CN101499459B - 封装结构 - Google Patents

封装结构 Download PDF

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CN101499459B
CN101499459B CN 200810005012 CN200810005012A CN101499459B CN 101499459 B CN101499459 B CN 101499459B CN 200810005012 CN200810005012 CN 200810005012 CN 200810005012 A CN200810005012 A CN 200810005012A CN 101499459 B CN101499459 B CN 101499459B
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substrate
side plate
reference column
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卢忻杰
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Advanced Semiconductor Engineering Inc
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Abstract

一种封装结构。封装结构包括一基板、一半导体组件及一金属屏蔽。基板具有至少一定位凹口。定位凹口设置于基板的一基板角落。半导体组件设置于基板的一上表面。金属屏蔽覆盖半导体组件。金属屏蔽包括一定位柱。定位柱插入于定位凹口内。

Description

封装结构
技术领域
本发明有关一种封装结构,且特别是有关具有金属屏蔽的封装结构。
背景技术
随着半导体封装技术的发展,封装结构的形式越来越复杂。举例来说,部分的处理芯片及通讯芯片需要一金属屏蔽加以防护,以避免外界的辐射干扰这些芯片,或者避免其所产生的辐射影响周边电子组件。
然而,金属屏蔽在回焊过程中,容易因热空气的对流而产生偏移。如此一来,可能造成金属屏蔽不稳固、屏蔽效果不佳或电气短路等现象。
发明内容
本发明的目的是提供一种封装结构,其利用其基板与金属屏蔽的设计,使得金属屏蔽良好地设置于基板上,并提供良好的屏蔽效果。
根据本发明的一方面,提出一种封装结构。封装结构包括一基板、一半导体组件及一金属屏蔽。基板具有至少一定位凹口。定位凹口设置于基板的一基板角落。半导体组件设置于基板的一上表面。金属屏蔽覆盖半导体组件。该金属屏蔽包括一定位柱。定位柱插入于定位凹口内。
附图说明
为让本发明的上述内容能更明显易懂,下面将配合附图对本发明的较佳实施例进行详细说明,其中:
图1绘示本发明第一实施例的封装结构的立体分解图;
图2绘示图1的封装结构组合图;
图3绘示定位柱及定位凹口的示意图;
图4绘示图2的封装结构的侧面示意图;
图5绘示一基板联片的示意图;
图6绘示金属屏蔽的投影范围与基板的示意图;以及
图7绘示本发明第二实施例的封装结构的定位柱及定位凹口的示意图。
具体实施方式
第一实施例
请参照图1,图1绘示本发明第一实施例的封装结构1000的立体分解图。封装结构1000包括一基板100、一半导体组件200及一金属屏蔽300。基板100例如是一电路板(Printed Circuit Board)或一导线架(Lead Frame)。基板100具有至少一定位凹口110。定位凹口110设置于基板100的一基板角落120。在本实施例中,基板100是四边形结构,故基板100具有四个基板角落120,四个定位凹口110则分别设置于基板100的四个基板角落120。
半导体组件200例如是一通讯芯片或一处理芯片。半导体组件200设置于基板100的一上表面130。半导体组件200设置于基板100的方式例如是打线接合(Wire Bonding)或覆晶接合(Flip Chip)。
金属屏蔽300亦设置于基板100上,并覆盖半导体组件200。由于上述半导体组件200容易受到外界的辐射干扰,其自身所发出的辐射亦可能影响周边电子组件。因此,通过金属屏蔽300覆盖此半导体组件200,即可达到良好的辐射频蔽效果。金属屏蔽300包括一本体板310、至少一侧板320及至少一定位柱330。定位柱330插入于定位凹口110内。在本实施例中,对应于四个定位凹口110,金属屏蔽300亦包括四个定位柱330,四个定位柱330分别插入于四个定位凹口110中。
其中,定位柱330是以焊接的方式设置于定位凹口110内。更具体说,如图1所示,基板100具有焊接铜箔140,焊接铜箔140亦暴露于定位凹口110的内壁111及邻近定位凹口110的部分上表面131。在封装结构1000的制作过程中,是通过钢板印刷的方式涂布锡膏(Solder Paste)于邻近定位凹口110的部分上表面131,再通过回焊的方式将定位柱330焊接于定位凹口110内。一般而言,在回焊过程中,部分的焊锡将会沿着定位凹口110的内壁111流下,使得定位柱330不仅焊接于邻近凹口110的部分上表面131,还焊接于定位凹口110的内壁111。
此外,在回焊过程中,金属屏蔽300的定位柱330已插入于定位凹口110中,因此金属屏蔽300不会任意偏移,而大幅增加工艺的稳定性。
基板100是四边形结构,基板100具有四基板长边150。本体板310是八角形结构,本体板310具有四屏蔽长边311及四屏蔽短边312。各个屏蔽长边311分别对应于各个基板长边150,各个屏蔽短边312分别对应于基板100的四个基板角落120。屏蔽长边311与邻接的两个屏蔽短边312的夹角θ皆为135度。金属屏蔽300的侧板320是延伸于屏蔽长边311其中之一,且定位柱330延伸于这些屏蔽短边312其中之一。侧板320及定位柱330分别与本体板310成九十度,在本实施例中,本体板310、侧板320及定位柱330是一体成型的结构。请参照图2,其绘示图1的封装结构1000的组合图,本体板310、侧板320、定位柱330及基板100所形成的空间几乎完整地包覆半导体组件200,以确保半导体组件200受到良好的辐射频蔽效果。
以下则分别就金属屏蔽300的定位柱330及侧板320的结构详细说明如下:
就定位柱330而言,请参照图3,其绘示定位柱330及定位凹口110的示意图。定位柱330包括一第一柱体部331及第二柱体部332。第一柱体部331的宽度W331大于定位凹口110对应于定位柱330的宽度W110。第二柱体部332的宽度W332小于定位凹口110对应于定位柱330的宽度W110。也就是说,仅有宽度较小的第二柱体部332插入定位凹口110之内。较佳地,第二柱体部332的长度L332是1/2~2/3倍基板100的厚度W100。所以,定位柱330的末端并不会凸出于基板100的下表面160。如此一来,封装结构1000即可平整地设置于另一电路板(未绘示)上,而不受到定位柱330的影响。
此外,第一柱体部331的长度L331将影响金属屏蔽300的高度,使用者可依据半导体组件200的高度及其电气特性来决定第一柱体部331的长度L331。本实施例的金属屏蔽300包括四个定位柱330,各个定位柱330的第一柱体部331的长度L331皆相等。借此,金属屏蔽300不会有倾斜的现象。
就侧板而言,请参照图4,其绘示图2的封装结构1000的侧面示意图。侧板320包括一第一侧板部321及一第二侧板部322。第一侧板部321延伸于屏蔽长边311其中之一。第二侧板部322延伸于第一侧板部321的部分边缘处,并抵靠基板100的上表面130。也就是说,侧板320并非以全部的边缘抵靠基板100的上表面130。在第一侧板部321与基板100的上表面130之间,仍存有部分的气流空间S。在回焊的过程中,热空气可由气流空间S进入金属屏蔽300的内部,以顺利对半导体组件200及金属屏蔽300进行焊接工序。
再者,如图4所示,第一侧板部321是自本体板310的边缘处延伸一第一距离D1,第二侧板部322是自第一侧板部321的边缘处延伸一第二距离D2。一般而言,气流空间S越大,有利于焊接工序,但不利于屏蔽效果。反之,气流空间S越小,不利于焊接工序,而有利于屏蔽效果。经过反复的实验证明,较佳地第二距离D2等于1/2~1倍的第一距离D1时,也就是气流空间S的高度(相当于第二距离D2)约为1/3~1/2倍的金属屏蔽300的高度(相当于第一距离D1及第二距离D2之和)时,不仅可维持良好的焊接工艺,还可维持良好的屏蔽效果。
其中,本实施例的金属屏蔽300包括四个侧板320,对应各个侧板320的第一距离D1及第二距离D2之和皆相等,且第二侧板部322的边缘是一直线。因此第二侧板部322可平稳地抵靠于基板100上,而不会使得金属屏蔽300有倾斜的现象。
此外,金属屏蔽300的本体板310、侧板320及定位柱330皆为平板状结构,且侧板320及定位柱330相互分离。因此,在金属屏蔽300的制造过程中,仅需将本体板310、侧板320及定位柱330的形状刻画于一金属板材上,再经过翻折后,即可形成上述金属屏蔽300的立体结构。此一制作方式不仅相当的方便,还降低许多制作成本。
请参照图5,其绘示一基板联片100’的示意图。上述的基板100是由一基板联片100’所裁切而成。基板联片100’具有多个圆形贯穿孔110’。待半导体组件200及金属屏蔽300均设置且焊接于基板联片100’后,再沿着圆形贯穿孔110’的连线裁切后,即形成数个封装结构1000。也就是说,基板联片100’的一个圆形贯穿孔110’可作为四个基板100的定位凹口110(绘示于图1),而每一定位凹口110的截面是四分之一圆形结构。并且定位凹口110恰好位于四边形结构的基板100的四个基板角落120,而基板100的两个基板角落120之间的边缘是直线。定位凹口110所占用的空间仅有四分之一圆,因此金属屏蔽300并不会占去基板100过多的空间。四边形结构的基板100具有四基板长边150。一般而言,基板角落120需要设置接垫或组件的机率不大,而基板长边150处需要设置接垫的机率较大。因此,设置于基板角落120的定位凹口110并不会影响基板100的接垫或组件的设置空间。如此一来,本实施例的封装结构1000更符合了组件微小化的趋势。
此外,请参照图6,其绘示金属屏蔽300的投影范围300’与基板100的示意图。金属屏蔽300投影至基板100的投影范围300’小于基板100。较佳地,金属屏蔽300投影至基板100的投影范围300’的边缘与基板100的边缘距离大于0.1毫米(mm)。如此一来,在基板联片100’中,两个相邻的金属屏蔽300之间距离0.2毫米(mm)以上。待数个封装结构1000完成后,在裁切的过程中,更可避免裁切刀具或激光束受到金属屏蔽300的影响。
第二实施例
请参照图7,其绘示本发明第二实施例的封装结构2000的定位柱430及定位凹口110的示意图。本实施例的封装结构2000与第一实施例的封装结构1000不同之处在于定位柱430还包括一凸出部433,其余相同之处不再重述。凸出部433是形成于第一柱体部331及第二柱体部332之间,凸出部433并抵靠于定位凹口110的内壁111。由于凸出部433设置于第一柱体部331及第二柱体部332之间,故凸出部433恰好抵靠于定位凹口110的上端的内壁111。当锡膏涂布于邻近定位凹口110的部分上表面131,且将定位柱430插入于定位凹口110中时,凸出部433恰好接触部分的锡膏。如此一来,在回焊过程中,部分的焊锡将会同时沿着定位柱430及定位凹口110的内壁111流下,使得焊锡完整地填满定位柱430与定位凹口110的内壁111的空间。
本发明上述实施例所揭露的封装结构,其利用基板与金属屏蔽的设计,使得封装结构具有多项优点,以下仅列举部分优点说明如下:
第一、在回焊过程中,金属屏蔽的定位柱已插入于定位凹口中,因此金属屏蔽不会任意偏移,而大幅增加工艺的稳定性。
第二、本体板、侧板、定位柱及基板所形成的空间几乎完整地包覆半导体组件,以确保半导体组件受到良好的辐射频蔽效果。
第三、仅有宽度较小的第二柱体部可插入至定位凹口之内,并且,第二柱体部的长度是1/2~2/3倍的基板的厚度。所以,定位柱的末端并不会凸出于基板的下表面。如此一来,封装结构即可平整地设置于另一电路板上,而不受到定位柱的影响。
第四、上述的金属屏蔽包括四个定位柱,各个定位柱的第一柱体部的长度皆相等。借此,金属屏蔽不会有倾斜的现象。
第五、在第一侧板部与基板的上表面之间,仍存有部分的气流空间。在回焊的过程中,热空气可由气流空间进入金属屏蔽的内部,以顺利对半导体组件及金属屏蔽进行焊接工序。
第六、经过反复的实验证明,当上述的第二距离等于1/2~1倍的第一距离(也就是气流空间的高度约为1/3~1/2倍的金属屏蔽的高度)时,不仅可维持良好的焊接过程,更可维持良好的屏蔽效果。
第七、上述金属屏蔽包括四个侧板,对应各个侧板的第一距离及第二距离之和皆相等,且第二侧板部的边缘是一直线。因此第二侧板部可平稳地抵靠于基板上,而不会使得金属屏蔽有倾斜的现象。
第八、金属屏蔽的本体板、侧板及定位柱皆为平板状结构,且侧板及定位柱是相互分离。因此,在金属屏蔽的制造过程中,仅需将本体板、侧板及定位柱的形状刻画于一金属板材上,再经过翻折后,即可形成上述金属屏蔽的立体结构。此一制作方式不仅相当的方便,还可降低许多制作成本。
第九、定位凹口所占用的空间仅有四分之一圆,因此金属屏蔽并不会占去基板过多的空间。
第十、设置于基板角落的定位凹口并不会影响基板的接垫或组件的设置空间。
第十一、金属屏蔽投影至基板的投影范围的边缘与基板的边缘距离大于0.1毫米(mm)。待数个封装结构完成后,在裁切的过程中,还可避免裁切刀具或激光束受到金属屏蔽的影响。
第十二、当锡膏涂布于邻近定位凹口的部分上表面,且将定位柱插入于定位凹口中时,第二实施例的凸出部恰好接触部分的锡膏。如此一来,在回焊过程中,部分的焊锡将会同时沿着定位柱及定位凹口的内壁流下,使得焊锡完整地填满定位柱与定位凹口之内壁的空间。
综上所述,虽然本发明已以较佳实施例揭露如上,然而其并非用以限定本发明。本发明所属技术领域中具有通常知识者,在不脱离本发明的精神和范围内,当可作各种等同的改变或替换。因此,本发明的保护范围当视后附的本申请权利要求范围所界定的为准。

Claims (11)

1.一种封装结构,包括:
一基板,其具有一定位凹口,该定位凹口设置于该基板的一基板角落;
一半导体组件,其设置于所述基板的一上表面;以及
一金属屏蔽,其覆盖所述半导体组件,所述金属屏蔽包括:
一定位柱,其插入于所述定位凹口内,所述定位柱包括:
一第一柱体部,所述第一柱体部的宽度大于所述定位凹口对应于所述定位柱的宽度;以及
一第二柱体部,所述第二柱体部的宽度小于所述定位凹口对应于所述定位柱的宽度,所述第二柱体部的长度是1/2~2/3倍的所述基板的厚度。
2.根据权利要求1所述的封装结构,其特征在于所述基板是四边形结构,所述基板具有四基板长边,所述金属屏蔽还包括:
一本体板,所述本体板是八边形结构,所述本体板具有四屏蔽长边及四屏蔽短边,这些屏蔽长边对应于所述基板长边,这些屏蔽短边是对应于所述基板的四个基板角落;以及
一侧板,延伸于所述屏蔽长边其中之一,所述侧板与所述本体板成九十度;
其中所述定位柱是延伸于这些屏蔽短边其中之一。
3.根据权利要求2所述的封装结构,其特征在于所述侧板包括:
一第一侧板部,延伸于所述屏蔽长边其中之一;及
一第二侧板部,延伸于所述第一侧板部的部分边缘处,并抵靠所述基板的所述上表面。
4.根据权利要求3所述的封装结构,其特征在于所述第一侧板部是自所述本体板的边缘处延伸一第一距离,所述第二侧板部是自所述第一侧板部的边缘处延伸一第二距离,所述第二距离等于1/2~1倍的所述第一距离。
5.根据权利要求4所述的封装结构,其特征在于所述金属屏蔽包括侧板,对应各所述侧板的该第一距离及该第二距离之和皆相等。
6.根据权利要求2所述的封装结构,其特征在于所述侧板与所述定位柱相互分离。
7.根据权利要求1所述的封装结构,其特征在于所述定位柱还包括:
一凸出部,其设置于所述第一柱体部及所述第二柱体部之间,所述凸出部并抵靠于所述定位凹口上端的内壁。
8.根据权利要求1所述的封装结构,其特征在于所述金属屏蔽包括多个定位柱,各所述定位柱的第一柱体部的长度皆相等。
9.根据权利要求1所述的封装结构,其特征在于所述基板具有一焊接铜箔,所述焊接铜箔暴露于所述定位凹口的内壁及邻近所述定位凹口的部分所述上表面。
10.根据权利要求1所述的封装结构,其特征在于所述定位柱是焊接于所述定位凹口内。
11.根据权利要求1所述的封装结构,其特征在于所述金属屏蔽投影至所述基板的一投影范围小于所述基板。
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