CN109983628B - 导电粒子配置膜、其制造方法、检查探头单元、导通检查方法 - Google Patents

导电粒子配置膜、其制造方法、检查探头单元、导通检查方法 Download PDF

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Publication number
CN109983628B
CN109983628B CN201780070701.4A CN201780070701A CN109983628B CN 109983628 B CN109983628 B CN 109983628B CN 201780070701 A CN201780070701 A CN 201780070701A CN 109983628 B CN109983628 B CN 109983628B
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conductive
inspection
conduction
film
conductive particle
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CN201780070701.4A
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Chinese (zh)
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CN109983628A (zh
Inventor
林慎一
阿久津恭志
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Dexerials Corp
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Dexerials Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Leads Or Probes (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
CN201780070701.4A 2016-11-30 2017-11-20 导电粒子配置膜、其制造方法、检查探头单元、导通检查方法 Active CN109983628B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111522759.2A CN114221146B (zh) 2016-11-30 2017-11-20 导电粒子配置膜、其制造方法、检查探头单元、导通检查方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016233397 2016-11-30
JP2016-233397 2016-11-30
PCT/JP2017/041699 WO2018101107A1 (ja) 2016-11-30 2017-11-20 導電粒子配置フィルム、その製造方法、検査プローブユニット、導通検査方法

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CN109983628B true CN109983628B (zh) 2021-12-24

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CN201780070701.4A Active CN109983628B (zh) 2016-11-30 2017-11-20 导电粒子配置膜、其制造方法、检查探头单元、导通检查方法

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US (1) US12066458B2 (enExample)
JP (2) JP7256351B2 (enExample)
KR (1) KR102282081B1 (enExample)
CN (2) CN114221146B (enExample)
TW (1) TWI760391B (enExample)
WO (1) WO2018101107A1 (enExample)

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KR102827173B1 (ko) 2018-06-26 2025-06-27 가부시끼가이샤 레조낙 이방성 도전 필름과 그 제조 방법 및 접속 구조체의 제조 방법
KR102856173B1 (ko) 2018-06-26 2025-09-04 가부시끼가이샤 레조낙 땜납 입자
CN112313031A (zh) * 2018-06-26 2021-02-02 昭和电工材料株式会社 焊料粒子及焊料粒子的制造方法
KR102187881B1 (ko) * 2018-07-26 2020-12-07 주식회사 에이엔케이 마이크로 led 검사용 프로브 소켓 디바이스 제조 방법
CN110911866A (zh) * 2018-09-14 2020-03-24 玮锋科技股份有限公司 单层粒子导电弹性体及其制作方法
JP6756996B1 (ja) * 2018-11-05 2020-09-16 Nok株式会社 導電性部材の製造方法

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JPH08148213A (ja) * 1994-11-25 1996-06-07 Hitachi Chem Co Ltd 接続部材、該接続部材を用いた電極の接続構造及び接続方法
JPH10200242A (ja) * 1997-01-10 1998-07-31 Jsr Corp 異方導電性ゴムシート
JP2001052793A (ja) * 1999-08-09 2001-02-23 Ibiden Co Ltd 導通検査方法及び導通検査装置
CN1434980A (zh) * 2000-06-14 2003-08-06 积水化学工业株式会社 微粒子配置薄膜、导电连接薄膜、导电连接构造体以及微粒子的配置方法
JP2007232627A (ja) * 2006-03-02 2007-09-13 Asahi Kasei Electronics Co Ltd 微細回路検査用異方導電性フィルム
JP2011038831A (ja) * 2009-08-07 2011-02-24 Dainippon Printing Co Ltd 基板検査用治具および基板検査方法
CN104541411A (zh) * 2012-08-24 2015-04-22 迪睿合电子材料有限公司 各向异性导电膜及其制造方法
JP5755527B2 (ja) * 2011-08-09 2015-07-29 木村　潔 異方導電性膜および導電性コネクタ

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JPS63102110A (ja) 1986-10-17 1988-05-07 富士ゼロックス株式会社 異方導電体及びその製法
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JPH08148213A (ja) * 1994-11-25 1996-06-07 Hitachi Chem Co Ltd 接続部材、該接続部材を用いた電極の接続構造及び接続方法
JPH10200242A (ja) * 1997-01-10 1998-07-31 Jsr Corp 異方導電性ゴムシート
JP2001052793A (ja) * 1999-08-09 2001-02-23 Ibiden Co Ltd 導通検査方法及び導通検査装置
CN1434980A (zh) * 2000-06-14 2003-08-06 积水化学工业株式会社 微粒子配置薄膜、导电连接薄膜、导电连接构造体以及微粒子的配置方法
JP2007232627A (ja) * 2006-03-02 2007-09-13 Asahi Kasei Electronics Co Ltd 微細回路検査用異方導電性フィルム
JP2011038831A (ja) * 2009-08-07 2011-02-24 Dainippon Printing Co Ltd 基板検査用治具および基板検査方法
JP5755527B2 (ja) * 2011-08-09 2015-07-29 木村　潔 異方導電性膜および導電性コネクタ
CN104541411A (zh) * 2012-08-24 2015-04-22 迪睿合电子材料有限公司 各向异性导电膜及其制造方法

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Publication number Publication date
TWI760391B (zh) 2022-04-11
JP7256351B2 (ja) 2023-04-12
CN109983628A (zh) 2019-07-05
KR102282081B1 (ko) 2021-07-27
CN114221146B (zh) 2024-11-22
US20190293683A1 (en) 2019-09-26
JP2018092924A (ja) 2018-06-14
JP7564462B2 (ja) 2024-10-09
TW201834316A (zh) 2018-09-16
US12066458B2 (en) 2024-08-20
WO2018101107A1 (ja) 2018-06-07
KR20190061082A (ko) 2019-06-04
JP2023030104A (ja) 2023-03-07
CN114221146A (zh) 2022-03-22

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