CN108029196B - 数据修正装置、描绘装置、配线图案形成系统、检查装置、数据修正方法及配线基板的制造方法 - Google Patents

数据修正装置、描绘装置、配线图案形成系统、检查装置、数据修正方法及配线基板的制造方法 Download PDF

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Publication number
CN108029196B
CN108029196B CN201680055055.XA CN201680055055A CN108029196B CN 108029196 B CN108029196 B CN 108029196B CN 201680055055 A CN201680055055 A CN 201680055055A CN 108029196 B CN108029196 B CN 108029196B
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CN
China
Prior art keywords
mask
pattern
substrate
gap width
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201680055055.XA
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English (en)
Chinese (zh)
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CN108029196A (zh
Inventor
小松崎孝雄
山本哲平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Linkus Technology Co ltd
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Hitachi Chemical Co Ltd
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Publication of CN108029196A publication Critical patent/CN108029196A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/80—Etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN201680055055.XA 2015-09-25 2016-07-20 数据修正装置、描绘装置、配线图案形成系统、检查装置、数据修正方法及配线基板的制造方法 Expired - Fee Related CN108029196B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-187980 2015-09-25
JP2015187980A JP6663672B2 (ja) 2015-09-25 2015-09-25 データ補正装置、描画装置、配線パターン形成システム、検査装置、データ補正方法および配線基板の製造方法
PCT/JP2016/071306 WO2017051599A1 (ja) 2015-09-25 2016-07-20 データ補正装置、描画装置、配線パターン形成システム、検査装置、データ補正方法および配線基板の製造方法

Publications (2)

Publication Number Publication Date
CN108029196A CN108029196A (zh) 2018-05-11
CN108029196B true CN108029196B (zh) 2020-07-28

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CN201680055055.XA Expired - Fee Related CN108029196B (zh) 2015-09-25 2016-07-20 数据修正装置、描绘装置、配线图案形成系统、检查装置、数据修正方法及配线基板的制造方法

Country Status (5)

Country Link
JP (1) JP6663672B2 (enExample)
KR (1) KR102082583B1 (enExample)
CN (1) CN108029196B (enExample)
TW (1) TWI617934B (enExample)
WO (1) WO2017051599A1 (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1535104A (zh) * 2002-12-26 2004-10-06 株式会社东芝 印刷布线板制造装置以及印刷布线板制造方法
JP2005116942A (ja) * 2003-10-10 2005-04-28 Fuji Photo Film Co Ltd 製造支援システムおよびプログラム

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07302824A (ja) * 1994-05-09 1995-11-14 Sony Corp パターン層の位置測定方法並びにテストパターン層及びその形成方法
JP3883706B2 (ja) * 1998-07-31 2007-02-21 シャープ株式会社 エッチング方法、及び薄膜トランジスタマトリックス基板の製造方法
US6768958B2 (en) * 2002-11-26 2004-07-27 Lsi Logic Corporation Automatic calibration of a masking process simulator
US7577932B2 (en) * 2006-02-17 2009-08-18 Jean-Marie Brunet Gate modeling for semiconductor fabrication process effects
KR101678070B1 (ko) * 2009-12-24 2016-11-22 삼성전자 주식회사 마스크리스 노광장치 및 그 제어방법
JP5503992B2 (ja) * 2010-02-08 2014-05-28 株式会社オーク製作所 露光装置
JP6491974B2 (ja) * 2015-07-17 2019-03-27 日立化成株式会社 露光データ補正装置、配線パターン形成システム、及び配線基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1535104A (zh) * 2002-12-26 2004-10-06 株式会社东芝 印刷布线板制造装置以及印刷布线板制造方法
JP2005116942A (ja) * 2003-10-10 2005-04-28 Fuji Photo Film Co Ltd 製造支援システムおよびプログラム

Also Published As

Publication number Publication date
CN108029196A (zh) 2018-05-11
WO2017051599A1 (ja) 2017-03-30
TWI617934B (zh) 2018-03-11
KR20180031776A (ko) 2018-03-28
TW201717076A (zh) 2017-05-16
JP2017063131A (ja) 2017-03-30
KR102082583B1 (ko) 2020-02-27
JP6663672B2 (ja) 2020-03-13

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Effective date of registration: 20220218

Address after: Kyoto Japan

Patentee after: SCREEN HOLDINGS Co.,Ltd.

Patentee after: Linkus Technology Co.,Ltd.

Address before: Kyoto Japan

Patentee before: SCREEN HOLDINGS Co.,Ltd.

Patentee before: HITACHI CHEMICAL Co.,Ltd.

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