CN108666279B - 电子封装件及其制法 - Google Patents

电子封装件及其制法 Download PDF

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CN108666279B
CN108666279B CN201710227780.7A CN201710227780A CN108666279B CN 108666279 B CN108666279 B CN 108666279B CN 201710227780 A CN201710227780 A CN 201710227780A CN 108666279 B CN108666279 B CN 108666279B
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substrate
layer
corner
cladding layer
shielding layer
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CN108666279A (zh
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张书齐
王维宾
萧宪隆
郑坤一
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Siliconware Precision Industries Co Ltd
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Abstract

一种电子封装件及其制法，通过于设有电子元件的基板上形成包覆该电子元件的包覆层，且于该包覆层的上表面形成金属材质的遮蔽层，并使该遮蔽层的延伸部沿该包覆层的角落延伸至该基板的侧面而未延伸至该基板下侧，以避免该遮蔽层接触该基板下侧的植球垫而造成短路的问题。

Description

电子封装件及其制法
技术领域
本发明有关一种封装技术，尤指一种能防止电磁干扰的半导体封装件及其制法。
背景技术
随着半导体技术的演进，半导体产品已开发出不同封装产品型态，而为提升电性品质，多种半导体产品要求具有屏蔽的功能，以防止电磁干扰(ElectromagneticInterference，简称EMI)产生。
如图1所示，现有具有EMI屏蔽(shielding)的射频(Radio frequency，简称RF)模组1，其将多个如射频及非射频式芯片的电子元件11电性连接在一基板10上，再以如环氧树脂的封装层13包覆各该电子元件11，之后于该封装层13的顶面13a与侧面13c及该基板10的侧面10c上以如溅镀(sputtering)等方式形成一金属层15，以通过该金属层15电性连接该基板10的侧面10c的接地结构100，再与系统大地电性连接，藉以保护该多个电子元件11免受外界EMI影响而受损。
惟，现有射频模组1中，位于该基板10的底侧外围的植球垫101因距离该基板10的边缘太近，故于溅镀该金属层15时，该金属层15容易溢镀至该基板10的底侧，致使该溢镀的金属层15a接触该植球垫101而发生短路问题。
因此，如何克服上述现有技术的问题，实已成目前亟欲解决的课题。
发明内容
鉴于上述现有技术的缺失，本发明提供一种电子封装件及其制法，以避免该遮蔽层接触该基板下侧的植球垫而造成短路的问题。
本发明的电子封装件，包括：基板，其具有相对的第一侧与第二侧及邻接该第一侧与第二侧的侧面；电子元件，其设于该基板的第一侧上并电性连接该基板；包覆层，其形成于该基板的第一侧上以包覆该电子元件，其中，该包覆层具有结合该基板第一侧的第一表面、相对该第一表面的第二表面、及邻接该第一与第二表面的侧面；以及遮蔽层，其形成于该包覆层的第二表面上且具有延伸部，该延伸部自该包覆层的第二表面的部分边缘沿该包覆层的侧面延伸至该基板的侧面而未延伸至该基板的第二侧，以令该包覆层的部分侧面与该基板的部分侧面外露于该遮蔽层。
本发明还提供一种电子封装件的制法，包括：设置至少一电子元件于一基板上，其中，该基板具有相对的第一侧与第二侧及邻接该第一侧与第二侧的侧面，且该电子元件设于该基板的第一侧上并电性连接该基板；形成包覆层于该基板上，以令该包覆层包覆该电子元件，其中，该包覆层具有结合该基板第一侧的第一表面、相对该第一表面的第二表面、及邻接该第一与第二表面的侧面；以及形成遮蔽层于该包覆层的第二表面上，其中，该遮蔽层具有延伸部，该延伸部自该包覆层的第二表面的部分边缘沿该包覆层的侧面延伸至该基板的侧面而未延伸至该基板的第二侧，以令该包覆层的部分侧面与该基板的部分侧面外露于该遮蔽层。
前述的制法中，该遮蔽层的制程包括：提供一承载结构，其包含多个基板及连结于各该基板之间的隔离部；设置该电子元件于该基板上，且以该包覆层包覆该电子元件；于该包覆层中形成多个穿孔，其中，该穿孔延伸至该基板的侧面，且该穿孔的位置对应该基板的角落的隔离部位置；形成该遮蔽层于该包覆层的第二表面上，且该遮蔽层延伸至该穿孔中以形成该延伸部；以及沿该隔离部进行切割以分离各该基板。
前述的电子封装件及其制法中，该基板具有多个电性接触垫，且该多个电性接触垫外露于该基板的第二侧。
前述的电子封装件及其制法中，该基板具有接触该遮蔽层的接地部。例如，该接地部连通该基板的侧面以接触该延伸部。
前述的电子封装件及其制法中，该包覆层为绝缘材。
前述的电子封装件及其制法中，该遮蔽层为导电材。
前述的电子封装件及其制法中，该延伸部自该包覆层的第二表面的角落朝该基板的第二侧的角落延伸。
由上可知，本发明的电子封装件及其制法，主要通过遮蔽层的延伸部自包覆层的第二表面的部分边缘沿包覆层的侧面延伸至基板的侧面而未延伸至基板的第二侧，以令包覆层的部分侧面与基板的部分侧面外露于遮蔽层，使该延伸部不会接触基板的电性接触垫，故相比于现有技术，本发明能有效避免短路的发生。
附图说明
图1为现有射频模组的剖面示意图；
图2A至图2D为本发明的电子封装件的制法的剖面示意图；
图2A’及图2B’为图2A及图2B的上视示意图；以及
图2D’为图2D的立体放大示意图。
符号说明：
1 射频模组
10,20’ 基板
10c,13c,20c,22c 侧面
100 接地结构
101 植球垫
11,21 电子元件
13 封装层
13a 顶面
15,15a 金属层
2 电子封装件
20 承载结构
20” 隔离部
20a 第一侧
20b 第二侧
200 线路层
201 电性接触垫
202 接地部
210 焊线
210’ 导电凸块
22 包覆层
22a 第一表面
22b 第二表面
23 遮蔽层
23a 延伸部
230 穿孔
230a 端面
A 交界处
S 切割路径。
具体实施方式
以下通过特定的具体实施例说明本发明的实施方式，本领域技术人员可由本说明书所揭示的内容轻易地了解本发明的其他优点及功效。
须知，本说明书所附图式所绘示的结构、比例、大小等，均仅用以配合说明书所揭示的内容，以供本领域技术人员的了解与阅读，并非用以限定本发明可实施的限定条件，故不具技术上的实质意义，任何结构的修饰、比例关系的改变或大小的调整，在不影响本发明所能产生的功效及所能达成的目的下，均应仍落在本发明所揭示的技术内容得能涵盖的范围内。同时，本说明书中所引用的如“上”、“第一”、“第二”及“一”等用语，也仅为便于叙述的明了，而非用以限定本发明可实施的范围，其相对关系的改变或调整，在无实质变更技术内容下，当也视为本发明可实施的范畴。
图2A至图2D为本发明的电子封装件2的制法的剖面示意图。
如图2A所示，提供一承载结构20，其具有相对的第一侧20a与第二侧20b，且于该承载结构20的第一侧20a上设有多个电子元件21。接着，形成一包覆层22于该承载结构20的第一侧20a上，以令该包覆层22包覆该多个电子元件21。
于本实施例中，该承载结构20为整版面型式，其包含多个阵列排设的基板20’，如图2A’所示，且各该基板20’之间连结有隔离部20”。例如，该基板20’为具有核心层的线路构造或无核心层(coreless)的线路构造，其具有多个线路层200，如扇出(fan out)型重布线路层(redistribution layer，简称RDL)，且形成该基板20’的主要材质为如聚对二唑苯(Polybenzoxazole，简称PBO)、聚酰亚胺(Polyimide，简称PI)、预浸材(Prepreg，简称PP)等的介电材。应可理解地，该基板20’也可为其它承载芯片的承载件，如有机板材、晶圆(wafer)、或其他具有金属布线(routing)的载板，并不限于上述。
此外，该线路层200定义有多个接地部202，且该线路层200于该第二侧20b上具有多个电性接触垫201。
又，该些电子元件21依所需的数量布设于各该基板20’上，其可为主动元件、被动元件或其组合等，其中，该主动元件为例如半导体芯片，且该被动元件为例如电阻、电容及电感。具体地，该电子元件21为射频芯片(例如：蓝芽芯片或Wi-Fi芯片)，但也可为其它不受电磁波干扰的电子元件。例如，该电子元件21具有多个电极垫(图略)，其可通过多个焊线210以打线方式电性连接该线路层200；或者，该电子元件21的电极垫通过多个如焊锡材料的导电凸块210’以覆晶方式设于该承载结构20上并电性连接该线路层200；抑或，该电子元件21直接结合及电性连接该线路层200。然而，有关该电子元件21电性连接该承载结构20的方式不限于上述。
另外，该包覆层22具有相对的第一表面22a与第二表面22b，使该包覆层22的第一表面22a结合至该承载结构20的第一侧20a上。具体地，该包覆层22为绝缘材，如聚酰亚胺(polyimide，简称PI)、干膜(dry film)、环氧树脂(epoxy)或封装材(molding compound)，其可用压合(lamination)或模压(molding)的方式形成于该承载结构20的第一侧20a上。然而，有关该包覆层22的材质及制作方式并不限于上述。
如图2B所示，于该包覆层22中形成多个穿孔230，并令该穿孔230延伸至该承载结构20的第二侧20b。
于本实施例中，于对应该多个隔离部20”的交界处A(如图2A所示)形成该多个穿孔230，使该多个穿孔230位于各该基板20’的角落处，且该穿孔230的端面230a呈十字形状，如图2B’所示。
如图2C所示，透过如电镀金属的方式形成一遮蔽层23于该包覆层22的第二表面22b上，且该遮蔽层23延伸至该多个穿孔230中以作为延伸部23a，使该遮蔽层23的延伸部23a接触并电性连接该承载结构20的接地部202，俾供作为电磁波屏障。
于本实施例中，形成该遮蔽层23的材质如金、银、铜(Cu)、镍(Ni)、铁(Fe)、铝(Al)、不锈钢(Sus)等。
此外，也可通过涂布(coating)、溅镀(sputtering)、化镀、无电镀或蒸镀等方式形成该遮蔽层23。
又，该遮蔽层23只需电性连接该接地部202即可，故该接地部202的位置并不限于上述。
如图2D及图2D’所示，沿如图2C所示的切割路径S(如隔离部20”)进行切单制程，以得到本发明的电子封装件2，其中，该切割路径S对应该隔离部20”位置且通过该穿孔230，且该延伸部23a自该包覆层22的第二表面22b的部分边缘(如角落处)沿该包覆层22的侧面22c延伸至该基板20’的侧面20c而未延伸至该基板20’的第二侧20b，以令该包覆层22的部分侧面22c与该基板20’的部分侧面20c外露于该遮蔽层23。
于本实施例中，该基板20’的侧面20c邻接该第一侧20a与第二侧20b，且该包覆层22的侧面22c邻接该第一表面22a与第二表面22b。
此外，该接地部202连通该基板20’的侧面20c以接触该延伸部23a，且该多个电性接触垫201外露于该基板20’的第二侧20b。
又，该延伸部23a自该包覆层22的第二表面22b的角落朝该基板20’的第二侧20b的角落延伸，且仅延伸至该基板20’的侧面20c与第二侧20b的交界处而不会延伸至该第二侧20b上。
另外，于后续制程中，形成多个如焊球的导电元件(图略)于该多个电性接触垫201上，以供后续接置如封装结构或电路板等外部装置(图略)。
因此，本发明的制法通过该穿孔230的设计，以于形成该遮蔽层23时，该延伸部23a会自该包覆层22的第二表面22b的角落朝该基板20’的第二侧20b的角落延伸，且仅延伸至该基板20’的侧面20c与第二侧20b的交界处而不会延伸至该第二侧20b上，故相比于现有技术，本发明的延伸部23a不会溢镀至该基板20’的第二侧20b，因而该延伸部23a不会接触该电性接触垫201，进而有效避免该电子封装件2发生短路。
此外，通过该电子元件21外围覆盖有该遮蔽层23，使该电子封装件2于运作时，该电子元件21不会遭受外界的电磁干扰(EMI)，故该电子封装件2的电性运作功能得以正常，因而不会影响整体该电子封装件2的电性效能。
本发明亦提供一种电子封装件2，其包括：一基板20’、至少一电子元件21、一包覆层22以及一遮蔽层23。
所述的基板20’具有相对的第一侧20a与第二侧20b及邻接该第一侧20a与第二侧20b的侧面20c。
所述的电子元件21设于该基板20’的第一侧20a上并电性连接该基板20’。
所述的包覆层22形成于该基板20’的第一侧20a上以包覆该电子元件21，其中，该包覆层22具有结合该基板20’第一侧20a的第一表面22a、相对该第一表面22a的第二表面22b、及邻接该第一与第二表面22a,22b的侧面22c。
所述的遮蔽层23形成于该包覆层22的第二表面22b上，其中，该遮蔽层23具有延伸部23a，自该包覆层22的第二表面22b的部分边缘沿该包覆层22的侧面22c延伸至该基板20’的侧面20c而未延伸至该基板20’的第二侧20b上，以令该包覆层22的部分侧面22c与该基板20’的部分侧面20c外露于该遮蔽层23。
于一实施例中，该基板20’具有多个电性接触垫201，且该多个电性接触垫201外露于该基板20’的第二侧20b。
于一实施例中，该基板20’具有接触该遮蔽层23的接地部202。例如，该接地部202连通该基板20’的侧面20c以接触该延伸部23a。
于一实施例中，该包覆层22为绝缘材。
于一实施例中，该遮蔽层23为导电材。
于一实施例中，该延伸部23a自该包覆层22的第二表面22b的角落朝该基板20’的第二侧20b的角落延伸。
综上所述，本发明的电子封装件及其制法，通过该遮蔽层的延伸部自该包覆层的第二表面的部分边缘沿该包覆层的侧面延伸至该基板的侧面而未延伸至该基板的第二侧，以令该包覆层的部分侧面与该基板的部分侧面外露于该遮蔽层，使该延伸部不会接触该电性接触垫，故本发明能有效避免该电子封装件发生短路。
上述实施例仅用以例示性说明本发明的原理及其功效，而非用于限制本发明。任何所属领域技术人员均可在不违背本发明的精神及范畴下，对上述实施例进行修改。因此本发明的权利保护范围，应如权利要求书所列。

Claims (15)

1.一种电子封装件，其特征为，该电子封装件包括：
基板，其具有相对的第一侧与第二侧及邻接该第一侧与第二侧的侧面；
电子元件，其设于该基板的第一侧上并电性连接该基板；
包覆层，其形成于该基板的第一侧上以包覆该电子元件，其中，该包覆层具有结合该基板的第一侧的第一表面、相对该第一表面的第二表面、及邻接该第一表面与第二表面的侧面，该包覆层的第二表面的角落形成有穿孔的一部分，且该穿孔的一部分自该包覆层的第二表面的角落沿该包覆层的侧面延伸至该基板的侧面；以及
遮蔽层，其形成于该包覆层的第二表面上且具有延伸部，该延伸部形成于该包覆层的第二表面的角落的该穿孔的一部分中，且该延伸部自该包覆层的第二表面的角落的该穿孔的一部分沿该包覆层的侧面延伸至该基板的侧面而未延伸至该基板的第二侧，以令该包覆层的部分侧面与该基板的部分侧面外露于该遮蔽层。
2.根据权利要求1所述的电子封装件，其特征为，该基板具有多个电性接触垫，且该多个电性接触垫外露于该基板的第二侧。
3.根据权利要求1所述的电子封装件，其特征为，该基板具有接触该遮蔽层的接地部。
4.根据权利要求3所述的电子封装件，其特征为，该接地部连通该基板的侧面以接触该延伸部。
5.根据权利要求1所述的电子封装件，其特征为，该包覆层为绝缘材。
6.根据权利要求1所述的电子封装件，其特征为，该遮蔽层为导电材。
7.根据权利要求1所述的电子封装件，其特征为，该延伸部自该包覆层的第二表面的角落朝该基板的第二侧的角落延伸，且该延伸部仅延伸至该基板的侧面与第二侧的交界处。
8.一种电子封装件的制法，其特征为，该制法包括：
设置至少一电子元件于一基板上，其中，该基板具有相对的第一侧与第二侧及邻接该第一侧与第二侧的侧面，且该电子元件设于该基板的第一侧上并电性连接该基板；
形成包覆层于该基板上，以令该包覆层包覆该电子元件，其中，该包覆层具有结合该基板的第一侧的第一表面、相对该第一表面的第二表面、及邻接该第一表面与第二表面的侧面，该包覆层的第二表面的角落形成有穿孔的一部分，且该穿孔的一部分自该包覆层的第二表面的角落沿该包覆层的侧面延伸至该基板的侧面；以及
形成遮蔽层于该包覆层的第二表面上，其中，该遮蔽层具有延伸部，该延伸部形成于该包覆层的第二表面的角落的该穿孔的一部分中，且该延伸部自该包覆层的第二表面的角落的该穿孔的一部分沿该包覆层的侧面延伸至该基板的侧面而未延伸至该基板的第二侧，以令该包覆层的部分侧面与该基板的部分侧面外露于该遮蔽层。
9.根据权利要求8所述的电子封装件的制法，其特征为，该遮蔽层的制程包括：
提供一承载结构，其包含多个基板及连结于各该基板之间的隔离部；
设置电子元件于该基板上，且以该包覆层包覆该电子元件；
于该包覆层中形成多个穿孔，其中，该穿孔延伸至该基板的侧面，且该穿孔的位置对应该基板的角落的隔离部位置；
形成该遮蔽层于该包覆层的第二表面上，且令该遮蔽层延伸至该穿孔中而形成该延伸部；以及
沿该隔离部进行切割以分离各该基板。
10.根据权利要求8所述的电子封装件的制法，其特征为，该基板具有多个电性接触垫，且该多个电性接触垫外露于该基板的第二侧。
11.根据权利要求8所述的电子封装件的制法，其特征为，该基板具有接触该遮蔽层的接地部。
12.根据权利要求11所述的电子封装件的制法，其特征为，该接地部连通该基板的侧面以接触该延伸部。
13.根据权利要求8所述的电子封装件的制法，其特征为，该包覆层为绝缘材。
14.根据权利要求8所述的电子封装件的制法，其特征为，该遮蔽层为导电材。
15.根据权利要求8所述的电子封装件的制法，其特征为，该延伸部自该包覆层的第二表面的角落朝该基板的第二侧的角落延伸，且该延伸部仅延伸至该基板的侧面与第二侧的交界处。
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