JP2019147070A - 塗布方法と塗布装置と部品の製造方法 - Google Patents
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Abstract
Description
図6(a)は、実施の形態の半導体実装構造体100の側面図、図6(b)は、実施の形態の半導体実装構造体100の平面図である。図7は、実施の形態の半導体実装構造体100の拡大側面図であり、接着材5の端部を示している。半導体素子4上に、保護部材6が、接着材5で接着されている。
従来は、塗布針1の下降開始から転写までを一定の速度の制御で、接着材5を塗布する方式を使用していた。ここで、一定速度の制御とは、初期、終期で、制御できない低速度の領域を除く。
図12(a)は、従来の接着材塗布動作、図12(b)は、実施の形態の接着材塗布動作である。従来方式に対し、実施の形態では、塗布針1の移動速度を変化させ、一時停止する制御をしている。
まず、ノズル2に接着材5を充填し、接着材5を保持する。接着材5は、この例では、アクリル樹脂系で1000mPa・s程度の低粘度のものを使用した。図2は、接着材5を塗布する装置の図である。接着材5を入れたノズル2に塗布針1を挿入した。すでに、ノズル2に接着材5が保持されていれば、充填工程は不要である。
図2の状態から、塗布針1を下方へ移動させ、塗布針1をノズル2外へ吐出させる。
吐出工程後、塗布針1の一定の移動速度を変更し、途中で止める。図8は、途中で停止した塗布針1と接着材5の関係を示す図である。塗布針1を下方向に移動させ、ノズル2から一定の距離突き出した状態で一旦停止させる。ノズル2から押し出された接着材5は、塗布針1の先端に付着する接着材5eと、塗布針1の側面に付着する接着材5dとに分離される。停止させることで接着材5を分離させる。なお、塗布針1を、一定速度で移動させても、接着材を分離できるが、分離する場所がばらつきよくない。
分離工程後、再度、塗布針1を移動させる。図10は実施の形態の接着材塗布の再下降した塗布針と接着材の関係を示す図である。塗布針1を再下降しても塗布針1の先端付近の側面1fには接着材5dが付着していない状態が継続される。
接着材5が塗布された後、半導体素子4と保護部材6とが、合体される。その後、接着材5が硬化される。
図13は従来方式と実施の形態の方式でそれぞれ接着材の塗布を行い、塗布量をプロットした結果である。以下の条件で実施した。
ノズル内径: φ800μm
塗布針の速度: 1.75mm/秒
塗布針の径: φ400μm
一時停止させた位置: ノズルから1mm突き出した位置
一時停止時間: 1秒
従来方式は一時停止なしで、その他は同条件。
塗布量のばらつきが大幅に低減できており、従来方式の3σ=0.22に対して、実施の形態では3σ=0.06となった。
(全体として)
接着材としては、半田ペースト、接合材を広く含む。
1f 側面
2 ノズル
4 半導体素子
5 接着材
5a 側面部
5b 周辺部
5c 中間部
5d 接着材
5e 接着材
5f 接着材
6 保護部材
10 接着材這い上がり
11 接着材垂れ
12 制御部
100 半導体実装構造体
Claims (7)
- ノズルから、接着材を付着した塗布針を出す吐出工程と、
前記接着材を、前記塗布針の先端と前記ノズルとに分離する分離工程と、
第1部材に前記接着材と付着させる付着工程と、を含む塗布方法。 - 前記分離工程は、前記塗布針の移動速度を変化させる工程である請求項1記載の塗布方法。
- 前記塗布針の移動速度の変化は、一時停止させることである請求項2記載の塗布方法。
- 前記塗布針の移動速度の変化は、前記移動速度を遅くすることである請求項2記載の塗布方法。
- 前記分離工程では、前記塗布針の側面の接着材を前記ノズル側へ戻し、前記塗布針の先端面の接着材を維持する請求項1〜4のいずれか1項に記載の塗布方法。
- ノズルから、接着材を付着した塗布針を出す吐出工程と、
前記塗布針の接着材を、前記塗布針の先端と前記ノズルとに分離する分離工程と、
第1部材に前記接着材と付着させる付着工程と、
前記第1部材上の前記接着材上から第2部材を接合する接合工程と、を含む部品の製造方法。 - 接着材を保持したノズルと、
先端に前記接着材が付着した状態で前記ノズルから吐出する塗布針と、
前記塗布針の移動速度を制御して前記先端の接着材を前記塗布針の先端と前記ノズルとに分離する制御をする制御部と、を有する塗布装置。
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JP2018031444A JP6937466B2 (ja) | 2018-02-26 | 2018-02-26 | 塗布方法と塗布装置と部品の製造方法 |
US16/274,176 US10906061B2 (en) | 2018-02-26 | 2019-02-12 | Coating method, coating apparatus and method for manufacturing component |
CN201910135817.2A CN110193452B (zh) | 2018-02-26 | 2019-02-21 | 涂敷方法、涂敷装置以及部件的制造方法 |
KR1020190020929A KR102558849B1 (ko) | 2018-02-26 | 2019-02-22 | 도포 방법과 도포 장치와 부품의 제조 방법 |
US17/130,456 US11305311B2 (en) | 2018-02-26 | 2020-12-22 | Coating method, coating apparatus and method for manufacturing component |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2010149085A (ja) * | 2008-12-26 | 2010-07-08 | Panasonic Corp | ペースト塗布装置および塗布方法 |
JP2012124381A (ja) * | 2010-12-09 | 2012-06-28 | Ntn Corp | 塗布装置、塗布方法、およびパターン修正装置 |
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