JP6842934B2 - 基板搬送装置、検出位置較正方法および基板処理装置 - Google Patents

基板搬送装置、検出位置較正方法および基板処理装置 Download PDF

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JP6842934B2
JP6842934B2 JP2017012830A JP2017012830A JP6842934B2 JP 6842934 B2 JP6842934 B2 JP 6842934B2 JP 2017012830 A JP2017012830 A JP 2017012830A JP 2017012830 A JP2017012830 A JP 2017012830A JP 6842934 B2 JP6842934 B2 JP 6842934B2
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substrate
unit
detectors
holding
detection
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Japanese (ja)
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JP2018121007A5 (https=
JP2018121007A (ja
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丈二 ▲桑▼原
丈二 ▲桑▼原
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Priority to JP2017012830A priority Critical patent/JP6842934B2/ja
Priority to TW106142495A priority patent/TWI679720B/zh
Priority to US15/843,279 priority patent/US10395968B2/en
Priority to KR1020170182302A priority patent/KR102045127B1/ko
Priority to CN201711473933.2A priority patent/CN108364898B/zh
Publication of JP2018121007A publication Critical patent/JP2018121007A/ja
Publication of JP2018121007A5 publication Critical patent/JP2018121007A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
JP2017012830A 2017-01-27 2017-01-27 基板搬送装置、検出位置較正方法および基板処理装置 Active JP6842934B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017012830A JP6842934B2 (ja) 2017-01-27 2017-01-27 基板搬送装置、検出位置較正方法および基板処理装置
TW106142495A TWI679720B (zh) 2017-01-27 2017-12-05 基板搬送裝置、檢測位置校正方法及基板處理裝置
US15/843,279 US10395968B2 (en) 2017-01-27 2017-12-15 Substrate transport device, detection position calibration method and substrate processing apparatus
KR1020170182302A KR102045127B1 (ko) 2017-01-27 2017-12-28 기판 반송 장치, 검출 위치 교정 방법 및 기판 처리 장치
CN201711473933.2A CN108364898B (zh) 2017-01-27 2017-12-29 基板搬送装置、检测位置校正方法及基板处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017012830A JP6842934B2 (ja) 2017-01-27 2017-01-27 基板搬送装置、検出位置較正方法および基板処理装置

Publications (3)

Publication Number Publication Date
JP2018121007A JP2018121007A (ja) 2018-08-02
JP2018121007A5 JP2018121007A5 (https=) 2019-11-21
JP6842934B2 true JP6842934B2 (ja) 2021-03-17

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Country Link
US (1) US10395968B2 (https=)
JP (1) JP6842934B2 (https=)
KR (1) KR102045127B1 (https=)
CN (1) CN108364898B (https=)
TW (1) TWI679720B (https=)

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JP7008609B2 (ja) * 2018-10-18 2022-01-25 東京エレクトロン株式会社 基板処理装置、及び搬送位置補正方法
US10974388B2 (en) * 2018-12-27 2021-04-13 Kawasaki Jukogyo Kabushiki Kaisha Method of correcting position of robot and robot
JP7107249B2 (ja) * 2019-02-26 2022-07-27 株式会社ダイフク 物品移載装置
JP7303648B2 (ja) * 2019-03-20 2023-07-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理装置における対象物の搬送方法
CN109924994B (zh) * 2019-04-02 2023-03-14 晓智未来(成都)科技有限公司 一种x光拍摄过程中的检测位置自动校准方法及系统
JP2021089963A (ja) * 2019-12-04 2021-06-10 キヤノン株式会社 搬送装置、露光装置及び物品の製造方法
KR102818927B1 (ko) * 2020-01-17 2025-06-11 주성엔지니어링(주) 기판 이송 방법 및 기판 이송 장치
TWI821679B (zh) * 2020-08-25 2023-11-11 南韓商杰宜斯科技有限公司 基板處理裝置及基板處理方法
JP7579657B2 (ja) * 2020-09-07 2024-11-08 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および基板搬送方法
JP7562377B2 (ja) * 2020-11-09 2024-10-07 ニデックインスツルメンツ株式会社 産業用ロボットの教示方法
JP7797104B2 (ja) 2021-01-12 2026-01-13 東京エレクトロン株式会社 基板搬送装置、基板搬送方法、および基板処理システム
JP7216752B2 (ja) * 2021-02-08 2023-02-01 キヤノントッキ株式会社 計測装置、インライン型蒸着装置および調整方法
KR102933167B1 (ko) * 2021-03-02 2026-03-03 (주)테크윙 전자부품 테스트 핸들러
CN115132632B (zh) * 2021-03-26 2025-03-11 深圳中科飞测科技股份有限公司 控制方法和检测装置
CN115763337B (zh) * 2023-01-10 2023-06-02 拉普拉斯(无锡)半导体科技有限公司 一种净化台放置舟的方法及其净化台
JP2024135250A (ja) * 2023-03-22 2024-10-04 東京エレクトロン株式会社 位置検出方法及び基板処理装置
CN119480659A (zh) * 2023-08-08 2025-02-18 盛美半导体设备(上海)股份有限公司 位置检测装置、半导体设备及检测基板偏移量的方法
TWI876761B (zh) * 2023-12-13 2025-03-11 日商Ｊｅｌ股份有限公司 搬送裝置及搬送裝置之控制方法
JP2026055365A (ja) * 2024-09-18 2026-03-31 株式会社Ｓｃｒｅｅｎホールディングス 基板搬送装置および位置教示方法

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Also Published As

Publication number Publication date
KR20180088576A (ko) 2018-08-06
CN108364898B (zh) 2022-02-01
US10395968B2 (en) 2019-08-27
TWI679720B (zh) 2019-12-11
CN108364898A (zh) 2018-08-03
US20180218935A1 (en) 2018-08-02
KR102045127B1 (ko) 2019-11-14
TW201828391A (zh) 2018-08-01
JP2018121007A (ja) 2018-08-02

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