JP7372737B2 - ダイシング・ダイボンディングフィルム - Google Patents

ダイシング・ダイボンディングフィルム Download PDF

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Publication number
JP7372737B2
JP7372737B2 JP2018501073A JP2018501073A JP7372737B2 JP 7372737 B2 JP7372737 B2 JP 7372737B2 JP 2018501073 A JP2018501073 A JP 2018501073A JP 2018501073 A JP2018501073 A JP 2018501073A JP 7372737 B2 JP7372737 B2 JP 7372737B2
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JP
Japan
Prior art keywords
component
mass
film
adhesive film
dicing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018501073A
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English (en)
Japanese (ja)
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JPWO2017145624A1 (ja
Inventor
華子 頼
崇 増子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2017145624A1 publication Critical patent/JPWO2017145624A1/ja
Priority to JP2021204926A priority Critical patent/JP7392706B2/ja
Application granted granted Critical
Publication of JP7372737B2 publication Critical patent/JP7372737B2/ja
Active legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
JP2018501073A 2016-02-26 2017-01-25 ダイシング・ダイボンディングフィルム Active JP7372737B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021204926A JP7392706B2 (ja) 2016-02-26 2021-12-17 接着フィルム

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016035409 2016-02-26
JP2016035409 2016-02-26
PCT/JP2017/002549 WO2017145624A1 (ja) 2016-02-26 2017-01-25 接着フィルム及びダイシング・ダイボンディングフィルム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021204926A Division JP7392706B2 (ja) 2016-02-26 2021-12-17 接着フィルム

Publications (2)

Publication Number Publication Date
JPWO2017145624A1 JPWO2017145624A1 (ja) 2018-12-27
JP7372737B2 true JP7372737B2 (ja) 2023-11-01

Family

ID=59685363

Family Applications (2)

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JP2018501073A Active JP7372737B2 (ja) 2016-02-26 2017-01-25 ダイシング・ダイボンディングフィルム
JP2021204926A Active JP7392706B2 (ja) 2016-02-26 2021-12-17 接着フィルム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2021204926A Active JP7392706B2 (ja) 2016-02-26 2021-12-17 接着フィルム

Country Status (5)

Country Link
JP (2) JP7372737B2 (ko)
KR (2) KR20180113210A (ko)
CN (1) CN108699402A (ko)
TW (1) TWI715721B (ko)
WO (1) WO2017145624A1 (ko)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021200585A1 (ko) * 2020-04-01 2021-10-07
CN118696105A (zh) * 2022-03-30 2024-09-24 古河电气工业株式会社 导热性膜状粘接剂用组合物和导热性膜状粘接剂、以及使用导热性膜状粘接剂的半导体封装及其制造方法
WO2024162417A1 (ja) * 2023-01-31 2024-08-08 積水化学工業株式会社 硬化性熱伝導性接着剤、熱伝導性部材及びバッテリアセンブリ

Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2012186361A (ja) 2011-03-07 2012-09-27 Nitto Denko Corp ダイシング・ダイボンドフィルム及び半導体素子
JP2012190719A (ja) 2011-03-11 2012-10-04 Sekisui Chem Co Ltd 絶縁材料及び積層構造体
WO2013035354A1 (ja) 2011-09-08 2013-03-14 日立化成株式会社 樹脂組成物、樹脂シート、樹脂シート硬化物、樹脂付き金属箔及び放熱部材
JP2015193704A (ja) 2014-03-31 2015-11-05 新日鉄住金化学株式会社 高熱伝導セラミックス粉末含有樹脂組成物、その硬化物

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JPH05198701A (ja) 1992-01-22 1993-08-06 Mitsubishi Electric Corp 半導体装置用パッケージ
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JP3617417B2 (ja) * 1999-06-18 2005-02-02 日立化成工業株式会社 接着剤、接着部材、接着部材を備えた半導体搭載用配線基板及びこれを用いた半導体装置
JP2001118961A (ja) * 1999-10-15 2001-04-27 Mitsubishi Electric Corp 樹脂封止型電力用半導体装置及びその製造方法
JP2009235402A (ja) 2008-03-05 2009-10-15 Hitachi Chem Co Ltd 接着フィルム
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DE102008049850A1 (de) * 2008-10-01 2010-04-08 Tesa Se Wärmeleitende Haftklebemasse
JP4360446B1 (ja) * 2008-10-16 2009-11-11 住友ベークライト株式会社 半導体装置の製造方法及び半導体装置
KR101597390B1 (ko) * 2009-09-29 2016-02-24 히타치가세이가부시끼가이샤 다층 수지 시트 및 그 제조 방법, 다층 수지 시트 경화물의 제조 방법, 그리고, 고열전도 수지 시트 적층체 및 그 제조 방법
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JP2012186361A (ja) 2011-03-07 2012-09-27 Nitto Denko Corp ダイシング・ダイボンドフィルム及び半導体素子
JP2012190719A (ja) 2011-03-11 2012-10-04 Sekisui Chem Co Ltd 絶縁材料及び積層構造体
WO2013035354A1 (ja) 2011-09-08 2013-03-14 日立化成株式会社 樹脂組成物、樹脂シート、樹脂シート硬化物、樹脂付き金属箔及び放熱部材
JP2015193704A (ja) 2014-03-31 2015-11-05 新日鉄住金化学株式会社 高熱伝導セラミックス粉末含有樹脂組成物、その硬化物

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テイサンレジンシリーズ （ｈｔｔｐｓ：／／ｗｗｗ．ｎａｇａｓｅ．ｃｎ／ｐｄｆ／ａｐｐｌｉｃａｔｉｏｎ／ＣＨＥＭＴＥＣ％２０Ｔｅｒｓｏｎ％２０ｒｅｓｉｎ％２０ＴＤＳ％２０Ｊａｐａｎｅｓｅ．ｐｄｆ）
三菱ケミカル株式会社 製品案内 ＪＥＲ（Ｒ）（丸の中にＲ）エポキシ樹脂
住友化学、無機材料事業部 アルミナ製品／高純度アルミナ 製品データブック（ｈｔｔｐｓ：／／ｗｗｗ．ｓｕｍｉｔｏｍｏ－ｃｈｅｍ．ｃｏ．ｊｐ／ｐｒｏｄｕｃｔｓ／ｆｉｌｅｓ／ｄｏｃｓ／ａ０６００８．ｐｄｆ）

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Publication number Publication date
JP2022027972A (ja) 2022-02-14
JP7392706B2 (ja) 2023-12-06
WO2017145624A1 (ja) 2017-08-31
KR20180113210A (ko) 2018-10-15
KR102570822B1 (ko) 2023-08-24
KR20230013169A (ko) 2023-01-26
TWI715721B (zh) 2021-01-11
TW201741414A (zh) 2017-12-01
CN108699402A (zh) 2018-10-23
JPWO2017145624A1 (ja) 2018-12-27

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