CN108028243B - 使用空腔结构的晶片级封装(wlp)球型支撑 - Google Patents

使用空腔结构的晶片级封装(wlp)球型支撑 Download PDF

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Publication number
CN108028243B
CN108028243B CN201680053950.8A CN201680053950A CN108028243B CN 108028243 B CN108028243 B CN 108028243B CN 201680053950 A CN201680053950 A CN 201680053950A CN 108028243 B CN108028243 B CN 108028243B
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China
Prior art keywords
dielectric layer
cavities
conductive pads
adhesive
conductors
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CN201680053950.8A
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English (en)
Chinese (zh)
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CN108028243A (zh
Inventor
M·F·维纶茨
D·F·伯蒂
C·H·尹
J·金
C·左
D·D·金
J-H·J·兰
N·S·慕达卡特
R·P·米库尔卡
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Qualcomm Inc
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Qualcomm Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/07—Structure, shape, material or disposition of the bonding areas after the connecting process
    • H01L24/09—Structure, shape, material or disposition of the bonding areas after the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/07—Structure, shape, material or disposition of the bonding areas after the connecting process
    • H01L2224/09—Structure, shape, material or disposition of the bonding areas after the connecting process of a plurality of bonding areas
    • H01L2224/0905—Shape

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
CN201680053950.8A 2015-09-20 2016-09-20 使用空腔结构的晶片级封装(wlp)球型支撑 Active CN108028243B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/859,323 2015-09-20
US14/859,323 US10074625B2 (en) 2015-09-20 2015-09-20 Wafer level package (WLP) ball support using cavity structure
PCT/US2016/052631 WO2017049324A1 (en) 2015-09-20 2016-09-20 Wafer level package (wlp) ball support using cavity structure

Publications (2)

Publication Number Publication Date
CN108028243A CN108028243A (zh) 2018-05-11
CN108028243B true CN108028243B (zh) 2021-05-14

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680053950.8A Active CN108028243B (zh) 2015-09-20 2016-09-20 使用空腔结构的晶片级封装(wlp)球型支撑

Country Status (8)

Country Link
US (1) US10074625B2 (enExample)
EP (1) EP3350831A1 (enExample)
JP (1) JP6549790B2 (enExample)
KR (1) KR102006115B1 (enExample)
CN (1) CN108028243B (enExample)
BR (1) BR112018005532B1 (enExample)
CA (1) CA2995621A1 (enExample)
WO (1) WO2017049324A1 (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100319974A1 (en) * 2008-02-19 2010-12-23 Naomi Ishizuka Printed wiring board, electronic device, and method for manufacturing electronic device

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JP3070514B2 (ja) * 1997-04-28 2000-07-31 日本電気株式会社 突起電極を有する半導体装置、半導体装置の実装方法およびその実装構造
GB2389460A (en) 1998-12-22 2003-12-10 Nec Corp Mounting semiconductor packages on substrates
JP3019851B1 (ja) * 1998-12-22 2000-03-13 日本電気株式会社 半導体装置実装構造
JP3446825B2 (ja) * 1999-04-06 2003-09-16 沖電気工業株式会社 半導体装置およびその製造方法
JP2002050716A (ja) * 2000-08-02 2002-02-15 Dainippon Printing Co Ltd 半導体装置及びその作製方法
JP3842548B2 (ja) * 2000-12-12 2006-11-08 富士通株式会社 半導体装置の製造方法及び半導体装置
US6818545B2 (en) * 2001-03-05 2004-11-16 Megic Corporation Low fabrication cost, fine pitch and high reliability solder bump
JP2003198068A (ja) 2001-12-27 2003-07-11 Nec Corp プリント基板、半導体装置、およびプリント基板と部品との電気的接続構造
US6854633B1 (en) * 2002-02-05 2005-02-15 Micron Technology, Inc. System with polymer masking flux for fabricating external contacts on semiconductor components
JP2004103928A (ja) * 2002-09-11 2004-04-02 Fujitsu Ltd 基板及びハンダボールの形成方法及びその実装構造
US7043830B2 (en) 2003-02-20 2006-05-16 Micron Technology, Inc. Method of forming conductive bumps
US8193092B2 (en) * 2007-07-31 2012-06-05 Micron Technology, Inc. Semiconductor devices including a through-substrate conductive member with an exposed end and methods of manufacturing such semiconductor devices
JP2012221998A (ja) * 2011-04-04 2012-11-12 Toshiba Corp 半導体装置ならびにその製造方法
JP5682496B2 (ja) * 2011-07-28 2015-03-11 富士通セミコンダクター株式会社 半導体装置、マルチチップ半導体装置、デバイス、及び半導体装置の製造方法
KR101840447B1 (ko) * 2011-08-09 2018-03-20 에스케이하이닉스 주식회사 반도체 패키지 및 이를 갖는 적층 반도체 패키지
JP2013074054A (ja) * 2011-09-27 2013-04-22 Renesas Electronics Corp 電子装置、配線基板、及び、電子装置の製造方法
JP2013080805A (ja) * 2011-10-03 2013-05-02 Sumitomo Bakelite Co Ltd 補強部材の製造方法
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EP2747132B1 (en) * 2012-12-18 2018-11-21 IMEC vzw A method for transferring a graphene sheet to metal contact bumps of a substrate for use in semiconductor device package
US10163828B2 (en) * 2013-11-18 2018-12-25 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and fabricating method thereof
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Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100319974A1 (en) * 2008-02-19 2010-12-23 Naomi Ishizuka Printed wiring board, electronic device, and method for manufacturing electronic device

Also Published As

Publication number Publication date
US10074625B2 (en) 2018-09-11
JP6549790B2 (ja) 2019-07-24
EP3350831A1 (en) 2018-07-25
JP2018527754A (ja) 2018-09-20
BR112018005532A2 (enExample) 2018-10-02
CN108028243A (zh) 2018-05-11
BR112018005532B1 (pt) 2023-03-07
US20170084565A1 (en) 2017-03-23
KR102006115B1 (ko) 2019-07-31
WO2017049324A1 (en) 2017-03-23
CA2995621A1 (en) 2017-03-23
KR20180056686A (ko) 2018-05-29

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