KR102202529B1 - Producing method of mask integrated frame and mask changing method of mask integrated frame - Google Patents

Abstract

The present invention relates to a method of manufacturing a frame-integrated mask and a method of separating/replacing a mask of the frame-integrated mask. A method of manufacturing a frame-integrated mask according to the present invention is a method of manufacturing a frame-integrated mask in which a plurality of masks 100 and a frame 200 supporting the mask 100 are integrally formed, comprising: (a) a plurality of mask patterns ( Providing a mask supporting template in which the mask 100 on which the P) is formed is adhered to the template 50, (b) providing a frame 200 having a plurality of mask cell regions CR, (c ) Elevating (ET) the temperature of the process area including the frame 200 to a first temperature, (d) loading the template 50 on the frame 200 to attach the mask 100 to the mask cell area of the frame The steps corresponding to (CR), (e) attaching the mask 100 to the frame 200 by irradiating a laser L to the weld WP of the mask 100, (f) (d) to Repeating step (e) to adhere the mask 100 to all mask cell regions CR of the frame 200, (g) lowering the temperature of the process region including the frame 200 to a second temperature ( It characterized in that it comprises a step of LT).

Description

Manufacturing method of frame-integrated mask and method of removing/replacement of mask in frame-integrated mask {PRODUCING METHOD OF MASK INTEGRATED FRAME AND MASK CHANGING METHOD OF MASK INTEGRATED FRAME}

The present invention relates to a method of manufacturing a frame-integrated mask and a method of separating/replacing a mask of the frame-integrated mask. In more detail, it is possible to stably support and move without deformation of the mask, make alignment between each mask clear, and prevent deformation of the frame in the process of separating and replacing the mask from the frame. The present invention relates to a method for manufacturing a frame-integrated mask and a method for separating/replacement of a mask for a frame-integrated mask.

As a technology for forming pixels in the OLED manufacturing process, the Fine Metal Mask (FMM) method is mainly used in which an organic material is deposited at a desired location by attaching a thin metal mask to a substrate.

In the existing OLED manufacturing process, the mask is manufactured in the form of a stick or plate, and then the mask is welded and fixed to the OLED pixel deposition frame. One mask may include several cells corresponding to one display. In addition, in order to manufacture a large area OLED, several masks can be fixed to the OLED pixel deposition frame. In the process of fixing to the frame, each mask is stretched so that it is flat. It is a very difficult task to adjust the tension so that the entire part of the mask is flat. In particular, in order to align a mask pattern with a size of only a few to tens of μm while making all the cells flat, a high level of work is required to check the alignment in real time while finely adjusting the tension applied to each side of the mask. do.

Nevertheless, in the process of fixing several masks to one frame, there is a problem in that the alignment between the masks and the mask cells is not good. Also, in the process of welding and fixing the mask to the frame, the thickness of the mask film is too thin and large area, so the mask is struck or distorted by the load, There were problems such as misalignment.

In the case of ultra-high-definition OLED, the current QHD quality is 500-600 PPI (pixel per inch), and the pixel size reaches about 30-50㎛, and 4K UHD, 8K UHD high-definition is higher than this, ~860 PPI, ~1600 PPI, etc. Will have a resolution of. In this way, in consideration of the pixel size of the ultra-high-definition OLED, the alignment error between cells should be reduced to about several µm, and the error beyond this leads to product failure, so the yield may be very low. Therefore, there is a need to develop a technique for preventing deformation such as a mask being struck or distorted, a technique for clarifying alignment, a technique for fixing a mask to a frame, and the like.

On the other hand, when the mask is partially aligned or a defect occurs in the mask, the mask must be removed, but there is a problem that the alignment of other masks is misaligned in the process of separating and replacing the welded mask.

Therefore, the present invention has been devised to solve the problems of the prior art as described above, and it is possible to stably support and move the mask without deformation, prevent deformation such as the mask being struck or distorted, and clear alignment. It is an object of the present invention to provide a method for manufacturing a frame-integrated mask that can be used.

In addition, an object of the present invention is to provide a method for manufacturing a frame-integrated mask in which the manufacturing time is remarkably reduced and the yield is significantly increased.

In addition, the present invention is a mask separation/replacement method for a frame-integrated mask that can prevent deformation such as distortion of the frame in a frame-integrated mask in which a mask and a frame form an integrated structure, and to separate and replace the mask so that the mask is clearly aligned Its purpose is to provide.

The above object of the present invention is to provide a method for manufacturing a frame-integrated mask in which a plurality of masks and a frame supporting the mask are integrally formed, (a) providing a mask supporting template in which a mask having a plurality of mask patterns is adhered to the template. Step to do; (b) providing a frame having a plurality of mask cell regions; (c) raising the temperature of the process region including the frame to a first temperature; (d) loading the template onto the frame to correspond the mask to the mask cell area of the frame; (e) attaching the mask to the frame by irradiating a laser to the welding portion of the mask; (f) repeating steps (d) to (e) to attach a mask to all mask cell areas of the frame; (g) lowering the temperature of the process region including the frame to a second temperature, which is achieved by a method of manufacturing a frame-integrated mask.
Step (a) may include (a1) providing a mask metal film; (a2) adhering a mask metal film on the template in which the temporary adhesive part is formed on one surface; And (a3) forming a mask pattern on the mask metal layer to manufacture a mask, thereby providing a mask supporting template in which a mask having a plurality of mask patterns formed thereon is adhered to the template.
The mask metal film may be formed by rolling or electroforming.
Between steps (a2) and (a3), the step of reducing the thickness of the mask metal film adhered to the template may be further included.
The temporary bonding unit may be an adhesive or adhesive sheet that can be separated by applying heat, and an adhesive or adhesive sheet that can be separated by UV irradiation.
The temporary adhesive may be a liquid wax or a thermal release tape.
The liquid wax can fix the mask metal film and the template at a temperature lower than 85°C.
Step (a3) may include (a3-1) forming a patterned insulating portion on the mask metal film; (a3-2) forming a mask pattern by etching a portion of the mask metal layer exposed between the insulating portions; And (a3-3) may include the step of removing the insulation.
The template may be a transparent material.
The template may include any one material of wafer, glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, and zirconia. have.
In step (e), the laser irradiated from the top of the template may pass through the laser through hole and be irradiated to the welding portion of the mask.
In step (e), a welding bead is formed on a portion of the welding portion to which the laser is irradiated, and the welding bead may be mediated so that the mask and the frame are integrally connected.
The first temperature may be equal to or higher than the OLED pixel deposition process temperature, and the second temperature may be at least lower than the first temperature.
The first temperature is any one of 25°C to 60°C, the second temperature is any one of 20°C to 30°C lower than the first temperature, and the OLED pixel deposition process temperature is any one of 25°C to 45°C. It can be one temperature.
In step (d), the mask on the template may correspond to the mask cell area only by controlling the position of the template without applying tension to the mask.
When the temperature of the process region is lowered to the second temperature in step (g), the mask attached to the frame is contracted and tension may be applied.
Between steps (e) and (f), at least one of heat application, chemical treatment, ultrasonic application, and UV application to the temporary bonding portion may be performed to separate the mask and the template.
The frame includes: a frame frame portion including a hollow area; And a mask cell sheet part connected to the frame frame part and including a plurality of mask cell regions.
The mask cell sheet portion, the frame sheet portion; And at least one first grid sheet portion extending in the first direction and having both ends connected to the edge sheet portion.
The mask cell sheet portion may further include at least one second grid sheet portion extending in a second direction perpendicular to the first direction, crossing the first grid sheet portion, and having both ends connected to the edge sheet portion.
The mask and frame may be made of any one of invar, super invar, nickel, and nickel-cobalt.
In addition, the above object of the present invention is a mask separation/replacement method for a frame-integrated mask in which a plurality of masks and a frame supporting the mask are integrally formed, wherein (a) the temperature of the process region including the frame is changed to a first temperature. Raising; (b) separating the target mask from the frame; (c) preparing a mask support template in which a plurality of mask patterns are formed on the template, and loading the template onto the frame to correspond the mask to the mask cell area where the target mask is separated; (d) attaching the mask to the frame by irradiating a laser to the welding portion of the mask; (e) lowering the temperature of the process region including the frame to a second temperature, which is achieved by a method of removing/replacement of a mask for a frame-integrated mask.
The first temperature may be equal to or higher than the OLED pixel deposition process temperature, and the second temperature may be at least lower than the first temperature.
The first temperature is any one of 25°C to 60°C, the second temperature is any one of 20°C to 30°C lower than the first temperature, and the OLED pixel deposition process temperature is any one of 25°C to 45°C. It can be one temperature.
In step (c), the mask on the template may correspond to the mask cell area only by controlling the position of the template without applying tension to the mask.
When the temperature of the process region is raised to the first temperature in step (a), the tension applied to the mask attached to the frame may be released.
When the temperature of the process region is lowered to the second temperature in step (e), the mask attached to the frame is contracted and tension may be applied again.
In step (b), the outer frame portion of at least one edge of the target mask to be separated/replaced is compressed, and an external force is applied to one edge of the mask to separate the mask from the frame.
In step (b), the upper surface and the lower surface of the outer frame portion of one corner of the mask may be compressed.
In step (b), an external force is applied to one edge of the mask to remove one edge of the mask from the frame, and an external force is applied to the other edge opposite to one side of the mask to remove the other edge from the frame, and the mask is separated from the frame. can do.

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According to the present invention configured as described above, there is an effect of stably supporting and moving the mask without deformation, preventing deformation such as the mask being struck or twisted, and clarifying alignment.

Further, according to the present invention, there is an effect of remarkably reducing the manufacturing time and increasing the yield remarkably.

In addition, according to the present invention, in a frame-integrated mask in which a mask and a frame are integrally structured, deformation such as distortion of a frame can be prevented and the mask can be separated and replaced so that the alignment of the mask is clear.

1 is a schematic diagram showing a conventional OLED pixel deposition mask.
2 is a schematic diagram showing a process of attaching a conventional mask to a frame.
3 is a schematic diagram showing that an alignment error between cells occurs in a process of tensioning a conventional mask.
4 is a front view and a side cross-sectional view showing a frame-integrated mask according to an embodiment of the present invention.
5 is a front view and a side cross-sectional view showing a frame according to an embodiment of the present invention.
6 is a schematic diagram showing a manufacturing process of a frame according to an embodiment of the present invention.
7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention.
8 is a schematic diagram showing a conventional mask for forming a high-resolution OLED.
9 is a schematic diagram showing a mask according to an embodiment of the present invention.
10 is a schematic diagram illustrating a process of manufacturing a mask metal film according to an embodiment of the present invention by a rolling method.
11 is a schematic diagram illustrating a process of manufacturing a mask metal film according to another embodiment of the present invention by electroforming.
12 to 13 are schematic diagrams illustrating a process of manufacturing a mask supporting template by attaching a mask metal layer on a template according to an embodiment of the present invention and forming a mask.
14 is an enlarged cross-sectional schematic view showing a temporary bonding unit according to an embodiment of the present invention.
15 is a schematic diagram illustrating a process of loading a mask supporting template onto a frame according to an embodiment of the present invention.
FIG. 16 is a schematic diagram illustrating a state in which a template is loaded onto a frame after increasing the temperature of a process area according to an embodiment of the present invention to correspond to a cell area of the frame.
17 is a schematic diagram illustrating a process of separating a mask from a template after attaching a mask to a frame according to an embodiment of the present invention.
18 is a schematic diagram illustrating a state in which a mask is associated with a cell area of a neighboring frame according to an embodiment of the present invention.
19 is a schematic diagram illustrating a process of separating a mask from a template after attaching a mask to a cell area of an adjacent frame according to an embodiment of the present invention.
20 is a schematic diagram showing a state in which a mask is attached to a frame according to an embodiment of the present invention.
21 is a schematic diagram illustrating a process of lowering a temperature of a process area after attaching a mask to a cell area of a frame according to an embodiment of the present invention.
22 is a schematic diagram showing an OLED pixel deposition apparatus using a frame-integrated mask according to an embodiment of the present invention.
23 is a schematic diagram showing a problem in the case of separating the mask from the frame-integrated mask.
24 to 26 are schematic diagrams illustrating a process of separating and replacing a mask in a frame-integrated mask according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION The detailed description of the present invention to be described later refers to the accompanying drawings, which illustrate specific embodiments in which the present invention may be practiced. These embodiments are described in detail sufficient to enable a person skilled in the art to practice the present invention. It is to be understood that the various embodiments of the present invention are different from each other, but need not be mutually exclusive. For example, specific shapes, structures, and characteristics described herein may be implemented in other embodiments without departing from the spirit and scope of the present invention in relation to one embodiment. In addition, it is to be understood that the location or arrangement of individual components within each disclosed embodiment may be changed without departing from the spirit and scope of the present invention. Accordingly, the detailed description to be described below is not intended to be taken in a limiting sense, and the scope of the present invention, if properly described, is limited only by the appended claims, along with all scopes equivalent to those claimed by the claims. In the drawings, similar reference numerals refer to the same or similar functions over several aspects, and the length, area, thickness, and the like may be exaggerated and expressed for convenience.
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings in order to enable those of ordinary skill in the art to easily implement the present invention.
1 is a schematic diagram showing a conventional OLED pixel deposition mask 10.
Referring to FIG. 1, a conventional mask 10 may be manufactured in a stick-type or plate-type. The mask 10 shown in (a) of FIG. 1 is a stick-type mask, and both sides of the stick can be welded and fixed to an OLED pixel deposition frame. The mask 100 shown in (b) of FIG. 1 is a plate-type mask and may be used in a process of forming a pixel having a large area.
A plurality of display cells C are provided on the body of the mask 10 (or the mask layer 11). One cell C corresponds to one display such as a smartphone. A pixel pattern P is formed in the cell C to correspond to each pixel of the display. When the cell C is enlarged, a plurality of pixel patterns P corresponding to R, G, and B appear. For example, a pixel pattern P is formed in the cell C to have a resolution of 70 X 140. That is, a number of pixel patterns P are clustered to form one cell C, and a plurality of cells C may be formed on the mask 10.
2 is a schematic diagram showing a process of attaching the conventional mask 10 to the frame 20. 3 is a schematic diagram showing that an alignment error occurs between cells in a process of stretching the conventional mask 10 (F1 to F2). A stick mask 10 including six cells C: C1 to C6 shown in FIG. 1A will be described as an example.
Referring to FIG. 2A, first, the stick mask 10 must be flattened. The stick mask 10 is unfolded as it is pulled by applying a tensile force F1 to F2 in the long axis direction of the stick mask 10. In that state, the stick mask 10 is loaded on the frame 20 in the form of a square frame. Cells C1 to C6 of the stick mask 10 are located in a blank area inside the frame of the frame 20. The frame 20 may have a size such that cells C1 to C6 of one stick mask 10 are located in an empty area inside the frame, and cells C1 to C6 of a plurality of stick masks 10 are It may be large enough to be located in an internal empty area.
Referring to FIG. 2(b), after aligning while finely adjusting the tensile forces (F1 to F2) applied to each side of the stick mask 10, a part of the side of the stick mask 10 is welded (W). Accordingly, the stick mask 10 and the frame 20 are interconnected. 2C shows a cross-sectional side view of the frame and the stick mask 10 connected to each other.
Referring to FIG. 3, although the tensile forces F1 to F2 applied to each side of the stick mask 10 are finely adjusted, there is a problem in that the mask cells C1 to C3 are not well aligned with each other. For example, the distances D1 to D1" and D2 to D2" between the patterns P of the cells C1 to C3 are different from each other, or the patterns P are skewed. Since the stick mask 10 has a large area including a plurality (for example, 6) of cells C1 to C6 and has a very thin thickness of several tens of µm, it is easily struck or distorted by a load. In addition, it is a very difficult task to check the alignment between each cell (C1 to C6) in real time through a microscope while adjusting the tensile force (F1 to F2) to flatten all of the cells (C1 to C6).
Therefore, a minute error in the tensile force (F1 to F2) may cause an error in the extent to which each of the cells (C1 to C3) of the stick mask 10 is stretched or unfolded, and accordingly, the distance D1 between the mask patterns (P) ~D1", D2 ~ D2") causes a problem that becomes different. Of course, it is difficult to completely align the error to be 0, but in order to prevent the mask pattern (P) having a size of several to tens of µm from adversely affecting the pixel process of an ultra-high-definition OLED, the alignment error should not exceed 3 µm. It is desirable not to. This alignment error between adjacent cells is referred to as PPA (pixel position accuracy).
In addition, a plurality of stick masks 10 of about 6 to 20 are connected to one frame 20, respectively, between a plurality of stick masks 10, and a plurality of cells C of the stick mask 10 It is also a very difficult task to clarify the alignment state between ~C6), and the process time according to the alignment is inevitably increased, which is a significant reason for reducing productivity.
On the other hand, after the stick mask 10 is connected and fixed to the frame 20, the tensile forces F1 to F2 applied to the stick mask 10 may act in reverse to the frame 20. That is, after the stick mask 10, which was stretched by the tensile force F1 to F2, is connected to the frame 20, a tension may be applied to the frame 20. Usually, this tension is not large and may not have a large effect on the frame 20, but when the size of the frame 20 is reduced in size and the rigidity is lowered, this tension may finely deform the frame 20. As a result, there may be a problem of misalignment between the plurality of cells C to C6.
Accordingly, the present invention proposes a frame 200 and a frame-integrated mask that enables the mask 100 to form an integral structure with the frame 200. The mask 100 integrally formed in the frame 200 is prevented from being struck or warped, and may be clearly aligned with the frame 200. Since no tensile force is applied to the mask 100 when the mask 100 is connected to the frame 200, the frame 200 may not be deformed after the mask 100 is connected to the frame 200. . In addition, the manufacturing time for integrally connecting the mask 100 to the frame 200 can be significantly reduced, and the yield can be remarkably increased.
Figure 4 is a front view [Fig. 4 (a)] and a side cross-sectional view [Fig. 4 (b)] showing a frame-integrated mask according to an embodiment of the present invention, Figure 5 is according to an embodiment of the present invention It is a front view [FIG. 5(a)] and a side cross-sectional view [FIG. 5(b)] showing the frame.
4 and 5, the frame-integrated mask may include a plurality of masks 100 and one frame 200. In other words, a plurality of masks 100 are attached to the frame 200, one by one. Hereinafter, for convenience of explanation, a square-shaped mask 100 will be described as an example, but the mask 100 may be in the form of a stick mask having protrusions clamped on both sides before being attached to the frame 200, and the frame 200 ), the protrusion can be removed after being attached.
A plurality of mask patterns P may be formed on each mask 100, and one cell C may be formed on one mask 100. One mask cell C may correspond to one display such as a smartphone.
Mask 100 may be a coefficient of thermal expansion of about 1.0 X 10 ^-6 / ℃ of invar (invar), about 1.0 X 10 ^-7 / ℃ Super Invar (super invar) material. Since the mask 100 made of this material has a very low coefficient of thermal expansion, it is less likely that the pattern shape of the mask may be deformed by thermal energy, so it can be used as a Fine Metal Mask (FMM) or a shadow mask in high-resolution OLED manufacturing. In addition, considering the recent development of technologies for performing a pixel deposition process in a range where the temperature change value is not large, the mask 100 is made of nickel (Ni) and nickel-cobalt (Ni-Co) having a slightly larger coefficient of thermal expansion than this. ), etc. The mask 100 may be formed of a metal sheet produced by a rolling process or electroforming. It will be described later in detail with reference to FIGS. 9 and 10.
The frame 200 is formed to attach a plurality of masks 100. The frame 200 may include several corners formed in a first direction (eg, horizontal direction) and a second direction (eg, vertical direction) including an outermost edge. These various corners may partition a region on the frame 200 to which the mask 100 is to be attached.
The frame 200 may include a frame portion 210 having a substantially square shape or a square frame shape. The inside of the frame frame 210 may have a hollow shape. That is, the frame frame unit 210 may include a hollow region R. The frame 200 may be made of metal materials such as Invar, Super Invar, aluminum, titanium, etc., and in consideration of thermal deformation, it is composed of materials such as Invar, Super Invar, nickel, nickel-cobalt, etc., which have the same coefficient of thermal expansion as the mask. Preferably, these materials may be applied to both the frame part 210 and the mask cell sheet part 220 which are components of the frame 200.
In addition, the frame 200 may include a plurality of mask cell regions CR, and may include a mask cell sheet part 220 connected to the frame frame part 210. Like the mask 100, the mask cell sheet part 220 may be formed by rolling, or may be formed using another film forming process such as electroplating. In addition, the mask cell sheet part 220 may form a plurality of mask cell regions CR on a planar sheet through laser scribing, etching, or the like, and then connect to the frame frame part 210. Alternatively, the mask cell sheet part 220 may form a plurality of mask cell regions CR through laser scribing, etching, or the like after connecting the planar sheet to the frame frame part 210. In the present specification, it is assumed that a plurality of mask cell regions CR are first formed in the mask cell sheet part 220 and then connected to the frame frame part 210.
The mask cell sheet part 220 may be configured to include at least one of an edge sheet part 221 and first and second grid sheet parts 223 and 225. The frame sheet portion 221 and the first and second grid sheet portions 223 and 225 refer to respective portions partitioned in the same sheet, and they are integrally formed with each other.
The frame sheet part 221 may be substantially connected to the frame frame part 210. Accordingly, the frame sheet part 221 may have a substantially square shape and a square frame shape corresponding to the frame frame part 210.
In addition, the first grid sheet portion 223 may be formed to extend in a first direction (horizontal direction). The first grid sheet portion 223 may be formed in a linear shape so that both ends may be connected to the edge sheet portion 221. When the mask cell sheet portion 220 includes a plurality of first grid sheet portions 223, it is preferable that each of the first grid sheet portions 223 form equal intervals.
Further, in addition to this, the second grid sheet portion 225 may be formed to extend in a second direction (vertical direction). The second grid sheet portion 225 may be formed in a linear shape so that both ends may be connected to the edge sheet portion 221. The first grid sheet portion 223 and the second grid sheet portion 225 may vertically cross each other. When the mask cell sheet portion 220 includes a plurality of second grid sheet portions 225, each of the second grid sheet portions 225 is preferably formed at an equal interval.
Meanwhile, the spacing between the first grid sheet parts 223 and the spacing between the second grid sheet parts 225 may be the same or different according to the size of the mask cell C.
The first grid sheet portion 223 and the second grid sheet portion 225 have a thin thickness in the form of a thin film, but the shape of a cross-section perpendicular to the length direction may be a rectangle, a square shape such as a trapezoid, a triangle shape, etc., Some of the sides and corners may be rounded. The cross-sectional shape can be adjusted in the process of laser scribing and etching.
The thickness of the frame frame part 210 may be thicker than the thickness of the mask cell sheet part 220. Since the frame frame portion 210 is responsible for the overall rigidity of the frame 200, it may be formed to a thickness of several mm to several cm.
In the case of the mask cell sheet part 220, the process of manufacturing a substantially thick sheet is difficult, and if it is too thick, the organic material source 600 (see FIG. 22) passes through the mask 100 in the OLED pixel deposition process. It can cause clogging problems. Conversely, if the thickness is too thin, it may be difficult to secure enough rigidity to support the mask 100. Accordingly, the mask cell sheet portion 220 is thinner than the thickness of the frame frame portion 210, but is preferably thicker than the mask 100. The thickness of the mask cell sheet part 220 may be about 0.1 mm to 1 mm. In addition, the first and second grid sheet portions 223 and 225 may have a width of about 1 to 5 mm.
A plurality of mask cell areas CR (CR11 to CR56) may be provided except for the area occupied by the edge sheet portion 221 and the first and second grid sheet portions 223 and 225 in a flat sheet. In another aspect, the mask cell area CR is an area occupied by the frame sheet part 221 and the first and second grid sheet parts 223 and 225 in the hollow area R of the frame frame part 210. Except for, it may mean an empty area.
As the cell C of the mask 100 corresponds to the mask cell region CR, it can be used as a passage through which the pixel of the OLED is deposited substantially through the mask pattern P. As described above, one mask cell C corresponds to one display such as a smartphone. Mask patterns P constituting one cell C may be formed on one mask 100. Alternatively, one mask 100 may include a plurality of cells C, and each cell C may correspond to each cell area CR of the frame 200, but clear alignment of the mask 100 is achieved. In order to do so, it is necessary to avoid the large-area mask 100, and a small-area mask 100 having one cell C is preferable. Alternatively, one mask 100 having a plurality of cells C may correspond to one cell area CR of the frame 200. In this case, for clear alignment, it may be considered to correspond to the mask 100 having a small number of cells C of about 2-3.
The frame 200 includes a plurality of mask cell areas CR, and each mask 100 may be attached such that one mask cell C corresponds to the mask cell area CR. Each mask 100 may include a mask cell C having a plurality of mask patterns P formed thereon, and a dummy around the mask cell C (corresponding to a portion of the mask layer 110 excluding the cell C). have. The dummy may include only the mask layer 110 or may include the mask layer 110 in which a predetermined dummy pattern similar to the mask pattern P is formed. The mask cell C corresponds to the mask cell area CR of the frame 200, and a part or all of the dummy may be attached to the frame 200 (mask cell sheet part 220). Accordingly, the mask 100 and the frame 200 can form an integral structure.
Meanwhile, according to another embodiment, the frame is not manufactured by attaching the mask cell sheet part 220 to the frame frame part 210, but the frame frame part 210 is formed in the hollow region R part of the frame frame part 210. ) And an integral grid frame (corresponding to the grid seat portions 223 and 225) may be directly formed. This type of frame also includes at least one mask cell area CR, and a frame-integrated mask can be manufactured by matching the mask 100 to the mask cell area CR.
Hereinafter, a process of manufacturing a frame-integrated mask will be described.
First, the frame 200 described above in FIGS. 4 and 5 may be provided. 6 is a schematic diagram showing a manufacturing process of the frame 200 according to an embodiment of the present invention.
Referring to FIG. 6A, a frame frame part 210 is provided. The frame frame part 210 may have a rectangular frame shape including a hollow region R.
Next, referring to FIG. 6B, a mask cell sheet part 220 is manufactured. The mask cell sheet part 220 is manufactured by manufacturing a flat sheet using rolling, electroplating, or other film forming processes, and then removing the mask cell area CR through laser scribing and etching. can do. In this specification, an example in which a 6 X 5 mask cell region (CR: CR11 to CR56) is formed will be described. Five first grid sheet portions 223 and four second grid sheet portions 225 may be present.
Next, the mask cell sheet part 220 may correspond to the frame frame part 210. In the process of correspondence, all sides of the mask cell sheet part 220 are stretched (F1 to F4) to flatten the mask cell sheet part 220 and the frame sheet part 221 is attached to the frame frame part 210. Can respond. In one side, it is possible to hold the mask cell sheet portion 220 at several points (for example, 1 to 3 points in FIG. 6 (b)) and stretch it. On the other hand, the mask cell sheet portion 220 may be stretched (F1, F2) along some side directions instead of all sides.
Next, when the mask cell sheet part 220 corresponds to the frame frame part 210, the frame sheet part 221 of the mask cell sheet part 220 may be attached by welding (W). It is preferable to weld (W) all sides so that the mask cell sheet part 220 can be firmly attached to the frame part 220. Welding (W) should be performed as close as possible to the edge of the frame frame part 210 to reduce the excitement space between the frame part 210 and the mask cell sheet part 220 and increase adhesion. The welding (W) part may be created in a line or spot shape, and the frame frame part 210 and the mask cell sheet part 220 are integrally made of the same material as the mask cell sheet part 220. It can be a medium to connect with.
7 is a schematic diagram showing a manufacturing process of a frame according to another embodiment of the present invention. In the embodiment of FIG. 6, the mask cell sheet part 220 having the mask cell area CR is first manufactured and attached to the frame frame part 210. However, in the embodiment of FIG. 210), a mask cell region CR is formed.
First, as shown in (a) of FIG. 6, a frame part 210 including a hollow region R is provided.
Next, referring to FIG. 7A, a flat sheet (a flat mask cell sheet 220 ′) may correspond to the frame frame 210. The mask cell sheet part 220 ′ is in a planar state in which the mask cell area CR has not yet been formed. In the matching process, all sides of the mask cell sheet part 220 ′ are stretched (F1 to F4) to correspond to the frame frame part 210 with the mask cell sheet part 220 ′ flattened. One side can also hold the mask cell sheet portion 220 ′ at several points (eg, 1 to 3 points in FIG. 7 (a)) and tension. On the other hand, the mask cell sheet portion 220 ′ may be stretched (F1, F2) along some side directions instead of all sides.
Next, when the mask cell sheet part 220 ′ corresponds to the frame frame part 210, the rim part of the mask cell sheet part 220 ′ may be attached by welding (W). It is preferable to weld (W) all sides so that the mask cell sheet part 220 ′ can be firmly attached to the frame frame part 220. Welding (W) should be performed as close as possible to the edge of the frame frame part 210 to reduce the excitement space between the frame part 210 and the mask cell sheet part 220 ′ and increase adhesion. The welding (W) portion may be generated in a line or spot shape, and has the same material as the mask cell sheet portion 220 ′, and the frame frame portion 210 and the mask cell sheet portion 220 ′ It can be a medium that connects all together.
Next, referring to FIG. 7B, a mask cell region CR is formed on a planar sheet (a planar mask cell sheet portion 220'). The mask cell area CR may be formed by removing the sheet in the mask cell area CR through laser scribing or etching. In this specification, an example in which a 6 X 5 mask cell region (CR: CR11 to CR56) is formed will be described. When the mask cell area CR is formed, the edge frame portion 210 and the welded (W) portion become the edge sheet portion 221, and the five first grid sheet portions 223 and the four second grids A mask cell sheet portion 220 having a sheet portion 225 may be configured.
8 is a schematic diagram showing a conventional mask for forming a high-resolution OLED.
In order to implement a high-resolution OLED, the size of the pattern is decreasing, and the thickness of the mask metal film used for this is also required to be thin. As shown in (a) of FIG. 8, in order to implement the high-resolution OLED pixel 6, the pixel spacing and pixel size of the mask 10' must be reduced (PD ->PD'). In addition, in order to prevent the OLED pixel 6 from being unevenly deposited due to the shadow effect, it is necessary to form the mask 10' in an oblique manner (14). However, in the process of forming (14) a pattern on a thick mask (10') having a thickness (T1) of about 30 to 50 µm in an inclined manner, patterning 13 suitable for a fine pixel gap PD' and a pixel size is performed. Because it is difficult to do, it causes the yield to deteriorate in the processing process. In other words, in order to form an inclined pattern 14 with a fine pixel gap PD', a thin mask 10' should be used.
In particular, for high resolution at the UHD level, fine patterning can be performed only when a thin mask 10 ′ having a thickness T2 of about 20 μm or less is used as shown in FIG. 8B. In addition, for ultra-high resolution of UHD or higher, use of a thin mask 10' having a thickness T2 of about 10 μm may be considered.
9 is a schematic diagram showing a mask 100 according to an embodiment of the present invention.
The mask 100 may include a mask cell C on which a plurality of mask patterns P are formed and a dummy DM surrounding the mask cell C. It has been described above that the mask 100 may be manufactured from a metal sheet produced by a rolling process or electroplating, and one cell C may be formed in the mask 100. The dummy DM corresponds to a portion of the mask layer 110 (mask metal layer 110) excluding the cell C, and includes only the mask layer 110, or a predetermined dummy having a shape similar to the mask pattern P A patterned mask layer 110 may be included. In the dummy DM, part or all of the dummy DM may be attached to the frame 200 (mask cell sheet part 220) corresponding to the edge of the mask 100.
The width of the mask pattern P may be less than 40 μm, and the thickness of the mask 100 may be about 5 to 20 μm. Since the frame 200 includes a plurality of mask cell regions CR: CR11 to CR56, the mask 100 having mask cells C: C11 to C56 corresponding to respective mask cell regions CR: CR11 to CR56 ) May also be provided.
Since one surface 101 of the mask 100 is a surface to be attached by contacting the frame 200, it is preferable that it is flat. One surface 101 may be flattened and mirrored in a planarization process to be described later. The other surface 102 of the mask 100 may face one surface of the template 50 to be described later.
Hereinafter, a mask metal layer 110 ′ is manufactured, and the mask 100 is manufactured by supporting it on the template 50, and the template 50 on which the mask 100 is supported is loaded on the frame 200. A series of processes for manufacturing a frame-integrated mask by attaching the mask 100 to the frame 200 will be described.
10 is a schematic diagram illustrating a process of manufacturing a mask metal film according to an embodiment of the present invention by a rolling method. 11 is a schematic diagram illustrating a process of manufacturing a mask metal film according to another embodiment of the present invention by electroforming.
First, a mask metal layer 110 may be prepared. As an embodiment, the mask metal layer 110 may be prepared by a rolling method.
Referring to FIG. 10A, the metal sheet produced by the rolling process may be used as the mask metal film 110 ′. The metal sheet manufactured by the rolling process may have a thickness of several tens to several hundred μm in the manufacturing process. As described above in FIG. 8, fine patterning can be performed by using a thin mask metal film 110 having a thickness of about 20 μm or less for a high resolution of UHD level, and a thickness of about 10 μm for ultra high resolution of UHD or higher. A thin mask metal layer 110 having a should be used. However, since the mask metal layer 110 ′ produced by the rolling process has a thickness of about 25 to 500 μm, it is necessary to have a thinner thickness.
Accordingly, a process of planarizing (PS) one surface of the mask metal layer 110 ′ may be further performed. Here, planarization (PS) refers to reducing the thickness of one surface (upper surface) of the mask metal layer 110 ′ to a thinner surface by removing a part of the upper surface of the mask metal layer 110 ′. Planarization (PS) may be performed by a CMP (Chemical Mechanical Polishing) method, and a known CMP method may be used without limitation. In addition, the thickness of the mask metal layer 110 ′ may be reduced by a chemical wet etching method or a dry etching method. In addition, a process capable of flattening the mask metal layer 110 ′ may be used without limitation.
In the process of performing the planarization (PS), for example, in the CMP process, the surface roughness R _a of the upper surface of the mask metal layer 110 ′ may be controlled. Preferably, mirroring can be performed in which the surface roughness is further reduced. Alternatively, as another example, after performing a chemical wet etching or dry etching process to perform planarization (PS), a polishing process such as a separate CMP process may be added thereafter to reduce the surface roughness R _a .
As such, the thickness of the mask metal layer 110 ′ can be made thin to about 50 μm or less. Accordingly, it is preferable that the thickness of the mask metal layer 110 is about 2 μm to 50 μm, and more preferably, the thickness may be about 5 μm to 20 μm. However, it is not necessarily limited thereto.
Referring to FIG. 10B, as in FIG. 10A, the mask metal layer 110 may be manufactured by reducing the thickness of the mask metal layer 110 ′ manufactured by the rolling process. However, the thickness of the mask metal layer 110 ′ may be reduced by performing a planarization (PS) process in a state that is adhered to the template 50 to be described later through the temporary bonding portion 55.
As another embodiment, the mask metal layer 110 may be prepared by electroplating.
Referring to FIG. 11 (a), a conductive substrate 21 is prepared. In order to perform electroforming, the base material 21 of the base plate may be a conductive material. The mother plate can be used as a cathode electrode in electroplating.
As a conductive material, in the case of metal, metal oxides may be generated on the surface, impurities may be introduced during the metal manufacturing process, in the case of a polycrystalline silicon substrate, inclusions or grain boundaries may exist, and conductive polymers In the case of the base material, the possibility of containing impurities is high and strength. Acid resistance may be weak. An element that prevents uniform formation of an electric field on the surface of the mother plate (or cathode) such as metal oxide, impurities, inclusions, grain boundaries, etc. is referred to as “defect”. Due to defects, a uniform electric field may not be applied to the cathode body made of the above-described material, so that a part of the plating film 110 (or the mask metal film 110) may be formed unevenly.
In implementing ultra-high definition pixels of the UHD level or higher, non-uniformity of the plating film and the plating film pattern [mask pattern P] may adversely affect the formation of the pixels. For example, in the case of current QHD quality, the size of the pixel reaches about 30-50㎛ with 500~600 PPI (pixel per inch), and in the case of 4K UHD and 8K UHD high quality, ~860 PPI and ~1600 PPI are higher. It has the same resolution. Micro-displays directly applied to VR devices, or micro-displays inserted into VR devices, aim for ultra-high quality of about 2,000 PPI or higher, and the size of the pixels reaches about 5 to 10 μm. The pattern width of the FMM and shadow mask applied to this can be formed in a size of several to several tens of µm, preferably smaller than 30 µm, so that even defects of several µm can occupy a large proportion of the pattern size of the mask. to be. In addition, in order to remove defects in the cathode material of the above-described material, an additional process for removing metal oxides and impurities may be performed, and in this process, another defect such as etching of the cathode material may be caused. have.
Accordingly, in the present invention, a single crystal base plate (or a cathode body) may be used. In particular, it is preferably made of single crystal silicon. In order to have conductivity, a high concentration doping of 10 ¹⁹ /cm ³ or more may be performed on the mother plate made of single crystal silicon. Doping may be performed on the entire parent plate, or may be performed only on the surface portion of the parent plate.
Meanwhile, as a single crystal material, metals such as Ti, Cu, and Ag, semiconductors such as GaN, SiC, GaAs, GaP, AlN, InN, InP, Ge, and carbon-based materials such as graphite and graphene _{, CH 3 NH 3 PbCl 3,} CH 3 NH 3 PbBr 3, CH 3 NH 3 PbI 3, SrTiO 3 , etc. page containing the perovskite (perovskite) superconductor single crystalline ceramic, aircraft single crystal second heat-resistant alloy for components for such structures Etc. can be used. Metal and carbon-based materials are basically conductive materials. In the case of a semiconductor material, high concentration doping of 10 ¹⁹ /cm ³ or more may be performed to have conductivity. In the case of other materials, doping may be performed or oxygen vacancy may be formed to form conductivity. Doping may be performed on the entire parent plate, or may be performed only on the surface portion of the parent plate.
Since there are no defects in the case of a single crystal material, there is an advantage in that a uniform plating film 110 can be generated due to the formation of a uniform electric field over the entire surface during electroplating. The frame-integrated masks 100 and 200 manufactured through a uniform plating film can further improve the quality level of OLED pixels. In addition, since there is no need to perform an additional process for removing and eliminating defects, there is an advantage in that process cost is reduced and productivity is improved.
Referring again to (a) of FIG. 11, next, the conductive substrate 21 is used as a mother plate [cathode body], and the anode body (not shown) is spaced apart on the conductive substrate 21 The plating film 110 (or the mask metal film 110) may be formed by electroplating. The plating film 110 may be formed on the exposed top and side surfaces of the conductive substrate 21 facing the anode body and on which the electric field can act. In addition to the side surfaces of the conductive substrate 21, the plating film 110 may be formed on a part of the lower surface of the conductive substrate 21.
Next, the edge portion of the plating film 110 is cut (D) with a laser, or a photoresist layer is formed on the plating film 110 and only the exposed portion of the plating film 110 is etched to remove (D). I can. Accordingly, as shown in (b) of FIG. 11, the plating film 110 may be separated from the conductive substrate 21.
On the other hand, before separating the plated film 110 from the conductive substrate 21, a heat treatment (H) may be performed. The present invention is to reduce the thermal expansion coefficient of the mask 100 and at the same time prevent the deformation of the mask 100 and the mask pattern P by heat, from the conductive substrate 21 (or the mother plate, the cathode body) 110) is characterized in that the heat treatment (H) is performed before separation. The heat treatment may be performed at a temperature of 300°C to 800°C.
In general, compared to the Invar sheet produced by rolling, the Invar sheet produced by electroplating has a higher coefficient of thermal expansion. Thus, by performing a heat treatment on the Invar sheet, the coefficient of thermal expansion may be lowered, and during this heat treatment process, the Invar sheet may be peeled or deformed. This is a phenomenon that occurs because only the Invar thin plate is heat-treated or the Invar thin plate temporarily adhered only to the upper surface of the conductive substrate 21 is heat-treated. However, in the present invention, since the plating film 110 is formed not only on the upper surface of the conductive substrate 21 but also on the side and lower surfaces of the conductive substrate 21, peeling or deformation does not occur even when heat treatment (H) is performed. In other words, since the heat treatment is performed in a state in which the conductive substrate 21 and the plating film 110 are closely adhered, there is an advantage of preventing delamination and deformation due to heat treatment and stably performing heat treatment.
The thickness of the mask metal layer 110 generated by the electroplating process may be thinner than that of the rolling process. Accordingly, the planarization (PS) process for reducing the thickness may be omitted, but since the etching characteristics may be different depending on the composition of the surface layer of the plating mask metal layer 110 ′ and the crystal structure/fine structure, planarization (PS) is performed. Through the need to control the surface properties and thickness.
12 to 13 are schematic diagrams illustrating a process of manufacturing a mask supporting template by bonding the mask metal layer 110 on the template 50 and forming the mask 100 according to an embodiment of the present invention.
Referring to FIG. 12A, a template 50 may be provided. The template 50 is a medium that can be moved while the mask 100 is attached and supported on one surface. It is preferable that one surface of the template 50 is flat so that it can be moved by supporting the flat mask 100. The central portion 50a may correspond to the mask cell C of the mask metal layer 110, and the edge portion 50b may correspond to the dummy DM of the mask metal layer 110. The size of the template 50 may be a flat plate shape having a larger area than that of the mask metal layer 110 so that the mask metal layer 110 can be entirely supported.
The template 50 is preferably made of a transparent material so that it is easy to observe vision or the like in the process of aligning and bonding the mask 100 to the frame 200. In addition, in the case of a transparent material, the laser may penetrate. As a transparent material, materials such as glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, and zirconia can be used. For example, the template 50 may be made of a BOROFLOAT ^® 33 material having excellent heat resistance, chemical durability, mechanical strength, transparency, etc. among borosilicate glass. In addition, BOROFLOAT ^® 33 has a coefficient of thermal expansion of about 3.3, which has a small difference in coefficient of thermal expansion from the Invar mask metal layer 110, so that it is easy to control the mask metal layer 110.
Meanwhile, in the template 50, one surface in contact with the mask metal layer 110 is a mirror surface so that an air gap does not occur between the interface with the mask metal layer 110 (or the mask 100). I can. In consideration of this, the surface roughness Ra of one surface of the template 50 may be 100 nm or less. In order to implement the template 50 having a surface roughness Ra of 100 nm or less, the template 50 may use a wafer. The wafer (wafer) has a surface roughness (Ra) of about 10 nm, there are many commercially available products, and many surface treatment processes are known, so it can be used as the template 50. Since the surface roughness (Ra) of the template 50 is in nm scale, there is no or almost no air gap, and it is easy to generate the weld bead (WB) by laser welding, which affects the alignment error of the mask pattern (P). I can not give it.
The template 50 includes a laser through hole 51 in the template 50 so that the laser L irradiated from the top of the template 50 can reach the welding portion WP of the mask 100 (a region to be welded). ) Can be formed. The laser through-hole 51 may be formed in the template 50 to correspond to the position and number of the welding portions WP. Since a plurality of welding portions WP are disposed along a predetermined interval in the edge or dummy DM portion of the mask 100, a plurality of laser through holes 51 may be formed along a predetermined interval to correspond thereto. As an example, since a plurality of welding parts are disposed along a predetermined distance on both sides (left/right) dummy (DM) parts of the mask 100, the laser through hole 51 is also provided on both sides (left/right). A plurality may be formed along a predetermined interval.
The laser through-hole 51 need not necessarily correspond to the position and number of the welding portions WP. For example, it is also possible to perform welding by irradiating the laser (L) to only a part of the laser through hole (51). In addition, some of the laser through-holes 51 that do not correspond to the welding part WP may be used instead of the alignment mark when aligning the mask 100 and the template 50. If the material of the template 50 is transparent to the laser (L) light, the laser through hole 51 may not be formed.
A temporary adhesive portion 55 may be formed on one surface of the template 50. Temporary bonding portion 55 is temporarily adhered to one surface of the template 50 until the mask 100 (or the mask metal film 110) is attached to the frame 200 Can be supported by
The temporary adhesive part 55 may be an adhesive or adhesive sheet (thermal release type) that can be separated by applying heat, an adhesive or adhesive sheet (UV release type) that can be separated by UV irradiation.
As an example, the temporary bonding portion 55 may be formed of liquid wax. The liquid wax may be the same as the wax used in the polishing step of a semiconductor wafer, and the like, and the type is not particularly limited. The liquid wax is mainly a resin component for controlling adhesion, impact resistance, and the like with respect to holding power, and may include materials and solvents such as acrylic, vinyl acetate, nylon, and various polymers. As an example, the temporary adhesive part 55 may use SKYLIQUID ABR-4016 including acrylonitrile butadiene rubber (ABR) as a resin component and n-propyl alcohol as a solvent component. The liquid wax may be formed on the temporary bonding portion 55 using spin coating.
The temporary adhesive part 55, which is a liquid wax, has a lower viscosity at a temperature higher than 85°C to 100°C, and becomes more viscous at a temperature lower than 85°C, and may be partially hardened like a solid, so that the mask metal film 110' and the template 50 ) Can be fixed and bonded.
Next, referring to FIG. 12B, a mask metal layer 110 ′ may be adhered on the template 50. After heating the liquid wax to 85° C. or higher and contacting the mask metal film 110 ′ with the template 50, adhesion may be performed by passing the mask metal film 110 ′ and the template 50 between rollers. .
According to an embodiment, baking is performed on the template 50 at about 120° C. for 60 seconds to vaporize the solvent of the temporary bonding portion 55, and immediately, a mask metal film lamination process may be performed. . Lamination is performed by loading the mask metal film 110 ′ on the template 50 on which the temporary bonding part 55 is formed, and passing it between the upper roll of about 100°C and the lower roll of about 0°C. I can. As a result, the mask metal layer 110 ′ may be in contact with the template 50 through the temporary bonding portion 55.
14 is an enlarged cross-sectional schematic view showing a temporary bonding portion 55 according to an embodiment of the present invention. As another example, the temporary adhesive part 55 may use a thermal release tape. In the thermal release tape, a core film 56 such as a PET film is disposed in the center, and thermal release adhesives 57a and 57b are disposed on both sides of the core film 56, and an adhesive layer 57a , 57b) may have a form in which the release film/release film 58a, 58b is disposed. Here, the adhesive layers 57a and 57b disposed on both sides of the core film 56 may have different temperatures at which they are separated from each other.
According to an embodiment, in the state where the release film/release film 58a, 58b is removed, the lower surface of the thermal release tape (the second adhesive layer 57b) is adhered to the template 50, and the upper part of the thermal release tape The surface (the first adhesive layer 57a) may be adhered to the mask metal layer 110 ′. Since the first adhesive layer 57a and the second adhesive layer 57b are separated from each other at different temperatures, when separating the template 50 from the mask 100 in FIG. 17 to be described later, the first adhesive layer 57a By applying the heat to be thermally separated, the mask 100 may be separated from the template 50 and the temporary bonding portion 55.
Subsequently, referring to FIG. 12B further, one surface of the mask metal layer 110 ′ may be planarized (PS). As described above in FIG. 10, the mask metal film 110 ′ manufactured by the rolling process may be reduced in thickness (110 ′ -> 110) through a planarization (PS) process. In addition, the mask metal layer 110 manufactured by the electroplating process may also be subjected to a planarization (PS) process to control surface characteristics and thickness.
Accordingly, as shown in (c) of FIG. 12, as the thickness of the mask metal layer 110' is reduced (110'-> 110), the thickness of the mask metal layer 110 becomes about 5 μm to 20 μm. I can.
Next, referring to (d) of FIG. 13, a patterned insulating portion 25 may be formed on the mask metal layer 110. The insulating part 25 may be formed of a photoresist material using a printing method or the like.
Subsequently, the mask metal layer 110 may be etched. A method such as dry etching or wet etching may be used without limitation, and as a result of the etching, a portion of the mask metal layer 110 exposed to the empty space 26 between the insulating portions 25 may be etched. The etched portion of the mask metal layer 110 constitutes the mask pattern P, and the mask 100 having a plurality of mask patterns P formed thereon may be manufactured.
Next, referring to (e) of FIG. 13, the manufacturing of the template 50 supporting the mask 100 may be completed by removing the insulating portion 25.
Since the frame 200 includes a plurality of mask cell regions CR: CR11 to CR56, the mask 100 having mask cells C: C11 to C56 corresponding to respective mask cell regions CR: CR11 to CR56 ) May also be provided. In addition, a plurality of templates 50 for supporting each of the plurality of masks 100 may be provided.
15 is a schematic diagram illustrating a process of loading a mask supporting template onto a frame according to an embodiment of the present invention.
Referring to FIG. 15, the template 50 may be transferred by the vacuum chuck 90. The vacuum chuck 90 may adsorb and transport the surface opposite to the surface of the template 50 to which the mask 100 is adhered. The vacuum chuck 90 may be connected to a moving means (not shown) that moves in the x, y, z, and θ axes. In addition, the vacuum chuck 90 may be connected to a flip means (not shown) capable of adsorbing and flipping the template 50. As shown in (b) of FIG. 15, the vacuum chuck 90 adsorbs and flips the template 50, and then, in the process of transferring the template 50 onto the frame 200, the mask 100 There is no effect on the adhesion and alignment.
FIG. 16 is a schematic diagram illustrating a state in which a template is loaded onto a frame after increasing the temperature of a process area according to an embodiment of the present invention to correspond to a cell area of the frame. In FIG. 16, one mask 100 is exemplified to correspond to/attach to the cell area CR, but the plurality of masks 100 are simultaneously corresponded to all the cell areas CR so that the mask 100 is frame 200 ) Can also be performed. In this case, a plurality of templates 50 for supporting each of the plurality of masks 100 may be provided.
Next, referring to FIG. 16, after increasing the temperature of the process region (ET), the mask 100 may correspond to one mask cell region CR of the frame 200. The present invention is characterized in that no tensile force is applied to the mask 100 while the mask 100 corresponds to the mask cell area CR of the frame 200.
Since the mask cell sheet portion 220 of the frame 200 has a thin thickness, when a tensile force is applied to the mask 100 and attached to the mask cell sheet portion 220, the tensile force remaining in the mask 100 is masked. It acts on the cell sheet part 220 and the mask cell area CR, and thus, they may be deformed. Therefore, it is necessary to attach the mask 100 to the mask cell sheet part 220 without applying a tensile force to the mask 100. Thus, it is possible to prevent deformation of the frame 200 (or the mask cell sheet part 220) by acting as a tension on the frame 200 as opposed to the tensile force applied to the mask 100.
However, one problem arises when a frame-integrated mask is manufactured by attaching it to the frame 200 (or mask cell sheet part 220) without applying a tensile force to the mask 100, and the frame-integrated mask is used in the pixel deposition process. Can occur. In the pixel deposition process performed at about 25 to 45° C., the mask 100 thermally expands by a predetermined length. Even in the case of the mask 100 made of an Invar material, the length of about 1 to 3 ppm may change according to a temperature increase of about 10° C. to form an atmosphere of the pixel deposition process. For example, when the total length of the mask 100 is 500 mm, the length may increase by about 5 to 15 μm. Then, there is a problem that the alignment error of the patterns P increases while causing deformation such as the mask 100 being struck by its own weight or being stretched and distorted while being fixed in the frame 200.
Accordingly, the present invention is characterized in that the mask 100 corresponds to and attaches to the mask cell area CR of the frame 200 without applying a tensile force to the mask 100 at a temperature higher than the normal temperature. In this specification, after raising (ET) the temperature of the process region to the first temperature, it is expressed that the mask 100 is attached to the frame 200.
The term "process area" may mean a space in which constituent elements such as the mask 100 and the frame 200 are located, and a process of attaching the mask 100 is performed. The process area may be a space within a closed chamber or an open space. Further, the term “first temperature” may mean a temperature higher than or equal to the pixel deposition process temperature when the frame-integrated mask is used in the OLED pixel deposition process. Considering that the pixel deposition process temperature is about 25 to 45°C, the first temperature may be about 25 to 60°C. The temperature increase in the process area may be performed by installing a heating means in the chamber or by installing a heating means around the process area.
Referring again to FIG. 16, after raising (ET) the temperature of the process region including the frame 200 to the first temperature, the mask 100 may correspond to the mask cell region CR. Alternatively, after the mask 100 corresponds to the mask cell region CR, the temperature of the process region including the frame 200 may be increased (ET) to the first temperature.
By loading the template 50 onto the frame 200 (or the mask cell sheet part 220), the mask 100 may correspond to the mask cell area CR. While controlling the position of the template 50/vacuum chuck 90, it is possible to examine whether the mask 100 corresponds to the mask cell area CR through a microscope. Since the template 50 compresses the mask 100, the mask 100 and the frame 200 can be in close contact with each other. Since the mask 100 can correspond to the mask cell area CR only by controlling the position of the template 50, any tensile force may not be directly applied to the mask 100.
Meanwhile, the lower support 70 may be further disposed under the frame 200. The lower support 70 may have a size such that it fits into the hollow region R of the frame rim 210 and may have a flat plate shape. Further, a predetermined support groove (not shown) corresponding to the shape of the mask cell sheet portion 220 may be formed on the upper surface of the lower support body 70. In this case, the edge sheet portion 221 and the first and second grid sheet portions 223 and 225 are fitted into the support grooves, so that the mask cell sheet portion 220 may be better fixed.
The lower support 70 may press the opposite surface of the mask cell area CR to which the mask 100 contacts. That is, the lower support 70 may support the mask cell sheet part 220 in an upward direction to prevent the mask cell sheet part 220 from sagging downward during the attaching process of the mask 100. At the same time, the lower support 70 and the template 50 are pressed against the edge and frame 200 (or mask cell sheet part 220) of the mask 100 in opposite directions, so that the mask 100 Can be maintained without being disturbed.
In this way, just by attaching the mask 100 on the template 50 and loading the template 50 on the frame 200, the mask 100 corresponds to the mask cell area CR of the frame 200. Since the process is completed, no tensile force may be applied to the mask 100 during this process.
Subsequently, the mask 100 may be attached to the frame 200 by irradiating the laser L to the mask 100 by laser welding. A welding bead WB is generated in the welding part WP of the laser-welded mask, and the welding bead WB may be integrally connected with the mask 100 / frame 200 and having the same material.
17 is a schematic diagram illustrating a process of separating the mask 100 and the template 50 after attaching the mask 100 to the frame 200 according to an embodiment of the present invention.
Referring to FIG. 17, after attaching the mask 100 to the frame 200, the mask 100 and the template 50 may be separated (debonded). Separation of the mask 100 and the template 50 can be performed through at least one of heat application (EP), chemical treatment (CM), ultrasonic application (US), and UV application (UV) to the temporary bonding part 55. have. Since the mask 100 remains attached to the frame 200, only the template 50 can be lifted. For example, when heat at a temperature higher than 85° C. to 100° C. is applied (EP), the viscosity of the temporary bonding portion 55 is lowered, and the adhesion between the mask 100 and the template 50 is weakened, and thus the mask 100 ) And the template 50 may be separated. As another example, the mask 100 and the template 50 may be separated by dissolving or removing the temporary bonding portion 55 by immersing (CM) the temporary bonding portion 55 in a chemical substance such as IPA, acetone, and ethanol. have. As another example, when ultrasound is applied (US) or UV is applied (UV), the adhesion between the mask 100 and the template 50 is weakened, so that the mask 100 and the template 50 may be separated.
In more detail, since the temporary bonding portion 55 that mediates the adhesion between the mask 100 and the template 50 is a TBDB adhesive material (temporary bonding&debonding adhesive), various debonding methods can be used.
As an example, a solvent debonding method according to a chemical treatment (CM) may be used. Debonding may be performed as the temporary bonding portion 55 is dissolved by the penetration of the solvent. At this time, since the pattern P is formed on the mask 100, the solvent may penetrate through the mask pattern P and the interface between the mask 100 and the template 50. Solvent debonding has an advantage of being relatively economical compared to other debonding methods because debonding is possible at room temperature and does not require a complex debonding facility designed separately.
As another example, a heat debonding method according to heat application (EP) may be used. When the temporary bonding portion 55 is decomposed using high temperature heat, and the adhesive force between the mask 100 and the template 50 is reduced, debonding may proceed in the vertical direction or the left and right directions.
As another example, a peelable adhesive debonding method according to application of heat (EP) or UV application (UV) may be used. When the temporary bonding part 55 is a thermal peeling tape, debonding can be performed using a peeling adhesive debonding method, and this method does not require high-temperature heat treatment and expensive heat treatment equipment like the thermal debonding method. It has a relatively simple advantage.
As another example, a room temperature debonding method according to chemical treatment (CM), ultrasonic application (US), and UV application (UV) may be used. When a non-sticky treatment is performed on a part (center) of the mask 100 or the template 50, only the edge portion may be adhered by the temporary bonding portion 55. In addition, during the debonding, the solvent penetrates into the edge portion and the debonding is performed by dissolving the entrance examination bonding portion 55. This method has the advantage of not causing direct loss or defects due to adhesive material residues during debonding, except for the edge area of the mask 100 and the template 50 during bonding and debonding. There is this. In addition, unlike the thermal debonding method, since a high-temperature heat treatment process is not required during debonding, there is an advantage of relatively reducing the process cost.
18 is a schematic diagram illustrating a state in which a mask 100 according to an embodiment of the present invention corresponds to a cell area CR of a neighboring frame 200.
Referring to FIG. 18, the mask 100 may correspond to a mask cell area CR12 adjacent to the mask cell area CR11 to which the mask 100 is attached. The temperature of the process region may be maintained in a state in which the temperature was raised (ET) to the first temperature in FIG. 16. Thus, the mask 100 can maintain the volume for the first temperature without applying a tensile force.
By loading the template 50 onto the frame 200 (or the mask cell sheet part 220), the mask 100 may correspond to the mask cell area CR12. A method of controlling the position of the template 50 to correspond the mask 100 to the mask cell area CR12 is the same as that of FIG. 16. Meanwhile, the mask 100 may be first corresponded to a mask cell area CR other than the mask cell area CR12 adjacent to the mask cell area CR11.
Subsequently, the mask 100 may be attached to the frame 200 by irradiating the laser L to the mask 100 by laser welding. A welding bead WB is generated in the welding portion of the laser-welded mask, and the welding bead WB may be integrally connected with the mask 100 / frame 200 and having the same material.
19 is a schematic diagram illustrating a process of separating the mask 100 and the template 50 after attaching the mask 100 to the cell area CR of the neighboring frame 200 according to an embodiment of the present invention.
Referring to FIG. 19, after attaching the mask 100 to the frame 200, the mask 100 and the template 50 may be separated (debonded). Separation of the mask 100 and the template 50 can be performed through at least one of heat application (EP), chemical treatment (CM), ultrasonic application (US), and UV application (UV) to the temporary bonding part 55. have. Since the mask 100 remains attached to the frame 200, only the template 50 can be lifted. This is the same as described above in FIG. 17.
20 is a schematic diagram showing a state in which a mask is attached to a frame according to an embodiment of the present invention.
Next, referring to FIG. 20, a process of attaching and attaching the mask 100 to the remaining mask cell area CR may be performed. All of the masks 100 may be attached on the mask cell area CR of the frame 200.
The conventional mask 10 of FIG. 1 has a long length because it includes 6 cells (C1 to C6), whereas the mask 100 of the present invention has a short length including one cell (C). The degree of distortion of the pixel position accuracy (PPA) can be reduced. For example, assuming that the length of the mask 10 including a plurality of cells (C1 to C6, ...) is 1 m and a PPA error of 10 μm occurs in the entire 1 m, the mask 100 of the present invention The above error range can be 1/n according to the reduction in the relative length (corresponding to the reduction in the number of cells C). For example, if the length of the mask 100 of the present invention is 100 mm, since it has a length reduced from 1 m to 1/10 of the conventional mask 10, a PPA error of 1 μm occurs in the entire 100 mm length. , There is an effect that the alignment error is significantly reduced.
On the other hand, if the mask 100 includes a plurality of cells C, and each cell C corresponds to each cell area CR of the frame 200 within a range in which the alignment error is minimized, The mask 100 may correspond to a plurality of mask cell regions CR of the frame 200. Alternatively, the mask 100 having a plurality of cells C may correspond to one mask cell area CR. Even in this case, in consideration of the process time and productivity according to the alignment, the mask 100 is preferably provided with as few cells (C) as possible.
In the case of the present invention, it is only necessary to match one cell (C) of the mask 100 and check the alignment state, so that a plurality of cells (C: C1 to C6) must be matched at the same time and check all alignment states. Compared to the conventional method [see Fig. 2], the manufacturing time can be significantly reduced.
That is, in the method of manufacturing a frame-integrated mask of the present invention, each of the cells C11 to C16 included in the six masks 100 correspond to each of the cell regions CR11 to CR16 and check the alignment state. Through a single process, the time can be much shorter than that of a conventional method in which the six cells C1 to C6 are simultaneously matched and the alignment state of the six cells C1 to C6 is checked at the same time.
In addition, in the method of manufacturing a frame-integrated mask of the present invention, the product yield in the process of 30 times of matching and aligning 30 masks 100 to 30 cell regions (CR: CR11 to CR56), respectively, is 6 cells (C1 The five masks 10 each including ~C6) (see Fig. 2 (a)) may appear much higher than the conventional product yield in the five processes of matching and aligning the frame 20. Since the conventional method of arranging six cells (C1 to C6) in a region corresponding to six cells (C) at a time is much cumbersome and difficult operation, the product yield is low.
FIG. 21 is a schematic diagram illustrating a process of lowering (LT) a temperature of a process area after attaching the mask 100 to the cell area CR of the frame 200 according to an exemplary embodiment of the present invention.
Next, referring to FIG. 21, the temperature of the process region is lowered (LT) to the second temperature. The term "second temperature" may mean a temperature lower than the first temperature. Considering that the first temperature is about 25° C. to 60° C., the second temperature may be about 20° C. to 30° C. on the assumption that the first temperature is lower than the first temperature, and preferably, the second temperature may be room temperature. The temperature drop in the process region may be performed by installing a cooling means in the chamber, a method of installing a cooling means around the process region, or a method of naturally cooling to room temperature.
When the temperature of the process region is lowered (LT) to the second temperature, the mask 100 may thermally contract by a predetermined length. The mask 100 may be isotropically heat-shrinkable along all side directions. However, since the mask 100 is fixedly connected to the frame 200 (or the mask cell sheet part 220) by welding (W), the heat contraction of the mask 100 is performed by the surrounding mask cell sheet part 220 The tension (TS) is applied by itself. The mask 100 may be attached on the frame 200 to be more taut by the application of the self-tension TS of the mask 100.
In addition, since the temperature of the process area is lowered (LT) to the second temperature after each of the masks 100 are attached to the corresponding mask cell area CR, all of the masks 100 simultaneously cause heat contraction and A problem that the 200 is deformed or the alignment error of the patterns P increases may be prevented. More specifically, even if the tension TS is applied to the mask cell sheet part 220, since the plurality of masks 100 apply tension TS in opposite directions to each other, the force is canceled and the mask cell sheet part No deformation occurs in 220. For example, the first grid sheet portion 223 between the mask 100 attached to the CR11 cell area and the mask 100 attached to the CR12 cell area is in the right direction of the mask 100 attached to the CR11 cell area. The applied tension TS and the tension TS applied in the left direction of the mask 100 attached to the CR12 cell area may be canceled. Thus, the deformation of the frame 200 (or the mask cell sheet part 220) due to the tension TS is minimized so that the alignment error of the mask 100 (or the mask pattern P) can be minimized. There is this.
22 is a schematic diagram showing an OLED pixel deposition apparatus 1000 using the frame-integrated masks 100 and 200 according to an embodiment of the present invention.
Referring to FIG. 22, the OLED pixel deposition apparatus 1000 includes a magnet plate 300 in which a magnet 310 is accommodated and a cooling water line 350 is disposed, and an organic material source 600 from a lower portion of the magnet plate 300. ) And a deposition source supply unit 500 to supply.
A target substrate 900 such as glass on which the organic material source 600 is deposited may be interposed between the magnet plate 300 and the source deposition unit 500. The frame-integrated masks 100 and 200 (or FMM) that allow the organic material source 600 to be deposited for each pixel may be disposed on the target substrate 900 in close contact or very close to each other. The magnet 310 generates a magnetic field and may be in close contact with the target substrate 900 by the magnetic field.
The deposition source supply unit 500 may reciprocate the left and right path to supply the organic material source 600, and the organic material sources 600 supplied from the deposition source supply unit 500 are pattern P formed on the frame-integrated masks 100 and 200. ) May be deposited on one side of the target substrate 900. The deposited organic material source 600 passing through the pattern P of the frame-integrated masks 100 and 200 may function as the pixel 700 of the OLED.
In order to prevent non-uniform deposition of the pixel 700 due to a shadow effect, the pattern of the frame-integrated masks 100 and 200 may be formed to be inclined (S) (or formed in a tapered shape (S)). . Since the organic material sources 600 passing through the pattern in a diagonal direction along the inclined surface may also contribute to the formation of the pixel 700, the overall thickness of the pixel 700 may be uniformly deposited.
Since the mask 100 is attached and fixed to the frame 200 at a first temperature higher than the pixel deposition process temperature, even if it is raised to the process temperature for pixel deposition, the position of the mask pattern P is hardly affected. The PPA between 100 and the mask 100 adjacent thereto may be maintained not to exceed 3 μm.
23 is a schematic diagram showing a problem in the case of separating the mask from the frame-integrated mask.
On the other hand, when a defect such as a foreign material interposed in the mask 100 attached to the frame 200 or damage to the mask pattern P occurs, the mask 100 needs to be replaced. Alternatively, even when the mask 100 is attached to the frame 200 so that the partial alignment of the mask pattern P is not clear, it is necessary to clarify the alignment by replacing only the mask 100.
Referring to FIG. 23, the conventional method is a method of separating the mask 100 from the frame 200 by applying a physical force to the mask 100 welded to the frame 200. For example, when a defect occurs in the mask 100 attached to the cell area CR11, the mask 100 is torn off. When the mask 100 is separated from the frame 200, the remaining cells except for the cell area CR11 A fine deformation may occur in the frame 200 due to the tension TS of the masks 100 attached to the regions CR12, CR13, CR21, .... Such deformation may cause alignment errors in the mask pattern P and the mask cell C sequentially along the PL line (see enlarged portion of FIG. 23 ). That is, the force canceled by applying the tension TS in the opposite direction of the plurality of masks 100 is applied to the frame 200 of any one of the masks 100 (mask 100 of the cell area CR11). As it is separated, it acts on the frame 200 again, resulting in an alignment error.
Accordingly, the present invention is characterized by separating/replacement of the target mask 100, which needs to be separated/replaced due to the occurrence of defects, after being made again in a state in which the tension TS does not act on the frame 200.
24 to 26 are schematic diagrams illustrating a process of separating and replacing the mask 100 in the frame-integrated mask according to an embodiment of the present invention. As an example, it is assumed that the target mask 100 including the mask cell C11 is separated/replaced from the frame 200, for example. In addition, the mask 100 is described assuming that the left and right corners are welded and attached to the frame 200 (mask cell sheet part 220), but the mask 100 in which all four corners are welded also The same can be applied.
Referring to FIG. 24, first, the temperature of the process region may be raised (ET) to the first temperature. The first temperature may mean a temperature higher than or equal to the pixel deposition process temperature when the frame-integrated mask is used in the OLED pixel deposition process. Considering that the pixel deposition process temperature is about 25 to 45°C, the first temperature may be about 25 to 60°C. This is the same as rising (ET) to the first temperature in FIG. 16.
When the temperature of the process region rises (ET) to the first temperature, the masks 100 that have been heat-shrunk simultaneously cause a predetermined thermal expansion. The degree of thermal expansion may correspond to the degree to which the application of the tension TS is released. In other words, when the temperature of the process region increases (ET) the first temperature, the tension TS applied to the mask 100 attached to the frame 200 may be released. Accordingly, the mask 100 and the frame 200 may be in a stress-free state.
Next, referring to FIG. 25, the target mask 100 may be separated from the frame 200. Separation from the frame 200 may be performed by applying a physical force to the target mask 100. However, in order to prevent deformation due to a force acting on the frame 200, it is necessary to compress the remaining corners when removing the attachment of one corner.
After removing one edge (right edge) of the mask 100 including the mask cell C11 from the frame 200, the other edge (left edge) may be removed from the frame 200. Specifically, one edge of the mask 100 may be attached to the first grid sheet portion 223 that is a right edge of the mask cell area CR11. Thus, when an external force is applied to one edge of the mask 100 to be removed, the adhesive force of the mask 100 and the frame 200 (the first grid sheet part 223) causes the first grid sheet part 223 to be removed. There is a problem caused by the transformation. Therefore, it is necessary to remove the mask 100 after fixing the frame 200 (first grid sheet portion 223) firmly.
In order to firmly fix the frame 200 against the external force, the outer portion of one edge (right edge) of the mask 100 to which the external force directly acts may be compressed. That is, the mask 100 may be attached to compress a portion of the frame 200 (the first grid sheet part 223) located outside one edge. It is preferable to perform compression on the upper and lower surfaces of the frame 200 (first grid sheet part 223) outside of one corner, and both sides. The upper surface may be compressed using a pressing bar (not shown), and the lower surface may be compressed using a lower support 70 (see FIG. 16) supporting the frame 200. When the other side edge (left edge) is removed from the frame 200, the outer portion of the other side edge (left edge) may be pressed in the same manner.
Next, referring to FIG. 26, a new mask 100 to be replaced may be associated with the mask cell area CR11. By loading the template 50 onto the frame 200 (or the mask cell sheet part 220), the mask 100 may correspond to the mask cell area CR11. Subsequently, the mask 100 may be attached to the frame 200 by irradiating the laser L to the mask 100 by laser welding. This is the same as the process of FIG. 16.
Next, the temperature of the process region may be lowered (LT) to the second temperature. Considering that the first temperature is about 25° C. to 60° C., the second temperature may be about 20° C. to 30° C. on the assumption that the first temperature is lower than the first temperature, and preferably, the second temperature may be room temperature. This is the same as lowering (LT) to the second temperature in FIG. 21.
When the temperature of the process region is lowered (LT) to the second temperature, the mask 100 may heat-shrink by a predetermined length. The mask 100 may heat-shrink along the lateral direction. At the same time, since the plurality of masks 100 apply tension TS in opposite directions to each other, the force is canceled so that deformation does not occur in the mask cell sheet part 220.
As described above, when separating/replacing the mask 100 in which the defect has occurred, the temperature of the process region is raised to the first temperature to perform the separating/replacement in a stress-free state, thereby preventing deformation of the frame 200, There is an advantage in that it is possible to stably separate/replace the mask 100 without causing an alignment error between the mask pattern P and the mask cell C.
Although the present invention has been shown and described with reference to a preferred embodiment as described above, it is not limited to the above embodiment, and within the scope not departing from the spirit of the present invention, various Transformation and change are possible. Such modifications and variations should be viewed as falling within the scope of the present invention and the appended claims.

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50: template
51: laser through hole
55: temporary bonding part
70: lower support
100: mask
110: mask film
200: frame
210: frame frame portion
220: mask cell sheet portion
221: border sheet portion
223: first grid seat portion
225: second grid seat portion
1000: OLED pixel deposition device
C: cell, mask cell
CM: chemical treatment
CR: Mask cell area
DM: dummy, mask dummy
ET: Raise the temperature of the process area to the first temperature
EP: heat application
L: laser
LT: Lower the temperature of the process area to the second temperature
R: hollow area of the frame part
P: mask pattern
US: Ultrasonic approval
UV: UV applied
W: welding
WB: welding bead
WP: weld

Claims (30)

A method of manufacturing a frame-integrated mask in which a plurality of masks and a frame supporting the mask are integrally formed,
(a) providing a mask supporting template in which a mask having a plurality of mask patterns formed thereon is adhered to the template;
(b) providing a frame having a plurality of mask cell regions;
(c) raising the temperature of the process region including the frame to a first temperature;
(d) loading the template onto the frame to correspond the mask to the mask cell area of the frame;
(e) attaching the mask to the frame by irradiating a laser to the welding portion of the mask;
(f) repeating steps (d) to (e) to attach a mask to all mask cell areas of the frame;
(g) lowering the temperature of the process region including the frame to the second temperature
Including,
The mask uses a mask metal film produced by rolling or electroforming,
The template includes a material of any one of a wafer, glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, and zirconia, Method of manufacturing a frame-integrated mask. The method of claim 1,
Step (a),
(a1) providing a mask metal film;
(a2) adhering a mask metal film on the template in which the temporary adhesive part is formed on one surface; And
(a3) providing a mask supporting template in which a mask on which a plurality of mask patterns are formed is adhered to the template by forming a mask pattern on the mask metal film to manufacture a mask
Containing, the manufacturing method of the frame-integrated mask. delete delete delete delete delete The method of claim 2,
Step (a3) is:
(a3-1) forming a patterned insulating portion on the mask metal film;
(a3-2) forming a mask pattern by etching a portion of the mask metal layer exposed between the insulating portions; And
(a3-3) Step of removing the insulation
Containing, the manufacturing method of the frame-integrated mask. delete delete delete delete delete delete delete delete delete The method of claim 1,
The frame is,
A frame part including a hollow area; And
Mask cell sheet unit connected to the frame frame unit and having a plurality of mask cell areas
Including,
The mask cell sheet part,
Border sheet portion;
At least one first grid sheet portion extending in a first direction and having both ends connected to the frame sheet portion; And
At least one second grid sheet portion extending in a second direction perpendicular to the first direction, crossing the first grid sheet portion, and having both ends connected to the frame sheet portion
Containing, the manufacturing method of the frame-integrated mask. delete delete The method of claim 1,
The mask and the frame are made of any one of invar, super invar, nickel, and nickel-cobalt, a method of manufacturing a frame-integrated mask. As a mask separation/replacement method of a frame-integrated mask in which a plurality of masks and a frame supporting the mask are integrally formed,
(a) raising the temperature of the process region including the frame to a first temperature;
(b) separating the target mask from the frame;
(c) preparing a mask support template in which a plurality of mask patterns are formed on the template, and loading the template onto the frame to correspond the mask to the mask cell area where the target mask is separated;
(d) attaching the mask to the frame by irradiating a laser to the welding portion of the mask;
(e) lowering the temperature of the process region including the frame to the second temperature
Including,
The mask uses a mask metal film produced by rolling or electroforming,
The template includes a material of any one of a wafer, glass, silica, heat-resistant glass, quartz, alumina (Al ₂ O ₃ ), borosilicate glass, and zirconia, How to remove/replace a mask for a frame-integrated mask. The method of claim 22,
The first temperature is a temperature equal to or higher than the OLED pixel deposition process temperature,
Wherein the second temperature is at least a temperature lower than the first temperature. The method of claim 23,
The first temperature is any one of 25 ℃ to 60 ℃,
The second temperature is any one of 20°C to 30°C lower than the first temperature,
The OLED pixel deposition process temperature is any one of 25°C to 45°C. The method of claim 22,
In step (c), a mask separation/replacement method of a frame-integrated mask, in which a mask on a template corresponds to a mask cell area only by controlling the position of the template without applying tension to the mask. The method of claim 22,
In step (a), when the temperature of the process region is raised to the first temperature, the tension applied to the mask attached to the frame is released from the mask separation/replacement method of the frame-integrated mask. The method of claim 22,
In step (e), when the temperature of the process region is lowered to the second temperature, the mask attached to the frame is contracted and tension is again applied. The method of claim 22,
In step (b), the mask separation/replacement method of a frame-integrated mask in which the outer frame portion of at least one edge of the target mask to be separated/replaced is pressed and the mask is separated from the frame by applying an external force to one edge of the mask. . The method of claim 28,
In step (b), the mask separation/replacement method of the frame-integrated mask, in which the upper and lower surfaces of the outer frame portion of one corner of the mask are compressed. The method of claim 28,
In step (b), an external force is applied to one edge of the mask to remove one edge of the mask from the frame, and an external force is applied to the other edge opposite to one side of the mask to remove the other edge from the frame, and the mask is separated from the frame. How to remove/replace the mask of the frame-integrated mask.

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