CN108699402A - 粘接膜和划片膜-芯片接合膜 - Google Patents

粘接膜和划片膜-芯片接合膜 Download PDF

Info

Publication number
CN108699402A
CN108699402A CN201780012916.0A CN201780012916A CN108699402A CN 108699402 A CN108699402 A CN 108699402A CN 201780012916 A CN201780012916 A CN 201780012916A CN 108699402 A CN108699402 A CN 108699402A
Authority
CN
China
Prior art keywords
film
ingredient
adhesive film
alpha
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780012916.0A
Other languages
English (en)
Chinese (zh)
Inventor
赖华子
增子崇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN108699402A publication Critical patent/CN108699402A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
CN201780012916.0A 2016-02-26 2017-01-25 粘接膜和划片膜-芯片接合膜 Pending CN108699402A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016035409 2016-02-26
JP2016-035409 2016-02-26
PCT/JP2017/002549 WO2017145624A1 (ja) 2016-02-26 2017-01-25 接着フィルム及びダイシング・ダイボンディングフィルム

Publications (1)

Publication Number Publication Date
CN108699402A true CN108699402A (zh) 2018-10-23

Family

ID=59685363

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780012916.0A Pending CN108699402A (zh) 2016-02-26 2017-01-25 粘接膜和划片膜-芯片接合膜

Country Status (5)

Country Link
JP (2) JP7372737B2 (ko)
KR (2) KR102570822B1 (ko)
CN (1) CN108699402A (ko)
TW (1) TWI715721B (ko)
WO (1) WO2017145624A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115298280A (zh) * 2020-04-01 2022-11-04 昭和电工材料株式会社 半导体用黏合剂、以及半导体装置及其制造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230158517A (ko) * 2022-03-30 2023-11-20 후루카와 덴키 고교 가부시키가이샤 열 전도성 필름형 접착제용 조성물 및 열 전도성 필름형 접착제, 그리고 열 전도성 필름형 접착제를 사용한 반도체 패키지 및 그 제조 방법

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10237410A (ja) * 1997-02-27 1998-09-08 Hitachi Chem Co Ltd 熱伝導性接着剤組成物及び該組成物を用いた熱伝導性接着フィルム
CN102124066A (zh) * 2008-08-18 2011-07-13 积水化学工业株式会社 绝缘片以及叠层结构体
CN102187442A (zh) * 2008-10-16 2011-09-14 住友电木株式会社 半导体装置的制造方法及半导体装置
JP2012186361A (ja) * 2011-03-07 2012-09-27 Nitto Denko Corp ダイシング・ダイボンドフィルム及び半導体素子
JP2012190719A (ja) * 2011-03-11 2012-10-04 Sekisui Chem Co Ltd 絶縁材料及び積層構造体
CN103119112A (zh) * 2010-10-25 2013-05-22 古河电气工业株式会社 粘接膜及晶片加工用带
CN103827221A (zh) * 2011-09-08 2014-05-28 日立化成株式会社 树脂组合物、树脂片、树脂片固化物、带有树脂的金属箔以及散热构件

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05198701A (ja) 1992-01-22 1993-08-06 Mitsubishi Electric Corp 半導体装置用パッケージ
JP3617417B2 (ja) * 1999-06-18 2005-02-02 日立化成工業株式会社 接着剤、接着部材、接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置
JP2001118961A (ja) * 1999-10-15 2001-04-27 Mitsubishi Electric Corp 樹脂封止型電力用半導体装置及びその製造方法
JP2009235402A (ja) 2008-03-05 2009-10-15 Hitachi Chem Co Ltd 接着フィルム
DE102008049850A1 (de) * 2008-10-01 2010-04-08 Tesa Se Wärmeleitende Haftklebemasse
KR20160140996A (ko) * 2009-09-29 2016-12-07 히타치가세이가부시끼가이샤 다층 수지 시트 및 그 제조 방법, 다층 수지 시트 경화물의 제조 방법, 그리고, 고열전도 수지 시트 적층체 및 그 제조 방법
JP2011241245A (ja) * 2010-05-14 2011-12-01 Mitsubishi Chemicals Corp エポキシ樹脂組成物および硬化物
JP2013095782A (ja) * 2011-10-28 2013-05-20 Mitsubishi Chemicals Corp 半導体発光装置用シリコーン樹脂組成物
WO2013129600A1 (ja) * 2012-03-02 2013-09-06 富士高分子工業株式会社 パテ状伝熱材及びその製造方法
WO2014136484A1 (ja) * 2013-03-07 2014-09-12 住友ベークライト株式会社 装置、接着剤用組成物、接着シート
JP5749314B2 (ja) 2013-10-11 2015-07-15 日東電工株式会社 放熱性ダイボンドフィルム
CN105658715B (zh) * 2013-10-24 2017-11-28 Dic株式会社 树脂组合物、散热材料及散热构件
EP3121210A4 (en) * 2014-03-20 2017-12-06 Hitachi Chemical Co., Ltd. Resin composition, resin sheet, resin sheet cured product, resin sheet laminate, resin sheet laminate cured product and method for producing same, semiconductor device, and led device.
JP2015193704A (ja) 2014-03-31 2015-11-05 新日鉄住金化学株式会社 高熱伝導セラミックス粉末含有樹脂組成物、その硬化物
JP2016104832A (ja) * 2014-12-01 2016-06-09 Dic株式会社 樹脂組成物、熱伝導性接着剤、熱伝導性接着シート及び積層体

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10237410A (ja) * 1997-02-27 1998-09-08 Hitachi Chem Co Ltd 熱伝導性接着剤組成物及び該組成物を用いた熱伝導性接着フィルム
CN102124066A (zh) * 2008-08-18 2011-07-13 积水化学工业株式会社 绝缘片以及叠层结构体
CN102187442A (zh) * 2008-10-16 2011-09-14 住友电木株式会社 半导体装置的制造方法及半导体装置
CN103119112A (zh) * 2010-10-25 2013-05-22 古河电气工业株式会社 粘接膜及晶片加工用带
JP2012186361A (ja) * 2011-03-07 2012-09-27 Nitto Denko Corp ダイシング・ダイボンドフィルム及び半導体素子
JP2012190719A (ja) * 2011-03-11 2012-10-04 Sekisui Chem Co Ltd 絶縁材料及び積層構造体
CN103827221A (zh) * 2011-09-08 2014-05-28 日立化成株式会社 树脂组合物、树脂片、树脂片固化物、带有树脂的金属箔以及散热构件

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
党嘉立 等: "《世纪之交复合材料的现状与发展 全国第十届复合材料学术会议论文集》", 30 September 1998, 湖南科学技术出版社 *
李正军 等: "《皮革涂饰剂与整饰技术》", 31 July 2002, 化学工业出版社 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115298280A (zh) * 2020-04-01 2022-11-04 昭和电工材料株式会社 半导体用黏合剂、以及半导体装置及其制造方法

Also Published As

Publication number Publication date
WO2017145624A1 (ja) 2017-08-31
JP7372737B2 (ja) 2023-11-01
TW201741414A (zh) 2017-12-01
KR20180113210A (ko) 2018-10-15
TWI715721B (zh) 2021-01-11
KR20230013169A (ko) 2023-01-26
JP2022027972A (ja) 2022-02-14
KR102570822B1 (ko) 2023-08-24
JPWO2017145624A1 (ja) 2018-12-27
JP7392706B2 (ja) 2023-12-06

Similar Documents

Publication Publication Date Title
KR101319171B1 (ko) 접착 필름 및 반도체 장치의 제조 방법
TWI742139B (zh) 樹脂組成物、樹脂薄片及半導體裝置
CN110945634B (zh) 散热性芯片接合膜及切割-芯片接合膜
JP7392706B2 (ja) 接着フィルム
WO2018168005A1 (ja) 樹脂組成物、樹脂シート、積層体、及び半導体素子
TWI724179B (zh) 接著膜及切晶黏晶一體型膜
TWI758489B (zh) 樹脂組成物及樹脂薄片
JP4839564B6 (ja) 接着フィルム及びその製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CB02 Change of applicant information

Address after: Tokyo

Applicant after: Lishennoco Co.,Ltd.

Address before: Tokyo

Applicant before: HITACHI CHEMICAL Co.,Ltd.

CB02 Change of applicant information