piece or film, thus, for example " metal
Plate " only cannot distinguish between out in not being same as above for address with the component for being known as " sheet metal " or " metal film ".
In addition, " plate face (unilateral, film surface) " refers to the plate (sheet, membranaceous) in entirety or gross examination of skeletal muscle as object
In the case where component, the face consistent with in-plane of the plate-shaped member (sheet component, film member) as object.Separately
Outside, the normal direction used for the component of plate (sheet, membranaceous) refers to the plate face (unilateral, film surface) relative to the component
Normal direction.
In addition, to shape or geometric condition and physical characteristic and their degree used in this specification
Carry out the specific such as value of the terms such as " parallel ", " orthogonal ", " identical ", " same " and length, angle and physical characteristic
Deng being not limited to stringent meaning, but include it can be expected that the range of the degree of said function explains.
(deposition mask device)
Firstly, an example about the deposition mask device comprising the deposition mask as manufacturing method object, referring especially to
FIG. 1 to FIG. 6 is illustrated.Herein, Fig. 1 is the top view for showing an example of the deposition mask device comprising deposition mask, and Fig. 2 is
For illustrating the figure of the application method of deposition mask device shown in FIG. 1.Fig. 3 is the vertical view that deposition mask is shown from the 1st surface side
Figure, Fig. 4~Fig. 6 are the sectional view of each position of Fig. 3.
Fig. 1 and deposition mask device 10 shown in Fig. 2 have 2 s' or more be made of substantially rectangular metal plate 21
Deposition mask 20 and be installed on 2 or more deposition mask 20 peripheral portion frame 15.Each deposition mask 20 is equipped with a large amount of
Through hole 25, a large amount of through hole 25 be to opposite each other the 1st face 21a and the 2nd face 21b metal plate 21 at least from
1st face 21a is etched and is formed.As shown in Fig. 2, the deposition mask device 10 is faced according to deposition mask 20 as vapor deposition
Mode below the substrate of object such as glass substrate 92 is supported in evaporation coating device 90, for substrate to be deposited
The vapor deposition of material.
In evaporation coating device 90, using the magnetic force from magnetite (not shown), deposition mask 20 and glass substrate 92 are closely sealed.It steams
In plating appts 90, in the lower section of deposition mask device 10, configured with receiving evaporation material (being as an example luminous organic material)
98 crucible 94 and the heater 96 of heating crucible 94.Evaporation material 98 in crucible 94 is issued in the heating from heater 96
Angerization or the surface for distilling and being attached to glass substrate 92.As described above, being formed with a large amount of through hole in deposition mask 20
25, evaporation material 98 is attached to glass substrate 92 by the through hole 25.As a result, according to the through hole with deposition mask 20
The corresponding desired pattern in 25 position, evaporation material 98 form a film in the surface of glass substrate 92.
As described above, through hole 25 configures in a predetermined pattern in each effective coverage 22 in present embodiment.It needs
It is bright, it is intended in the case where carrying out colored display, can make to steam along the orientation (an above-mentioned direction) of through hole 25
Plating mask 20 (deposition mask device 10) and glass substrate 92 relatively move bit by bit, successively the red organic hair of vapor deposition
The luminous organic material of luminescent material, the luminous organic material of green and blue.
It should be noted that the frame 15 of deposition mask device 10 is installed on the peripheral portion of the deposition mask 20 of rectangle.Frame
Deposition mask is maintained at the state of tensioning by frame 15 in the way of bending deposition mask 20.Deposition mask 20 and frame 15
It is fixed each other by such as spot welding.
Implement the inside of evaporation coating device 90 of the vapor deposition treatment under high-temperature atmosphere.Therefore, during vapor deposition treatment, it is maintained at steaming
Deposition mask 20, frame 15 and substrate 92 inside plating appts 90 are also heated.At this point, deposition mask, frame 15 and substrate 92
Show the behavior of the change in size based on each thermal expansion.In this case, if deposition mask 20, frame 15 and substrate
92 thermal expansion coefficient difference is larger, then misplaces because of the difference of their change in size, as a result, being attached to substrate 92
On evaporation material dimensional accuracy and position precision can reduce.In order to solve the problems, preferably deposition mask 20 and frame
The thermal expansion coefficient of frame 15 and the thermal expansion coefficient of substrate 92 are same value.For example, using glass substrate 92 as substrate 92
When, as the material of deposition mask 20 and frame 15, can be used in iron added with 36% nickel alloy i.e. invar alloy
Material.
(deposition mask)
The following detailed description of deposition mask 20.As shown in Figure 1, deposition mask 20 is by 21 structure of metal plate in present embodiment
At with substantially quadrangle form in top view, further accurately having substantially rectangular profile in a top view.Vapor deposition
The metal plate 21 of mask 20 includes that regularly arranged formation has the effective coverage 22 of through hole 25 and surrounds the week of effective coverage 22
Enclose region 23.Peripheral region 23 is the region for being used to support effective coverage 22, is not intended to vapor deposition to the vapor deposition on substrate
The region that material passes through.For example, the deposition mask 20 used in the vapor deposition of the luminous organic material of organic EL display device
In, effective coverage 22 is and the area for being used to be formed pixel by the vapor deposition of luminous organic material on substrate (glass substrate 92)
The region in deposition mask 20 that domain faces is to be used to form made organic EL display device substrate on substrate
Display surface area surface pair deposition mask 20 in region.But various purposes are based on, it can also be in 23 shape of peripheral region
At through hole or recess portion.In example shown in FIG. 1, each effective coverage 22 has substantially quadrangle form in a top view, into one
Step precisely has substantially rectangular profile in a top view.
In the example in the figures, 2 or more effective coverages 22 of deposition mask 20 are along the length with deposition mask 20
A parallel direction of direction forms a line across scheduled interval.In example illustrated, an effective coverage 22 corresponds to
One organic EL display device.That is, deposition mask device 10 (deposition mask 20) according to figure 1, is able to carry out piecewise weight
Multiple vapor deposition (multi-panel, which is paid, steams).
As shown in figure 3, in the example in the figures, it is effective at this in 2 or more the through holes 25 that each effective coverage 22 is formed
It is arranged at predetermined intervals respectively in region 22 along two mutually orthogonal directions.About the perforation formed on the metal plate 21
An example in hole 25, is further described in detail referring especially to Fig. 3~Fig. 6.
As shown in Fig. 4~Fig. 6,2 or more through holes 25 extend between the 1st face 20a and the 2nd face 20b and penetrate through vapor deposition
Mask 20, the 1st face 20a are the side along normal direction of deposition mask 20, and the 2nd face 20b is deposition mask 20
The other side along normal direction.In example illustrated, as being explained in detail below, from the method as deposition mask
The 1st face side 21a of the metal plate 21 of the side in line direction forms the 1st recess portion 30 by being etched on metal plate 21, from as gold
The 2nd face side 21b for belonging to the other side of the normal direction of plate 21 forms second recesses 35 on metal plate 21, utilizes the 1st recess portion 30
Through hole 25 is formed with second recesses 35.
As shown in Fig. 3~Fig. 6, from the 1st face side 20a of deposition mask 20 to the 2nd face side 20b, on the edge of deposition mask 20
The position of normal direction, sectional area of each 1st recess portion 30 in the section of the plate face along deposition mask 20 gradually become
It is small.As shown in Figure 3, the wall surface 31 of the 1st recess portion 30 is in its whole region in the direction that the normal direction with deposition mask 20 is intersected
Extend, exposes towards the side of the normal direction along deposition mask 20.Similarly, in deposition mask 20 along normal direction
Position, sectional area of each second recesses 35 in the section of the plate face along deposition mask 20 can be from deposition mask 20
The 2nd face side 20b gradually become smaller to the 1st face side 20a.The wall surface 36 of second recesses 35 its whole region with deposition mask 20
Normal direction intersect direction extend, towards along deposition mask 20 normal direction the other side expose sectional area section
Product.
It should be noted that the wall surface 31 of the 1st recess portion 30 passes through with the wall surface 36 of second recesses 35 as shown in Fig. 4~Fig. 6
The interconnecting piece 41 of all shapes and connect.Interconnecting piece 41 is by inclined 1st recess portion 30 of normal direction relative to deposition mask
The crest line of protruding portion that wall surface 31 and the wall surface 36 of the inclined second recesses 35 of normal direction relative to deposition mask merge into and
It marks.Also, interconnecting piece 41 marks the smallest through portion 42 of area of through hole 25 in the top view of deposition mask 20.
As shown in Fig. 4~Fig. 6, the 2nd face of the face of the other side along normal direction of deposition mask, i.e. deposition mask 20
On 20b, two adjacent through holes 25 are spaced from each other along the plate face of deposition mask.That is, manufacturing method as be described hereinafter, from steaming
The 2nd face side 21b for plating the corresponding metal plate 21 of the 2nd face 20b of mask 20 is etched the metal plate 21 and makes second recesses
When 35, remaining has the 2nd face 21b of metal plate 21 between two adjacent second recesses 35.
On the other hand, as shown in Fig. 4~Fig. 6, in deposition mask along the side of normal direction, i.e. deposition mask 20
The 1st face side 20a, adjacent two the 1st recess portions 30 connection.That is, manufacturing method as be described hereinafter, from the 1st face with deposition mask 20
When the 1st face side 21a of the corresponding metal plate 21 of 20a is etched to the metal plate 21 and forms 1 recess portion 30, adjacent two
Remaining there will not be the 1st face 21a of metal plate 21 between a 1st recess portion 30.That is, the 1st face 21a of metal plate 21 is in effective coverage 22
Whole region be etched.Using the 1st face 20a for being formed by deposition mask 20 by such 1st recess portion 30, according to such as figure
It, can be effective in the case that the mode that 1st face 20a of deposition mask 20 shown in 2 faces evaporation material 98 uses the deposition mask 20
Improve the utilization efficiency of evaporation material 98.
As shown in Fig. 2, in the case where deposition mask device 10 is contained in evaporation coating device 90, such as double dot dash line in Fig. 4
Shown, the 1st face 20a of deposition mask 20 is located at 94 side of crucible for maintaining evaporation material 98, the 2nd face 20b of deposition mask 20
In face of glass substrate 92.Therefore, evaporation material 98 is attached to glass substrate 92 by gradually smaller 1st recess portion 30 of sectional area
On.As shown by the arrows in Figure 4, evaporation material 98 is from crucible 94 to glass substrate 92 not only along the normal direction of glass substrate 92
It is mobile and sometimes mobile in the larger inclined direction of the normal direction relative to glass substrate 92.At this point, deposition mask 20
Thickness it is big when, the evaporation material 98 of inclination movement much by through hole 25 reach glass substrate 92 before can reach the 1st
The wall surface 31 of recess portion 30 and adhere to.In addition, vapor deposition material can be generated in the region faced with through hole 25 on glass substrate 92
Expect 98 regions easy to reach and is difficult to the part reached.Therefore, in order to improve evaporation material utilization efficiency (film forming efficiency:
The ratio being attached on glass substrate 92) and save expensive evaporation material and make the film forming that expensive evaporation material is utilized
Stablize in desired region and equably implemented, it is important that according to the evaporation material 98 for making inclination movement as far as possible
The mode of glass substrate 92 is reached to constitute deposition mask 20.That is, in Fig. 4~Fig. 6 orthogonal with piece face of deposition mask 20
Section in, so that straight line L1 is formed by minimum angles θ 1 (referring to Fig. 4) relative to the normal direction of deposition mask 20 and sufficiently become
It is advantageous greatly, the straight line L1 is recessed by the interconnecting piece 41 and the 1st as the part with minimum sectional area of through hole 25
Any other position of the wall surface 31 in portion 30.
As one of the method for increasing angle, θ 1, it is contemplated that reduce the thickness of deposition mask 20, make as a result,
The wall surface 31 of 1st recess portion 30, the height of the wall surface 36 of second recesses 35 become smaller.That is, it can be said that as constituting deposition mask
20 metal plate 21, it is preferable to use the metal plates 21 that thickness is as thin as possible in the range of can ensure that the intensity of deposition mask 20.
As the other methods for increasing angle, θ 1, it is also contemplated that optimize the profile of the 1st recess portion 30.Such as root
According to present embodiment, converged by the wall surface 31 of two adjacent the 1st recess portions 30, compared to do not converge with other recess portions have with
The recess portion of wall surface shown in dotted line (profile) can substantially increase the angle, θ 1.Illustrate its reason below.
As being explained in detail below, the 1st recess portion 30 is and the 1st face 21a to metal plate 21 is etched
It is formed.By the wall surface shape generally in curved surface for the recess portion that etching is formed, which corrodes direction.Therefore,
Wall surface 31 by the recess portion of etching formation is precipitous in the region of etching starting side, in the side opposite with etching starting side
The most deep side of region, i.e. recess portion, the normal direction relative to metal plate 21 significantly tilt.On the other hand, the steaming of diagram
It plating in mask 20, the wall surface 31 of two adjacent the 1st recess portions 30 converges in etching starting side, therefore, two the 1st recess portions 30
The outer profile of part 43 that converges of front edge 32 of wall surface 31 be not precipitous shape, but the shape of chamfering.Therefore, may be used
So that the wall surface 31 for forming most 1st recess portion 30 of through hole 25 effectively inclines relative to the normal direction of deposition mask
Tiltedly.I.e., it is possible to increase angle, θ 1.It as a result, can be accurately stable while being effectively improved the utilization efficiency of evaporation material 98
Implement the vapor deposition under desired pattern.
But the small metal plate 21 of thickness in order to obtain, need to increase rolling when manufacturing metal plate 21 by base material
Rate.But rolling rate is bigger, the non-uniform degree of the deformation based on rolling is also bigger.For example, the elongation percentage of metal plate 21 because
The position of width direction (direction orthogonal with the direction of transfer of base material) and it is different, as a result, sometimes above-mentioned fluctuating shape
Shape appears on metal plate 21.Herein, consider the case when: each deposition mask 20 shown in FIG. 1 is respectively by the metal of elongate
Plate is constituted, and the metal plate of the elongate is to be cut off by that will roll the obtained metal plate of base material along its length direction
It obtains.In this case, it is believed that since the length of each deposition mask 20 is different, each deposition mask 20 it is effective
The spacing of each through hole 25 in region 22 is also different in each deposition mask 20, as a result, the position precision of vapor deposition is reduced, steamed
The utilization efficiency for plating material reduces.Therefore, in order to inhibit each deposition mask 20 effective coverage 22 each through hole 25 spacing
Deviation, the small organic EL display device of deviation of the size to obtain pixel and position, as described later, it is important that screening
The difference of elongation percentage small metal plate 21 uses out.
Below to such composition present embodiment and its effect and effect be illustrated.Here, first to
It is illustrated in the manufacturing method of the metal plate of manufacture deposition mask.Then to using obtained metal plate to manufacture deposition mask
Method be illustrated.Thereafter, to use obtained deposition mask carried out on substrate evaporation material vapor deposition method into
Row explanation.
(manufacturing method of metal plate)
Firstly, referring to Fig. 7 (a), (b), Fig. 8, Fig. 9 (a), (b), (c), (d) and Figure 10 to the manufacturing method of metal plate into
Row explanation.Fig. 7 (a) is to show to obtain the figure with the process of the metal plate of desired thickness, Fig. 7 by rolling base material
It (b) is the figure shown to by rolling the process that obtained metal plate is annealed.
[rolling process]
First as shown in Fig. 7 (a), prepare the base material 55 containing invar alloy material, to including a pair of of Rolling roller 56a, 56b
Rolling device 56 always transmit the base material 55 along sender shown in arrow D1.It reaches between a pair of of Rolling roller 56a, 56b
Base material 55 rolled by a pair of of Rolling roller 56a, 56b, as a result, the thickness of base material 55 reduces, while being prolonged along the conveying direction
It stretches.Thickness t can be obtained as a result,0Long metal sheet 64.As shown in Fig. 7 (a), by batching long metal sheet 64 on core material 61
And form coiling body 62.To thickness t0Occurrence be not particularly limited, for example, 0.020mm or more and 0.100mm is below
In range.
[annealing operation]
Thereafter, it is accumulated because of rolling in order to eliminate in the residual stress in long metal sheet 64, as shown in Fig. 7 (b), using moving back
Fiery device 57 anneals to long metal sheet 64.As shown in Fig. 7 (b), annealing operation can on one side by long metal sheet 64 in biography
Direction (length direction) stretching is sent to implement on one side.As a result, residual stress can be obtained be removed to a certain degree, thickness t0's
Long metal sheet 64.It should be noted that thickness t0Maximum gauge Tb generally equal in the peripheral region 23 of deposition mask 20.
It should be noted that the form of rolling process and annealing operation is not particularly limited to shape shown in Fig. 7 (a), (b)
State.For example, rolling process can use 2 couples or more Rolling roller 56a, 56b to implement.In addition it is also possible to by the way that work will be rolled
Sequence and annealing operation are repeated 2 times or more to make thickness t0Long metal sheet 64.In addition, showing annealing in Fig. 7 (b)
Process on one side by long metal sheet 64 while length direction stretches the example implemented, but not limited to this, can also be with
Implement annealing operation in the state that long metal sheet 64 is taken up in core material 61.It should be noted that being rolled up in long metal sheet 64
It is taken in the case where implementing annealing operation in the state of core material 61, the volume with coiling body 62 can be generated on long metal sheet 64 sometimes
The problem of taking diameter corresponding warpage.It therefore, on one side will long gold according to the material for batching diameter, constituting base material 55 of coiling body 62
Belonging to plate 64, implementation annealing operation is advantageous on one side in length direction stretching.
[inspection operation]
Thereafter, implement the inspection operation checked the degree of the extension difference of obtained long metal sheet 64.Fig. 8 is
Perspective view by the obtained metal plate of process shown in Fig. 7 (a), (b) is shown.As shown in figure 8, at least office of long metal sheet 64
Portion have undulations, the undulations due to the length direction D1 of the long metal sheet 64 length because its width direction D2's
Position and it is different.Here, length direction D1 is the direction parallel with direction of transfer when rolling base material 55, width direction D2
For the direction orthogonal with length direction D1.In Fig. 8, the end of the width direction D2 of long metal sheet 64 is indicated with symbol 64e.
The undulations shown in long metal sheet 64 are illustrated.Fig. 9 (a), (b), (c), (d) are respectively along figure
8 a-a line, b-b line, c-c line and d-d line sectional view.The a-a line of Fig. 8 is in the width direction along long metal sheet 64
The line that centre portion 64c extends in length direction, therefore, Fig. 9 (a) show the central portion 64c's of the width direction of long metal sheet 64
The section of long metal sheet 64.In addition, the d-d line of Fig. 8 is the end 64e along the width direction of long metal sheet 64 in length direction
The line of extension, therefore, Fig. 9 (d) show the section of the long metal sheet 64 of the end 64e of the width direction of long metal sheet 64.Base
Occur intermediate ripple in the long metal sheet 64 of present embodiment, therefore, width direction central portion 64c in long metal sheet 64
The degree of the undulations of middle appearance than the b-b line in the position of central portion 64c slightly away, such as Fig. 8 position in long gold
The degree for belonging to the undulations occurred in plate 64 is big.In addition, also there is rippled edge in the long metal sheet 64 based on present embodiment,
Therefore, the end 64e of width direction long metal sheet 64 the undulations of appearance degree ratio in end 64e slightly away
Position, such as Fig. 8 c-c line the degree of undulations that occurs in long metal sheet 64 of position it is big.
In inspection operation, firstly, calculating the long gold in the preset range of length direction D1 in each position of width direction D2
Belong to the length of plate 64.Here, " length " refers to, the undulations occurred in long metal sheet 64, length direction D1 length
The length of the profile on the surface (the 1st face 64a or the 2nd face 64b) of metal plate 64.Specifically, such as Fig. 9 (a), (b), (c), (d)
It is shown, length la, lb, lc of the long metal sheet 64 of the position shown in the a-a line of Fig. 8, b-b line, c-c line and d-d line and
Ld is also contemplated that the undulations shown in long metal sheet 64 and is measured.To the side of the length for calculating long metal sheet 64
Method is not particularly limited.For example, calculate central portion 64c long metal sheet 64 length la when, firstly, allow to measurement with it is right
As the distance between object range unit width direction D2 central portion 64c along the length direction D1 of long metal sheet 64 in length
It is scanned on metal plate 64, thus alongst D1 at predetermined intervals carries out the height and position on the surface of long metal sheet 64
Measurement.The interval is in the range of such as 1mm or more and 5mm or less.Then, depicting will be smoothly connected between each measuring point
Curve calculates thereafter the length of a curve.The length la of the long metal sheet 64 of central portion 64c can be obtained as a result,.In addition, changing
Such measurement is repeated while the position of width direction D2, so that the long gold of the position of width direction D2 can be obtained
Belong to the length of plate 64.
Then, long on the basis of the minimum value of the length of the long metal sheet 64 obtained in each position of width direction D2 setting
Degree.In present embodiment, the length lb of the long metal sheet 64 of the position shown in the b-b line as Fig. 8 is set to datum length.
Thereafter, by the length of the long metal sheet 64 of the position of width direction D2 and the difference of datum length lb relative to datum length lb
Ratio can be regarded as extension rate.Such as the extension rate of the long metal sheet 64 of central portion 64c is exported by (la-lb)/lb.Figure
10 be the figure for showing the curve 80 of extension rate of calculating.In Figure 10, horizontal axis shows the position of the width direction D2 of long metal sheet 64
It sets, the longitudinal axis is with 10-5The order of magnitude extension rate is shown.The upper section of the horizontal axis of Figure 10 is described with the order of magnitude of mm with width direction
The central portion 64c of D2 be origin in the case where width direction D2 position.In addition, the lower section of the horizontal axis of Figure 10 shows width with %
Spend the ratio of the overall with relative to long metal sheet 64 of the position of direction D2.It should be noted that in Figure 10, to as making
The case where making the long metal sheet of the long metal sheet 64 of deposition mask 20 using the overall with 500mm is illustrated.Thus, for example
The ratio for the position that central portion 64c apart from width direction D2 is+100mm is+20%.In addition, in Figure 10, the a-a line of Fig. 8,
The extension rate of the long metal sheet 64 of the position of b-b line, c-c line and d-d line is indicated respectively with symbol A, B, C and D.
Thereafter, based on the obtained value for extending rate, implement the screening of long metal sheet 64.Here, in aftermentioned vapor deposition
It is used only in the manufacturing process of mask 20 and meets following full terms (1)~(3) long metal sheet 64, thus implement long metal
The screening of plate 64.
(1) the extension rate of the center portion R1 of long metal sheet 64 is 10 × 10-5Below；
(2) the extension rate of the end 64e of the width direction D2 of long metal sheet 64 is 20 × 10-5Below；With
(3) maximum value for extending extension rate of the rate greater than center portion R1 of end 64e；
Above-mentioned condition (1)~(3) are studied respectively below.It should be noted that in Figure 10, in long metal sheet 64
Centre part indicates that the peripheral portion on the outside of centrally located part R1 is indicated with symbol R2 with symbol R1.In present embodiment, center
Part R1 is defined as accounting for 40% part of the overall with of long metal sheet 64 comprising in the width direction D2 of long metal sheet 64
Centre portion 64c.
It is general as shown in Figure 10 in the long metal sheet 64 for producing intermediate ripple and rippled edge, in long metal sheet 64
The central portion 64c of width direction nearby occurs extending the maximum (point A) of rate.In addition, in the width side from long metal sheet 64
To central portion occur extending the minimum (point B) of rate to peripheral portion side position slightly away.Also, extend rate from point
B is gradually increased (point C) to the peripheral portion of width direction, also, in the end of width direction, the value for extending rate reaches maximum
(point D).Therefore, in Figure 10 as indicated by chain dotted lines, depict and extension rate=10 × 10 are shown in center portion R1-5, in week
Rim portion R2 shows extension rate=20 × 10-5Reference line 81 in the case where, the curve 80 for extending rate is located at reference line 81
Lower section, this expression meets above-mentioned condition (1) and (2).In the example shown in Fig. 10, above-mentioned condition (1) is met
(2).
About condition (3), determine the end 64e of width direction D2 whether extend rate, i.e. extension rate at point D big
In the maximum value of the extension rate of center portion R1 (in example shown in Fig. 10, for the extension rate at point A).It is shown in Fig. 10
In example, above-mentioned condition (3) are met.
By implementing such screening, even if causing to go out in long metal sheet 64 because the rolling rate of long metal sheet 64 is big
In the case where existing undulations, can also judge whether the degree of the undulations can be in the system of deposition mask 20 later in advance
Making becomes problem in the manufacturing process of process, organic EL display device.It can make 2 or more made simultaneously elongates as a result,
The degree of the difference of the length of deposition mask 20 is in permissible range.Therefore, the effective district of the deposition mask 20 of manufacture can be made
The deviation of the spacing of each through hole 25 in domain 22 is reduced, and the size essence of the pixel of organic EL display device can be improved as a result,
Degree and position precision.In addition, the yield rate in the manufacturing process of deposition mask 20 can be improved.
It should be noted that for obtaining that there is the curve 80 for extending rate, overall with 500mm length shown in Fig. 10
The method of metal plate 64 is not particularly limited.
For example, by rolling base material 55, make have be more than the overall with of 500mm, the overall with of such as 700mm long metal
The both ends of the width direction of the long metal sheet are cut away preset range, thus can make the long metal sheet of wide 500mm by plate thereafter
64.It should be noted that in the long metal sheet of the overall with 700mm, as with shown in double dot dash line, occasionally there are prolong in Figure 10
Stretching rate is more than 20 × 10-5Part.Even if can obtain meeting above-mentioned in this case, by the way that preset range is cut away at both ends
Condition (1)~(3) long metal sheet 64.
Alternatively, in the case where preset range not being cut away at both ends above-mentioned condition (1) can also be met by rolling production
The long metal sheet 64 of~(3).
(manufacturing method of deposition mask)
In the following, referring especially to Figure 11~Figure 20, to manufacturing deposition mask 20 using the long metal sheet 64 as above filtered out
Method be illustrated.In the manufacturing method of deposition mask 20 described below, as shown in figure 11, long metal sheet 64 is supplied,
Through hole 25, further severing long metal sheet 64, to obtain being made of the metal plate 21 of sheet are formed on the long metal sheet 64
Deposition mask 20.
More specifically, the manufacturing method of deposition mask 20 includes: the process that supply extends the long metal sheet 64 to become band；
It will be implemented on long metal sheet 64 using the etching of photolithographic techniques, forms the from the 1st face side 64a on long metal sheet 64
The process of 1 recess portion 30；With the etching that photolithographic techniques are utilized is implemented on long metal sheet 64, in long metal sheet 64
On from the 2nd face side 64b formed second recesses 35 process.Also, it is formed in the 1st recess portion 30 and second recesses 35 of long metal sheet 64
It mutually communicates, to produce through hole 25 on long metal sheet 64.In the example shown in Figure 11, the formation of second recesses 35
Process is implemented before the formation process of the 1st recess portion 30, and in the formation of the formation process of second recesses 35 and the 1st recess portion 30
The process being sealed to made second recesses 35 is further provided between process.Each process described further below.
Figure 11 shows the manufacturing device 60 for making deposition mask 20.As shown in figure 11, firstly, preparing long metal
Plate 64 batches the coiling body 62 made of on core material 61.Also, coiling body 62 is unreeled by rotating the core material 61, thus such as
Supply extends the long metal sheet 64 to become band as shown in Figure 11.It should be noted that long metal sheet 64 is formed with through hole 25
The metal plate 21 of sheet is formed afterwards and then forms deposition mask 20.
The long metal sheet 64 being supplied to is sent to Etaching device (etching unit) 70 by transfer roller 72.Utilize etching unit
70, implement to manage everywhere in shown in Figure 12~Figure 20.
Firstly, as shown in figure 12, on the 1st face 64a of long metal sheet 64 (on the face of the downside in the paper of Figure 12) and
It is coated with the photonasty anticorrosive additive material of minus on 2nd face 64b, forms resist film 65c, 65d on long metal sheet 64.Then,
Prepare exposed mask 85a, 85b, the exposed mask 85a, 85b do not make light through being removed into resist film 65c, 65d
Exposed mask 85a, 85b are configured on resist film 65c, 65d by region as shown in figure 13 respectively.As exposed mask 85a,
85b, using such as glass dry plate, which does not make light through the region to be removed into resist film 65c, 65d.Its
Afterwards, keep exposed mask 85a, 85b and resist film 65c, 65d sufficiently closely sealed by the way that vacuum is closely sealed.
Need to illustrate when, as photonasty anticorrosive additive material, the photonasty anticorrosive additive material of eurymeric can be used.It is this
In the case of, as exposed mask, use the exposed mask for making light penetrate the region to be removed into resist film.
Here, according to the present embodiment, as described above, using extension rate the prolonging greater than center portion R1 of end 64e
Stretch the long metal sheet 64 of the maximum value of rate.That is, the degree of the undulations of the end 64e of the width direction D2 of long metal sheet 64
The degree of undulations greater than the central portion 64c of the width direction D2 of long metal sheet 64.Generally in vacuum is closely sealed, by making
Existing air is set between resist film 65c, 65d on long metal sheet 64 and exposed mask 85a, 85b from long metal sheet
The end of the laminate of 64 and resist film 65c, 65d is to outside discharge, it can be achieved that resist film 65c, 65d and exposed mask
It is closely sealed between 85a, 85b.Here, it is assumed that the degree of the undulations of the end 64e of long metal sheet 64 is less than long metal sheet 64
Central portion 64c undulations degree, it may be considered that, compared with the region near the central portion of laminate, laminate
End near region take the lead in it is closely sealed with exposed mask 85a, 85b, as a result, causing the central portion of laminate existing nearby
The overflow channel of air disappears.In contrast, according to the present embodiment, the journey of the undulations of the end 64e of long metal sheet 64
Therefore the degree that degree is greater than the undulations of the central portion 64c of long metal sheet 64 can reliably ensure the central portion of laminate
Nearby therefore the overflow channel of existing air can make exposed mask 85a, 85b and resist film 65c, 65d in entire area
Domain is sufficiently closely sealed.
Thereafter, resist film 65c, 65d are exposed across exposed mask 85a, 85b, further by resist film 65c, 65d
Development.In this way, as shown in figure 14, resist pattern (also referred to as resist) can be formed on the 1st face 64a of long metal sheet 64
65a, resist pattern (also referred to as resist) 65b is formed on the 2nd face 64b of long metal sheet 64.
Then, as shown in figure 15, using the resist pattern 65b formed on long metal sheet 64 as mask, etching solution is used
(such as iron chloride (III) solution), from the 2nd face 64b lateral erosion of long metal sheet 64.For example, etching solution is from nozzle across against corrosion
Agent pattern 65b sprays to the 2nd face 64b of long metal sheet 64, and the nozzle configuration is in the 2nd face of the long metal sheet 64 with transmission
The side that 64b is faced.As a result, as shown in figure 15, in the region not covered by resist pattern 65b in long metal sheet 64,
Erosion caused by etching solution promotes.In this way, forming a large amount of second recesses 35 on long metal sheet 64 from the 2nd face side 64b.
Thereafter, as shown in figure 16, have indefatigable resin 69 using to etching solution, second recesses 35 will be formed by and be coated.
That is, having indefatigable resin 69 using to etching solution, second recesses 35 are sealed.In example as shown in figure 16, the film of resin 69
It is formed in such a way that not only covering is formed by second recesses 35 but also the 2nd face 64b (resist pattern 65b) of covering.
Then, as shown in figure 17, the 2nd etching is carried out to long metal sheet 64.In the 2nd etching, long metal sheet 64 is only
It is etched from the 1st face side 64a, from the 1st face side 64a, the formation of the 1st recess portion 30 is promoted.Due to the 2nd face 64b of long metal sheet 64
Side, which is coated with, has indefatigable resin 69 to etching solution, therefore, the second recesses for forming desired shape is etched by the 1st time
35 shape is not damaged.
Part based on the erosion of etching contacting in long metal sheet 64 with etching solution carries out.Therefore, it corrodes not only
It promotes in the normal direction (thickness direction) of long metal sheet 64, is also promoted in the direction of the plate face along long metal sheet 64.It is tied
Fruit, as shown in figure 18, the normal direction for being etched in long metal sheet 64 promote and connect the 1st recess portion 30 with second recesses 35, not only
In this way, in place in two the 1st recess portions 30 that the position that the adjacent two hole 66a with resist pattern 65a is faced is respectively formed
Converge on the inside of bridge portion 67a between two hole 66a.
As shown in figure 19, it is pushed further into from the etching of the 1st face side 64a of long metal sheet 64.As shown in figure 19, adjacent
What two the 1st recess portions 30 merged converges the disengaging of part 43 resist pattern 65a, being somebody's turn to do under resist pattern 65a
Converge in part 43, corroding caused by etching also promotes in the normal direction (thickness direction) of metal plate 64.As a result, towards along
The sharp part 43 of converging in the side of the normal direction of deposition mask is etched from the side of the normal direction along deposition mask,
To be chamfered as shown in Figure 19.The wall surface 31 of the 1st recess portion 30 can be made relative to the normal direction institute of deposition mask as a result,
The tiltangleθ 1 of formation increases.
In this way, the erosion of the 1st face 64a of the long metal sheet 64 based on etching is used to form effective district in long metal sheet 64
It is promoted in the whole region in domain 22.Be used to form as a result, the long metal sheet 64 in the region of effective coverage 22 along normal side
To maximum gauge Ta compared to etching before long metal sheet 64 maximum gauge Tb it is thinning.
As described above, preset amount is only promoted from the etching of the 1st face side 64a of long metal sheet 64, to long metal sheet
64 the 2nd etching terminates.At this point, the 1st recess portion 30 is extended to along the thickness direction of long metal sheet 64 reaches second recesses 35
At position, to form through hole 25 on long metal sheet 64 using the 1st recess portion 30 and second recesses 35 mutually communicated.
Thereafter, as shown in figure 20, resin 69 is removed from long metal sheet 64.It can by using such as alkali system stripper
Remove resin film 69.It should be noted that as shown in figure 20, also being removed simultaneously with resin 69 in the case where using alkali system stripper
Go resist pattern 65a, 65b.
The transfer roller 72,72 rotated using the state to clamp the long metal sheet 64 is to disconnecting device (cutting unit)
73 transmission are thusly-formed the long metal sheet 64 of a large amount of through holes 25.It should be noted that by the transfer roller 72,72 is utilized
The tension (drawing force) of long metal sheet 64 is rotated and acted on, above-mentioned supply core material 61 is rotated, to be supplied by coiling body 62
To long metal sheet 64.
Thereafter, the long metal sheet 64 for being formed with a large amount of recess portions 61 is cut into using disconnecting device (cutting unit) 73 predetermined
Length and width, to obtain the sheet metal plate 21 for being formed with a large amount of through holes 25.
As above operation, the available deposition mask 20 being made of the metal plate 21 for being formed with a large amount of through holes 25.Here, root
According to present embodiment, whole region of the 1st face 21a of metal plate 21 in effective coverage 22 is etched.Therefore, make deposition mask 20
Effective coverage 22 thickness reduce, and can make the 1st face side 21a formed two the 1st recess portions 30 wall surface 31 elder generation
The outer profile for the part 43 that end margin 32 converges is the shape of chamfering.Therefore, above-mentioned angle, θ 1 can be increased, can be improved as a result,
The utilization efficiency of evaporation material and the position precision of vapor deposition.
But the long metal sheet 64 with undulations is alongst cut into scheduled width it is meant that by
The length for each deposition mask 20 that the elongate metal plate 21 that obtains after cutting is constituted is according to cutting out the position of metal plate 21, exist
The position of the width direction of long metal sheet 64 and it is different.Here, according to the present embodiment, as described above, using being based on
The extension rate of width direction D2 and the long metal sheet 64 filtered out in advance.Therefore, even if there is fluctuating shape in long metal sheet 64
In the case where shape, it can also make the degree of the difference of the length of make simultaneously 2 or more deposition masks 20 in permissible range.
Therefore, according to the present embodiment, by reducing the thickness of the effective coverage 22 of deposition mask 20 and increasing the of deposition mask 20
The tilt angle theta 1 of the wall surface 31 of 1 recess portion 30 can be realized simultaneously the position essence of the utilization efficiency and vapor deposition that improve evaporation material
The deviation and raising deposition mask of the spacing of each through hole 25 of the effective coverage 22 of degree, reduction deposition mask 20 manufacture work
Adaptation, the yield rate of the manufacturing process of raising deposition mask 20 of exposure process in sequence.Therefore, offer can be stablized with excellent
The deposition mask 20 of different characteristic.
(evaporation coating method)
Then, it is illustrated in the method on substrate 92 to using obtained deposition mask 20 that evaporation material is deposited.
Firstly, as shown in Fig. 2, keeping deposition mask 20 and substrate 92 closely sealed.At this point, the tensioning of deposition mask 20 is set on frame 15, from
And the face of deposition mask 20 is made to be parallel to the face of substrate 92.Here, according to the present embodiment, having used based on width direction D2's
The long metal sheet 64 for extending rate and filtering out in advance.Therefore, compared with the case where such screening is not carried out, each deposition mask
The deviation of 20 length is equably reduced, and then the deviation of the spacing of each through hole 25 of effective coverage 22 obtains equably
It reduces.Therefore, evaporation material can be deposited on substrate 92 with high position precision.Therefore, organic EL is formed by vapor deposition
When the pixel of display device, the dimensional accuracy and position precision of the pixel of organic EL display device can be improved.It can produce as a result,
The organic EL display device of fine.
It should be noted that in above-mentioned present embodiment, in the example that shows, not by long metal sheet 64 in length
The case where degree direction cutting, gets off to calculate the length of the long metal sheet 64 of the position of the width direction D2 of long metal sheet 64.But
It is, however it is not limited to this, it can also be by long metal sheet 64 after length direction cuts into length appropriate, in each of width direction D2
Position calculates the length of the metal plate after cutting, implements the screening of metal plate based on the result.
In addition, in present embodiment, in the example that shows, the entire area of the 1st face 21a of metal plate 21 in effective coverage 22
Domain is etched.But, however it is not limited to this, can also a part only in effective coverage 22 the 1st face 21a of metal plate 21 is lost
It carves.
Embodiment
In the following, further illustrate the present invention by embodiment, the present invention without departing from its main points be just not limited to
Under embodiment record.
(the 1st sample)
Firstly, implementing above-mentioned rolling process and annealing operation to the base material containing invar alloy material, to manufacture length
Coiling body made of metal plate batches (the 1st coiling body).Thereafter, the front end of the 1st coiling body is cut using shearing machine, thus such as
Shown in Figure 21, the 1st sample 100 being made of the metal plate that width is 500mm, projected length is 700mm is obtained.It needs to illustrate
It is, in the case that " projected length " refers to the undulations for ignoring metal plate in the case where metal plate, i.e. from surface
The length (size of rolling direction) of metal plate.In addition, the width of the 1st sample 100 refers to the 1st sample 100 of width direction
The distance between a pair of end portions 101,102.The portion that a pair of end portions 101,102 of 1st sample 100 is formed by cut off operation
Point, in the cut off operation, the both ends of the width direction of the metal plate obtained by rolling process and annealing operation are cut away pre-
Determine range, which extends substantially straightly.
Then, as shown in figure 21, the 1st sample 100 is placed horizontally on platform 110.At this point, according in the 1st sample 100
In do not generate the mode of local dent the 1st sample 100 be gently placed on platform 110.Then, the one of the 1st sample 100
A end 101 measures the physical length of the 1st sample 100 in the region of projected length 500mm, considers the length of undulations
Degree.It is in it should be noted that the region of projected length 500mm refers to remove from the 1st sample 100 of projected length 700mm
The both ends 103,104 of length direction away from sample 1 are region obtained from the region within 100mm.Will in away from both ends 103,
104 for the region within 100mm from removal in measure object be the 1st sample 100 caused by the cutting based on shearing machine in order to prevent
The influence of skew can involve the measurement result of length.In Figure 21, the region of projected length 500mm is shown in dash-dot lines.
In measurement, in Figure 21 as shown by arrow s, by the length direction using the range unit of laser along the 1st sample 100
1st sample 100 is made a relative move, with the surface of an end 101 of the 1st sample 100 of 1mm measuring space length direction
Height and position.In addition, depict will be smoothly connected between each measuring point made of curve calculate the length of a curve thereafter.Make
For the range unit of the height and position on the surface for measuring the 1st sample 100, the Lasertec as laser microscope has been used
The OPTELICS H1200 of Co., Ltd.'s manufacture.It should be noted that when measurement the element that is moved can be range unit or
Any one of 1st sample 100, but herein uses the automatic station of 500mm × 500mm as the platform of the 1st sample 100 of mounting,
It is determined to keep sample 100 mobile.Laser interferometer is utilized in the control of the automatic station in the direction XY.In this way,
Determine the length of the 1st sample 100 an of end 101.
Then, in the position for being displaced 20mm from an end 101 to another 102 side of end, the 1st sample is similarly measured
100 length.By on one side with scheduled spacing p change the 1st sample 100 width direction position while repeatedly implement it is above-mentioned
Measurement, to be measured to the length of the 1st sample of each position of width direction.Here, setting spacing p as 20mm.It is acquired
Measurement result include the measurement result of length of an end 101, the measurement result of the length of another end 102 and
The measurement result of the measurement result of the length of center portion and the length between center portion and end 101,102.It needs
Illustrate, on the basis of an end 101, center portion be one end 101 of distance be 150mm or more and
Part in the range of 350mm or less.It should be noted that the following setting that locates of width direction: in the 1st sample 100
Central portion, i.e. one end 101 of distance and another end be measurement that length is implemented in equal position.
Then, long on the basis of the minimum value of the length of the 1st sample 100 obtained in each position of width direction setting
Degree.Thereafter, the ratio by the length of the 1st sample 100 of each position of width direction and the difference of datum length relative to datum length
Example can be regarded as extension rate.As a result, the extension rate of an end 101 is 79.9 × 10-5, another end 102 extension rate
It is 71.2 × 10-5, center portion each position extension rate maximum value be 15.8 × 10-5。
The calculated result of the extension rate of 1st sample 100 is compareed with above-mentioned condition (1)~(3), as a result, the 1st
In sample 100, meet condition (3), but is unsatisfactory for condition (1) and (2).Therefore, determine that the 1st sample 100 cannot function as making
Make deposition mask material carry out using.
In addition, manufacture is multiple alongst using the metal plate for the 1st coiling body for obtaining the 1st above-mentioned sample 100
It is provided with the deposition mask of 5 effective coverages.It is formed in a regular array in each effective coverage of each deposition mask a large amount of
Through hole.Then, in order to evaluate the position precision of obtained deposition mask, total spacing of each deposition mask is measured, and calculate
The extent of deviation of total spacing out.
Here, total spacing refer at scheduled 2 points in deposition mask between distance.As long as the position of deposition mask can be evaluated
Precision is not particularly limited 2 points of setting position, here, in the effective coverage for the one end for being located at deposition mask
Nearby be formed by it is scheduled label, with positioned at deposition mask another side effective coverage near be formed by it is predetermined
The distance between label be measured, as total spacing.Total spacing in this case is about 600mm in design.
The index of extent of deviation as total spacing utilizes the standard deviation of the measured value of total spacing to each deposition mask
(σ) is multiplied by value, so-called 3 σ obtained from 3.The deviation (3 σ) of the measured value of total spacing of the deposition mask obtained by the 1st coiling body
It is 35.2 μm.It should be noted that n number when calculating standard deviation (σ) is compared between each sample according to aftermentioned
On the basis of standard deviation (σ) value have sufficient reliability mode set.Specifically, setting n number as 400.
(the 2nd sample)
By cutting the front end of 2nd coiling body different from above-mentioned 1st coiling body, obtain by wide 500mm, projected length
The 2nd sample that the metal plate of 700mm is constituted.Then, with above-mentioned 1 sample the case where in the same manner as surveyed in each position of width direction
The length of fixed 2nd sample, and calculate extension rate.As a result, the extension rate of an end is 24.7 × 10-5, another end
The extension rate in portion is 29.8 × 10-5, center portion each position extension rate maximum value be 1.0 × 10-5。
The calculated result of the extension rate of 2nd sample is compareed with above-mentioned condition (1)~(3), as a result, the 2nd
In sample, meet condition (1) and (3), but is unsatisfactory for condition (2).Therefore, it is determined that the 2nd sample is that cannot function as manufacturing vapor deposition
The material of mask and carry out using.
In addition, in the same manner as with above-mentioned 1 sample the case where, using the metal plate of the 2nd coiling body, manufacture it is multiple is provided with it is big
Measure the deposition mask of through hole.Then, in the same manner as with above-mentioned 1 sample the case where, the total of obtained each deposition mask is measured
Spacing, and calculate the deviation (3 σ) of the measured value of total spacing.As a result, the value of 3 σ is 16.1 μm.
(the 3rd sample)
By cutting the front end of 3rd coiling body different from above-mentioned 1st coiling body and the 2nd coiling body, obtain by width
3rd sample of the metal plate composition of 500mm, projected length 700mm.Then, in the same manner as with above-mentioned 1 sample the case where, in width
The each position for spending direction measures the length of the 3rd sample, and calculates extension rate.As a result, the extension rate of an end is
18.1×10-5, another end extension rate be 19.0 × 10-5, center portion each position extension rate maximum value
It is 13.2 × 10-5。
The calculated result of the extension rate of 3rd sample is compareed with above-mentioned condition (1)~(3), as a result, in the 3rd sample
In product, meet condition (2) and (3), but is unsatisfactory for condition (1).Therefore, it is determined that the 3rd sample cannot function as manufacturing deposition mask
Material and carry out using.
In addition, in the same manner as with above-mentioned 1 sample the case where, using the metal plate of the 3rd coiling body, manufacture it is multiple is provided with it is big
Measure the deposition mask of through hole.Then, in the same manner as with above-mentioned 1 sample the case where, the total of obtained each deposition mask is measured
Spacing, and calculate the deviation (3 σ) of the measured value of total spacing.As a result, the value of 3 σ is 14.2 μm.
(the 4th sample)
By cutting the front end of 4th coiling body different from above-mentioned 1st coiling body~the 3rd coiling body, obtain by width
4th sample of the metal plate composition of 500mm, projected length 700mm.Then, in the same manner as with above-mentioned 1 sample the case where, in width
The each position for spending direction measures the length of the 4th sample, and calculates extension rate.As a result, the extension rate of an end is
26.8×10-5, another end extension rate be 18.6 × 10-5, center portion each position extension rate maximum value
It is 3.9 × 10-5。
The calculated result of the extension rate of 4th sample is compareed with above-mentioned condition (1)~(3), as a result, in the 4th sample
Meet condition (1) and (3) in product, but is unsatisfactory for condition (2).Therefore, it is determined that the 4th sample cannot function as manufacturing deposition mask
Material and carry out using.
In addition, in the same manner as with above-mentioned 1 sample the case where, using the metal plate of the 4th coiling body, manufacture it is multiple is provided with it is big
Measure the deposition mask of through hole.Then, in the same manner as with above-mentioned 1 sample the case where, the total of obtained each deposition mask is measured
Spacing, and calculate the deviation (3 σ) of the measured value of total spacing.As a result, the value of 3 σ is 13.5 μm.
(the 5th sample)
By cutting the front end of 5th coiling body different from above-mentioned 1st coiling body~the 4th coiling body, obtain by width
5th sample of the metal plate composition of 500mm, projected length 700mm.Then, in the same manner as with above-mentioned 1 sample the case where, in width
The each position for spending direction measures the length of the 5th sample, and calculates extension rate.As a result, the extension rate of an end is
18.2×10-5, another end extension rate be 12.3 × 10-5, center portion each position extension rate maximum value
It is 9.1 × 10-5。
The calculated result of the extension rate of 5th sample is compareed with above-mentioned condition (1)~(3), as a result, in the 5th sample
Meet condition (1)~(3) whole in product.Therefore, it is determined that the 5th sample can as the material for manufacturing deposition mask and into
It exercises and uses.
In addition, in the same manner as with above-mentioned 1 sample the case where, using the metal plate of the 5th coiling body, manufacture it is multiple is provided with it is big
Measure the deposition mask of through hole.Then, in the same manner as with above-mentioned 1 sample the case where, the total of obtained each deposition mask is measured
Spacing, and calculate the deviation (3 σ) of the measured value of total spacing.As a result, the value of 3 σ is 5.6 μm.
(the 6th sample)
By cutting the front end of 6th coiling body different from above-mentioned 1st coiling body~the 5th coiling body, obtain by width
6th sample of the metal plate composition of 500mm, projected length 700mm.Then, in the same manner as with above-mentioned 1 sample the case where, in width
The each position for spending direction measures the length of the 6th sample, and calculates extension rate.As a result, the extension rate of an end is
18.2×10-5, another end extension rate be 8.8 × 10-5, center portion each position extension rate maximum value
It is 9.1 × 10-5。
The calculated result of the extension rate of 6th sample is compareed with above-mentioned condition (1)~(3), as a result, in the 3rd sample
Meet condition (1) and (2) in product, but is unsatisfactory for condition (3).Therefore, it is determined that the 6th sample cannot function as manufacturing deposition mask
Material and carry out using.
In addition, in the same manner as with above-mentioned 1 sample the case where, using the metal plate of the 6th coiling body, manufacture it is multiple is provided with it is big
Measure the deposition mask of through hole.Then, in the same manner as with above-mentioned 1 sample the case where, the total of obtained each deposition mask is measured
Spacing, and calculate the deviation (3 σ) of the measured value of total spacing.As a result, the value of 3 σ is 12.6 μm.
(the 7th sample)
By cutting the front end of 7th coiling body different from above-mentioned 1st coiling body~the 6th coiling body, obtain by width
7th sample of the metal plate composition of 500mm, projected length 700mm.Then, in the same manner as with above-mentioned 1 sample the case where, in width
The each position for spending direction measures the length of the 7th sample, and calculates extension rate.As a result, the extension rate of an end is
16.5×10-5, another end extension rate be 3.2 × 10-5, center portion each position extension rate maximum value
It is 0.8 × 10-5。
The calculated result of the extension rate of 7th sample is compareed with above-mentioned condition (1)~(3), as a result, in the 7th sample
Meet condition (1)~(3) whole in product.Therefore, it is determined that the 7th sample can as the material for manufacturing deposition mask and into
It exercises and uses.
In addition, in the same manner as with above-mentioned 1 sample the case where, using the metal plate of the 7th coiling body, manufacture it is multiple is provided with it is big
Measure the deposition mask of through hole.Then, in the same manner as with above-mentioned 1 sample the case where, the total of obtained each deposition mask is measured
Spacing, and calculate the deviation (3 σ) of the measured value of total spacing.As a result, the value of 3 σ is 4.3 μm.
Well determine in this way, achieving to make based on above-mentioned condition (1)~(3) in the metal plate of the 5th, the 7th coiling body
Sample 5,7 in the case where the metal plate for having used the described 5th, the 7th coiling body, makes the measured value of total spacing of deposition mask
Deviation (3 σ) value reduce, specifically can be 10 μm or less.On the other hand, the metal of the the 1st~the 4th and the 6th coiling body
It is achieved in plate and is determined as undesirable sample 1~4 and 6 based on above-mentioned condition (1)~(3), used the the 1st~the 4th and the 6th winding
In the case where the metal plate of body, the value of the deviation (3 σ) of the measured value of total spacing of deposition mask is big, specifically, being greater than 10 μ
m.It is possible thereby to think, have between the performance of judgement result and obtained deposition mask based on above-mentioned condition (1)~(3)
There is very big correlation.That is, by utilizing above-mentioned condition (1)~(3), it, can be precisely pre- in the stage of coiling body
Survey the characteristic of the deposition mask obtained by the metal plate of the coiling body.Accordingly, it is believed that above-mentioned condition (1)~(3) are to have
The judgment method of power.
Symbol description
20 deposition masks
21 metal plates
1st face of 21a metal plate
2nd face of 21b metal plate
22 effective coverages
23 peripheral regions
25 through holes
30 the 1st recess portions
31 wall surfaces
35 second recesses
36 wall surfaces
55 base materials
56 rolling devices
57 annealing devices
61 core materials
62 coiling bodies
64 long metal sheets
1st face of 64a long metal sheet
2nd face of 64b long metal sheet
The central portion of the width direction of 64c long metal sheet
The end of the width direction of 64e long metal sheet
65a, 65b resist pattern
65c, 65d resist film
80 extend the curve of rate
81 reference lines
85a, 85b exposed mask.
Claims (1)
1. a kind of manufacturing method of deposition mask, which comprises the process that supply extends the long metal sheet to become band；It will be sharp
It is implemented on long metal sheet with the etching of photolithographic techniques, forms the work of the 1st recess portion from the 1st surface side on long metal sheet
Sequence；With the etching that photolithographic techniques are utilized is implemented on long metal sheet, is formed on long metal sheet from the 2nd surface side
The process of second recesses, also, it is formed in the 1st recess portion of long metal sheet and second recesses mutually communicate, thus on long metal sheet
Through hole is produced, the formation process of second recesses is implemented before the formation process of the 1st recess portion, and in the formation of second recesses
The process being sealed to made second recesses is further provided between process and the formation process of the 1st recess portion.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-002923 | 2013-01-10 | ||
| JP2013002923 | 2013-01-10 | ||
| JP2013162712A JP5382259B1 (en) | 2013-01-10 | 2013-08-05 | Metal plate, method for producing metal plate, and method for producing vapor deposition mask using metal plate |
| JP2013-162712 | 2013-08-05 | ||
| CN201480003445.3A CN104854254B (en) | 2013-01-10 | 2014-01-10 | Metallic plate, the manufacture method of metallic plate and the method using metallic plate manufacture deposition mask |
| PCT/JP2014/050345 WO2014109393A1 (en) | 2013-01-10 | 2014-01-10 | Metal plate, metal plate production method, and method for producing vapor deposition mask using metal plate |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480003445.3A Division CN104854254B (en) | 2013-01-10 | 2014-01-10 | Metallic plate, the manufacture method of metallic plate and the method using metallic plate manufacture deposition mask |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110306155A true CN110306155A (en) | 2019-10-08 |
| CN110306155B CN110306155B (en) | 2022-04-26 |
Family
ID=50036550
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711266179.5A Pending CN107937870A (en) | 2013-01-10 | 2014-01-10 | Metallic plate, the manufacture method of metallic plate and the method using metallic plate manufacture deposition mask |
| CN201480003445.3A Active CN104854254B (en) | 2013-01-10 | 2014-01-10 | Metallic plate, the manufacture method of metallic plate and the method using metallic plate manufacture deposition mask |
| CN201711266191.6A Pending CN107858643A (en) | 2013-01-10 | 2014-01-10 | Metallic plate, the manufacture method of metallic plate and the method using metallic plate manufacture deposition mask |
| CN201910715831.XA Active CN110306155B (en) | 2013-01-10 | 2014-01-10 | Method for manufacturing vapor deposition mask |
Family Applications Before (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711266179.5A Pending CN107937870A (en) | 2013-01-10 | 2014-01-10 | Metallic plate, the manufacture method of metallic plate and the method using metallic plate manufacture deposition mask |
| CN201480003445.3A Active CN104854254B (en) | 2013-01-10 | 2014-01-10 | Metallic plate, the manufacture method of metallic plate and the method using metallic plate manufacture deposition mask |
| CN201711266191.6A Pending CN107858643A (en) | 2013-01-10 | 2014-01-10 | Metallic plate, the manufacture method of metallic plate and the method using metallic plate manufacture deposition mask |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5382259B1 (en) |
| KR (6) | KR20210112420A (en) |
| CN (4) | CN107937870A (en) |
| WO (1) | WO2014109393A1 (en) |
Families Citing this family (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5455099B1 (en) | 2013-09-13 | 2014-03-26 | 大日本印刷株式会社 | Metal plate, metal plate manufacturing method, and mask manufacturing method using metal plate |
| JP5516816B1 (en) | 2013-10-15 | 2014-06-11 | 大日本印刷株式会社 | Metal plate, method for producing metal plate, and method for producing vapor deposition mask using metal plate |
| JP6698265B2 (en) * | 2014-02-14 | 2020-05-27 | 大日本印刷株式会社 | Method for manufacturing vapor deposition mask device, vapor deposition mask with substrate and laminated body |
| JP5641462B1 (en) * | 2014-05-13 | 2014-12-17 | 大日本印刷株式会社 | Metal plate, metal plate manufacturing method, and mask manufacturing method using metal plate |
| EP3626852B1 (en) | 2015-02-10 | 2022-04-06 | Dai Nippon Printing Co., Ltd. | Method for manufacturing a deposition mask |
| TWI651588B (en) | 2015-02-10 | 2019-02-21 | 日商大日本印刷股份有限公司 | Method for manufacturing vapor deposition mask and vapor deposition mask |
| JP6701543B2 (en) * | 2015-07-10 | 2020-05-27 | 大日本印刷株式会社 | Vapor deposition mask and method for manufacturing vapor deposition mask |
| KR101810824B1 (en) * | 2015-07-17 | 2017-12-19 | 도판 인사츠 가부시키가이샤 | Metal mask substrate, metal mask substrate control method, metal mask, and metal mask production method |
| JP6432072B2 (en) | 2015-07-17 | 2018-12-05 | 凸版印刷株式会社 | Metal mask base material and metal mask manufacturing method |
| CN107406963B (en) | 2015-07-17 | 2018-11-20 | 凸版印刷株式会社 | Vapor deposition metal mask substrate and its manufacturing method, vapor deposition metal mask and its manufacturing method |
| CN113403574A (en) | 2015-07-17 | 2021-09-17 | 凸版印刷株式会社 | Base material for metal mask and method for producing same, metal mask for vapor deposition and method for producing same |
| KR102477941B1 (en) | 2015-09-30 | 2022-12-16 | 다이니폰 인사츠 가부시키가이샤 | Deposition mask, method of manufacturing deposition mask and metal plate |
| US10541387B2 (en) | 2015-09-30 | 2020-01-21 | Dai Nippon Printing Co., Ltd. | Deposition mask, method of manufacturing deposition mask and metal plate |
| KR102375261B1 (en) * | 2016-04-01 | 2022-03-17 | 엘지이노텍 주식회사 | Metal mask for deposition, and oled pannel using the same |
| JP6237972B1 (en) * | 2016-04-14 | 2017-11-29 | 凸版印刷株式会社 | Vapor deposition mask substrate, vapor deposition mask substrate production method, and vapor deposition mask production method |
| KR20240063164A (en) | 2016-09-29 | 2024-05-09 | 다이니폰 인사츠 가부시키가이샤 | Vapor deposition mask package and vapor deposition mask packaging method |
| WO2018092531A1 (en) * | 2016-11-18 | 2018-05-24 | 大日本印刷株式会社 | Vapor deposition mask |
| JP7121918B2 (en) * | 2016-12-14 | 2022-08-19 | 大日本印刷株式会社 | Evaporation mask device and method for manufacturing evaporation mask device |
| JP6851820B2 (en) * | 2016-12-28 | 2021-03-31 | マクセルホールディングス株式会社 | Thin-film deposition mask and its installation method and manufacturing method |
| JP6376483B2 (en) | 2017-01-10 | 2018-08-22 | 大日本印刷株式会社 | Vapor deposition mask manufacturing method, vapor deposition mask device manufacturing method, and vapor deposition mask quality determination method |
| KR102333411B1 (en) * | 2017-01-10 | 2021-12-02 | 다이니폰 인사츠 가부시키가이샤 | Vapor deposition mask, method for manufacturing vapor deposition mask device, and method for manufacturing vapor deposition mask |
| JP6428903B2 (en) * | 2017-01-17 | 2018-11-28 | 大日本印刷株式会社 | Vapor deposition mask and vapor deposition mask manufacturing method |
| KR102657827B1 (en) * | 2017-01-17 | 2024-04-17 | 다이니폰 인사츠 가부시키가이샤 | Intermediate product |
| KR102330373B1 (en) * | 2017-03-14 | 2021-11-23 | 엘지이노텍 주식회사 | Metal substrate, metal mask for deposition, and method for manufacturing of the same |
| KR20230073352A (en) | 2017-09-05 | 2023-05-25 | 다이니폰 인사츠 가부시키가이샤 | Production method for vapor deposition mask device and production device for vapor deposition mask device |
| CN116083843A (en) * | 2017-09-07 | 2023-05-09 | Lg伊诺特有限公司 | Metal material OLED deposition mask and method for measuring residual stress of deposition mask |
| JP6319505B1 (en) * | 2017-09-08 | 2018-05-09 | 凸版印刷株式会社 | Vapor deposition mask substrate, vapor deposition mask substrate production method, vapor deposition mask production method, and display device production method |
| WO2019054462A1 (en) * | 2017-09-15 | 2019-03-21 | 凸版印刷株式会社 | Method for manufacturing deposition mask, method for manufacturing display device and deposition mask |
| JP6299921B1 (en) | 2017-10-13 | 2018-03-28 | 凸版印刷株式会社 | Vapor deposition mask substrate, vapor deposition mask substrate production method, vapor deposition mask production method, and display device production method |
| JP6981302B2 (en) * | 2017-10-13 | 2021-12-15 | 凸版印刷株式会社 | A base material for a vapor deposition mask, a method for manufacturing a base material for a vapor deposition mask, a method for manufacturing a vapor deposition mask, and a method for manufacturing a display device. |
| JP6299922B1 (en) * | 2017-10-13 | 2018-03-28 | 凸版印刷株式会社 | Vapor deposition mask substrate, vapor deposition mask substrate production method, vapor deposition mask production method, and display device production method |
| JP6988565B2 (en) * | 2017-10-13 | 2022-01-05 | 凸版印刷株式会社 | A base material for a vapor deposition mask, a method for manufacturing a base material for a vapor deposition mask, a method for manufacturing a vapor deposition mask, and a method for manufacturing a display device. |
| KR20200070345A (en) | 2017-11-01 | 2020-06-17 | 다이니폰 인사츠 가부시키가이샤 | Deposition mask device |
| CN109778114B (en) | 2017-11-14 | 2021-10-15 | 大日本印刷株式会社 | Metal plate for manufacturing vapor deposition mask, method for manufacturing metal plate, vapor deposition mask, and method for manufacturing vapor deposition mask |
| KR20230051717A (en) * | 2018-07-09 | 2023-04-18 | 다이니폰 인사츠 가부시키가이샤 | Vapor-deposition mask manufacturing method and vapor-deposition mask device manufacturing method |
| WO2020013643A1 (en) * | 2018-07-12 | 2020-01-16 | 엘지이노텍 주식회사 | Metal plate deposition mask for oled pixel deposition |
| DE102019007831A1 (en) | 2018-11-13 | 2020-05-14 | Dai Nippon Printing Co., Ltd. | METAL PLATE FOR MANUFACTURING VAPOR PHASE DEVICE MASKS, METHOD FOR MANUFACTURING METAL PLATES, VAPOR PHASE DEVICE MASK, METHOD FOR MANUFACTURING A STEAM PHASE VAPOR DETECTION VAPOR EVAPORATION DETECTOR |
| KR102202529B1 (en) * | 2018-11-27 | 2021-01-13 | 주식회사 오럼머티리얼 | Producing method of mask integrated frame and mask changing method of mask integrated frame |
| JP6838693B2 (en) * | 2019-01-31 | 2021-03-03 | 大日本印刷株式会社 | Thin-film masks, electronic device manufacturing methods and electronic devices |
| JP7487481B2 (en) | 2019-02-06 | 2024-05-21 | 大日本印刷株式会社 | DEPOSITION MASK APPARATUS, MASK SUPPORT MECHANISM, AND METHOD FOR MANUFACTURING DEPOSITION MASK APPARATUS |
| JP7196717B2 (en) * | 2019-03-25 | 2022-12-27 | 大日本印刷株式会社 | Mask manufacturing method |
| JP7449485B2 (en) | 2019-03-28 | 2024-03-14 | 大日本印刷株式会社 | Vapor deposition mask and method for manufacturing a vapor deposition mask |
| JP2019151936A (en) * | 2019-06-11 | 2019-09-12 | 大日本印刷株式会社 | Method for manufacturing vapor deposition mask device, vapor deposition mask having substrate, and laminate |
| JP6788852B1 (en) | 2019-10-08 | 2020-11-25 | 大日本印刷株式会社 | Metal plate manufacturing method |
| KR20210042026A (en) | 2019-10-08 | 2021-04-16 | 다이니폰 인사츠 가부시키가이샤 | Metal plate for producing vapor deposition mask, production method for metal plate, vapor deposition mask and production method for vapor deposition mask |
| US11732361B2 (en) | 2019-10-08 | 2023-08-22 | Dai Nippon Printing Co., Ltd. | Metal plate for manufacturing deposition mask, method for manufacturing metal plate, deposition mask and method for manufacturing deposition mask |
| KR102269904B1 (en) * | 2021-02-25 | 2021-06-28 | (주)세우인코퍼레이션 | Method for manufacturing open metal mask of large area for oled deposition |
| KR102405552B1 (en) * | 2021-11-16 | 2022-06-07 | (주)세우인코퍼레이션 | Method for manufacturing open metal mask of large area for oled deposition |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0867914A (en) * | 1994-08-25 | 1996-03-12 | Sumitomo Metal Ind Ltd | Production of ic lead frame material |
| CN1828410A (en) * | 2003-03-07 | 2006-09-06 | 精工爱普生株式会社 | Mask, method of manufacturing mask, device for manufacturing mask, method of manufacturing layer of luminescent material |
| CN101210307A (en) * | 2006-12-27 | 2008-07-02 | 三星Sdi株式会社 | Mask device, method of fabricating the same, and method of fabricating organic light emitting display device using the same |
| KR20090021094A (en) * | 2007-08-24 | 2009-02-27 | 다이니폰 인사츠 가부시키가이샤 | Vapor deposition mask and manufacturing method of vapor deposition mask |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1034237A (en) * | 1996-07-30 | 1998-02-10 | Sumitomo Metal Ind Ltd | Production of cold rolling stainless steel sheet with excellent flatness |
| KR100429360B1 (en) * | 1999-05-07 | 2004-04-29 | 마쯔시다덴기산교 가부시키가이샤 | Method for producing shadow mask |
| JP3651432B2 (en) * | 2001-09-25 | 2005-05-25 | セイコーエプソン株式会社 | Mask, manufacturing method thereof, and manufacturing method of electroluminescence device |
| JP4126648B2 (en) * | 2002-07-01 | 2008-07-30 | 日立金属株式会社 | Method for manufacturing metal mask member |
| JP2004185890A (en) * | 2002-12-02 | 2004-07-02 | Hitachi Metals Ltd | Metal mask |
| JP2004362908A (en) * | 2003-06-04 | 2004-12-24 | Hitachi Metals Ltd | Metal mask and manufacturing method thereof |
| JP2006247721A (en) * | 2005-03-11 | 2006-09-21 | Jfe Steel Kk | Method and apparatus for straightening shape of metallic sheet using roll having uneven cross-sectional shape for pinching metallic sheet |
| JP5294072B2 (en) * | 2009-03-18 | 2013-09-18 | 日立金属株式会社 | Etching material manufacturing method and etching material |
| JP2012059631A (en) * | 2010-09-10 | 2012-03-22 | Hitachi Displays Ltd | Mask for organic electroluminescence |
| CN103205701A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A vapor deposition mask plate and a production method thereof |
| CN202786401U (en) * | 2012-08-29 | 2013-03-13 | 四川虹视显示技术有限公司 | Mask plate for OLED evaporation |
-
2013
- 2013-08-05 JP JP2013162712A patent/JP5382259B1/en active Active
-
2014
- 2014-01-10 KR KR1020217028725A patent/KR20210112420A/en not_active IP Right Cessation
- 2014-01-10 KR KR1020177016027A patent/KR20170071610A/en not_active Application Discontinuation
- 2014-01-10 KR KR1020227044685A patent/KR20230007527A/en not_active Application Discontinuation
- 2014-01-10 CN CN201711266179.5A patent/CN107937870A/en active Pending
- 2014-01-10 CN CN201480003445.3A patent/CN104854254B/en active Active
- 2014-01-10 CN CN201711266191.6A patent/CN107858643A/en active Pending
- 2014-01-10 CN CN201910715831.XA patent/CN110306155B/en active Active
- 2014-01-10 KR KR1020217028724A patent/KR20210112419A/en not_active IP Right Cessation
- 2014-01-10 WO PCT/JP2014/050345 patent/WO2014109393A1/en active Application Filing
- 2014-01-10 KR KR1020157009819A patent/KR101749435B1/en active IP Right Review Request
- 2014-01-10 KR KR1020197029100A patent/KR20190116559A/en not_active IP Right Cessation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0867914A (en) * | 1994-08-25 | 1996-03-12 | Sumitomo Metal Ind Ltd | Production of ic lead frame material |
| CN1828410A (en) * | 2003-03-07 | 2006-09-06 | 精工爱普生株式会社 | Mask, method of manufacturing mask, device for manufacturing mask, method of manufacturing layer of luminescent material |
| CN101210307A (en) * | 2006-12-27 | 2008-07-02 | 三星Sdi株式会社 | Mask device, method of fabricating the same, and method of fabricating organic light emitting display device using the same |
| KR20090021094A (en) * | 2007-08-24 | 2009-02-27 | 다이니폰 인사츠 가부시키가이샤 | Vapor deposition mask and manufacturing method of vapor deposition mask |
| JP2009074160A (en) * | 2007-08-24 | 2009-04-09 | Dainippon Printing Co Ltd | Vapor deposition mask and method for producing vapor deposition mask |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014148743A (en) | 2014-08-21 |
| KR20170071610A (en) | 2017-06-23 |
| CN104854254A (en) | 2015-08-19 |
| KR101749435B1 (en) | 2017-06-20 |
| CN110306155B (en) | 2022-04-26 |
| JP5382259B1 (en) | 2014-01-08 |
| KR20190116559A (en) | 2019-10-14 |
| CN104854254B (en) | 2017-11-10 |
| CN107937870A (en) | 2018-04-20 |
| KR20210112420A (en) | 2021-09-14 |
| WO2014109393A1 (en) | 2014-07-17 |
| KR20230007527A (en) | 2023-01-12 |
| KR20210112419A (en) | 2021-09-14 |
| CN107858643A (en) | 2018-03-30 |
| KR20150103654A (en) | 2015-09-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110306155A (en) | The manufacturing method of deposition mask | |
| CN104838037B (en) | Metallic plate, the manufacture method of metallic plate and the method using metallic plate manufacture deposition mask | |
| CN105492654B (en) | Metallic plate, the manufacture method of metallic plate and the method using metallic plate manufacture mask | |
| CN105637110B (en) | Metallic plate, the manufacture method of metallic plate and the method that deposition mask is manufactured using metallic plate | |
| CN207498456U (en) | Deposition mask | |
| CN111004996B (en) | Method for manufacturing metal plate and method for manufacturing vapor deposition mask | |
| KR102268198B1 (en) | Vapor deposition mask substrate, vapor deposition mask substrate manufacturing method, vapor deposition mask manufacturing method, and display device manufacturing method | |
| JP6670469B2 (en) | Deposition mask and deposition mask intermediate | |
| CN208501081U (en) | Deposition mask | |
| KR102268199B1 (en) | Vapor deposition mask substrate, vapor deposition mask substrate manufacturing method, vapor deposition mask manufacturing method, and display device manufacturing method | |
| CN108286034A (en) | The manufacturing method of deposition mask, the manufacturing method of deposition mask device and deposition mask | |
| JP7190117B2 (en) | Deposition mask and deposition mask intermediate | |
| JP2019073791A (en) | Vapor deposition mask substrate, manufacturing method for the same, manufacturing method for vapor deposition mask and manufacturing method for display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |