CN110193452A - 涂敷方法、涂敷装置以及部件的制造方法 - Google Patents

涂敷方法、涂敷装置以及部件的制造方法 Download PDF

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CN110193452A
CN110193452A CN201910135817.2A CN201910135817A CN110193452A CN 110193452 A CN110193452 A CN 110193452A CN 201910135817 A CN201910135817 A CN 201910135817A CN 110193452 A CN110193452 A CN 110193452A
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伊藤光实
蛯原裕
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Panasonic Intellectual Property Management Co Ltd
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Abstract

本发明提供一种抑制涂敷量波动的涂敷方法、涂敷装置以及部件的制造方法。涂敷方法包括：从喷嘴将附着有粘合材料的涂敷针伸出的排出工序；将所述粘合材料分离至所述涂敷针的顶端和所述喷嘴的分离工序；以及使所述粘合材料附着于第一零件的附着工序。涂敷装置具有：喷嘴，其保持粘合材料；涂敷针，其在顶端附着有所述粘合材料的状态下从所述喷嘴排出；以及控制部，其控制所述涂敷针的移动速度，而进行将所述顶端的粘合材料分离至所述涂敷针的顶端和所述喷嘴的控制。

Description

涂敷方法、涂敷装置以及部件的制造方法
技术领域
本发明涉及涂敷方法、涂敷装置以及部件的制造方法。尤其涉及使用了粘合材料的涂敷方法、涂敷装置以及部件的制造方法。
背景技术
以往，为了保护图像传感器的像素部而粘贴玻璃盖。
图1是拟将作为图像传感器的半导体元件4与保护零件6即玻璃盖粘贴的立体图。为了将半导体元件4与保护零件6粘贴，首先需要在半导体元件4的表面上涂敷粘合材料5。图2是涂敷粘合材料5的装置的图。涂敷针1插在装入了粘合材料5的喷嘴2中。
图3是正在将粘合材料5涂敷于半导体元件4上时的图。使涂敷针1向下部移动，从喷嘴2向外部伸出。在涂敷针1的顶端附着有粘合材料5e，通过使涂敷针1进一步下降，在半导体元件4上转印粘合材料5e。使涂敷针1以恒定的速度动作，下降至在半导体元件4上转印粘合材料5e的位置。转印时，涂敷针1的顶端的粘合材料5e和附着于涂敷针1的顶端附近的侧面1f上的粘合材料5f同时被转印。
涂敷粘合材料5后，如图1所示，使保护零件6接近半导体元件4。此时的粘合材料5的扩展在图4的(a)～图4的(c)中示出。图4的(a)～图4的(c)是示出将半导体元件4与保护零件6粘合时的经时变化的俯视图。
按照图4中(a)～图4中(c)的顺序，粘合材料5呈同心圆状扩展。保护零件6是透明的，因此能够看到粘合材料5。
为了牢固粘合，需要使粘合材料5遍布到保护零件6的四角部分。因此，需要设定为粘合材料5从半导体元件4的外形露出的状态，因而考虑到涂敷量的波动，需要多涂敷一些。
最终，在粘合材料5的涂敷量过多的情况下的完成品在图5的侧视图中示出。产生向半导体元件4侧面的粘合材料流挂11、向玻璃盖的粘合材料爬升10。粘合材料流挂11、粘合材料爬升10在保护零件6的边的中央部产生更多。粘合材料爬升10处于在保护零件6边的中央隆起最大的状态，而在保护零件6的两侧角方向较少。粘合材料流挂11处于在半导体元件4的边的中央隆起最大的状态，而在半导体元件4的两侧角方向较少。这是在粘贴保护零件6时，因粘合材料5呈同心圆状扩展所致的痕蹄，在下一道工序中，存在发生不需要的粘合材料转印等而使质量降低的危险。如果考虑到涂敷量的波动而多涂敷一些粘合材料5，则很有可能会大量生产出质量差的完成品。因此，需要极力抑制涂敷量的波动，尽可能不增多涂敷粘合材料的量。
作为高精度地控制涂敷量的方法，有专利文献1的方法。在专利文献1中，将粘合剂涂敷于半导体元件的一个边，并使其向其他边扩展。
在先技术文献
专利文献1：日本特开2016-21736号公报
然而，专利文献1并非抑制涂敷量波动的方法，还需要额外的工序。
发明内容
本发明要解决的课题
本发明解决上述以往的课题，提供一种抑制了涂敷量波动的涂敷方法、涂敷装置以及部件的制造方法。
用于解决课题的方案
为了解决上述课题，使用一种涂敷方法，包括：从喷嘴将附着有粘合材料的涂敷针伸出的排出工序；将所述粘合材料分离至所述涂敷针的顶端和所述喷嘴的分离工序；以及使所述粘合材料附着于第一零件的附着工序。
使用一种部件的制造方法，包括：从喷嘴将附着有粘合材料的涂敷针伸出的排出工序；将所述粘合材料分离至所述涂敷针的顶端和所述喷嘴的分离工序；使所述粘合材料附着于第一零件的附着工序；以及在所述第一零件上的所述粘合材料上接合第二零件的接合工序。
使用一种涂敷装置，具有：喷嘴，其保持粘合材料；涂敷针，其在顶端附着有所述粘合材料的状态下从所述喷嘴排出；以及控制部，其控制所述涂敷针的移动速度，而进行将所述顶端的粘合材料分离至所述涂敷针的顶端和所述喷嘴的控制。
发明效果
根据本发明的转印涂敷装置，能够使微小的一点转印的涂敷量波动减小，因此能够以较好的精度涂敷可在接合零件之下充分地填充至四角的粘合材料量，从而能够提高半导体芯片与接合零件的粘合可靠性。另外，粘合材料从接合零件的露出量也变少，不会影响下一道工序。
附图说明
图1是以往的将半导体元件与玻璃盖粘合时的立体图。
图2是示出以往的用粘合材料涂敷针涂敷粘合材料的图。
图3是示出以往的粘合材料涂敷的转印过程中涂敷针与粘合材料的关系的图。
图4的(a)至(c)是以往的将半导体元件与保护零件粘合时的俯视图。
图5是使用了以往的粘合材料涂敷方式时的半导体元件的侧视图。
图6的(a)是实施方式的安装结构体的主视图，(b)是实施方式的安装结构体的俯视图。
图7是实施方式的半导体安装结构体的放大侧视图。
图8是示出实施方式的粘合材料涂敷的中途停止的涂敷针与粘合材料的关系的图。
图9是示出实施方式的粘合材料涂敷的中途停止后的涂敷针与粘合材料的关系的图。
图10是示出实施方式的粘合材料涂敷的再次下降了的涂敷针与粘合材料的关系的图。
图11是示出实施方式的粘合材料涂敷的转印过程中涂敷针与粘合材料的关系的图。
图12的(a)是示出以往的粘合材料涂敷时的动作流程的图，(b)是示出实施方式的粘合材料涂敷时的动作流程的图。
图13是绘出了以往方式和实施方式的涂敷量的图表。
图14的(a)是示出以往的涂敷针顶端的位置与时间的关系的图，(b)至(c)是示出实施方式的涂敷针顶端的位置与时间的关系的图。
附图文字说明
1 涂敷针
1f 侧面
2 喷嘴
4 半导体元件
5 粘合材料
5a 侧面部
5b 周边部
5c 中间部
5d 粘合材料
5e 粘合材料
5f 粘合材料
6 保护零件
10 粘合材料爬升
11 粘合材料流挂
12 控制部
100 半导体安装结构体
具体实施方式
以下参照附图说明本发明的实施方式。
<结构>
图6的(a)是实施方式的半导体安装结构体100的侧视图，图6的(b)是实施方式的半导体安装结构体100的俯视图。图7是实施方式的半导体安装结构体100的放大侧视图，示出粘合材料5的端部。在图7中，保护零件6以粘合材料5粘合在半导体元件4上。
半导体元件4是图像传感器等功能性元件。在该例中，在俯视观察下，为1mm×1mm左右的正方形，整体形状为长方体。
在该情况下保护零件6为玻璃盖。是保护半导体元件4的零件。在俯视观察下，玻璃盖的大小比半导体元件4小，是小于1mm×1mm的正方形。
粘合材料5是将半导体元件4和保护零件6粘合起来的材料。
粘合材料5具有半导体元件4与保护零件6之间的中间部5c、位于中间部5c的周边的周边部5b、以及爬升到方形的保护零件6的侧面的侧面部5a。需要说明的是，中间部5c仅位于保护零件6的下表面(连接面)。侧面部5a位于周边部5b的顶部。该侧面部5a、周边部5b的大小因粘合材料5的涂敷量波动而变化。由于需要以至少中间部5c完全涂满的量作为最少的涂敷量，因此需要根据涂敷量波动而保证能够达到最少涂敷量以上。因此，如果涂敷量波动较大，会导致侧面部5a、周边部5b达到必要以上的量，成为产生向半导体元件4的侧面的粘合材料流挂11的主要原因。
在实施方式的半导体安装结构体100中，能够减小粘合材料5的涂敷量波动，从而能够减少向半导体元件4的侧面的粘合材料流挂11的产生。
该结构能够通过以下制造方法来实现。
<制造方法>
以往使用通过将从涂敷针1开始下降直至转印控制为恒定速度来涂敷粘合材料5的方式。在此，恒定速度的区域除去涂敷针1启动的初期、涂敷针1停止的终期这样的低速度区域。
在实施方式中，通过对涂敷针1的下降动作进行速度控制，能够减少粘合材料5的涂敷量波动。
<工序>
图12的(a)是以往的粘合材料涂敷动作，图12的(b)是实施方式的粘合材料涂敷动作。相对于以往的方式，在实施方式中，进行使涂敷针1的移动速度改变并暂停的控制。
接下来说明直至使用将上述涂敷针1的下降动作暂停的动作并将粘合材料5涂敷于半导体元件4为止的工序。
(1)填充工序
首先，向喷嘴2填充粘合材料5，并将粘合材料5保持于喷嘴2。在该例中，粘合材料5使用了丙烯酸树脂系中1000mPa·s左右的低粘度材料。图2是涂敷粘合材料5的装置的图。将涂敷针1插入装有粘合材料5的喷嘴2中。如果在喷嘴2中已经保持有粘合材料5，则无需填充工序。
(2)排出工序
从图2的状态起，使涂敷针1向下方移动，将涂敷针1向喷嘴2外排出。
(3)分离工序
排出工序后，改变涂敷针1的恒定的移动速度，并中途停止。图8是示出在中途停止了的涂敷针1与粘合材料5的关系的图。使涂敷针1向下方移动，在从喷嘴2突出一定距离的状态下暂时停止。从喷嘴2推出的粘合材料5分离为附着于涂敷针1的顶端的粘合材料5e和附着于涂敷针1的侧面的粘合材料5d。通过使其停止来使粘合材料5分离。需要说明的是，即使使涂敷针1以恒定速度移动，也能使粘合材料5分离，但分离的位置波动因而状况不佳。
此次，使涂敷针1在从喷嘴2的顶端突出1mm时停止。涂敷针1从喷嘴2的顶端突出的长度需根据粘合材料5的种类、喷嘴2的外径、内径、涂敷针1的外径而改变。
图9是示出实施方式的粘合材料涂敷的中途停止后的涂敷针1与粘合材料5的关系的图。是在涂敷针1停止后、1秒钟后的状态。附着于涂敷针1的顶端面(底面)的粘合材料5e与图8相同(被保持着)，但附着于涂敷针1的侧面的粘合材料5d的形状不同。因粘合材料5的粘性，附着于涂敷针1的侧面的粘合材料5d克服被涂敷针1推出的力而向喷嘴2退回而分离，由此附着于涂敷针1的侧面的粘合材料5d发生变化。其结果是，粘合材料5d没有附着于涂敷针1的顶端附近的侧面1f上。
(4)涂敷工序
分离工序后，再次使涂敷针1移动。图10是示出实施方式的粘合材料涂敷的再次下降了的涂敷针1与粘合材料的关系的图。即使将涂敷针1再次下降，涂敷针1的顶端附近的侧面1f上也继续保持没有附着粘合材料5d的状态。
图11是示出实施方式的粘合材料涂敷的转印过程中的涂敷针1与粘合材料5的关系的图。向半导体元件4涂敷粘合材料是仅涂敷针1的顶端部被转印。附着于涂敷针1的侧面的粘合材料5d不成为转印的对象，因此所涂敷的粘合材料5的量波动较少而稳定。
暂停时间优选为0.5秒～5.0秒的范围。也可以是更长的时间，但若考虑生产率，则优选为5秒以下。
停止的位置或者减慢涂敷针1的速度的位置或者分离工序的位置为与喷嘴2相距1mm～2mm左右、小于3mm之处。若与喷嘴2之间的距离过长(3mm)，则未完全退回到喷嘴2侧的粘合材料5残留在涂敷针1的侧面，涂敷量不稳定。
即使不暂停，通过从某个地点起降低速度，也有望获得相同的效果。图14的(a)是示出以往的涂敷针顶端的位置与时间的关系的图。图14的(b)～图14的(c)是示出实施方式的涂敷针顶端的位置与时间的关系的图。在图14的(b)中，正使涂敷针中途停止。在图14的(c)中，没有使涂敷针停止，但在中途减慢速度。例如，从喷嘴2以1mm/秒排出涂敷针1，在与喷嘴2相距1mm之处起以0.11mm/秒前进5秒钟，之后，以1mm/秒移动涂敷针1，也与暂停的结果相同。优选在中途阶段性地改变移动速度。停止或者减慢速度只要有一处即可。与整体上缓慢地变化相比，优选不连续的变化。
需要说明的是，减慢涂敷针1的速度(暂停涂敷针1)除去初期、终期。即，除去涂敷针1刚从喷嘴2出来之后的初期和涂敷针1接近对象物的半导体元件4、涂敷粘合材料5前后的终期。
(5)接合工序
在涂敷了粘合材料5之后，将半导体元件4和保护零件6合体。之后，粘合材料5固化。
<实验>
图13是按照以往方式和实施方式的方式分别进行粘合材料的涂敷并将涂敷量绘图而成的结果。上述涂敷按照以下条件实施。
粘合剂：丙烯酸树脂系1000mPa·s左右
喷嘴内径：φ800μm
涂敷针的速度：1.75mm/秒
涂敷针的直径：φ400μm
暂停的位置：从喷嘴突出了1mm的位置
暂停时间：1秒
以往方式无暂停，其他都为相同条件。
涂敷量的波动得以大幅减少，相对于以往方式的3σ＝0.22，在实施方式中，为3σ＝0.06。至少，在此次的实施方式中，3σ为0.20以下。优选为0.10以下。
如上所述，针对以往的由涂敷针转印来涂敷的方法，通过使涂敷针的下降动作暂停，能够消除涂敷针侧面的粘合材料附着，从而能够减小涂敷量波动。
(整体上)
作为粘合材料广泛地包括焊膏、接合材料。
取代半导体元件4，也能够应用于作为第一零件的各种设备。取代保护零件6，也能够使用作为第二零件的除了玻璃盖以外的各种保护零件、其他设备。
涂敷针1的控制等装置的控制由图3的控制部12实施。
工业上的可用性
本发明的涂敷装置具有能够在一点转印上减小涂敷量的波动的特征，能够广泛地应用于优质地粘合零件的用途。另外，本发明的半导体安装方法和半导体安装装置并不局限于半导体，也可以用于光学部件等精密部件。

Claims (10)

1.一种涂敷方法，包括：
从喷嘴将附着有粘合材料的涂敷针伸出的排出工序；
将所述粘合材料分离至所述涂敷针的顶端和所述喷嘴的分离工序；以及
使所述粘合材料附着于第一零件的附着工序。
2.根据权利要求1所述的涂敷方法，其中，
在所述分离工序中，使所述涂敷针的侧面的粘合材料返回所述喷嘴侧，维持所述涂敷针的顶端面的粘合材料。
3.根据权利要求1所述的涂敷方法，其中，
所述分离工序在距离所述喷嘴1mm以上且小于3mm处实施。
4.根据权利要求1所述的涂敷方法，其中，
所述分离工序是通过改变所述涂敷针的移动速度来使所述粘合材料分离至所述涂敷针的顶端和所述喷嘴的工序。
5.根据权利要求4所述的涂敷方法，其中，
所述涂敷针的移动速度的改变是暂停。
6.根据权利要求5所述的涂敷方法，其中，
所述暂停的时间为0.5秒以上且5.0秒以下。
7.根据权利要求4所述的涂敷方法，其中，
所述涂敷针的移动速度的改变是减慢所述移动速度。
8.根据权利要求1所述的涂敷方法，其中，
在反复实施所述涂敷方法的情况下，附着于所述第一零件上的所述粘合材料的量的波动的3σ为0.20以下。
9.一种部件的制造方法，包括：
权利要求1所述的涂敷方法；
使所述粘合材料附着于所述第一零件的工序；以及
在所述第一零件上的所述粘合材料上接合第二零件的接合工序。
10.一种涂敷装置，具有：
喷嘴，其保持粘合材料；
涂敷针，其在顶端附着有所述粘合材料的状态下从所述喷嘴排出；以及
控制部，其控制所述涂敷针的移动速度，而进行将所述顶端的粘合材料分离至所述涂敷针的顶端和所述喷嘴的控制。
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