JP6663672B2 - データ補正装置、描画装置、配線パターン形成システム、検査装置、データ補正方法および配線基板の製造方法 - Google Patents

データ補正装置、描画装置、配線パターン形成システム、検査装置、データ補正方法および配線基板の製造方法 Download PDF

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Publication number
JP6663672B2
JP6663672B2 JP2015187980A JP2015187980A JP6663672B2 JP 6663672 B2 JP6663672 B2 JP 6663672B2 JP 2015187980 A JP2015187980 A JP 2015187980A JP 2015187980 A JP2015187980 A JP 2015187980A JP 6663672 B2 JP6663672 B2 JP 6663672B2
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JP
Japan
Prior art keywords
mask
pattern
substrate
gap
gap width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2015187980A
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English (en)
Japanese (ja)
Other versions
JP2017063131A5 (enExample
JP2017063131A (ja
Inventor
孝雄 小松崎
孝雄 小松崎
哲平 山本
哲平 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Resonac Corp
Original Assignee
Screen Holdings Co Ltd
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd, Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Screen Holdings Co Ltd
Priority to JP2015187980A priority Critical patent/JP6663672B2/ja
Priority to PCT/JP2016/071306 priority patent/WO2017051599A1/ja
Priority to KR1020187006007A priority patent/KR102082583B1/ko
Priority to CN201680055055.XA priority patent/CN108029196B/zh
Priority to TW105123797A priority patent/TWI617934B/zh
Publication of JP2017063131A publication Critical patent/JP2017063131A/ja
Publication of JP2017063131A5 publication Critical patent/JP2017063131A5/ja
Application granted granted Critical
Publication of JP6663672B2 publication Critical patent/JP6663672B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/80—Etching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2015187980A 2015-09-25 2015-09-25 データ補正装置、描画装置、配線パターン形成システム、検査装置、データ補正方法および配線基板の製造方法 Expired - Fee Related JP6663672B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2015187980A JP6663672B2 (ja) 2015-09-25 2015-09-25 データ補正装置、描画装置、配線パターン形成システム、検査装置、データ補正方法および配線基板の製造方法
PCT/JP2016/071306 WO2017051599A1 (ja) 2015-09-25 2016-07-20 データ補正装置、描画装置、配線パターン形成システム、検査装置、データ補正方法および配線基板の製造方法
KR1020187006007A KR102082583B1 (ko) 2015-09-25 2016-07-20 데이터 보정 장치, 묘화 장치, 배선 패턴 형성 시스템, 검사 장치, 데이터 보정 방법 및 배선 기판의 제조 방법
CN201680055055.XA CN108029196B (zh) 2015-09-25 2016-07-20 数据修正装置、描绘装置、配线图案形成系统、检查装置、数据修正方法及配线基板的制造方法
TW105123797A TWI617934B (zh) 2015-09-25 2016-07-27 資料修正裝置、描繪裝置、配線圖案形成系統、檢查裝置、資料修正方法及配線基板之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015187980A JP6663672B2 (ja) 2015-09-25 2015-09-25 データ補正装置、描画装置、配線パターン形成システム、検査装置、データ補正方法および配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2017063131A JP2017063131A (ja) 2017-03-30
JP2017063131A5 JP2017063131A5 (enExample) 2018-08-09
JP6663672B2 true JP6663672B2 (ja) 2020-03-13

Family

ID=58385958

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015187980A Expired - Fee Related JP6663672B2 (ja) 2015-09-25 2015-09-25 データ補正装置、描画装置、配線パターン形成システム、検査装置、データ補正方法および配線基板の製造方法

Country Status (5)

Country Link
JP (1) JP6663672B2 (enExample)
KR (1) KR102082583B1 (enExample)
CN (1) CN108029196B (enExample)
TW (1) TWI617934B (enExample)
WO (1) WO2017051599A1 (enExample)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07302824A (ja) * 1994-05-09 1995-11-14 Sony Corp パターン層の位置測定方法並びにテストパターン層及びその形成方法
JP3883706B2 (ja) * 1998-07-31 2007-02-21 シャープ株式会社 エッチング方法、及び薄膜トランジスタマトリックス基板の製造方法
US6768958B2 (en) * 2002-11-26 2004-07-27 Lsi Logic Corporation Automatic calibration of a masking process simulator
JP2004207611A (ja) * 2002-12-26 2004-07-22 Toshiba Corp プリント配線板製造装置およびプリント配線板製造方法エッチング装置
JP2005116942A (ja) * 2003-10-10 2005-04-28 Fuji Photo Film Co Ltd 製造支援システムおよびプログラム
US7577932B2 (en) * 2006-02-17 2009-08-18 Jean-Marie Brunet Gate modeling for semiconductor fabrication process effects
KR101678070B1 (ko) * 2009-12-24 2016-11-22 삼성전자 주식회사 마스크리스 노광장치 및 그 제어방법
JP5503992B2 (ja) * 2010-02-08 2014-05-28 株式会社オーク製作所 露光装置
JP6491974B2 (ja) * 2015-07-17 2019-03-27 日立化成株式会社 露光データ補正装置、配線パターン形成システム、及び配線基板の製造方法

Also Published As

Publication number Publication date
CN108029196A (zh) 2018-05-11
WO2017051599A1 (ja) 2017-03-30
TWI617934B (zh) 2018-03-11
KR20180031776A (ko) 2018-03-28
TW201717076A (zh) 2017-05-16
JP2017063131A (ja) 2017-03-30
KR102082583B1 (ko) 2020-02-27
CN108029196B (zh) 2020-07-28

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