CN108987365A - 具有减小的开关节点振铃的三维电源模块 - Google Patents
具有减小的开关节点振铃的三维电源模块 Download PDFInfo
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- CN108987365A CN108987365A CN201810832541.9A CN201810832541A CN108987365A CN 108987365 A CN108987365 A CN 108987365A CN 201810832541 A CN201810832541 A CN 201810832541A CN 108987365 A CN108987365 A CN 108987365A
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Dc-Dc Converters (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/021,969 US20120200281A1 (en) | 2011-02-07 | 2011-02-07 | Three-Dimensional Power Supply Module Having Reduced Switch Node Ringing |
| US13/021,969 | 2011-02-07 | ||
| CN2012800078397A CN103348469A (zh) | 2011-02-07 | 2012-02-07 | 具有减小的开关节点振铃的三维电源模块 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012800078397A Division CN103348469A (zh) | 2011-02-07 | 2012-02-07 | 具有减小的开关节点振铃的三维电源模块 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108987365A true CN108987365A (zh) | 2018-12-11 |
Family
ID=46600221
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012800078397A Pending CN103348469A (zh) | 2011-02-07 | 2012-02-07 | 具有减小的开关节点振铃的三维电源模块 |
| CN201810832541.9A Pending CN108987365A (zh) | 2011-02-07 | 2012-02-07 | 具有减小的开关节点振铃的三维电源模块 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012800078397A Pending CN103348469A (zh) | 2011-02-07 | 2012-02-07 | 具有减小的开关节点振铃的三维电源模块 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20120200281A1 (enExample) |
| JP (1) | JP6131195B2 (enExample) |
| CN (2) | CN103348469A (enExample) |
| WO (1) | WO2012109265A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115188756A (zh) * | 2022-06-24 | 2022-10-14 | 艾科微电子(深圳)有限公司 | 芯片堆叠结构 |
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| TWI453831B (zh) | 2010-09-09 | 2014-09-21 | 台灣捷康綜合有限公司 | 半導體封裝結構及其製造方法 |
| US8981748B2 (en) * | 2011-08-08 | 2015-03-17 | Semiconductor Components Industries, Llc | Method of forming a semiconductor power switching device, structure therefor, and power converter |
| US9171784B2 (en) * | 2012-03-28 | 2015-10-27 | International Rectifier Corporation | Dual power converter package using external driver IC |
| US9589872B2 (en) * | 2012-03-28 | 2017-03-07 | Infineon Technologies Americas Corp. | Integrated dual power converter package having internal driver IC |
| US20140063744A1 (en) * | 2012-09-05 | 2014-03-06 | Texas Instruments Incorporated | Vertically Stacked Power FETS and Synchronous Buck Converter Having Low On-Resistance |
| JP5966921B2 (ja) * | 2012-12-28 | 2016-08-10 | トヨタ自動車株式会社 | 半導体モジュールの製造方法 |
| US9589929B2 (en) * | 2013-03-14 | 2017-03-07 | Vishay-Siliconix | Method for fabricating stack die package |
| US9966330B2 (en) | 2013-03-14 | 2018-05-08 | Vishay-Siliconix | Stack die package |
| US9214415B2 (en) * | 2013-04-11 | 2015-12-15 | Texas Instruments Incorporated | Integrating multi-output power converters having vertically stacked semiconductor chips |
| US9171828B2 (en) | 2014-02-05 | 2015-10-27 | Texas Instruments Incorporated | DC-DC converter having terminals of semiconductor chips directly attachable to circuit board |
| US9136256B2 (en) * | 2014-02-20 | 2015-09-15 | Texas Instruments Incorporated | Converter having partially thinned leadframe with stacked chips and interposer, free of wires and clips |
| US9355942B2 (en) * | 2014-05-15 | 2016-05-31 | Texas Instruments Incorporated | Gang clips having distributed-function tie bars |
| US9515014B2 (en) | 2014-10-08 | 2016-12-06 | Infineon Technologies Americas Corp. | Power converter package with integrated output inductor |
| US10103140B2 (en) * | 2016-10-14 | 2018-10-16 | Alpha And Omega Semiconductor Incorporated | Switch circuit with controllable phase node ringing |
| US11189591B2 (en) | 2017-05-19 | 2021-11-30 | Shindengen Electric Manufacturing Co., Ltd. | Electronic module |
| JP6952042B2 (ja) * | 2017-05-19 | 2021-10-20 | 新電元工業株式会社 | 電子モジュール |
| CN109287129B (zh) * | 2017-05-19 | 2022-04-08 | 新电元工业株式会社 | 电子模块 |
| JP6808849B2 (ja) * | 2017-10-26 | 2021-01-06 | 新電元工業株式会社 | 半導体装置 |
| DE102018207308B4 (de) * | 2018-05-09 | 2020-07-02 | Infineon Technologies Ag | Halbleiterbauteil mit integriertem shunt-widerstand und verfahren zu dessen herstellung |
| US20200194347A1 (en) * | 2018-12-18 | 2020-06-18 | Alpha And Omega Semiconductor (Cayman) Ltd. | Semiconductor package and method of making the same |
| US11616295B2 (en) | 2019-03-12 | 2023-03-28 | Epirus, Inc. | Systems and methods for adaptive generation of high power electromagnetic radiation and their applications |
| US11658410B2 (en) | 2019-03-12 | 2023-05-23 | Epirus, Inc. | Apparatus and method for synchronizing power circuits with coherent RF signals to form a steered composite RF signal |
| US11211703B2 (en) | 2019-03-12 | 2021-12-28 | Epirus, Inc. | Systems and methods for dynamic biasing of microwave amplifier |
| US12381523B2 (en) | 2020-06-22 | 2025-08-05 | Epirus, Inc. | Systems and methods for radio frequency power systems |
| US12068618B2 (en) | 2021-07-01 | 2024-08-20 | Epirus, Inc. | Systems and methods for compact directed energy systems |
| US11469722B2 (en) | 2020-06-22 | 2022-10-11 | Epirus, Inc. | Systems and methods for modular power amplifiers |
| US12003223B2 (en) | 2020-06-22 | 2024-06-04 | Epirus, Inc. | Systems and methods for modular power amplifiers |
| US20220020671A1 (en) * | 2020-07-20 | 2022-01-20 | Electronics And Telecommunications Research Institute | Flip-stack type semiconductor package and method of manufacturing the same |
| US12273075B2 (en) | 2021-07-01 | 2025-04-08 | Epirus, Inc. | Systems and methods for power distribution for amplifier arrays |
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- 2012-02-07 CN CN2012800078397A patent/CN103348469A/zh active Pending
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- 2012-02-07 JP JP2013553496A patent/JP6131195B2/ja active Active
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2014511027A (ja) | 2014-05-01 |
| JP6131195B2 (ja) | 2017-05-17 |
| US20120200281A1 (en) | 2012-08-09 |
| CN103348469A (zh) | 2013-10-09 |
| WO2012109265A3 (en) | 2012-11-01 |
| WO2012109265A2 (en) | 2012-08-16 |
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Application publication date: 20181211 |