CN110099515B - 一种改善pcb钻孔的方法 - Google Patents
一种改善pcb钻孔的方法 Download PDFInfo
- Publication number
- CN110099515B CN110099515B CN201910428398.1A CN201910428398A CN110099515B CN 110099515 B CN110099515 B CN 110099515B CN 201910428398 A CN201910428398 A CN 201910428398A CN 110099515 B CN110099515 B CN 110099515B
- Authority
- CN
- China
- Prior art keywords
- pcb
- composite resin
- resin material
- drilling
- layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005553 drilling Methods 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 title claims abstract description 43
- 239000000805 composite resin Substances 0.000 claims abstract description 161
- 239000000463 material Substances 0.000 claims abstract description 95
- 238000000576 coating method Methods 0.000 claims abstract description 34
- 239000011248 coating agent Substances 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 21
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical class OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 14
- 150000001412 amines Chemical class 0.000 claims description 11
- 125000001931 aliphatic group Chemical group 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 8
- 239000000654 additive Substances 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 239000004645 polyester resin Substances 0.000 claims description 3
- 229920001225 polyester resin Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 229920006305 unsaturated polyester Polymers 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- 239000012670 alkaline solution Substances 0.000 claims description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 2
- 238000003475 lamination Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 80
- 238000001723 curing Methods 0.000 description 35
- 239000002585 base Substances 0.000 description 12
- 239000004814 polyurethane Substances 0.000 description 8
- 229920002635 polyurethane Polymers 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- -1 phenolic aldehyde Chemical class 0.000 description 4
- 239000000454 talc Substances 0.000 description 4
- 229910052623 talc Inorganic materials 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 239000012752 auxiliary agent Substances 0.000 description 3
- 239000013043 chemical agent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical group CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 229920002522 Wood fibre Polymers 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 239000002025 wood fiber Substances 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910428398.1A CN110099515B (zh) | 2019-05-22 | 2019-05-22 | 一种改善pcb钻孔的方法 |
TW108131948A TWI711518B (zh) | 2019-05-22 | 2019-09-04 | 一種改善pcb鑽孔的方法 |
KR1020190111305A KR102183776B1 (ko) | 2019-05-22 | 2019-09-09 | Pcb 드릴링 개선 방법 |
JP2019177489A JP6787608B1 (ja) | 2019-05-22 | 2019-09-27 | Pcbパネルのドリル穴開けの改善方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910428398.1A CN110099515B (zh) | 2019-05-22 | 2019-05-22 | 一种改善pcb钻孔的方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110099515A CN110099515A (zh) | 2019-08-06 |
CN110099515B true CN110099515B (zh) | 2021-09-14 |
Family
ID=67448857
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910428398.1A Active CN110099515B (zh) | 2019-05-22 | 2019-05-22 | 一种改善pcb钻孔的方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6787608B1 (ja) |
KR (1) | KR102183776B1 (ja) |
CN (1) | CN110099515B (ja) |
TW (1) | TWI711518B (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113025114A (zh) * | 2020-02-18 | 2021-06-25 | 深圳市百柔新材料技术有限公司 | 钻孔油墨及其应用 |
CN113784508B (zh) * | 2020-06-10 | 2024-03-29 | 南通深南电路有限公司 | 一种钻针选择方法和pcb钻孔方法 |
CN111644892A (zh) * | 2020-07-08 | 2020-09-11 | 昆山广谦电子有限公司 | 改善金属板加工毛刺的方法 |
CN113402953A (zh) * | 2021-07-30 | 2021-09-17 | 深圳市宏宇辉科技有限公司 | 一种pcb钻孔用盖板及其制备方法和应用 |
CN114888895B (zh) * | 2022-06-23 | 2024-07-16 | 中国电子科技集团公司第十四研究所 | 一种热塑性粘结片聚四氟乙烯多层板高质量钻孔方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NO890091L (no) * | 1988-01-11 | 1989-07-12 | Thiokol Morton Inc | Fremgangsmaate og anordning for aa paafoere polymere materialer paa trykte kretser. |
JPH01210206A (ja) * | 1988-02-16 | 1989-08-23 | San Alum Kogyo Kk | プリント基板穴明け加工用当て板 |
JPH05347467A (ja) * | 1992-06-15 | 1993-12-27 | Showa Alum Corp | 半導体用アルミニウム基板の製造方法 |
JP2828129B2 (ja) * | 1993-06-07 | 1998-11-25 | 三菱瓦斯化学株式会社 | プリント配線板の孔明け加工法 |
JP2003152308A (ja) * | 2001-11-09 | 2003-05-23 | Nippon Synthetic Chem Ind Co Ltd:The | プリント配線基板の穿孔方法 |
JP4644414B2 (ja) * | 2003-01-28 | 2011-03-02 | 三菱瓦斯化学株式会社 | 着色された孔あけ用滑剤シート |
EP2191701B1 (en) * | 2007-09-28 | 2013-03-20 | Tri-Star Laminates, Inc. | Entry sheet, method of manufacturing thereof and methods for drilling holes in printed circuit boards |
US20090258187A1 (en) * | 2008-04-10 | 2009-10-15 | Michael Donavon Brady | Protective coating for glass manufacturing and processing into articles |
JP5347467B2 (ja) | 2008-12-09 | 2013-11-20 | 住友電気工業株式会社 | 移動通信機及び通信制御方法 |
DE102008064166A1 (de) * | 2008-12-22 | 2010-06-24 | Schmoll Maschinen Gmbh | Automatisierte Werkzeugmaschine und Verfahren zum Einbringen von Referenzbohrungen in Leiterplatten |
JP2016023204A (ja) * | 2014-07-17 | 2016-02-08 | ジーティーエー エレクトロニクス カンパニー リミテッド | 孔あけ用ガイドシートの感光性コーティング樹脂及びその応用 |
CN105505135B (zh) * | 2015-12-24 | 2018-04-10 | 深圳市柳鑫实业股份有限公司 | 一种pcb钻孔用垫板及其制备方法 |
CN105729557B (zh) * | 2016-03-14 | 2018-08-24 | 深圳市柳鑫实业股份有限公司 | 一种改善pcb钻孔毛刺的方法 |
WO2017208912A1 (ja) * | 2016-05-31 | 2017-12-07 | 三菱瓦斯化学株式会社 | ドリル孔あけ用エントリーシート及びそれを用いたドリル孔あけ加工方法 |
CN106922083A (zh) * | 2017-02-15 | 2017-07-04 | 深圳市柳鑫实业股份有限公司 | 一种改善pcb钻孔毛刺的方法 |
CN107623997A (zh) * | 2017-10-18 | 2018-01-23 | 梅州市志浩电子科技有限公司 | 一种无披锋pcb的加工方法及pcb |
CN108990283A (zh) * | 2018-08-03 | 2018-12-11 | 深圳市柳鑫实业股份有限公司 | 一种改善软硬结合pcb板高低差钻孔的方法 |
-
2019
- 2019-05-22 CN CN201910428398.1A patent/CN110099515B/zh active Active
- 2019-09-04 TW TW108131948A patent/TWI711518B/zh active
- 2019-09-09 KR KR1020190111305A patent/KR102183776B1/ko active IP Right Grant
- 2019-09-27 JP JP2019177489A patent/JP6787608B1/ja active Active
Also Published As
Publication number | Publication date |
---|---|
TW202042995A (zh) | 2020-12-01 |
JP2020189394A (ja) | 2020-11-26 |
TWI711518B (zh) | 2020-12-01 |
KR102183776B1 (ko) | 2020-11-27 |
CN110099515A (zh) | 2019-08-06 |
JP6787608B1 (ja) | 2020-11-18 |
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