TWI679720B - 基板搬送裝置、檢測位置校正方法及基板處理裝置 - Google Patents

基板搬送裝置、檢測位置校正方法及基板處理裝置 Download PDF

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Publication number
TWI679720B
TWI679720B TW106142495A TW106142495A TWI679720B TW I679720 B TWI679720 B TW I679720B TW 106142495 A TW106142495 A TW 106142495A TW 106142495 A TW106142495 A TW 106142495A TW I679720 B TWI679720 B TW I679720B
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TW
Taiwan
Prior art keywords
substrate
detectors
offset
unit
holding
Prior art date
Application number
TW106142495A
Other languages
English (en)
Chinese (zh)
Other versions
TW201828391A (zh
Inventor
桒原丈二
Joji Kuwahara
Original Assignee
日商斯庫林集團股份有限公司
SCREEN Holdings Co., Ltd.
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Publication date
Application filed by 日商斯庫林集團股份有限公司, SCREEN Holdings Co., Ltd. filed Critical 日商斯庫林集團股份有限公司
Publication of TW201828391A publication Critical patent/TW201828391A/zh
Application granted granted Critical
Publication of TWI679720B publication Critical patent/TWI679720B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
TW106142495A 2017-01-27 2017-12-05 基板搬送裝置、檢測位置校正方法及基板處理裝置 TWI679720B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017012830A JP6842934B2 (ja) 2017-01-27 2017-01-27 基板搬送装置、検出位置較正方法および基板処理装置
JP2017-012830 2017-01-27

Publications (2)

Publication Number Publication Date
TW201828391A TW201828391A (zh) 2018-08-01
TWI679720B true TWI679720B (zh) 2019-12-11

Family

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Family Applications (1)

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TW106142495A TWI679720B (zh) 2017-01-27 2017-12-05 基板搬送裝置、檢測位置校正方法及基板處理裝置

Country Status (5)

Country Link
US (1) US10395968B2 (https=)
JP (1) JP6842934B2 (https=)
KR (1) KR102045127B1 (https=)
CN (1) CN108364898B (https=)
TW (1) TWI679720B (https=)

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JP7008609B2 (ja) * 2018-10-18 2022-01-25 東京エレクトロン株式会社 基板処理装置、及び搬送位置補正方法
US10974388B2 (en) * 2018-12-27 2021-04-13 Kawasaki Jukogyo Kabushiki Kaisha Method of correcting position of robot and robot
JP7107249B2 (ja) * 2019-02-26 2022-07-27 株式会社ダイフク 物品移載装置
JP7303648B2 (ja) * 2019-03-20 2023-07-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理装置における対象物の搬送方法
CN109924994B (zh) * 2019-04-02 2023-03-14 晓智未来(成都)科技有限公司 一种x光拍摄过程中的检测位置自动校准方法及系统
JP2021089963A (ja) * 2019-12-04 2021-06-10 キヤノン株式会社 搬送装置、露光装置及び物品の製造方法
KR102818927B1 (ko) * 2020-01-17 2025-06-11 주성엔지니어링(주) 기판 이송 방법 및 기판 이송 장치
TWI821679B (zh) * 2020-08-25 2023-11-11 南韓商杰宜斯科技有限公司 基板處理裝置及基板處理方法
JP7579657B2 (ja) * 2020-09-07 2024-11-08 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および基板搬送方法
JP7562377B2 (ja) * 2020-11-09 2024-10-07 ニデックインスツルメンツ株式会社 産業用ロボットの教示方法
JP7797104B2 (ja) 2021-01-12 2026-01-13 東京エレクトロン株式会社 基板搬送装置、基板搬送方法、および基板処理システム
JP7216752B2 (ja) * 2021-02-08 2023-02-01 キヤノントッキ株式会社 計測装置、インライン型蒸着装置および調整方法
KR102933167B1 (ko) * 2021-03-02 2026-03-03 (주)테크윙 전자부품 테스트 핸들러
CN115132632B (zh) * 2021-03-26 2025-03-11 深圳中科飞测科技股份有限公司 控制方法和检测装置
CN115763337B (zh) * 2023-01-10 2023-06-02 拉普拉斯(无锡)半导体科技有限公司 一种净化台放置舟的方法及其净化台
JP2024135250A (ja) * 2023-03-22 2024-10-04 東京エレクトロン株式会社 位置検出方法及び基板処理装置
CN119480659A (zh) * 2023-08-08 2025-02-18 盛美半导体设备(上海)股份有限公司 位置检测装置、半导体设备及检测基板偏移量的方法
TWI876761B (zh) * 2023-12-13 2025-03-11 日商Ｊｅｌ股份有限公司 搬送裝置及搬送裝置之控制方法
JP2026055365A (ja) * 2024-09-18 2026-03-31 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および位置教示方法

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Also Published As

Publication number Publication date
KR20180088576A (ko) 2018-08-06
CN108364898B (zh) 2022-02-01
US10395968B2 (en) 2019-08-27
CN108364898A (zh) 2018-08-03
US20180218935A1 (en) 2018-08-02
KR102045127B1 (ko) 2019-11-14
JP6842934B2 (ja) 2021-03-17
TW201828391A (zh) 2018-08-01
JP2018121007A (ja) 2018-08-02

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