CN109616321B - 一种基于凹版涂布印刷的多层陶瓷电容器用镍浆及应用 - Google Patents
一种基于凹版涂布印刷的多层陶瓷电容器用镍浆及应用 Download PDFInfo
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- CN109616321B CN109616321B CN201811566307.2A CN201811566307A CN109616321B CN 109616321 B CN109616321 B CN 109616321B CN 201811566307 A CN201811566307 A CN 201811566307A CN 109616321 B CN109616321 B CN 109616321B
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- Prior art keywords
- mixture
- multilayer ceramic
- ceramic capacitor
- nickel
- stirring
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 111
- 238000007639 printing Methods 0.000 title claims abstract description 54
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 52
- 238000007756 gravure coating Methods 0.000 title claims abstract description 46
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 42
- 239000003292 glue Substances 0.000 claims abstract description 42
- 239000000843 powder Substances 0.000 claims abstract description 35
- 239000000919 ceramic Substances 0.000 claims abstract description 33
- 239000003960 organic solvent Substances 0.000 claims abstract description 24
- 239000002270 dispersing agent Substances 0.000 claims abstract description 20
- 239000004014 plasticizer Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 19
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 16
- 239000000126 substance Substances 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims description 54
- 238000003756 stirring Methods 0.000 claims description 51
- 238000001914 filtration Methods 0.000 claims description 41
- 238000003801 milling Methods 0.000 claims description 28
- 239000002245 particle Substances 0.000 claims description 23
- 238000011085 pressure filtration Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 18
- 238000002156 mixing Methods 0.000 claims description 18
- 239000002002 slurry Substances 0.000 claims description 12
- 229910002113 barium titanate Inorganic materials 0.000 claims description 11
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical group [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 11
- 238000000498 ball milling Methods 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 10
- 239000012258 stirred mixture Substances 0.000 claims description 10
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 9
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 9
- 229940116411 terpineol Drugs 0.000 claims description 9
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000001856 Ethyl cellulose Substances 0.000 claims description 6
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 6
- 239000004952 Polyamide Substances 0.000 claims description 6
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 6
- ZFOZVQLOBQUTQQ-UHFFFAOYSA-N Tributyl citrate Chemical compound CCCCOC(=O)CC(O)(C(=O)OCCCC)CC(=O)OCCCC ZFOZVQLOBQUTQQ-UHFFFAOYSA-N 0.000 claims description 6
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 6
- 229920001249 ethyl cellulose Polymers 0.000 claims description 6
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 6
- 239000000194 fatty acid Substances 0.000 claims description 6
- 229930195729 fatty acid Natural products 0.000 claims description 6
- 150000004665 fatty acids Chemical class 0.000 claims description 6
- 238000007646 gravure printing Methods 0.000 claims description 6
- QNVRIHYSUZMSGM-UHFFFAOYSA-N hexan-2-ol Chemical compound CCCCC(C)O QNVRIHYSUZMSGM-UHFFFAOYSA-N 0.000 claims description 6
- 229920002647 polyamide Polymers 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 5
- 238000005303 weighing Methods 0.000 claims description 5
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 claims description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 3
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 3
- HCIQUGMKXQZZMG-UHFFFAOYSA-N ethyl hexyl hydrogen phosphate Chemical compound CCCCCCOP(O)(=O)OCC HCIQUGMKXQZZMG-UHFFFAOYSA-N 0.000 claims description 3
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 3
- 229920002401 polyacrylamide Polymers 0.000 claims description 3
- 229920001522 polyglycol ester Polymers 0.000 claims description 3
- 229920005749 polyurethane resin Polymers 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 3
- 230000007547 defect Effects 0.000 abstract description 6
- 238000005245 sintering Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 238000005054 agglomeration Methods 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 238000010020 roller printing Methods 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 2
- 239000002003 electrode paste Substances 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002042 Silver nanowire Substances 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
- Ceramic Capacitors (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
Claims (8)
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CN201811566307.2A CN109616321B (zh) | 2018-12-18 | 2018-12-18 | 一种基于凹版涂布印刷的多层陶瓷电容器用镍浆及应用 |
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CN201811566307.2A CN109616321B (zh) | 2018-12-18 | 2018-12-18 | 一种基于凹版涂布印刷的多层陶瓷电容器用镍浆及应用 |
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CN109616321A CN109616321A (zh) | 2019-04-12 |
CN109616321B true CN109616321B (zh) | 2021-04-06 |
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Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110379570B (zh) * | 2019-08-09 | 2020-12-08 | 大连海外华昇电子科技有限公司 | 一种多层陶瓷电容器用镍浆制作工艺及应用 |
CN111627698B (zh) * | 2020-06-08 | 2022-05-17 | 江苏国瓷泓源光电科技有限公司 | 一种mlcc用镍内电极浆料 |
CN112142480B (zh) * | 2020-09-22 | 2022-06-21 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | 一种湿法工艺多层片式瓷介电容器的瓷浆及其制备方法 |
CN112542315A (zh) * | 2020-11-27 | 2021-03-23 | 四川华瓷科技有限公司 | 一种mlcc镍浆处理方法 |
CN113178328B (zh) * | 2021-03-30 | 2023-04-25 | 大连海外华昇电子科技有限公司 | 一种多层陶瓷电容器用铜内电极导电浆料及其应用 |
CN113436886A (zh) * | 2021-04-28 | 2021-09-24 | 佛山市顺德区百锐新电子材料有限公司 | 一种水性mlcc专用辊印镍浆及其制备方法 |
CN113257570B (zh) * | 2021-05-28 | 2023-01-03 | 大连海外华昇电子科技有限公司 | 一种多层陶瓷电容器用银浆及其制备方法和应用 |
CN113823437B (zh) * | 2021-09-28 | 2023-02-14 | 大连海外华昇电子科技有限公司 | 一种用于mlcc凹版印刷工艺的辊印浆料及其制备工艺 |
CN113948235B (zh) * | 2021-12-20 | 2022-03-29 | 西安宏星电子浆料科技股份有限公司 | 一种高分散性、低收缩率的镍内电极浆料及其制备方法 |
CN116665987B (zh) * | 2023-06-06 | 2024-02-13 | 广东盈科材料有限公司 | 一种高印刷性辊印浆料及其制备工艺 |
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JP2004303748A (ja) * | 2003-03-28 | 2004-10-28 | Matsushita Electric Ind Co Ltd | グラビア印刷用導電性水性インキ及びそれを用いた積層セラミック電子部品の製造方法 |
JP5569747B2 (ja) * | 2011-02-18 | 2014-08-13 | 住友金属鉱山株式会社 | 積層セラミックコンデンサ内部電極に用いられるグラビア印刷用導電性ペースト |
CN104302713B (zh) * | 2012-05-18 | 2016-09-21 | 株式会社村田制作所 | 喷墨用墨水、印刷方法及陶瓷电子部件的制造方法 |
CN104637571A (zh) * | 2015-02-05 | 2015-05-20 | 合肥圣达电子科技实业公司 | 一种陶瓷电容器用银浆料及其制备方法 |
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Denomination of invention: A nickel paste for multilayer ceramic capacitor based on gravure coating printing and its application Effective date of registration: 20210524 Granted publication date: 20210406 Pledgee: Bank of China Limited Dalian high tech Park sub branch Pledgor: DALIAN OVERSEAS HUASHENG ELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2021210000031 |
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Date of cancellation: 20210618 Granted publication date: 20210406 Pledgee: Bank of China Limited Dalian high tech Park sub branch Pledgor: DALIAN OVERSEAS HUASHENG ELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: Y2021210000031 |
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