CN108364898B - 基板搬送装置、检测位置校正方法及基板处理装置 - Google Patents

基板搬送装置、检测位置校正方法及基板处理装置 Download PDF

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CN108364898B
CN108364898B CN201711473933.2A CN201711473933A CN108364898B CN 108364898 B CN108364898 B CN 108364898B CN 201711473933 A CN201711473933 A CN 201711473933A CN 108364898 B CN108364898 B CN 108364898B
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substrate
detectors
unit
holding
detection
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CN108364898A (zh
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桑原丈二
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Screen Holdings Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
CN201711473933.2A 2017-01-27 2017-12-29 基板搬送装置、检测位置校正方法及基板处理装置 Active CN108364898B (zh)

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Application Number Priority Date Filing Date Title
JP2017012830A JP6842934B2 (ja) 2017-01-27 2017-01-27 基板搬送装置、検出位置較正方法および基板処理装置
JP2017-012830 2017-01-27

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CN108364898A CN108364898A (zh) 2018-08-03
CN108364898B true CN108364898B (zh) 2022-02-01

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US (1) US10395968B2 (https=)
JP (1) JP6842934B2 (https=)
KR (1) KR102045127B1 (https=)
CN (1) CN108364898B (https=)
TW (1) TWI679720B (https=)

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JP7008609B2 (ja) * 2018-10-18 2022-01-25 東京エレクトロン株式会社 基板処理装置、及び搬送位置補正方法
US10974388B2 (en) * 2018-12-27 2021-04-13 Kawasaki Jukogyo Kabushiki Kaisha Method of correcting position of robot and robot
JP7107249B2 (ja) * 2019-02-26 2022-07-27 株式会社ダイフク 物品移載装置
JP7303648B2 (ja) * 2019-03-20 2023-07-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理装置における対象物の搬送方法
CN109924994B (zh) * 2019-04-02 2023-03-14 晓智未来(成都)科技有限公司 一种x光拍摄过程中的检测位置自动校准方法及系统
JP2021089963A (ja) * 2019-12-04 2021-06-10 キヤノン株式会社 搬送装置、露光装置及び物品の製造方法
KR102818927B1 (ko) * 2020-01-17 2025-06-11 주성엔지니어링(주) 기판 이송 방법 및 기판 이송 장치
TWI821679B (zh) * 2020-08-25 2023-11-11 南韓商杰宜斯科技有限公司 基板處理裝置及基板處理方法
JP7579657B2 (ja) * 2020-09-07 2024-11-08 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および基板搬送方法
JP7562377B2 (ja) * 2020-11-09 2024-10-07 ニデックインスツルメンツ株式会社 産業用ロボットの教示方法
JP7797104B2 (ja) 2021-01-12 2026-01-13 東京エレクトロン株式会社 基板搬送装置、基板搬送方法、および基板処理システム
JP7216752B2 (ja) * 2021-02-08 2023-02-01 キヤノントッキ株式会社 計測装置、インライン型蒸着装置および調整方法
KR102933167B1 (ko) * 2021-03-02 2026-03-03 (주)테크윙 전자부품 테스트 핸들러
CN115132632B (zh) * 2021-03-26 2025-03-11 深圳中科飞测科技股份有限公司 控制方法和检测装置
CN115763337B (zh) * 2023-01-10 2023-06-02 拉普拉斯(无锡)半导体科技有限公司 一种净化台放置舟的方法及其净化台
JP2024135250A (ja) * 2023-03-22 2024-10-04 東京エレクトロン株式会社 位置検出方法及び基板処理装置
CN119480659A (zh) * 2023-08-08 2025-02-18 盛美半导体设备(上海)股份有限公司 位置检测装置、半导体设备及检测基板偏移量的方法
TWI876761B (zh) * 2023-12-13 2025-03-11 日商Ｊｅｌ股份有限公司 搬送裝置及搬送裝置之控制方法
JP2026055365A (ja) * 2024-09-18 2026-03-31 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および位置教示方法

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CN101537617A (zh) * 2007-08-30 2009-09-23 应用材料公司 利用校准装置的机械手校准的方法和设备
CN101552219B (zh) * 2008-04-03 2012-12-05 Asm日本公司 具有晶片对准装置的晶片处理设备
CN102046338A (zh) * 2008-05-27 2011-05-04 日商乐华股份有限公司 输送装置、位置示教方法以及传感器夹具
CN101640181A (zh) * 2008-07-31 2010-02-03 佳能安内华股份有限公司 基底对准设备和基底处理设备
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WO2013172184A1 (ja) * 2012-05-18 2013-11-21 東京応化工業株式会社 重ね合わせ装置および重ね合わせ方法
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TW201614761A (en) * 2014-07-18 2016-04-16 Screen Holdings Co Ltd Substrate processing apparatus and substrate processing method
CN106340479A (zh) * 2015-07-07 2017-01-18 东京毅力科创株式会社 基板输送方法和基板处理装置

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Publication number Publication date
KR20180088576A (ko) 2018-08-06
US10395968B2 (en) 2019-08-27
TWI679720B (zh) 2019-12-11
CN108364898A (zh) 2018-08-03
US20180218935A1 (en) 2018-08-02
KR102045127B1 (ko) 2019-11-14
JP6842934B2 (ja) 2021-03-17
TW201828391A (zh) 2018-08-01
JP2018121007A (ja) 2018-08-02

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