CN108369376A - 感光性树脂组合物、固化膜、层叠体、触控面板用构件和固化膜的制造方法 - Google Patents
感光性树脂组合物、固化膜、层叠体、触控面板用构件和固化膜的制造方法 Download PDFInfo
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- CN108369376A CN108369376A CN201680075153.XA CN201680075153A CN108369376A CN 108369376 A CN108369376 A CN 108369376A CN 201680075153 A CN201680075153 A CN 201680075153A CN 108369376 A CN108369376 A CN 108369376A
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- photosensitive polymer
- polymer combination
- cured film
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- GYDSPAVLTMAXHT-UHFFFAOYSA-N pentyl 2-methylprop-2-enoate Chemical compound CCCCCOC(=O)C(C)=C GYDSPAVLTMAXHT-UHFFFAOYSA-N 0.000 description 1
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- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
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Abstract
本发明的目的在于,提供图案加工性优异、在150℃以下的低温固化下也给出充分的耐药品性和基板密合性的感光性树脂组合物。本发明是感光性树脂组合物,其含有(A)含有烯属不饱和基团和羧基的光反应性树脂、(B)环氧化合物、(C)多官能环氧化合物、(D)光聚合引发剂。
Description
技术领域
本发明涉及感光性树脂组合物、固化膜、触控面板用构件和固化膜的制造方法。
背景技术
现在的智能手机、平板电脑终端大多使用电容式触控面板。电容式触控面板的传感器基板在玻璃上具有对ITO(Indium Tin Oxide,铟锡氧化物)、金属(银、钼、铝等)进行图案加工而得到的配线,除此之外,一般为在配线的交叉部具有保护绝缘膜、ITO和金属的保护膜的结构。一般而言,保护膜由高硬度的无机系的SiO2、SiNx、感光性透明材料等形成,绝缘膜由感光性透明材料形成的情况较多。
触控面板的方式大致分为在盖板玻璃与液晶面板之间形成触控面板层的Out-sell(外挂)类、在盖板玻璃上直接形成触控面板层的OGS(One Glass Solution,单片玻璃解决方案)类、在液晶面板上形成触控面板层的On-sell类、和在液晶面板的内部形成触控面板层的In-sell类,近年来,与以往相比能够使制造工艺简略化,因此广泛进行了On-sell类的开发。On-sell类在液晶面板上直接形成触控面板层,因此配线材料、保护膜、绝缘膜材料需要在液晶的耐热温度以下的低温下形成。
但是,无机系材料需要通过CVD(Chemial Vapor Deposition,化学气相沉积)而高温制膜从而形成SiO2、SiNx,难以应用于On-sell类。此外,以往的感光性透明材料需要在200℃以上的温度固化,在低温的固化的情况中,耐药品性不足(例如参照专利文献1)。因此,要求能够低温固化、且耐药品性、基板密合性优异、能够进行图案加工的感光性透明材料。
作为感光性透明材料,已知含有碱可溶性聚合物、单体、光聚合引发剂和其他添加剂的UV固化型涂布组合物。所述组合物除了用于例如彩色滤光片用外涂层材料和间隔物材料之外,进一步通过使用着色剂,也用于彩色抗蚀剂(color resist)(例如参照专利文献2)。除此之外,层间绝缘膜、阻焊剂、显示装置用分隔壁等,其应用范围广泛(例如参照专利文献3、4)。
作为提高这些组合物的特性的手段,专利文献1中研究了多官能环氧化合物,专利文献2中研究了Cardo系树脂,专利文献3中研究了具有环氧基的丙烯酸酯化合物,专利文献4中研究了具有环氧基或氧杂环丁烷基的化合物,暗示了基板密合性、耐药品性的提高。
现有技术文献
专利文献
专利文献1:日本特开2013-76821号公报
专利文献2:国际公开第2012/176694号小册子
专利文献3:日本特开2015-110765号公报
专利文献4:国际公开第2015/133162号小册子。
发明内容
发明所要解决的课题
On-sell类的触控面板中,液晶的耐热性低,因此在150℃以下的低温下的工艺是必须的。如专利文献1、2那样,需要230℃以上的固化的材料在150℃的低温固化的情况中无法得到充分的耐药品性、基板密合性。此外,专利文献3、4的材料的情况中,难以兼顾图案加工性和固化膜特性。
本发明的目的在于,提供能够低温固化、且耐药品性、基板密合性优异、能够进行图案加工的感光性透明材料。
解决课题的手段
本发明人等发现,本发明的目的通过下述感光性树脂组合物实现,所述感光性树脂组合物含有:含有烯属不饱和基团和羧基的光反应性树脂、特定的环氧化合物、特定的多官能环氧化合物和光聚合引发剂。
即,本发明的感光性树脂组合物包含:(A)含有烯属不饱和基团和羧基的光反应性树脂、(B)下述通式(1)所示的环氧化合物、(C)下述通式(2)所示的多官能环氧化合物、和(D)光聚合引发剂。
[化1]
(式中,X表示具有碳原子数为4~10的烯化氧的基团、或源自双酚类的基团,R1表示氢原子或甲基)。
[化2]
(式中,连接基团Y表示碳原子数为1~15的烃基,R2和R3各自独立地表示氢原子或碳原子数为1~6的烃基;n表示3或4的整数)。
本发明的目的通过使上述感光性树脂组合物固化而成的固化膜实现。
本发明的目的通过在基材上具备上述固化膜的层叠体实现。
本发明的目的通过具备上述层叠体的触控面板用构件实现。
本发明的目的通过下述固化膜的制造方法实现,所述制造方法按顺序包括:将上述感光性树脂组合物涂布于基材上的步骤、和在80~150℃加热的步骤。
发明的效果
本发明的感光性树脂组合物的图案加工性优异,能够进行150℃以下的低温固化,可以得到具备良好的耐药品性、基板密合性的固化膜。
附图说明
图1是触控面板构件的制造中的各步骤后的概略顶视图。
图2是表示触控面板构件的概略截面图。
具体实施方式
本发明的感光性树脂组合物含有:(A)含有烯属不饱和基团和羧基的光反应性树脂、(B)上述通式(1)所示的环氧化合物、(C)上述通式(2)所示的多官能环氧化合物、(D)光聚合引发剂、和(E)含磷化合物。
[(A)光反应性树脂]
本发明的感光性树脂组合物含有(A)含有烯属不饱和基团和羧基的光反应性树脂(以下也称为(A)光反应性树脂)。通过具有烯属不饱和基团,呈现负型的感光性,通过具有羧基,能够在碱水溶液中显影。
作为(A)光反应性树脂,可以使用例如(A-1)含有烯属不饱和基团和羧基的Cardo系树脂(以下也称为(A-1)Cardo系树脂)、(A-2)含有烯属不饱和基团和羧基的丙烯酸树脂(以下也称为(A-2)丙烯酸树脂)。以下,举出光反应性树脂的优选的例子,但不限于此。
作为(A-1)Cardo系树脂,可以举出具有2个以上的下述式(3)所示的结构作为重复单元、且含有烯属不饱和基团和羧基的Cardo系树脂。(A)光反应性树脂中,(A-1)Cardo系树脂从光固化性高、耐药品性优异的观点出发是优选的
[化3]
。
(A-1)Cardo系树脂可以通过例如使环氧化合物和含自由基聚合性基团的一元酸化合物的反应物进一步与酸二酐反应而得到。
加聚反应和加成反应中使用的催化剂没有限制,可以举出例如四丁基乙酸铵等铵系催化剂;2,4,6-三(二甲基氨基甲基)苯酚或二甲基苯甲基胺等胺系催化剂;三苯基膦等磷系催化剂;和乙酰丙酮合铬或氯化铬等铬系催化剂。
作为环氧化合物,可以举出以下的化合物。
[化4]
。
作为含自由基聚合性基团的一元酸化合物,可以举出例如(甲基)丙烯酸、丁二酸单(2-(甲基)丙烯酰氧基乙基)酯、邻苯二甲酸单(2-(甲基)丙烯酰氧基乙基)酯、四氢邻苯二甲酸单(2-(甲基)丙烯酰氧基乙基)酯或对羟基苯乙烯等。
作为酸二酐,可以举出例如均苯四甲酸二酐、3,3'4,4'-联苯四甲酸二酐、2,3,3',4-联苯四甲酸二酐、2,2',3,3'-联苯四甲酸二酐、3,3'4,4'-二苯甲酮四甲酸二酐、2,2',3,3'-二苯甲酮四甲酸二酐、2,2-双(3,4-二羧基苯基)六氟丙烷二酐、2,2-双(2,3-二羧基苯基)六氟丙烷二酐、1,1-双(3,4-二羧基苯基)乙烷二酐、1,1-双(2,3-二羧基苯基)乙烷二酐、双(3,4-二羧基苯基)甲烷二酐、双(2,3-二羧基苯基)甲烷二酐、双(3,4-二羧基苯基)砜二酐、双(3,4-二羧基苯基)醚二酐、1,2,5,6-萘四甲酸二酐、2,3,6,7-萘四甲酸二酐、2,3,5,6-吡啶四甲酸二酐或3,4,9,10-苝四甲酸二酐等芳族四甲酸二酐;丁烷四甲酸二酐、环丁烷四甲酸二酐、1,2,3,4-环戊烷四甲酸二酐、环己烷四甲酸二酐、双环[2.2.1.]庚烷四甲酸二酐、双环[3.3.1.]四甲酸二酐、双环[3.1.1.]庚-2-烯四甲酸二酐、双环[2.2.2.]辛烷四甲酸二酐或金刚烷四甲酸二酐等脂肪族四甲酸二酐。为了提高固化膜的耐药品性,优选均苯四甲酸二酐、3,3'4,4'-联苯四甲酸二酐、2,3,3',4-联苯四甲酸二酐或2,2',3,3'-联苯四甲酸二酐。
酸二酐为了调整分子量,还可以将酸二酐的一部分替换为酸酐使用。作为酸酐,可以举出例如丁二酸酐、马来酸酐、衣康酸酐、邻苯二甲酸酐、偏苯三甲酸酐、均苯四甲酸一酐、2,3-联苯二甲酸酐、3,4-联苯二甲酸酐、六氢邻苯二甲酸酐、戊二酸酐、3-甲基邻苯二甲酸酐、降冰片烯二甲酸酐、环己烯二甲酸酐或3-三甲氧基甲硅烷基丙基丁二酸酐。
此外,作为(A-1)Cardo系树脂,可以优选使用市售品,可以举出“WR-301(商品名)”((株)ADEKA制)、“V-259ME(商品名)”(新日铁住金化学(株)制)、“オグゾールCR-TR1(商品名)”、“オグゾールCR-TR2(商品名)”、“オグゾールCR-TR3(商品名)”、“オグゾールCR-TR4(商品名)”、“オグゾールCR-TR5(商品名)”、“オグゾールCR-TR6(商品名)”(以上均为大阪ガスケミカル(株)制)等。
作为(A-2)丙烯酸树脂,可以举出例如通过下述方式而得到的含有烯属不饱和基团和羧基的丙烯酸树脂:将不饱和羧酸和烯属不饱和化合物进行自由基聚合从而得到具有羧基的树脂之后,使羧基中的一部分与具有烯属不饱和双键基团的环氧化合物进行加成反应而酯化,从而得到。
自由基聚合的催化剂没有特别限制,一般使用偶氮二异丁腈等偶氮化合物、过氧化苯甲酰等有机过氧化物等。
具有烯属不饱和双键基团的环氧化合物的加成反应中使用的催化剂没有特别限制,可以使用公知的催化剂。可以使用例如二甲基苯胺、2,4,6-三(二甲基氨基甲基)苯酚、二甲基苯甲基胺等氨基系催化剂、2-乙基己酸锡(II)、月桂酸二丁基锡等锡系催化剂、2-乙基己酸钛(IV)等钛系催化剂、三苯基膦等磷系催化剂和乙酰丙酮合铬、氯化铬等铬系催化剂等。
作为不饱和羧酸,可以举出例如(甲基)丙烯酸、衣康酸、巴豆酸、马来酸、富马酸或乙烯基乙酸。
作为烯属不饱和化合物,可以举出例如(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丙酯、(甲基)丙烯酸异丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸仲丁酯、(甲基)丙烯酸异丁酯、(甲基)丙烯酸叔丁酯、(甲基)丙烯酸正戊酯、(甲基)丙烯酸2-羟基乙酯或(甲基)丙烯酸苯甲酯等不饱和羧酸烷基酯;苯乙烯、对甲基苯乙烯、邻甲基苯乙烯、间甲基苯乙烯或α-甲基苯乙烯等芳族乙烯基化合物;丙烯酸氨基乙酯等不饱和羧酸氨基烷基酯;(甲基)丙烯酸缩水甘油基酯等不饱和羧酸缩水甘油基酯;乙酸乙烯酯、丙酸乙烯酯等羧酸乙烯基酯;(甲基)丙烯腈或α-氯丙烯腈等氰乙烯化合物(シアン化ビニル化合物);1,3-丁二烯或异戊二烯等脂肪族共轭二烯;或者在各自的末端上具有(甲基)丙烯酰基的聚苯乙烯、聚丙烯酸甲酯、聚甲基丙烯酸甲酯、聚丙烯酸丁酯或聚甲基丙烯酸丁酯等。
作为具有烯属不饱和双键基团的环氧化合物,可以举出例如(甲基)丙烯酸缩水甘油基酯、(甲基)丙烯酸α-乙基缩水甘油基酯、(甲基)丙烯酸α-正丙基缩水甘油基酯、(甲基)丙烯酸α-正丁基缩水甘油基酯、(甲基)丙烯酸3,4-环氧丁酯、(甲基)丙烯酸3,4-环氧庚酯、(甲基)丙烯酸α-乙基-6,7-环氧庚酯、烯丙基缩水甘油基醚、乙烯基缩水甘油基醚、邻乙烯基苯甲基缩水甘油基醚、间乙烯基苯甲基缩水甘油基醚、对乙烯基苯甲基缩水甘油基醚、α-甲基-邻乙烯基苯甲基缩水甘油基醚、α-甲基-间乙烯基苯甲基缩水甘油基醚、α-甲基-对乙烯基苯甲基缩水甘油基醚、2,3-二缩水甘油基氧基甲基苯乙烯、2,4-二缩水甘油基氧基甲基苯乙烯、2,5-二缩水甘油基氧基甲基苯乙烯、2,6-二缩水甘油基氧基甲基苯乙烯、2,3,4-三缩水甘油基氧基甲基苯乙烯、2,3,5-三缩水甘油基氧基甲基苯乙烯、2,3,6-三缩水甘油基氧基甲基苯乙烯、3,4,5-三缩水甘油基氧基甲基苯乙烯、2,4,6-三缩水甘油基氧基甲基苯乙烯、甲基丙烯酸3,4-环氧环己基甲酯等。
(A)光反应性树脂的重均分子量(Mw)没有特别限制,以通过凝胶渗透色谱(GPC)测定的聚苯乙烯换算,优选为1,000以上且100,000以下。通过使Mw为上述范围,可以得到良好的涂布特性,图案形成时在显影液中的溶解性也变得良好。
本发明的感光性树脂组合物中,(A)光反应性树脂的含量没有特别限制,可以根据期望的膜厚、用途而任意选择,相对于固体成分100重量份优选为20~60重量份。通过设为该范围,以良好的平衡保持了显影性和所得固化膜的特性。
[(B)环氧化合物]
本发明的感光性树脂组合物含有(B)下述通式(1)所示的环氧化合物(以下也称为(B)环氧化合物)。
[化5]
。
上述式中,X表示具有碳原子数为4~10的烯化氧的基团、或源自双酚类的基团,R1表示氢原子或甲基。
(B)环氧化合物具有(甲基)丙烯酰基,通过光照射,该(甲基)丙烯酰基与(A)光反应性树脂的加成反应进行。进一步,通过热固化,环氧基与后述的(C)多官能环氧化合物的交联进行,由此所得固化膜的交联密度变高,可以得到优异的耐药品性和基板密合性。
从光反应性的观点出发,通式(1)中的X优选为碳原子数为4以上的烯化氧基。此外,从所得固化膜的耐药品性和基板密合性的观点出发,通式(1)中的X优选为碳原子数为10以下的烯化氧基或源自双酚类的基团。通过使X为长链基团,反应的自由度高,容易进行光反应或者环氧基的交联反应。此外,即使在(甲基)丙烯酰基或环氧基中任一者反应从而并入其他成分中的情况中,通过使X为长链基团,另一个反应性基团也容易露出,交联密度容易变高。
作为(B)环氧化合物的具体例,可以举出(甲基)丙烯酸4-羟基丁酯缩水甘油基醚、双酚A单缩水甘油基醚单(甲基)丙烯酸酯、双酚F单缩水甘油基醚单(甲基)丙烯酸酯等。(B)环氧化合物可以使用一种或组合使用多种。
本发明的感光性树脂组合物中,(B)环氧化合物的含量没有特别限制,可以根据期望的膜厚、用途任意选择,相对于固体成分100重量份,优选为1~30重量份。更优选为5重量份以上、此外更优选为20重量份以下。
[(C)多官能环氧化合物]
本发明的感光性树脂组合物含有(C)下述通式(2)所示的多官能环氧化合物(以下也称为(C)多官能环氧化合物)。
[化6]
。
上述式中,连接基团Y表示碳原子数为1~15的烃基,R2和R3各自独立地表示氢原子或碳原子数为1~6的烃基。n表示3或4的整数。多个R2和R3各自可以相同或不同。连接基团Y的例子如下所示。
[化7]
。
上述式中,*表示连接部位,R7~R20各自表示氢原子或烃基。
优选的连接基团Y的例子和对应于该连接基团Y的例子的(C)多官能环氧化合物的优选的例子示于下述式。
[化8]
。
这些中,从感光性树脂组合物的碱溶解性和所得固化膜的耐药品性的平衡出发,特别优选使用式(5)所示的连接基团Y。
前述通式(2)中,通过使n为3或4,所得固化膜的耐药品性提高。在2以下的情况中,所得固化膜的交联密度低,因此无法得到充分的耐药品性,在5以上的情况中,对显影液的溶解性降低,图案加工性恶化。即,(C)多官能环氧化合物为3官能或者4官能。(C)多官能环氧化合物可以使用一种或组合使用多种。
(C)多官能环氧化合物在单独的情况下也可以得到耐药品性的提高效果,但通过与(B)环氧化合物组合使用,交联密度变高,飞跃性地提高了耐药品性。
(C)多官能环氧化合物的含量没有特别限制,可以根据期望的膜厚、用途而任意选择,相对于固体成分100重量份,优选为0.5~20重量份。更优选为2重量份以上、此外更优选为15重量份以下。
[(D)光聚合引发剂]
本发明的感光性树脂组合物含有(D)光聚合引发剂。(D)光聚合引发剂通过光(包括紫外线、电子射线)而分解和/或反应,产生自由基。
作为具体例,可以举出2-甲基-[4-(甲硫基)苯基]-2-吗啉代丙-1-酮、2-二甲基氨基-2-(4-甲基苯甲基)-1-(4-吗啉-4-基-苯基)-丁-1-酮、2-苯甲基-2-二甲基氨基-1-(4-吗啉代苯基)-丁酮-1、2,4,6-三甲基苯甲酰基苯基氧化膦、双(2,4,6-三甲基苯甲酰基)-苯基氧化膦、双(2,6-二甲氧基苯甲酰基)-(2,4,4-三甲基戊基)-氧化膦、1-苯基-1,2-丙二酮-2-(邻乙氧基羰基)肟、1,2-辛二酮,1-[4-(苯硫基)-2-(O-苯甲酰基肟)]、1-苯基-1,2-丁二酮-2-(邻甲氧基羰基)肟、1,3-二苯基丙三酮-2-(邻乙氧基羰基)肟、乙酮,1-[9-乙基-6-(2-甲基苯甲酰基)-9H-咔唑-3-基]-,1-(O-乙酰基肟)、4,4-双(二甲基氨基)二苯甲酮、4,4-双(二乙基氨基)二苯甲酮、对二甲基氨基苯甲酸乙酯、对二甲基氨基苯甲酸2-乙基己酯、对二乙基氨基苯甲酸乙酯、二乙氧基苯乙酮、2-羟基-2-甲基-1-苯基丙烷-1-酮、安息香双甲醚、1-(4-异丙基苯基)-2-羟基-2-甲基丙烷-1-酮、4-(2-羟基乙氧基)苯基-(2-羟基-2-丙基)酮、1-羟基环己基-苯基酮、苯偶姻、苯偶姻甲基醚、苯偶姻乙基醚、苯偶姻异丙基醚、苯偶姻异丁基醚、二苯甲酮、邻苯甲酰基苯甲酸甲酯、4-苯基二苯甲酮、4,4-二氯二苯甲酮、羟基二苯甲酮、4-苯甲酰基-4'-甲基-二苯硫醚、烷基化二苯甲酮、3,3',4,4'-四(叔丁基过氧基羰基)二苯甲酮、4-苯甲酰基-N,N-二甲基-N-[2-(1-氧代-2-丙烯基氧基)乙基]苯甲基溴化铵、(4-苯甲酰基苯甲基)三甲基氯化铵、2-羟基-3-(4-苯甲酰基苯氧基)-N,N,N-三甲基-1-丙烯氯化铵一水盐、2-异丙基噻吨酮、2,4-二甲基噻吨酮、2,4-二乙基噻吨酮、2,4-二氯噻吨酮、2-羟基-3-(3,4-二甲基-9-氧代-9H-噻吨-2-基氧基)-N,N,N-三甲基-1-丙基氯化铵、2,2'-双(邻氯苯基)-4,5,4',5'-四苯基-1,2-联咪唑、10-丁基-2-氯吖啶酮、2-乙基蒽醌、苯偶酰、9,10-菲醌、樟脑醌、甲基苯基乙醛酸酯(メチルフェニルグリオキシエステル)、η5-环戊二烯基-η6-异丙苯基-铁(1+)-六氟磷酸盐(1-)、二苯硫醚衍生物、双(η5-2,4-环戊二烯-1-基)-双(2,6-二氟-3-(1H-吡咯-1-基)-苯基)钛、噻吨酮、2-甲基噻吨酮、2-氯噻吨酮、4-苯甲酰基-4-甲基苯基酮、二苄基酮、芴酮、2,3-二乙氧基苯乙酮、2,2-二甲氧基-2-苯基-2-苯基苯乙酮、2-羟基-2-甲基苯丙酮、对叔丁基二氯苯乙酮、苯甲基甲氧基乙基缩醛(ベンジルメトキシエチルアセタール)、蒽醌、2-叔丁基蒽醌、2-氨基蒽醌、β-氯蒽醌、蒽酮、苯并蒽酮、二苯并环庚酮、亚甲基蒽酮、4-叠氮基苯亚甲基苯乙酮、2,6-双(对叠氮基苯亚甲基)环己烷、2,6-双(对叠氮基苯亚甲基)-4-甲基环己酮、萘磺酰氯、喹啉磺酰氯、N-苯基硫代吖啶酮、苯并噻唑二硫化物、三苯基膦、四溴化碳、三溴苯基砜、过氧化苯甲酰、以及曙红、亚甲蓝等光还原性的色素与抗坏血酸、三乙醇胺等还原剂的组合等。它们可以使用一种或组合使用多种。
(D)光聚合引发剂的含量没有特别限制,相对于固体成分100重量份,优选为0.05~20重量份以下。更优选为2重量份以上,更优选为15重量份以下。
[(E)含磷化合物]
本发明的感光性树脂组合物可以含有(E)含磷化合物。通过含有(E)含磷化合物,与金属基材、特别是含钼的金属基材的密合性提高。(E)含磷化合物优选为下述通式(4)所示的化合物。
[化9]
。
上述式中,R4~R6各自独立地表示氢原子或碳原子数为1~6的烃基。
作为(E)含磷化合物的具体例,可以举出磷酸甲酯、磷酸乙酯、磷酸丙酯、磷酸丁酯、磷酸苯酯、磷酸二甲酯、磷酸二乙酯、磷酸二丙酯、磷酸二丁酯、磷酸二苯酯、磷酸三甲酯、磷酸三乙酯、磷酸三丙酯、磷酸三丁酯、磷酸三苯酯等。
(E)含磷化合物的含量没有特别限制,相对于固体成分100重量份,优选为0.01~10重量份。更优选为0.05重量份以上,此外,更优选为5重量份以下。
本发明的感光性树脂组合物为了调整树脂组合物的灵敏度而可以含有多官能单体。多官能单体是指在分子中具有至少2个以上的烯属不饱和双键的化合物。考虑到自由基聚合性的容易性,优选具有(甲基)丙烯酰基的多官能单体。以下,举出多官能单体的具体例,但不限于此。
作为在分子内具有2个(甲基)丙烯酰基的聚合性化合物,可以举出例如1,3-丁二醇二(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1,9-壬二醇二(甲基)丙烯酸酯、1,10-癸二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、2,4-二甲基-1,5-戊二醇二(甲基)丙烯酸酯、丁基乙基丙二醇二(甲基)丙烯酸酯、乙氧基化环己烷甲醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯、低聚乙二醇二(甲基)丙烯酸酯、二丙二醇二(甲基)丙烯酸酯、聚丙二醇二(甲基)丙烯酸酯、2-乙基-2-丁基-丙二醇二(甲基)丙烯酸酯、2-乙基-2-丁基-丁二醇二(甲基)丙烯酸酯、羟基特戊酸新戊二醇二(甲基)丙烯酸酯、烯化氧改性双酚A二(甲基)丙烯酸酯、烯化氧改性双酚F二(甲基)丙烯酸酯、低聚丙二醇二(甲基)丙烯酸酯、三环癸烷二(甲基)丙烯酸酯、双(2-羟基乙基)异氰脲酸酯二(甲基)丙烯酸酯、9,9-双[4-(2-(甲基)丙烯酰氧基乙氧基)苯基]芴、9,9-双[4-(2-(甲基)丙烯酰氧基乙氧基)-3-甲基苯基]芴、9,9-双[4-(2-(甲基)丙烯酰氧基丙氧基)-3-甲基苯基]芴或9,9-双[4-(2-(甲基)丙烯酰氧基乙氧基)-3,5-二甲基苯基]芴。
作为在分子内具有3个(甲基)丙烯酰基的聚合性化合物,可以举出例如三羟甲基丙烷三(甲基)丙烯酸酯、三羟甲基乙烷三(甲基)丙烯酸酯、三羟甲基丙烷的烯化氧改性三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇三(甲基)丙烯酸酯、三羟甲基丙烷三((甲基)丙烯酰氧基丙基)醚、丙三醇三(甲基)丙烯酸酯、三(2-羟基乙基)异氰脲酸酯三(甲基)丙烯酸酯、异氰脲酸烯化氧改性三(甲基)丙烯酸酯、丙酸二季戊四醇三(甲基)丙烯酸酯、三((甲基)丙烯酰氧基乙基)异氰脲酸酯、羟基新戊醛改性二羟甲基丙烷三(甲基)丙烯酸酯、山梨糖醇三(甲基)丙烯酸酯、丙氧基化三羟甲基丙烷三(甲基)丙烯酸酯或乙氧基化丙三醇三丙烯酸酯。
作为在分子内具有4个(甲基)丙烯酰基的聚合性化合物,可以举出例如季戊四醇四(甲基)丙烯酸酯、山梨糖醇四(甲基)丙烯酸酯、二(三羟甲基丙烷)四(甲基)丙烯酸酯、丙酸二季戊四醇四(甲基)丙烯酸酯或乙氧基化季戊四醇四(甲基)丙烯酸酯。
作为在分子内具有5个(甲基)丙烯酰基的聚合性化合物,可以举出例如山梨糖醇五(甲基)丙烯酸酯或二季戊四醇五(甲基)丙烯酸酯。
作为在分子内具有6个(甲基)丙烯酰基的聚合性化合物,可以举出例如二季戊四醇六(甲基)丙烯酸酯、山梨糖醇六(甲基)丙烯酸酯或己内酯改性二季戊四醇六(甲基)丙烯酸酯。
作为在分子内具有7个(甲基)丙烯酰基的聚合性化合物,可以举出例如三季戊四醇七丙烯酸酯。
作为在分子内具有8个(甲基)丙烯酰基的聚合性化合物,可以举出例如三季戊四醇八丙烯酸酯。它们可以使用一种或组合使用多种。
本发明的感光性树脂组合物可以含有促进树脂组合物的固化、或者使固化变得容易的各种固化剂。作为固化剂,没有特别限定,可以使用公知的物质,作为具体例,可以举出含氮有机物、有机硅树脂固化剂、各种金属醇盐、各种金属螯合物化合物、异氰酸酯化合物和其聚合物、羟甲基化三聚氰胺衍生物、羟甲基化尿素衍生物等。可以含有这些中的多种。其中,从固化剂的稳定性、所得涂布膜的加工性等出发,优选使用金属螯合物化合物、羟甲基化三聚氰胺衍生物、羟甲基化尿素衍生物。
本发明的感光性树脂组合物可以含有紫外线吸收剂。通过含有紫外线吸收剂,所得固化膜的耐光性提高,在需要图案加工的用途中,提高了显影后的分辨率。作为紫外线吸收剂,没有特别限定,可以使用公知的物质,但从透明性、非着色性的方面出发,优选使用苯并三唑系化合物、二苯甲酮系化合物、三嗪系化合物。
作为苯并三唑系化合物的紫外线吸收剂,可以举出2-(2H苯并三唑-2-基)苯酚、2-(2H-苯并三唑-2-基)-4,6-叔戊基苯酚、2-(2H苯并三唑-2-基)-4-(1,1,3,3-四甲基丁基)苯酚、2(2H-苯并三唑-2-基)-6-十二烷基-4-甲基苯酚、2-(2'-羟基-5'-甲基丙烯酰氧基乙基苯基)-2H-苯并三唑等。作为二苯甲酮系化合物的紫外线吸收剂,可以举出2-羟基-4-甲氧基二苯甲酮等。作为三嗪系化合物的紫外线吸收剂,可以举出2-(4,6-二苯基-1,3,5三嗪-2-基)-5-[(己基)氧基]-苯酚等。
本发明的感光性树脂组合物可以含有聚合抑制剂。通过适量含有聚合抑制剂,显影后的分辨率提高。作为聚合抑制剂,没有特别限制,可以使用公知的物质,可以举出例如二叔丁基羟基甲苯、丁基羟基苯甲醚、氢醌、4-甲氧基苯酚、1,4-苯醌、叔丁基邻苯二酚。此外,作为市售的聚合抑制剂,可以举出“IRGANOX 1010(商品名)”、“IRGANOX 1035(商品名)”、“IRGANOX 1076(商品名)”、“IRGANOX 1098(商品名)”、“IRGANOX 1135(商品名)”、“IRGANOX 1330(商品名)”、“IRGANOX 1726(商品名)”、“IRGANOX 1425(商品名)”、“IRGANOX1520(商品名)”、“IRGANOX 245(商品名)”、“IRGANOX 259(商品名)”、“IRGANOX 3114(商品名)”、“IRGANOX 565(商品名)”、“IRGANOX 295(商品名)”(以上均为BASFジャパン(株)制)等。
本发明的感光性树脂组合物可以含有溶剂。本发明的感光性树脂组合物适合使用大气压下的沸点为250℃以下的溶剂,可以使用这些中的多种。此外,如果在使本发明的感光性树脂组合物加热固化而得到的固化膜中残留有溶剂,则耐药品性、与基板的密合性随时间的经过受损,因此大气压下的沸点为150℃以下的溶剂在感光性树脂组合物中优选为溶剂总体的50重量份以上。
作为大气压下的沸点为150℃以下的溶剂,可以举出例如乙醇、异丙醇、1-丙醇、1-丁醇、2-丁醇、异戊醇、乙二醇单甲基醚、乙二醇二甲基醚、乙二醇单乙基醚、乙酸甲氧基甲酯、丙二醇单甲基醚、丙二醇单乙基醚、丙二醇单甲基醚乙酸酯、丙二醇单丙基醚、乙二醇单甲基醚乙酸酯、1-甲氧基丙基-2-乙酸酯、丙酮醇、乙酰丙酮、甲基异丁基酮、甲基乙基酮、甲基丙基酮、乳酸甲酯、甲苯、环戊酮、环己烷、正庚烷、苯、乙酸甲酯、乙酸乙酯、乙酸丙酯、乙酸异丁酯、乙酸丁酯、乙酸异戊酯、乙酸戊酯、3-羟基-3-甲基-2-丁酮、4-羟基-3-甲基-2-丁酮、5-羟基-2-戊酮。
作为大气压下的沸点为150~250℃的溶剂,可以举出例如乙二醇二乙基醚、乙二醇单正丁基醚、乙二醇单叔丁基醚、丙二醇单正丁基醚、丙二醇单叔丁基醚、乙酸2-乙氧基乙酯、3-甲氧基-1-丁醇、3-甲氧基-3-甲基丁醇、3-甲氧基-3-甲基丁基乙酸酯、3-甲氧基丁基乙酸酯、3-乙氧基丙酸乙酯、丙二醇单甲基醚丙酸酯、二丙二醇甲基醚、二异丁基酮、双丙酮醇、乳酸乙酯、乳酸丁酯、二甲基甲酰胺、二甲基乙酰胺、γ-丁内酯、γ-戊内酯、δ-戊内酯、碳酸亚丙酯、N-甲基吡咯烷酮、环己酮、环庚酮、二乙二醇单丁基醚、乙二醇二丁基醚。
溶剂的含量没有特别限制,可以根据涂布方法等而使用任意的量。例如,通过旋涂进行膜形成的情况中,一般设为感光性树脂组合物总体的50重量份以上且95重量份以下。
本发明的感光性树脂组合物为了提高涂布时的流动性,可以含有各种氟系表面活性剂、硅氧烷系表面活性剂等各种表面活性剂。表面活性剂的种类没有特别限制,可以使用例如“メガファック(注册商标)”“F142D(商品名)”、“F172(商品名)”、“F173(商品名)”、“F183(商品名)”、“F445(商品名)”、“F470(商品名)”、“F475(商品名)”、“F477(商品名)”(以上为大日本インキ化学工业(株)制)、“NBX-15(商品名)”、“FTX-218(商品名)”((株)ネオス制)等氟系表面活性剂、“BYK-333(商品名)”、“BYK-301(商品名)”、“BYK-331(商品名)”、“BYK-345(商品名)”、“BYK-307(商品名)”(ビックケミー・ジャパン(株)制)等硅氧烷系表面活性剂、聚烯化氧系表面活性剂、聚(甲基)丙烯酸酯系表面活性剂等。可以使用这些中的2种以上。
本发明的感光性树脂组合物中,根据需要,还可以含有溶解抑制剂、稳定剂、消泡剂等添加剂。
本发明的感光性树脂组合物的固体成分浓度没有特别限制,根据涂布方法等,可以使用任意的量的溶剂、溶质。例如,如后所述,通过旋涂进行膜形成的情况中,一般将固体成分浓度设为5重量份以上且50重量份以下。
针对本发明的感光性树脂组合物的代表性的制造方法,如下说明。
例如,将(C)多官能环氧化合物、(D)光聚合引发剂和其他添加剂添加至任意的溶剂中,搅拌从而使其溶解后,添加(A)含有烯属不饱和基团和羧基的光反应性树脂和(B)环氧化合物,进一步搅拌20分钟~3小时。过滤所得溶液,得到感光性树脂组合物。
针对使用本发明的感光性树脂组合物的固化膜的形成方法,举出例子进行说明。将本发明的感光性树脂组合物通过微凹版涂布、旋涂、浸涂、帘式流涂、辊涂、喷涂、狭缝涂布等公知的方法涂布于底部基板上,用加热板、烘箱等加热装置进行预烘烤。预烘烤在50~130℃的范围进行30秒~30分钟,预烘烤后的膜厚优选设为0.1~15μm。
预烘烤后,使用步进式光刻机、镜面投影掩模对准器(MPA)、平行光掩模对准器(PLA)等曝光机,进行曝光。曝光强度为10~4000J/m2左右(换算为波长为365nm的曝光量),且隔着或不隔着期望的掩模而照射该光。曝光光源没有限制,可以使用i射线、g射线、h射线等紫外线、KrF(波长为248nm)激光、ArF(波长为193nm)激光等。
接着,通过显影使曝光部溶解,可以得到负型的图案。作为显影方法,优选通过喷淋、浸渍、拍桨(paddling)等方法在显影液中浸渍5秒~10分钟。作为显影液,可以使用公知的碱显影液。作为具体例,可以举出包含碱金属的氢氧化物、碳酸盐、磷酸盐、硅酸盐、硼酸盐等无机碱、2-二乙基氨基乙醇、单乙醇胺、二乙醇胺等胺类、四甲基氢氧化铵、胆碱等季铵盐中的1种或者2种以上的水溶液等。显影后,优选用水进行润洗,接着,还可以在50~130℃的范围进行干燥烘烤。
其后,将该膜用加热板、烘箱等加热装置在80~150℃的范围加热15分钟~1小时左右。
由本发明的感光性树脂组合物得到的固化膜的膜厚没有特别限制,优选为0.1~15μm。此外,优选1.5μm的膜厚下透射率为85%以上。应予说明,透射率是指400nm的波长下的透射率。透射率可以通过选择曝光量、热固化温度而调整。
在基材上具备将本发明的感光性树脂组合物固化而得到的固化膜的层叠体可以用于触控面板用保护膜、各种硬涂材料、TFT用平坦化膜、彩色滤光片用外涂层、防反射膜、钝化膜等各种保护膜、以及滤光片、触控面板用绝缘膜、TFT用绝缘膜、彩色滤光片用光阻隔物(photo spacer)等。这些之中,从具有高耐药品性、基板密合性的观点出发,可以适合用作触控面板用绝缘膜。
进一步,将本发明的感光性树脂组合物固化而得到的固化膜对金属基材具有高密合性,因此适合用作金属配线保护膜。所保护的金属没有特别限制,可以举出例如铜、银、铝、铬、钼、钛、ITO、IZO(氧化铟锌)、AZO(添加了铝的氧化锌)、ZnO2等。
本发明的感光性树脂组合物可以在150℃以下的低温下固化,因此可以适合用于例如显示面板、膜等耐热温度低的基材。
实施例
以下,举出实施例,进一步具体说明本发明。本发明不限定于这些实施例。合成例和实施例中使用的化合物之中,针对使用简写的物质,解释如下。
PGMEA:丙二醇单甲基醚乙酸酯
PGME:丙二醇单甲基醚
MAM:钼/铝/钼层叠膜。
合成例1 (A-1)Cardo系树脂溶液(a-1)的合成
向500ml的烧瓶中,投入9,9-双(4-缩水甘油基氧基苯基)芴(大阪ガスケミカル公司制“PG-100(商品名)”)92.2g、丙烯酸14.4g、四丁基乙酸铵0.32g、2,6-二叔丁基邻苯二酚0.26g和PGMEA 110g,在120℃下搅拌9小时。接着,添加联苯四甲酸二酐34.8g和PGMEA 50g,进一步在120℃下搅拌5小时。其后,冷却至室温,添加PGMEA以使所得(A-1)Cardo系树脂溶液的固体成分浓度达到40wt%,以PGMEA溶液形式得到(A-1)Cardo系树脂溶液(a-1)。通过GPC法测定的聚苯乙烯换算的重均分子量为5700。
合成例2 (A-2)丙烯酸树脂溶液(a-2)的合成
向500ml的烧瓶中,投入2,2'-偶氮二(异丁腈) 3g、PGMEA 50g。其后,添加甲基丙烯酸30g、苯乙烯22.48g、甲基丙烯酸环己酯25.13g。将混合液在室温下搅拌片刻,将烧瓶内进行氮气置换后,在70℃下加热搅拌5小时。接着,向所得溶液中,添加甲基丙烯酸缩水甘油基酯15g、二甲基苯甲基胺1g、对甲氧基苯酚0.2g、PGMEA 100g,在90℃加热搅拌4小时。其后,冷却至室温,添加PGMEA以使所得(A-2)丙烯酸树脂溶液的固体成分浓度达到40wt%,以PGMEA溶液形式得到(A-2)丙烯酸树脂溶液(a-2)。通过GPC法测定的聚苯乙烯换算的重均分子量为13500。
合成例3 (A-1)Cardo系树脂溶液(a-3)的调配
含有烯属不饱和基团和羧基的(A-1)Cardo系树脂PGMEA溶液、即“WR-301(商品名)”(ADEKA公司制)是固体成分浓度为45wt%、固体成分酸值为100、通过GPC法测定的聚苯乙烯换算的重均分子量为5500的制品。称量“WR-301”100g,添加PGMEA 12.5g并搅拌。以这样的方式,得到固体成分浓度为40wt%的(A-1)Cardo系树脂溶液(a-3)。
比较合成例1 不含烯属不饱和键的丙烯酸树脂溶液(a-4)
向500ml的烧瓶中,投入2,2'-偶氮二(异丁腈) 3g、PGMEA 50g。其后,添加甲基丙烯酸20g、苯乙烯32.67g、甲基丙烯酸环己酯39.93g。将混合液在室温下搅拌片刻,将烧瓶内进行氮气置换后,在70℃下加热搅拌5小时。接着,添加对甲氧基苯酚0.2g、PGMEA 100g。其后,冷却至室温,添加PGMEA以使所得丙烯酸树脂溶液的固体成分浓度达到40wt%,以PGMEA溶液形式得到丙烯酸树脂溶液(a-4)。通过GPC法测定的聚苯乙烯换算的重均分子量为16500。
实施例中使用的(B)环氧化合物和(C)多官能环氧化合物如下所示。
[化10]
4HBAGE(商品名)(日本化成(株)制)
EA-1010N(商品名)((株)新中村化学制)
VG-3101L(商品名)((株)プリンテック制)
NC-3000(商品名)(日本化药(株)制)。
(1)图案加工性的评价
将感光性树脂组合物在硅晶片上使用旋涂机(ミカサ(株)制“1H-360S(商品名)”)以任意的转速进行旋涂,将基板使用加热板(大日本スクリーン制造(株)制“SCW-636(商品名)”)在100℃进行2分钟预烘烤,制作膜厚为2μm的膜。
其后,将所制作的膜使用平行光掩模对准器(キヤノン(株)制“PLA-501F(商品名)”),以超高压汞灯作为光源,隔着灵敏度测定用的灰阶掩模,以100μm的间隙进行曝光。其后,使用自动显影装置(泷泽产业(株)制“AD-2000(商品名)”),用0.045wt%氢氧化钾水溶液进行60秒喷淋显影,接着,用水进行30秒润洗。
曝光、显影后,将以1比1的宽度形成30μm的线和空间图案的曝光量(以下将其称为最佳曝光量)作为灵敏度,将最佳曝光量下的显影后的最小图案尺寸记作分辨率。
(2)粘接性的评价
将所制作的感光性树脂组合物使用旋涂机(ミカサ(株)制“1H-360S(商品名)”)以任意的转速旋涂于在表面溅射有ITO或MAM的玻璃基板(以下称为“ITO基板”或“MAM基板”)上,使用加热板(大日本スクリーン制造(株)制“SCW-636(商品名)”)在100℃下进行2分钟预烘烤,制作膜厚为2μm的膜。将所制作的膜使用平行光掩模对准器(キヤノン(株)制“PLA-501F(商品名)”),以超高压汞灯作为光源进行曝光,使用烘箱(エスペック(株)制“IHPS-222(商品名)”),在空气中、150℃下进行1小时固化,制作膜厚为1.5μm的固化膜。将以这样的方式得到的固化膜按照JIS“K5600-5-6(制定年月日=1999/04/20)”评价ITO或MAM与固化膜的粘接性。
在玻璃基板上的固化膜表面上,用切割刀以到达玻璃板的裸面的方式,以1mm间隔画出垂直的纵横各11根平行的直线,制作100个1mm×1mm的棋盘格。在经切割的固化膜表面上粘贴赛璐玢粘合胶带(宽度=18mm,粘合力=3.7N/10mm),用橡皮擦(JIS S6050合格品)擦拭并使其密合,抓持胶带的一端,通过目视评价与板保持为直角而瞬间剥离时的棋盘格的残留数。通过棋盘格的剥离面积,如下所述地进行判定,以4以上作为合格。
5:剥离面积=0%
4:剥离面积=<5%
3:剥离面积=5~14%
2:剥离面积=15~34%
1:剥离面积=35%~64%
0:剥离面积=65%~100%。
(3)耐药品性(N300耐性)的评价
在ITO基板或MAM基板上,以与前述(2)粘接性的评价中记载的方法相同的方式,制作膜厚为1.5μm的固化膜。在作为抗蚀剂剥离液的“N300(商品名)”(ナガセケムテックス(株)制)中,在规定的温度浸渍5分钟后,按照JIS“K5600-5-6(制定年月日=1999/04/20)”,评价ITO或MAM与固化膜的粘接性。棋盘格的剥离面积为5%以下时,判断为在该条件下具有耐药性。
条件1:40℃、5分钟
条件2:60℃、5分钟
条件3:80℃、5分钟。
基于耐药性没有问题的条件,如下所述地按照4阶段评价耐药性,以2以上作为合格。
3:条件1、2、3下均具有耐药性
2:条件1、2下具有耐药性
1:仅条件1下具有耐药性
0:任一条件下均不具有耐药性。
实施例1
在黄色灯下,使(D)光聚合引发剂1,2-辛二酮,1-[4-(苯硫基)-2-(O-苯甲酰基肟)](“イルガキュアOXE-01(商品名)”BASFジャパン(株)制)0.188g、4-叔丁基邻苯二酚(以下称为TBC)的PGMEA 1wt%溶液1.200g、(C)通式(2)所示的多官能环氧化合物“テクモアVG-3101L(商品名)”((株)プリンテック制,相当于化学式(5)的化合物)0.320g溶解于PGME9.600g、PGMEA 2.116g中,添加作为硅氧烷系表面活性剂的“BYK-333(商品名)”(ビックケミージャパン(株)制)的PGMEA 1wt%溶液0.4000g(相当于浓度200ppm),进行搅拌。向其中,添加二季戊四醇六丙烯酸酯(““カヤラッド(注册商标)”DPHA(商品名)”日本化药(株)制)1.200g、(B)通式(1)所示的环氧化合物丙烯酸4-羟基丁酯缩水甘油基醚(“4HBAGE(商品名)”日本化成(株)制)0.480g、(A-1)Cardo系树脂溶液(a-1)4.500g,进行搅拌。接着,用0.45μm的过滤器进行过滤,得到感光性树脂组合物(P-1)。针对所得感光性树脂组合物(P-1),实施上述(1)图案加工性的评价、(2)粘接性的评价、(3)耐药品性的评价,将结果记载于表2中。
实施例2
使用(A-2)丙烯酸树脂溶液(a-2)4.000g替代(A-1)Cardo系树脂溶液(a-1),使(B)通式(1)所示的环氧化合物“4HBAGE(商品名)”为0.400g,使(C)通式(2)所示的多官能环氧化合物“テクモアVG-3101L(商品名)”为0.600g,除此之外,以与实施例1相同的方式,得到感光性树脂组合物(P-2)。使用所得感光性树脂组合物(P-2),以与实施例1相同的方式,进行评价。
实施例3
使用(A-1)Cardo系树脂溶液(a-3)4.000g替代(A-1)Cardo系树脂溶液(a-1),使(B)通式(1)所示的环氧化合物“4HBAGE(商品名)”为0.800g,使(C)通式(2)所示的多官能环氧化合物“テクモアVG-3101L(商品名)”为0.200g,除此之外,以与实施例1相同的方式,得到感光性树脂组合物(P-3)。使用所得感光性树脂组合物(P-3),以与实施例1相同的方式,进行评价。
实施例4
使用双酚A单缩水甘油基醚单丙烯酸酯(“EA-1010N(商品名)”(株)新中村化学制)0.200g替代(B)通式(1)所示的环氧化合物“4HBAGE(商品名)”,使(C)通式(2)所示的多官能环氧化合物“テクモアVG-3101L(商品名)”为0.600g,除此之外,进行与实施例1相同的操作,得到感光性树脂组合物(P-4)。使用所得感光性树脂组合物(P-4),以与实施例1相同的方式,进行评价。
实施例5
使用前述的“EA-1010N(商品名)”替代(B)通式(1)所示的环氧化合物“4HBAGE(商品名)”,使(A-2)丙烯酸树脂溶液(a-2)为4.500g,使(C)通式(2)所示的多官能环氧化合物“テクモアVG-3101L(商品名)”为0.400g,除此之外,进行与实施例2相同的操作,得到感光性树脂组合物(P-5)。使用所得感光性树脂组合物(P-5),以与实施例1相同的方式,进行评价。
实施例6
使用“NC-3000(商品名)”(日本化药(株)制,相当于化学式(6)的化合物)替代(C)通式(2)所示的多官能环氧化合物“テクモアVG-3101L(商品名)”,除此之外,进行与实施例1相同的操作,得到感光性树脂组合物(P-6)。使用所得感光性树脂组合物(P-6),以与实施例1相同的方式,进行评价。
实施例7
进一步添加(E)含磷化合物磷酸三甲酯0.016g,除此之外,进行与实施例1相同的操作,得到感光性树脂组合物(P-7)。使用所得感光性树脂组合物(P-7),以与实施例1相同的方式,进行评价。
实施例8
使用磷酸二苯酯0.040g替代(E)含磷化合物磷酸三甲酯,除此之外,进行与实施例8相同的操作,得到感光性树脂组合物(P-8)。使用所得感光性树脂组合物(P-8),以与实施例1相同的方式,进行评价。
实施例9
进一步添加(E)含磷化合物磷酸三甲酯0.080g,除此之外,进行与实施例2相同的操作,得到感光性树脂组合物(P-9)。使用所得感光性树脂组合物(P-9),以与实施例1相同的方式,进行评价。
实施例10
按照以下的流程,制作触控面板用构件。
(1)透明电极(ITO膜)的制作
在厚度为约1mm的玻璃基板上使用溅射装置HSR-521A((株)島津制作所制),在RF功率为1.4kW、真空度为6.65×10-1Pa的条件下进行12.5分钟溅射,由此成膜为膜厚为150nm、且表面电阻为15Ω/□的ITO膜,涂布正型光致抗蚀剂(“OFPR-800”东京应化工业(株)制),在80℃下进行20分钟预烘烤,得到膜厚1.1μm的抗蚀剂膜。使用PLA,对所得膜将超高压汞灯隔着掩模进行图案曝光后,使用自动显影装置,用2.38wt%TMAH水溶液进行90秒喷淋显影,接着,用水进行30秒润洗。其后,在25℃的HCl/HNO3/H2O=18/4.5/77.5(重量比)混合溶液中浸渍80秒,由此蚀刻ITO膜,用40℃的剥离液“N-300(商品名)”进行120秒处理,由此去除光致抗蚀剂,制作具有膜厚为150nm的经图案加工的ITO膜(图1和图2的标记2)的玻璃基板(相当于图1的a)。
(2)绝缘膜的制作
在(1)中得到的玻璃基板(相当于图1的a)上,使用感光性树脂组合物(P-7),按照上述评价的方法的流程,制作绝缘膜(图1和图2的标记3)。
(3)配线电极(MAM配线)的制作
在(2)中得到的玻璃基板(相当于图1的b)上,作为靶材,使用钼和铝,作为蚀刻液,使用H3PO4/HNO3/CH3COOH/H2O=65/3/5/27(重量比)混合溶液,除此之外,通过与(1)ITO膜的制作相同的流程,制作MAM配线(图1和图2的标记4)。
(4)保护膜的制作
在(3)中得到的玻璃基板(相当于图1的c)上,使用感光性树脂组合物(P-7),按照上述评价的方法的流程,制作保护膜。使用检测仪,实施连接部的导通测试时,确认到电流的导通(相当于图2)。
比较例1
使用不含烯属不饱和键的丙烯酸树脂溶液(a-4)替代(A-1)Cardo系树脂溶液(a-1),除此之外,进行与实施例1相同的操作,得到感光性树脂组合物(P-10)。使用所得感光性树脂组合物(P-10),以与实施例1相同的方式,进行评价。
比较例2
不添加(B)通式(1)所示的环氧化合物“4HBAGE(商品名)”,除此之外,进行与实施例1相同的操作,得到感光性树脂组合物(P-11)。使用所得感光性树脂组合物(P-11),以与实施例1相同的方式,进行评价。
比较例3
不添加(C)通式(2)所示的多官能环氧化合物“テクモアVG-3101L(商品名)”,除此之外,进行与实施例1相同的操作,得到感光性树脂组合物(P-12)。使用所得感光性树脂组合物(P-12),以与实施例1相同的方式,进行评价。
比较例4
使用甲基丙烯酸缩水甘油基酯(以下称为GMA)替代(B)通式(1)所示的环氧化合物“4HBAGE(商品名)”,除此之外,进行与实施例1相同的操作,得到感光性树脂组合物(P-13)。使用所得感光性树脂组合物(P-13),以与实施例1相同的方式,进行评价。
比较例5
使用2官能环氧化合物“jER834(商品名)”(三菱化学(株)制,双酚A型环氧树脂)替代(C)通式(2)所示的多官能环氧化合物“テクモアVG-3101L(商品名)”,除此之外,进行与实施例1相同的操作,得到感光性树脂组合物(P-14)。使用所得感光性树脂组合物(P-14),以与实施例1相同的方式,进行评价。
比较例6
使用3-缩水甘油基氧基丙基三甲氧基硅烷(“KBM-403(商品名)”信越化学工业(株)制)替代(B)通式(1)所示的环氧化合物“4HBAGE(商品名)”,除此之外,进行与实施例1相同的操作,得到感光性树脂组合物(P-15)。使用所得感光性树脂组合物(P-15),以与实施例1相同的方式,进行评价。
[表1]
[表2]
工业实用性
将本发明的感光性树脂组合物固化而得到的固化膜除了适合用于触控面板的保护膜等各种硬涂膜之外,还适合用于触控传感器用绝缘膜、液晶、有机EL显示器的TFT用平坦化膜、金属配线保护膜、绝缘膜、防反射膜、防反射膜、滤光片、以及彩色滤光片用外涂层、柱材料等。
附图标记说明
a:透明电极形成后的顶视图
b:绝缘膜形成后的顶视图
c:配线电极形成后的顶视图
1:玻璃基板
2:透明电极
3:绝缘膜
4:配线电极
5:保护膜
Claims (12)
1.感光性树脂组合物,其包含下述(A)~(D),
(A)含有烯属不饱和基团和羧基的光反应性树脂
(B)下述通式(1)所示的环氧化合物
[化1]
式(1)中,X表示具有碳原子数为4~10的烯化氧的基团、或源自双酚类的基团,R1表示氢原子或甲基;
(C)下述通式(2)所示的多官能环氧化合物
[化2]
式(2)中,连接基团Y表示碳原子数为1~15的烃基,R2和R3各自独立地表示氢原子或碳原子数为1~6的烃基;n表示3或4的整数;
(D)光聚合引发剂。
2.根据权利要求1所述的感光性树脂组合物,其特征在于,(A)是具有2个以上的下述通式(3)所示的结构作为重复单元、且含有烯属不饱和基团和羧基的Cardo系树脂,
[化3]
。
3.根据权利要求1或2所述的感光性树脂组合物,其特征在于,通式(2)中,连接基团Y为下式所示的结构,
[化4]
式中,*号表示连接部位。
4.根据权利要求1~3中任一项所述的感光性树脂组合物,其还包含(E)含磷化合物。
5.根据权利要求4所述的感光性树脂组合物,其特征在于,(E)含磷化合物为下述通式(4)所示的化合物,
[化5]
式中,R4~R6各自独立地表示氢原子或碳原子数为1~6的烃基。
6.固化膜,其是使权利要求1~5中任一项所述的感光性树脂组合物固化而成的。
7.层叠体,其在基材上具备权利要求6所述的固化膜。
8.根据权利要求7所述的层叠体,其中,所述基材是具有金属配线的基材,所述金属配线含有选自钼、钛、铬中的至少1种金属。
9.根据权利要求7或8所述的层叠体,其中,所述基材为显示面板。
10.触控面板用构件,其具备权利要求7~9中任一项所述的层叠体。
11.根据权利要求10所述的触控面板用构件,其中,所述层叠体中的固化膜为层间绝缘膜。
12.固化膜的制造方法,其按顺序包括:将权利要求1~5所述的感光性树脂组合物涂布于基材上的步骤、和在80~150℃下加热的步骤。
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003233166A (ja) * | 2002-02-07 | 2003-08-22 | Konica Corp | 感光性平版印刷版材料及び感光性平版印刷版材料の製造方法 |
CN102131883A (zh) * | 2008-08-27 | 2011-07-20 | 日立化成工业株式会社 | 感光性粘接剂组合物、以及使用该组合物的膜状粘接剂、粘接片、粘接剂图形、带有粘接剂层的半导体晶片和半导体装置 |
CN102361896A (zh) * | 2009-03-23 | 2012-02-22 | 巴斯夫欧洲公司 | 光致抗蚀剂组合物 |
JP2013076821A (ja) * | 2011-09-30 | 2013-04-25 | Toray Ind Inc | ネガ型感光性樹脂組成物およびそれを用いた保護膜およびタッチパネル部材 |
WO2015068703A1 (ja) * | 2013-11-05 | 2015-05-14 | 太陽インキ製造株式会社 | 硬化型組成物、これを用いた硬化塗膜及びプリント配線板 |
CN104968688A (zh) * | 2013-02-05 | 2015-10-07 | Dnp精细化工股份有限公司 | 能量射线固化性树脂组合物 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101267289B1 (ko) * | 2008-08-08 | 2013-05-24 | 쇼와 덴코 가부시키가이샤 | 에폭시기 함유 공중합체, 이것을 사용한 에폭시(메타)아크릴레이트 공중합체, 및 그것들의 제조 방법 |
JP5830830B2 (ja) * | 2009-03-19 | 2015-12-09 | 日立化成株式会社 | 感光性接着剤組成物、それを用いたフィルム状接着剤、接着シート、接着剤層付半導体ウェハ、半導体装置、感光性接着剤組成物及びフィルム状接着剤の製造方法、並びに接着剤パターンの形成方法 |
CN103797418B (zh) | 2011-06-24 | 2017-06-13 | 东京应化工业株式会社 | 一种负型感光性树脂组合物、图案形成方法、固化膜、绝缘膜、滤色器及显示装置 |
KR101349622B1 (ko) * | 2011-08-26 | 2014-01-10 | 롬엔드하스전자재료코리아유한회사 | 광중합성 불포화 수지, 이를 포함하는 감광성 수지 조성물 및 이로부터 형성되는 차광성 스페이서와 액정 디스플레이 장치 |
JP5945296B2 (ja) * | 2013-05-28 | 2016-07-05 | 東友ファインケム株式会社Dongwoo Fine−Chem Co., Ltd. | スペーサ形成用感光性樹脂組成物及びこれから製造されたスペーサ |
TWI501032B (zh) * | 2013-08-30 | 2015-09-21 | Hitachi Chemical Co Ltd | 光波導形成用樹脂組成物、光波導形成用樹脂膜及使用它們的光波導 |
CN105518499A (zh) * | 2013-08-30 | 2016-04-20 | 日立化成株式会社 | 光波导形成用树脂组合物、光波导形成用树脂膜和使用它们的光波导 |
JP6538328B2 (ja) | 2013-11-05 | 2019-07-03 | 太陽インキ製造株式会社 | 硬化型組成物、これを用いた硬化塗膜及びプリント配線板 |
US9784965B2 (en) | 2014-03-04 | 2017-10-10 | Jsr Corporation | Display element, photosensitive composition and electrowetting display |
-
2016
- 2016-12-16 KR KR1020187015123A patent/KR102507584B1/ko active IP Right Grant
- 2016-12-16 CN CN201680075153.XA patent/CN108369376B/zh active Active
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003233166A (ja) * | 2002-02-07 | 2003-08-22 | Konica Corp | 感光性平版印刷版材料及び感光性平版印刷版材料の製造方法 |
CN102131883A (zh) * | 2008-08-27 | 2011-07-20 | 日立化成工业株式会社 | 感光性粘接剂组合物、以及使用该组合物的膜状粘接剂、粘接片、粘接剂图形、带有粘接剂层的半导体晶片和半导体装置 |
CN102361896A (zh) * | 2009-03-23 | 2012-02-22 | 巴斯夫欧洲公司 | 光致抗蚀剂组合物 |
JP2013076821A (ja) * | 2011-09-30 | 2013-04-25 | Toray Ind Inc | ネガ型感光性樹脂組成物およびそれを用いた保護膜およびタッチパネル部材 |
CN104968688A (zh) * | 2013-02-05 | 2015-10-07 | Dnp精细化工股份有限公司 | 能量射线固化性树脂组合物 |
WO2015068703A1 (ja) * | 2013-11-05 | 2015-05-14 | 太陽インキ製造株式会社 | 硬化型組成物、これを用いた硬化塗膜及びプリント配線板 |
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