TWI266602B - EMI shielding package and method of making the same - Google Patents

EMI shielding package and method of making the same

Info

Publication number
TWI266602B
TWI266602B TW94112031A TW94112031A TWI266602B TW I266602 B TWI266602 B TW I266602B TW 94112031 A TW94112031 A TW 94112031A TW 94112031 A TW94112031 A TW 94112031A TW I266602 B TWI266602 B TW I266602B
Authority
TW
Taiwan
Prior art keywords
making
same
shielded
emi shielding
shielding package
Prior art date
Application number
TW94112031A
Other languages
Chinese (zh)
Other versions
TW200637480A (en
Inventor
Xiao-Hua Kong
Original Assignee
Hon Hai Prec Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW94112031A priority Critical patent/TWI266602B/en
Publication of TW200637480A publication Critical patent/TW200637480A/en
Application granted granted Critical
Publication of TWI266602B publication Critical patent/TWI266602B/en

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

An electromagnetic interference (EMI) shielding package includes a substrate mounting a plurality of electronic components, which the electronic component comprising components being shielded or not being shielded; a metal cap is configured on the substrate, which is covered on the electronic components being shielded; and a plastic encapsulating the electronic components being shielded, the metal cap, and gaps between the electronic components and the substrate.
TW94112031A 2005-04-15 2005-04-15 EMI shielding package and method of making the same TWI266602B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94112031A TWI266602B (en) 2005-04-15 2005-04-15 EMI shielding package and method of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94112031A TWI266602B (en) 2005-04-15 2005-04-15 EMI shielding package and method of making the same

Publications (2)

Publication Number Publication Date
TW200637480A TW200637480A (en) 2006-10-16
TWI266602B true TWI266602B (en) 2006-11-11

Family

ID=38191620

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94112031A TWI266602B (en) 2005-04-15 2005-04-15 EMI shielding package and method of making the same

Country Status (1)

Country Link
TW (1) TWI266602B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI463735B (en) * 2010-08-03 2014-12-01 Shunsin Technology Zhong Shan Ltd Module having an antenna interface and manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI619224B (en) * 2017-03-30 2018-03-21 矽品精密工業股份有限公司 Electronic package and the manufacture thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI463735B (en) * 2010-08-03 2014-12-01 Shunsin Technology Zhong Shan Ltd Module having an antenna interface and manufacturing method thereof

Also Published As

Publication number Publication date
TW200637480A (en) 2006-10-16

Similar Documents

Publication Publication Date Title
WO2008043012A3 (en) Package-level electromagnetic interference shielding
WO2008008948A3 (en) System and method of attenuating electromagnetic interference with a grounded top film
WO2004093505A3 (en) Emi shielding for electronic component packaging
IL160070A0 (en) Emi shielding for electronic packages
SG153729A1 (en) Integrated circuit package system for shielding electromagnetic interference
WO2008018959A3 (en) Overmolded semiconductor package with a wirebond cage for emi shielding
EP2259164B8 (en) Thermal solution for electronic devices
DE60333971D1 (en) Shielding of electromagnetic interference for an encapsulated packaging of an electronic device
WO2007092515A3 (en) Heat sink gasket
EP1895826A3 (en) Electronic Appliance with a metallic heat dissipating member
AU2002306475A1 (en) Integrated circuit die having an electromagnetic interference shield
TW200631491A (en) Sandwiched thermal solution
MY124778A (en) Conforming shielded form for electronic component assemblies
TW200631145A (en) A heat sink, an electronic component package, and a method of manufacturing a heat sink
TW200635496A (en) Radiation shielding circuit, memory device, and manufacturing method thereof
CA2704683A1 (en) Grounded lid for micro-electronic assemblies
IN2012DN05096A (en)
WO2008011254A3 (en) Electrostatic discharge protection for components of an rfid tag
WO2004027340A3 (en) Equipment and methods for producing continuous metallized thermoformable emi shielding material
EP1890326A3 (en) Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure
TW200740331A (en) Hybrid multilayer circuit board and method of manufacturing the same
WO2012009588A3 (en) Integrated shielding for a package-on-package system
WO2005057995A3 (en) Replacement cover for electromagnetic shielding system
TWI266602B (en) EMI shielding package and method of making the same
TWI267181B (en) Structure and assembly method of IC packaging