CN110099515B - 一种改善pcb钻孔的方法 - Google Patents

一种改善pcb钻孔的方法 Download PDF

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Publication number
CN110099515B
CN110099515B CN201910428398.1A CN201910428398A CN110099515B CN 110099515 B CN110099515 B CN 110099515B CN 201910428398 A CN201910428398 A CN 201910428398A CN 110099515 B CN110099515 B CN 110099515B
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China
Prior art keywords
pcb
composite resin
resin material
drilling
layer
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Application number
CN201910428398.1A
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English (en)
Chinese (zh)
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CN110099515A (zh
Inventor
张伦强
杨迪
张斌
王建
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Newccess Industrial Co ltd
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Shenzhen Newccess Industrial Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Shenzhen Newccess Industrial Co ltd filed Critical Shenzhen Newccess Industrial Co ltd
Priority to CN201910428398.1A priority Critical patent/CN110099515B/zh
Publication of CN110099515A publication Critical patent/CN110099515A/zh
Priority to TW108131948A priority patent/TWI711518B/zh
Priority to KR1020190111305A priority patent/KR102183776B1/ko
Priority to JP2019177489A priority patent/JP6787608B1/ja
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Publication of CN110099515B publication Critical patent/CN110099515B/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Drilling And Boring (AREA)
CN201910428398.1A 2019-05-22 2019-05-22 一种改善pcb钻孔的方法 Active CN110099515B (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN201910428398.1A CN110099515B (zh) 2019-05-22 2019-05-22 一种改善pcb钻孔的方法
TW108131948A TWI711518B (zh) 2019-05-22 2019-09-04 一種改善pcb鑽孔的方法
KR1020190111305A KR102183776B1 (ko) 2019-05-22 2019-09-09 Pcb 드릴링 개선 방법
JP2019177489A JP6787608B1 (ja) 2019-05-22 2019-09-27 Ｐｃｂパネルのドリル穴開けの改善方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910428398.1A CN110099515B (zh) 2019-05-22 2019-05-22 一种改善pcb钻孔的方法

Publications (2)

Publication Number Publication Date
CN110099515A CN110099515A (zh) 2019-08-06
CN110099515B true CN110099515B (zh) 2021-09-14

Family

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Family Applications (1)

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CN201910428398.1A Active CN110099515B (zh) 2019-05-22 2019-05-22 一种改善pcb钻孔的方法

Country Status (4)

Country Link
JP (1) JP6787608B1 (ja)
KR (1) KR102183776B1 (ja)
CN (1) CN110099515B (ja)
TW (1) TWI711518B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113025114A (zh) * 2020-02-18 2021-06-25 深圳市百柔新材料技术有限公司 钻孔油墨及其应用
CN113784508B (zh) * 2020-06-10 2024-03-29 南通深南电路有限公司 一种钻针选择方法和pcb钻孔方法
CN111644892A (zh) * 2020-07-08 2020-09-11 昆山广谦电子有限公司 改善金属板加工毛刺的方法
CN113402953A (zh) * 2021-07-30 2021-09-17 深圳市宏宇辉科技有限公司 一种pcb钻孔用盖板及其制备方法和应用
CN114888895B (zh) * 2022-06-23 2024-07-16 中国电子科技集团公司第十四研究所 一种热塑性粘结片聚四氟乙烯多层板高质量钻孔方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO890091L (no) * 1988-01-11 1989-07-12 Thiokol Morton Inc Fremgangsmaate og anordning for aa paafoere polymere materialer paa trykte kretser.
JPH01210206A (ja) * 1988-02-16 1989-08-23 San Alum Kogyo Kk プリント基板穴明け加工用当て板
JPH05347467A (ja) * 1992-06-15 1993-12-27 Showa Alum Corp 半導体用アルミニウム基板の製造方法
JP2828129B2 (ja) * 1993-06-07 1998-11-25 三菱瓦斯化学株式会社 プリント配線板の孔明け加工法
JP2003152308A (ja) * 2001-11-09 2003-05-23 Nippon Synthetic Chem Ind Co Ltd:The プリント配線基板の穿孔方法
JP4644414B2 (ja) * 2003-01-28 2011-03-02 三菱瓦斯化学株式会社 着色された孔あけ用滑剤シート
EP2191701B1 (en) * 2007-09-28 2013-03-20 Tri-Star Laminates, Inc. Entry sheet, method of manufacturing thereof and methods for drilling holes in printed circuit boards
US20090258187A1 (en) * 2008-04-10 2009-10-15 Michael Donavon Brady Protective coating for glass manufacturing and processing into articles
JP5347467B2 (ja) 2008-12-09 2013-11-20 住友電気工業株式会社 移動通信機及び通信制御方法
DE102008064166A1 (de) * 2008-12-22 2010-06-24 Schmoll Maschinen Gmbh Automatisierte Werkzeugmaschine und Verfahren zum Einbringen von Referenzbohrungen in Leiterplatten
JP2016023204A (ja) * 2014-07-17 2016-02-08 ジーティーエー エレクトロニクス カンパニー リミテッド 孔あけ用ガイドシートの感光性コーティング樹脂及びその応用
CN105505135B (zh) * 2015-12-24 2018-04-10 深圳市柳鑫实业股份有限公司 一种pcb钻孔用垫板及其制备方法
CN105729557B (zh) * 2016-03-14 2018-08-24 深圳市柳鑫实业股份有限公司 一种改善pcb钻孔毛刺的方法
WO2017208912A1 (ja) * 2016-05-31 2017-12-07 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート及びそれを用いたドリル孔あけ加工方法
CN106922083A (zh) * 2017-02-15 2017-07-04 深圳市柳鑫实业股份有限公司 一种改善pcb钻孔毛刺的方法
CN107623997A (zh) * 2017-10-18 2018-01-23 梅州市志浩电子科技有限公司 一种无披锋pcb的加工方法及pcb
CN108990283A (zh) * 2018-08-03 2018-12-11 深圳市柳鑫实业股份有限公司 一种改善软硬结合pcb板高低差钻孔的方法

Also Published As

Publication number Publication date
TW202042995A (zh) 2020-12-01
JP2020189394A (ja) 2020-11-26
TWI711518B (zh) 2020-12-01
KR102183776B1 (ko) 2020-11-27
CN110099515A (zh) 2019-08-06
JP6787608B1 (ja) 2020-11-18

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