JP6698265B2 - Method for manufacturing vapor deposition mask device, vapor deposition mask with substrate and laminated body - Google Patents

Description

  The present invention relates to a method for manufacturing a vapor deposition mask device capable of applying an appropriate value of tension to a vapor deposition mask, a vapor deposition mask with a substrate, and a laminated body.

  Conventionally, a method of forming a thin film in a desired pattern using a vapor deposition mask including through holes arranged in a desired pattern is known. In recent years, vapor deposition may be used when depositing an extremely expensive material, such as when an organic material is vapor-deposited on a substrate at the time of manufacturing an organic EL display device. The vapor deposition mask can generally be manufactured by forming a through hole in a metal plate by etching using a photolithography technique (for example, Patent Document 1).

JP 2004-39319 A

  The vapor deposition mask having such a structure is adhered to a frame made of a metal material or the like, and thus a vapor deposition mask device including the vapor deposition mask and the frame is obtained. By the way, when adhering the vapor deposition mask to the frame, the vapor deposition mask is positioned on the frame, and the vapor deposition mask is physically tensioned and then adhered.

  On the other hand, it is considered that the vapor deposition mask is produced by plating, but also in this case, it is not easy to uniformly apply tension to the vapor deposition mask when adhering the vapor deposition mask to the frame. Further, when the plating mask is made of the foil alone, the total pitch varies greatly due to variations in the internal stress of the plating, and it cannot be used for a large-sized display or a small high-definition display. For this reason, the plating mask itself has existed from the past, but there are very few practical examples.

  The present invention has been made in consideration of such a point, and a vapor deposition mask can be formed by a plating process, and a tension of an appropriate value is easily and surely applied to the vapor deposition mask, and plating is performed. An object of the present invention is to provide a vapor deposition mask device manufacturing method, a vapor deposition mask with a substrate, and a laminated body that can suppress the variation in total pitch due to (stress).

  The present invention comprises a step of forming a vapor deposition mask having a perforated region and a non-perforated region surrounding the perforated region on a substrate by a plating process to produce a vapor deposition mask with a substrate, and a perforated region of the vapor deposition mask. And a step of preparing a frame made of a material having a thermal expansion coefficient smaller than that of either the substrate or the vapor deposition mask, and laminating the vapor deposition mask with the substrate and the frame so that the vapor deposition mask faces the frame side. To produce a laminated body by heating the laminated body to a temperature higher than room temperature on a thermal control board to fix the non-perforated area of the vapor deposition mask to the frame, and return the laminated body to room temperature. A method of manufacturing a vapor deposition mask device, comprising: a step of applying tension to the vapor deposition mask; and a step of removing the substrate from the stacked body.

  The present invention is the method for manufacturing a vapor deposition mask device, wherein the substrate has a glass substrate and a conductive film provided on the glass substrate.

  The present invention is a method for manufacturing a vapor deposition mask device, wherein the substrate has a metal substrate.

  The present invention is the method for manufacturing a vapor deposition mask device, wherein the non-hole region of the vapor deposition mask is fixed to the frame with a thermosetting resin.

  The present invention is the method of manufacturing a vapor deposition mask device, wherein the non-hole region of the vapor deposition mask is welded and fixed to the frame by laser light irradiation.

  The present invention is the method for manufacturing a vapor deposition mask device, wherein the substrate is removed from the laminate by peeling.

  The present invention is the method for manufacturing a vapor deposition mask device, wherein the substrate is removed from the laminate by peeling or etching.

  The present invention relates to a vapor deposition mask with a substrate having a substrate, a vapor deposition mask formed on the substrate by plating, and having a perforated region and a non-perforated region surrounding the perforated region, and a vapor deposition mask with the substrate. A laminated body which is laminated on a vapor deposition mask, has an opening corresponding to a perforated region of the vapor deposition mask, and has a frame made of a material having a thermal expansion coefficient smaller than either the substrate or the vapor deposition mask. is there.

  The present invention provides a vapor deposition mask with a substrate, comprising: a substrate; a vapor deposition mask formed on the substrate by plating; and a vapor deposition mask having a perforated region and a non-perforated region surrounding the perforated region. is there.

  According to the present invention, a vapor deposition mask can be formed by a plating process, and an appropriate value of tension can be reliably applied to the vapor deposition mask, and fluctuations in total pitch due to plating (stress) can be suppressed. A vapor deposition mask device can be manufactured.

FIG. 1 is a diagram for explaining an embodiment of the present invention, and is a schematic perspective view showing a method for manufacturing a vapor deposition mask device including a vapor deposition mask. FIG. 2 is a diagram for explaining the embodiment of the present invention, and is a schematic perspective view showing a method for manufacturing a vapor deposition mask device including a vapor deposition mask. FIG. 3 is a view for explaining the embodiment of the present invention, and is a schematic perspective view showing a method for manufacturing a vapor deposition mask device including a vapor deposition mask. FIG. 4 is a diagram for explaining the embodiment of the present invention, and is a schematic perspective view showing a method for manufacturing a vapor deposition mask device including a vapor deposition mask. FIG. 5 is a schematic perspective view showing a vapor deposition mask device including a vapor deposition mask. FIG. 6 is a diagram for explaining a vapor deposition method using a vapor deposition mask device. FIG. 7 is a perspective view showing a vapor deposition mask with a substrate. FIG. 8A to FIG. 8D are views showing a method for manufacturing a vapor deposition mask device. FIG. 9 is a diagram showing a modified example of the present invention, and is a schematic perspective view showing a vapor deposition mask with a substrate. 10(a), (b), (c), and (d) are views for showing a modified example of the present invention, which is a diagram showing a method for manufacturing a vapor deposition mask device including a vapor deposition mask. 11(a), (b), (c), and (d) are views for showing a modified example of the present invention, and a diagram showing a method for manufacturing a vapor deposition mask device including a vapor deposition mask.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. In addition, in the drawings attached to the present specification, for convenience of illustration and understanding, the scale, the vertical and horizontal dimension ratios, etc. are appropriately exaggerated from the actual ones.

  1 to 11 are views for explaining an embodiment of the present invention and a modification thereof. In the following embodiments and modifications thereof, a method for manufacturing a vapor deposition mask device used for patterning an organic light emitting material in a desired pattern on a glass substrate when manufacturing an organic EL display device will be described as an example. To do. However, the present invention is not limited to such an application, and the present invention can be applied to vapor deposition mask devices used for various applications and methods for manufacturing vapor deposition mask devices.

  In the present specification, the terms “plate”, “sheet”, and “film” are not distinguished from each other based only on the difference in designation. For example, a “plate” is a concept that also includes members that can be called sheets and films. Therefore, “metal plate” is distinguished from members called “metal sheets” and “metal films” only by the difference in name. I don't get it.

  The term “plate surface (sheet surface, film surface)” means the target plate-shaped member (sheet-shaped member) when the target plate-shaped (sheet-shaped, film-shaped) member is viewed as a whole and comprehensively. (A member, a film-like member) refers to a surface that coincides with the plane direction. Further, the normal direction used for a plate-shaped (sheet-shaped, film-shaped) member refers to the direction normal to the plate surface (sheet surface, film surface) of the member.

  Further, as used herein, the shape and geometric conditions and their degrees are specified. For example, terms such as “parallel”, “orthogonal”, and “identical” and length and angle values are strict. Without being bound by the meaning, it should be interpreted in a range including the extent to which similar functions can be expected.

  First, an example of a vapor deposition mask device including a vapor deposition mask that can be manufactured by the method for manufacturing a vapor deposition mask according to the present embodiment will be described mainly with reference to FIGS. 1 to 5. Here, FIG. 1 to FIG. 3 are perspective views showing a method of manufacturing a vapor deposition mask device including a vapor deposition mask. The vapor deposition mask device is shown in FIG.

The vapor deposition mask device 10 shown in FIG. 4 includes a plurality of vapor deposition masks 20 made of a rectangular metal plate, and a frame 15 to which the vapor deposition masks 20 are adhered and which holds the vapor deposition masks 20. .. Each vapor deposition mask 20 includes a metal plate 21 having a first surface 21a and a second surface 21b opposite to the first surface 21a. The metal plate 21 includes a first surface 21a and a second surface 21b. A plurality of through holes 25 extending in the space are formed. As shown in FIG. 6, the vapor deposition mask device 10 is supported in the vapor deposition device 90 such that the vapor deposition mask 20 faces the glass substrate 92. Then, by a magnet (not shown), the vapor deposition mask 20 and the glass substrate 92 are urged so as to come into close contact with each other.
In the vapor deposition device 90, below the glass substrate 92 sandwiching the vapor deposition mask device 10, a crucible 94 containing a vapor deposition material (an organic light emitting material as an example) 98 and a heater 96 for heating the crucible 94 are arranged. Has been done. The vapor deposition material 98 in the crucible 94 is vaporized or sublimated by heating from the heater 96 and adheres to the surface of the glass substrate 92. As described above, a large number of through holes 25 are formed in the vapor deposition mask 20, and the vapor deposition material 98 adheres to the glass substrate 92 via the through holes 25. As a result, the vapor deposition material 98 is deposited on the surface of the glass substrate 92 in a desired pattern corresponding to the position of the through hole 25 of the vapor deposition mask 20.

  As shown in FIGS. 1 to 5, in the present embodiment, the vapor deposition mask 20 is composed of a metal film (metal plate) 21 formed by a plating process, has a substantially quadrangular shape in a plan view, and more precisely, a plan view. Has a substantially rectangular contour. The metal plate 21 of the vapor deposition mask 20 has a perforated region 22 in which the through holes 25 are formed and a non-perforated region 23 in which the through holes 25 are not formed and which occupies a region surrounding the perforated region 22. Have As shown in FIGS. 1 to 5, each perforated region 22 has a substantially quadrangular shape in plan view, and more precisely, a substantially rectangular contour in plan view. The perforated region 22 may have a stripe shape (a strip shape) or a polygonal shape such as a pentagonal shape or a hexagonal shape in a plan view.

  In the illustrated example, the plurality of perforated regions 22 are arranged at predetermined intervals along one direction parallel to one side of the vapor deposition mask 20. In the illustrated example, one perforated region 22 corresponds to one organic EL display device. That is, according to the vapor deposition mask device 10 (vapor deposition mask 20) shown in FIGS. 1 to 5, vapor deposition with multiple faces is possible.

  Further, as shown in FIGS. 1 to 5, the plurality of through holes 25 formed in each perforated region 22 are arranged in the perforated region 22 side by side at equal intervals along one direction. ..

In addition, each through hole 25 extends in a slender manner from one end to the other end of the perforated region 22 in parallel with the other direction orthogonal to the one direction.

  As described above, the vapor deposition mask device 10 has the plurality of vapor deposition masks 20 and the frame 15 to which the vapor deposition masks 20 are adhered and holds the vapor deposition masks 20, and the frame 15 has the vapor deposition masks 20. An opening 16 corresponding to the hole area 22 is formed.

  Further, as shown in FIG. 5, a plurality of warp prevention plates 60 described later are attached to the back surface of the frame 15. Each vapor deposition mask 20 held on the surface of the frame 15 has a strip-like shape having a plurality of perforated regions 22 arranged continuously, and the warp prevention plate 60 has a strip-like shape like the vapor deposition mask 20, It is arranged in the same direction as the longitudinal direction of the mask 20.

  By the way, as described later, the vapor deposition mask 20 is formed by performing a plating process on the substrate 1 having the glass substrate body 1a and the ITO film 1b formed on the substrate body 1a (FIGS. 7 and 7). 8(a) to (d)).

  In this case, the vapor deposition mask 20 and the glass substrate 1 form a vapor deposition mask 20A with a substrate. Then, by removing the substrate 1 from the vapor deposition mask 20A with a substrate, the vapor deposition mask 20 according to the present embodiment is obtained.

  The number of vapor deposition masks 20 arranged on the surface of the frame 15 is not particularly limited.

  A single vapor deposition mask 20 may be arranged on the surface of the frame 15, or two, three, or four or more vapor deposition masks 20 may be arranged on the frame 15.

  The vapor deposition mask 20 and the warp prevention plate 60 are fixed to the frame 15 by welding or an adhesive.

  Further, the number of warp prevention plates 60 attached to the back surface of the frame 15 is not particularly limited. The warp prevention plate 60 is made of a material having the same coefficient of thermal expansion as that of the vapor deposition mask 20, preferably the same material. When tension is applied to the vapor deposition mask 20 arranged on the surface of the frame 15 by using thermal expansion as described later, thermal expansion is also used for the warp prevention plate 60 also arranged on the back surface of the frame. To apply tension. As a result, the vapor deposition mask device 10 as a whole does not warp.

  If the frame 15 has sufficient rigidity, it is not necessary to provide the warp prevention plate 60 on the back surface of the frame 15.

Next, the operation of the present embodiment having such a configuration will be described.
First, a method of manufacturing the vapor deposition mask 20 will be described mainly with reference to FIGS. 7 and 8.

  First, as shown in FIG. 8A, a glass substrate 1 having a glass substrate body 1a and an ITO film 1b formed on the substrate body 1a is prepared. Next, the resist pattern 3 is formed on the ITO film 1b of the substrate 1, and the ITO film 1b is used to conduct electricity to form the plating layer 2 between the resist patterns 3 by plating.

  Next, as shown in FIG. 8B, the resist pattern 3 is removed from the glass substrate 1 to leave the plating layer 2 on the substrate 1. As a result, the vapor deposition mask 20 made of the plating layer 2 can be formed on the substrate 1. In this case, the vapor deposition mask 20 made of the plating layer 2 has a perforated region 22 having a through hole 25 corresponding to the resist pattern 3 and a non-perforated region 23 surrounding the perforated region 22.

  Further, the substrate 1 and the vapor deposition mask 20 formed by plating on the substrate 1 constitute a vapor deposition mask 20A with a substrate (see FIG. 7).

Next, the material of the vapor deposition mask 20A with a substrate will be described.
A glass substrate body having a thickness of 0.7 mm can be used as the substrate body 1a constituting the substrate 1 of the substrate-attached vapor deposition mask 20A, and the vapor deposition mask 20 has a Ni plating layer or Ni having a thickness of 1 to 20 μm. A material including the alloy-made plating layer 2 can be used.

  Next, the vapor deposition mask device 10 is manufactured using the vapor deposition mask 20A thus obtained.

  First, as shown in FIG. 8C, a plurality of vapor deposition masks 20 with a substrate described above are prepared (see FIG. 1). In this case, the vapor deposition mask 20 of each substrate-equipped vapor deposition mask 20A has a perforated region 22 and a non-perforated region 23 surrounding the perforated region 22, and a plurality of perforated regions 22 of the vapor deposition mask 20 are continuously arranged. Each vapor deposition mask 20 has a strip shape. The vapor deposition mask 20 is composed of a Ni-plated layer or a Ni-alloy plated layer and has a thermal expansion coefficient of 12.8 ppm/°C. The substrate 1 of the vapor deposition mask 20A with a substrate is made of glass having a thermal expansion coefficient of 3 to 9 ppm/°C.

  Similarly, a frame 15 having an opening 16 and having a thickness of 3 to several tens mm is prepared. In this case, the frame 15 is made of 36Ni Invar material having a thermal expansion coefficient of about 1 ppm/°C. Therefore, the frame 15 has a thermal expansion coefficient smaller than that of both the substrate 1 and the evaporation mask 20 of the evaporation mask with substrate 20A.

  Next, as shown in FIG. 1, each substrate-equipped vapor deposition mask 20A is placed on a frame 15 having an opening 16. In this case, a positioning mark 15a is provided on the surface of the frame 15, and a positioning mark 20a corresponding to the positioning mark 15a of the frame 15 is also provided on each substrate-equipped vapor deposition mask 20A. The positioning marks 15a, 20a are used to form the frame. The vapor deposition mask 20A with a substrate can be accurately positioned on the substrate 15.

  Next, as shown in FIG. 2, the vapor deposition mask 20A with a substrate, the frame 15 and the warp prevention plate 60 are laminated in this order on the thermal control board 70, and thus the vapor deposition mask 20A with a substrate and the frame 15 are stacked in this manner. Then, a laminated body 10A including the warp prevention plate 60 is manufactured.

  In this case, the warp prevention plate 60 is preferably made of a material having the same coefficient of thermal expansion as the vapor deposition mask 20A with a substrate, for example, a glass material. The warp prevention plate 60 is located between the openings 16 of the frame 15 on the back surface of the frame 15.

  The heat control board 70 has a function as a hot plate for heating the laminated body 10A or a cold plate for cooling the laminated body 10A.

  Next, in FIG. 2, the laminate 10A is heated on the thermal control board 70 from room temperature of 20° C. to 50° C., for example.

  At this time, on the thermal control board 70, the laminated body 20A is heated to 50° C. as a whole, and the frame 15 made of 36Ni Invar material of the laminated body 20A does not significantly expand thermally. The warp prevention plate 60 thermally expands based on its own coefficient of thermal expansion. In this state, laser light is irradiated from the glass substrate 1 side to the non-perforated region 23 of the vapor deposition mask 20A with a substrate on the frame 15 to weld the non-perforated region 23 of the vapor deposition mask 20A with a substrate to the frame 15. Let In this way, the vapor deposition mask 20A with the substrate is fixed to the frame 15 through the fixing portions 65 (see FIGS. 3 and 8C).

  Next, the warp prevention plate 60 is adhered to the back surface of the frame 15. In this case, the laminated body 10A is repeatedly drawn on the heat control board 70 to bond the warp prevention plate 60 located between the openings 16 of the frame 15 to the frame 15.

  Then, as shown in FIG. 4, the laminated body 10A is unloaded from the thermal control panel 70, cooled to room temperature, and returned. In this case, the shape of the frame 15 made of 36Ni Invar material hardly changes, but the vapor deposition mask 20A with a substrate is cooled to room temperature and thermally contracts. Since the vapor deposition mask 20A with a substrate is fixed to the frame 15, an appropriate tension is applied to the vapor deposition mask 20A with a substrate in association with the thermal contraction action, and the fluctuation of the total pitch due to plating (stress) is suppressed. can do.

  Similarly, since the warp prevention plate 60 is also adhered to the frame 15, the warp prevention plate 60 is cooled to room temperature and heat-shrinks, and a tension is applied to the warp prevention plate 60 along with the heat-shrinking action.

  After that, the substrate 1 of each vapor deposition mask 20A with a substrate on the frame 15 is peeled from the stacked body 10A (see FIGS. 4 and 8D).

  In this way, the substrate 1 of the vapor deposition mask 20A with a substrate is peeled from the laminated body 10A, and the vapor deposition mask 20 fixed on the frame 15 is obtained (see FIG. 5).

As described above, according to the present embodiment, the laminated body 10A including the vapor deposition mask with a substrate 20A, the frame 15, and the warp prevention plate 60 is heated on the thermal control board 70, and in this state, the vapor deposition mask with a substrate. 20A and the warp prevention plate 60 are fixed and adhered to the frame 15, and then the laminated body 10A is cooled to room temperature.
This makes it possible to apply appropriate tension to the vapor deposition mask 20A with a substrate and the vapor deposition mask 20. Further, as compared with the case where the vapor deposition mask 20A with a substrate is physically pulled and the vapor deposition mask 20A with a substrate is fixed to the frame 15, the vapor deposition mask with a substrate is set by setting the heating temperature by the heat control board 70 to a desired value. It is possible to always apply an appropriate value of tension to the frame 20A and the vapor deposition mask 20 uniformly in the frame 15.

  Further, the non-perforated area 23 of the vapor deposition mask with substrate 20A is adhered onto the frame 15 via the fixing points 65, and the fixing points 65 are provided on the left and right of each perforated area 22 along the width direction of the vapor deposition mask with substrate 20A. By continuously providing (see FIG. 4), tension can be applied to each of the perforated regions 22 of the vapor deposition mask 20A with a substrate in both the longitudinal direction and the width direction of the vapor deposition mask 20.

  Furthermore, the vapor deposition mask 20A with a substrate is thermally shrunk on the front surface side of the frame 15 to apply tension to the vapor deposition mask 20, and the warp prevention plate 60 is also thermally shrunk on the back surface side of the frame 15 to prevent the warp prevention plate. Since tension can be applied to 60, it is possible to prevent the entire vapor deposition mask device 10 from bending to one side.

  Next, a modified example of the present invention will be described. In the above-described embodiment, an example in which the vapor deposition mask 20A with a substrate is fixed to the frame 15 by irradiating the vapor deposition mask 20A with a substrate with a laser beam is shown, but the present invention is not limited to this, and FIGS. As shown in, the adhesive 5 may be applied to the non-perforated region 23 surrounding the perforated region 22 of the vapor deposition mask with substrate 20A using the adhesive applicator 5a.

  In the modified examples shown in FIGS. 9 and 10, the same parts as those of the embodiment shown in FIGS. 1 to 8 are designated by the same reference numerals, and detailed description thereof will be omitted.

  That is, first, as shown in FIG. 10A, a glass substrate 1 having a glass substrate body 1a and an ITO film 1b formed on the substrate body 1a is prepared. Next, the resist pattern 3 is formed on the ITO film 1b of the substrate 1, and the ITO film 1b is used to conduct electricity to form the plating layer 2 between the resist patterns 3 by plating.

  Next, as shown in FIG. 10B, the resist pattern 3 is removed from the glass substrate 1 to leave the plating layer 2 on the substrate 1. As a result, the vapor deposition mask 20 made of the plating layer 2 can be formed on the substrate 1. In this case, the vapor deposition mask 20 made of the plating layer 2 has a perforated region 22 having a through hole 25 corresponding to the resist pattern 3 and a non-perforated region 23 surrounding the perforated region 22.

  Further, the substrate 1 and the vapor deposition mask 20 formed by plating on the substrate 1 constitute a vapor deposition mask 20A with a substrate (see FIG. 7).

  Next, as shown in FIG. 10C, the adhesive 5 is applied to the non-perforated area 23 surrounding the perforated area 22 in the vapor deposition mask 20A with a substrate. The adhesive 5 is a UV light curable adhesive.

  Next, the vapor deposition mask 20A with a substrate is laminated on the glass frame 15 having a smaller thermal expansion coefficient than the glass base material 1 to form a laminated body 10A, and the laminated body 10A is placed on the thermal control board 70. The laminate 10A is heated from room temperature of 20° C. to 50° C.

  When the laminated body 10A is heated to 50° C. to expand the laminated body, the adhesive 5 is irradiated with UV light from the glass frame 15 side to cure the adhesive 5. In this way, the vapor deposition mask 20A with the substrate is fixed to the frame 15. Thereafter, a warp prevention plate 60 is adhered to the back surface of the frame 15, and the laminate 10A is lowered from the heat control board 70 and cooled to room temperature, whereby tension can be applied to the vapor deposition mask with substrate 20A.

  Thereafter, as shown in FIG. 10D, the substrate 1 is peeled off from the laminated body 10A to obtain the vapor deposition mask 20 fixed on the frame 15.

  In the modification shown in FIGS. 10A to 10D, an example in which the UV curable adhesive 5 is applied to the non-perforated region 23 surrounding the perforated region 22 in the substrate-equipped vapor deposition mask 20A has been shown. However, not limited to this, a thermosetting adhesive 5 may be used instead of the UV curing adhesive 5.

  In this case, the adhesive 5 is cured only by placing the laminated body 10A on the heat control board 70 and heating the laminated body 10A from room temperature of 20° C. to 50° C. Therefore, UV light is applied to the adhesive 5. No need to irradiate.

Next, another modification of the present invention will be described with reference to FIGS. 11(a)(b)(c)(d).
As shown in FIG. 11A, a metal substrate 6, for example, a Cu or sus substrate 6 may be prepared instead of the glass substrate 1. Next, the resist pattern 3 is formed on the metal substrate 6, and the substrate 6 is energized to form the plating layer 2 between the resist patterns 3 by plating.

  Next, as shown in FIG. 11B, the resist pattern 3 is removed from the substrate 6 to leave the plating layer 2 on the substrate 6. As a result, the vapor deposition mask 20 made of, for example, the Ni-made plating layer or the Ni-alloy plating layer 2 can be formed on the substrate 6. In this case, the vapor deposition mask 20 made of the plating layer 2 has a hole area 22 having a through hole 25 corresponding to the resist pattern 3 and a non-hole area 23 surrounding the hole area 22.

  Further, the substrate 6 and the vapor deposition mask 20 formed on the substrate 6 by a plating process form a vapor deposition mask 20A with a substrate (see FIG. 7).

  Next, as shown in FIG. 11C, the adhesive 5 is applied to the non-perforated region 23 surrounding the perforated region 22 of the vapor deposition mask 20A with a substrate. The adhesive 5 is a thermosetting adhesive.

  Next, the vapor deposition mask 20A with a substrate is laminated on the frame 15 to form a laminated body 10A, the laminated body 10A is placed on the thermal control board 70, and the laminated body 10A is heated from room temperature of 20° C. to 50° C. To do.

  When the laminated body 10A is heated to 50° C. to expand the laminated body, the thermosetting resin 5 is cured. In this way, the vapor deposition mask 20A with the substrate is fixed to the frame 15. Thereafter, a warp prevention plate 60 is adhered to the back surface of the frame 15, and the laminate 10A is lowered from the heat control board 70 and cooled to room temperature, whereby tension can be applied to the vapor deposition mask with substrate 20A.

  Thereafter, as shown in FIG. 11D, the substrate 6 is peeled off from the laminated body 10A to obtain the vapor deposition mask 20 fixed on the frame 15.

  In the modification shown in FIGS. 11A to 11D, the vapor deposition mask 20A with a substrate has a metal substrate 6 and a vapor deposition mask 20 made of a plating layer.

  The metal substrate 6 is a Cu substrate having a thermal expansion coefficient of 16.8 ppm/° C. or a SUS substrate having a thermal expansion coefficient of 17.3 ppm/° C.

  The vapor deposition mask 20 is composed of a Ni-made plating layer or a Ni-alloy plating layer 2 having a thermal expansion coefficient of 12.8 ppm/°C.

  Therefore, as the frame 15, a material having a thermal expansion coefficient smaller than that of either the substrate 6 or the vapor deposition mask 20, for example, 36% Ni Invar material having a thermal expansion coefficient of 1 ppm/° C., or a thermal expansion coefficient of 3 to 9 ppm/° C. A glass material can be used.

  In this way, as the frame 15, a material having a thermal expansion coefficient smaller than that of either the substrate 6 or the vapor deposition mask 20 is used. As a result, the laminated body 10A is heated by the thermal control board 70, the frame 15 and the vapor deposition mask 20A with the substrate are fixed to each other, and then the laminated body 10A is cooled, and the tension is appropriately applied to the vapor deposition mask 20A with the substrate. can do.

  In addition, in the modified example shown in FIGS. 11A to 11D, when the vapor deposition mask 20A with a substrate having the metal substrate 6 and the vapor deposition mask 20 including the plating layer 2 is used, the warp prevention plate 60 is used. A material having a thermal expansion coefficient similar to that of the vapor deposition mask 20A with a substrate can be used.

  Further, in the modified examples shown in FIGS. 11A to 11D, the example in which the substrate 6 is peeled from the laminated body 10A is shown, but the invention is not limited to peeling the substrate 6 from the laminated body 10A, and the metal is removed from the laminated body 10A. The manufactured substrate 6 may be removed by etching.

1 Substrate 1a Substrate body 1b ITO film 2 Plating layer 3 Resist pattern 5 Adhesive 6 Substrate 10 Vapor deposition mask device 10A Laminated body 15 Frame 16 Opening 20 Vapor deposition mask 20A Vapor deposition mask with substrate 21 Metal plate 21a First surface 21b Second surface 22 Perforated area 23 Non-perforated area 25 Through hole 60 Warp prevention plate 65 Fixed part 70 Thermal control panel

Claims (3)

On a substrate having a glass substrate and a conductive film provided on the glass substrate , a vapor deposition mask having a perforated region and a non-perforated region surrounding the perforated region is formed by plating and arranged in parallel. A step of producing a plurality of vapor deposition masks with a substrate having a strip shape, and the vapor deposition masks of the vapor deposition masks of the respective substrates having a plurality of perforated regions arranged continuously,
Preparing a frame made of a material having an opening corresponding to each perforated region of the vapor deposition mask of each substrate and having a coefficient of thermal expansion smaller than either the substrate of the vapor deposition mask with each substrate or the vapor deposition mask; ,
A step of laminating each substrate-equipped vapor deposition mask and a frame so that the vapor deposition mask faces the frame side to produce a laminate,
Heating the laminated body to a temperature higher than room temperature on the thermal control board, and fixing the non-perforated area of the vapor deposition mask of the vapor deposition mask with each substrate to the frame,
A step of applying tension to the vapor deposition mask of each substrate-equipped vapor deposition mask by returning the laminate to room temperature,
And a step of removing the substrate of the vapor deposition mask with each substrate from the laminate by etching .   The method of manufacturing a vapor deposition mask device according to claim 1, wherein the non-hole region of the vapor deposition mask of each vapor deposition mask with a substrate is fixed to the frame with a thermosetting resin.   2. The method for manufacturing a vapor deposition mask device according to claim 1, wherein the non-hole area of the vapor deposition mask of each substrate-equipped vapor deposition mask is welded and fixed to the frame by laser light irradiation.

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