CN110265371A - 软性电路基板的布线结构 - Google Patents
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- 238000005452 bending Methods 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000004642 Polyimide Substances 0.000 claims description 6
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
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- 239000000956 alloy Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
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- 239000010931 gold Substances 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 239000011135 tin Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 description 11
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Abstract
一种软性电路基板的布线结构包含软性基板及多个线路,该软性基板具有表面,各该线路形成于该软性基板的该表面上,各该线路具有凸块导接端,该凸块导接端位于该表面的芯片设置区中并电性连接芯片,其中,各该线路具有弯曲段,该弯曲段具有第一导接点及第二导接点,该第一导接点与该第二导接点之间具有直线距离,该弯曲段的长度大于该直线距离。
Description
技术领域
本发明是关于一种软性电路基板,特别是关于一种软性电路基板的布线结构。
背景技术
薄膜覆晶基板(Chip on film)为一种封装技术,特征在于芯片以倒置的方式接合于薄膜基板上,其中芯片具有多个凸块,薄膜基板具有多个线路,芯片的各该凸块连接薄膜基板的各该线路,使得芯片可借由凸块电性连接薄膜基板,而可直接通过凸块进行信号的传输,以大幅地降低整体封装装置的尺寸。由于薄膜基板具有可挠性,因此薄膜基板又被称为可挠性基板或软性电路基板,随着科技的发展,软性电路基板上的线路间距(pitch)已进入了微间距之尺寸(fine pitch,线路间距约介于20μm至30μm之间)。
软性电路基板在朝向超威间距(super fine pitch,线路间距约介于10μm至20μm之间)的目标发展中,所面临的问题是线路之间的间距为超威间距时,因蚀刻制程的需求使得线路的宽度随之下降,这也导致线路与软性基板之间接触面积过小而造成连接强度不足的问题发生,使得芯片与软性电路板热接合制程时,软性电路基板会受热而膨胀,令线路由软性基板上剥离(peeling)或是凸块与其对应之线路错位(bonding shift)的情形发生。
发明内容
本发明的主要目的在于借由线路的弯曲段增加线路与软性基板之间的接合强度,以避免线路于凸块接合的热压合制程中由软性基板上剥离或凸块错位的情形发生。
本发明的一种软性电路基板的布线结构包含软性基板及多个线路,该软性基板具有表面,芯片覆晶于该表面的芯片设置区上,各该线路形成于该软性基板的该表面上,各该线路具有凸块导接端,该些凸块导接端位于该芯片设置区中并电性连接该芯片的多个凸块,各该线路具有弯曲段,且各该弯曲段与各该凸块的边缘之间的距离介于20μm至110μm之间,其中,该弯曲段具有第一导接点及第二导接点,该第一导接点与该第二导接点之间具有直线距离,该弯曲段的长度大于该直线距离。
所述的软性电路基板的布线结构,其中该直线距离介于25μm至65μm之间。
所述的软性电路基板的布线结构,其中该软性基板的材料为聚酰亚胺(Polyimide)。
所述的软性电路基板的布线结构,其中该些线路的材料为铜。
所述的软性电路基板的布线结构,其中该些凸块的材料可选自于金、铜、银、镍、锡或其合金。
所述的软性电路基板的布线结构,其中各该线路之间的间距(pitch)介于10μm至20μm之间。
所述的软性电路基板的布线结构,其中各该凸块之间的间距与各该线路之间的该间距实质上相同。
所述的软性电路基板的布线结构,其中该芯片的该些凸块的排列呈一字型,各该凸块的该边缘与该弯曲段之间的该距离实质上均相同,且该距离介于90μm至110μm之间。
所述的软性电路基板的布线结构,其中该芯片的该些凸块的排列呈交错型,该些凸块包含多个第一凸块及多个第二凸块,各该第一凸块的第一边缘与该弯曲段之间具有第一距离,且该第一距离介于90μm至110μm之间,各该第二凸块的第二边缘与该弯曲段之间具有第二距离,且该第二距离介于20μm至30μm之间。
所述的软性电路基板的布线结构,其中该些凸块的材料可选自于金、铜、银、镍、锡或其合金。
本发明借由该些线路的该弯曲段的设置增加该些线路与该软性基板之间的接触面积,以提升该些线路的该凸块导接端与该软性基板之间的接合强度,而可避免该些线路在热压合的制程中剥离。
附图说明
图1:依据本发明的第一实施例,软性电路基板的布线结构的示意图。
图2:依据本发明的第一实施例,该软性电路基板的布线结构的侧视图。
图3:依据本发明的第一实施例,该软性电路基板的布线结构的局部示意图。
图4:依据本发明的第二实施例,软性电路基板的布线结构的局部示意图。
【主要元件符号说明】
100:软性电路基板的布线结构 110:软性基板
111:表面 111a:芯片设置区
120:芯片 121:凸块
121a:边缘 121b:第一凸块
121c:第二凸块 121d:第一边缘
121e:第二边缘 130:线路
131:凸块导接端 132:弯曲段
132a:第一导接点 132b:第二导接点
P1、P2:间距 SLD:直线距离
D:距离 D1:第一距离
D2:第二距离
具体实施方式
请参阅图1,其为本发明的第一实施例,一种软性电路基板的布线结构100的示意图,该软性电路基板的布线结构100包含软性基板110、芯片120及多个线路130,该软性基板110具有用以设置组件的表面111,该芯片120及该些线路130设置于该软性基板110的该表面111上。请参阅图1、2及图3,在本实施例中,该表面111上具有芯片设置区111a,而该芯片120覆晶于该表面111的该芯片设置区111a上,该线路130具有凸块导接端131,该凸块导接端131位于该芯片设置区111a中并电性连接该芯片120,其中,该芯片120具有多个凸块121,各该凸块121连接各该线路130的该凸块连接端131,使该芯片120经由各该凸块121电性连接各该线路130的该凸块导接端131,让该芯片120与该软性基板110的该些线路130之间能进行信号的传输。
在本实施例中,该软性基板110、该芯片120及该线路130构成薄膜覆晶基板封装(Chip on film package,COF),其中,该软性基板110的材料为聚酰亚胺(Polyimide),该些线路130的材料为铜,该些凸块121的材料可选自于金、铜、银、镍、锡或其合金。
请参阅图2,较佳的,各该线路130之间的间距(Pitch)P1介于10μm至20μm之间,使该薄膜封装基板可为超威间距(Super fine pitch)的规格,由于各该线路130是与各该凸块121相互导接,因此,各该凸块121之间的间距P2与各该线路130之间的该间距P1实质上相同。
请参阅图3,由于该芯片120在覆晶的热压合制程中会以加温加压装置(图未绘出)抵压及加热该芯片120或该软性基板110的该芯片设置区111a,让该芯片120的该凸块121能与该些线路130的该凸块导接端131共晶连接,但热压合所产生的热会影响到邻近的该软性基板110使其略为膨胀而影响该些线路130与该软性基板110之间的接合强度。在本实施例中,该芯片120的该些凸块121的排列呈一字型,也就是该些凸块121排列于同一直在线,且各该线路130具有弯曲段132,各该凸块121的边缘121a与该弯曲段132之间的距离D实质上均相同,其中,该弯曲段132与各该凸块的121该边缘121a之间的该距离D介于90μm至110μm之间,是为容易受到热压合的高温影响的位置,该弯曲段132具有第一导接点132a及第二导接点132b,该第一导接点132a与该第二导接点132b之间具有直线距离SLD,其中该弯曲段132的长度大于该直线距离SLD,借此,能让邻近该芯片设置区111a的该些线路130与该软性基板110之间的接合强度能够提升,以避免该线路130由该软性基板110上剥离,在本实施例中,该直线距离SLD介于25μm至65μm之间。
请参阅图4,为本发明的第二实施例的局部示意图,第二实施例与第一实施例的差异在于该芯片的该些凸块121的排列呈交错型,也就是相邻的两个凸块121的位置是错开的,可令该些凸块及该些线路之间的该间距较第一实施例密集。其中,该些凸块121包含多个第一凸块121b及多个第二凸块121c,各该第一凸块121b的第一边缘121d与该弯曲段132之间具有第一距离D1,且该第一距离D1介于90μm至110μm之间,各该第二凸块121c的第二边缘121e与该弯曲段132之间具有第二距离D2,且该第二距离D2介于20μm至30μm之间,相同地,本实施例亦可借由该弯曲段132增加该些线路130与该软性基板110之间的接合强度,以避免该些线路130由该软性基板110上剥离。
本发明借由该些线路130的该弯曲段132的设置,增加该些线路130与该软性基板110之间的接触面积,以提升该些线路130的该凸块导接端131与该软性基板110之间的接合强度,而可避免该些线路130在热压合的制程中剥离。
以上所述,仅是本发明的较佳实施例而已,并非对本发明作任何形式上的限制,虽然本发明已以较佳实施例揭露如上,然而并非用以限定本发明,任何熟悉本专业的技术人员,在不脱离本发明技术方案范围内,当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例,但凡是未脱离本发明技术方案的内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本发明技术方案的范围内。
Claims (10)
1.一种软性电路基板的布线结构,其特征在于,其包含:
软性基板,具有表面,芯片覆晶于该表面的芯片设置区上;以及
多个线路,形成于该软性基板的该表面上,各该线路具有凸块导接端,该些凸块导接端位于该芯片设置区中并电性连接该芯片的多个凸块,各该线路具有弯曲段,且各该弯曲段与各该凸块的边缘之间的距离介于20μm至110μm之间,其中,该弯曲段具有第一导接点及第二导接点,该第一导接点与该第二导接点之间具有直线距离,该弯曲段的长度大于该直线距离。
2.如权利要求1所述的软性电路基板的布线结构,其特征在于,其中该直线距离介于25μm至65μm之间。
3.如权利要求1所述的软性电路基板的布线结构,其特征在于,其中该软性基板的材料为聚酰亚胺(Polyimide)。
4.如权利要求1所述的软性电路基板的布线结构,其特征在于,其中该些线路的材料为铜。
5.如权利要求1所述的软性电路基板的布线结构,其特征在于,其中该些凸块的材料可选自于金、铜、银、镍、锡或其合金。
6.如权利要求1所述的软性电路基板的布线结构,其特征在于,其中各该线路之间的间距(pitch)介于10μm至20μm之间。
7.如权利要求1或6所述的软性电路基板的布线结构,其特征在于,其中各该凸块之间的间距与各该线路之间的该间距实质上相同。
8.如权利要求1所述的软性电路基板的布线结构,其特征在于,其中该芯片的该些凸块的排列呈一字型,各该凸块的该边缘与该弯曲段之间的该距离实质上均相同,且该距离介于90μm至110μm之间。
9.如权利要求1所述的软性电路基板的布线结构,其特征在于,其中该芯片的该些凸块的排列呈交错型,该些凸块包含多个第一凸块及多个第二凸块,各该第一凸块的第一边缘与该弯曲段之间具有第一距离,且该第一距离介于90μm至110μm之间,各该第二凸块的第二边缘与该弯曲段之间具有第二距离,且该第二距离介于20μm至30μm之间。
10.如权利要求1所述的软性电路基板的布线结构,其特征在于,其中该些凸块的材料可选自于金、铜、银、镍、锡或其合金。
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