CN108027797A - 增强型串行外围接口 - Google Patents

增强型串行外围接口 Download PDF

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Publication number
CN108027797A
CN108027797A CN201680054326.XA CN201680054326A CN108027797A CN 108027797 A CN108027797 A CN 108027797A CN 201680054326 A CN201680054326 A CN 201680054326A CN 108027797 A CN108027797 A CN 108027797A
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CN
China
Prior art keywords
line
slave
master
address
master device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680054326.XA
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English (en)
Chinese (zh)
Inventor
L·J·米什拉
R·D·韦斯特费尔特
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Qualcomm Inc
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Qualcomm Inc
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Filing date
Publication date
Application filed by Qualcomm Inc filed Critical Qualcomm Inc
Publication of CN108027797A publication Critical patent/CN108027797A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/14—Handling requests for interconnection or transfer
    • G06F13/36—Handling requests for interconnection or transfer for access to common bus or bus system
    • G06F13/362—Handling requests for interconnection or transfer for access to common bus or bus system with centralised access control
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4063—Device-to-bus coupling
    • G06F13/4068—Electrical coupling
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
    • G06F13/4282—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/42—Bus transfer protocol, e.g. handshake; Synchronisation
    • G06F13/4282—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus
    • G06F13/4291—Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus using a clocked protocol

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Information Transfer Systems (AREA)
  • Small-Scale Networks (AREA)
CN201680054326.XA 2015-09-21 2016-08-26 增强型串行外围接口 Pending CN108027797A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/860,568 2015-09-21
US14/860,568 US9990316B2 (en) 2015-09-21 2015-09-21 Enhanced serial peripheral interface
PCT/US2016/049105 WO2017053010A1 (en) 2015-09-21 2016-08-26 Enhanced serial peripheral interface

Publications (1)

Publication Number Publication Date
CN108027797A true CN108027797A (zh) 2018-05-11

Family

ID=56853908

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680054326.XA Pending CN108027797A (zh) 2015-09-21 2016-08-26 增强型串行外围接口

Country Status (8)

Country Link
US (2) US9990316B2 (https=)
EP (1) EP3353668B1 (https=)
JP (1) JP2018527678A (https=)
KR (1) KR20180054780A (https=)
CN (1) CN108027797A (https=)
CA (1) CA2996419A1 (https=)
TW (1) TWI701555B (https=)
WO (1) WO2017053010A1 (https=)

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CN107832250A (zh) * 2017-11-02 2018-03-23 北京中电华大电子设计有限责任公司 一种基于spi的主从通讯时序方法及可靠传输方法
CN112882979A (zh) * 2021-03-15 2021-06-01 广东拓斯达科技股份有限公司 一种通信系统和方法

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CN109582616B (zh) * 2018-12-05 2020-07-17 北京爱其科技有限公司 基于串行总线的通信系统和方法
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US11928069B2 (en) * 2019-01-15 2024-03-12 Christoph HELDEIS Optical output device, bus unit, bus control unit and methods
CN109902046B (zh) * 2019-02-01 2020-03-20 福瑞泰克智能系统有限公司 一种用于串行外围总线系统的通信方法、相关设备及系统
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EP3780558B1 (en) * 2019-08-14 2025-02-19 Schneider Electric Industries SAS Addressing of slave devices using iterative power activation
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US11188495B2 (en) * 2020-01-31 2021-11-30 Infineon Technologies Ag SPI broadcast mode
US11106620B1 (en) * 2020-04-07 2021-08-31 Qualcomm Incorporated Mixed signal device address assignment
US11088815B1 (en) * 2020-10-02 2021-08-10 Qualcomm Incorporated Techniques for timed-trigger and interrupt coexistence
US11119971B1 (en) 2020-10-15 2021-09-14 Texas Instruments Incorporated I2C standard compliant bidirectional buffer
US11379402B2 (en) * 2020-10-20 2022-07-05 Micron Technology, Inc. Secondary device detection using a synchronous interface
US11379401B2 (en) * 2020-10-20 2022-07-05 Micron Technology, Inc. Deferred communications over a synchronous interface
US11334512B1 (en) 2021-02-12 2022-05-17 Qualcomm Incorporated Peripheral access control for secondary communication channels in power management integrated circuits
TWI773247B (zh) * 2021-04-13 2022-08-01 新唐科技股份有限公司 匯流排系統
TWI791271B (zh) 2021-08-25 2023-02-01 新唐科技股份有限公司 匯流排系統
US11847087B2 (en) * 2021-09-16 2023-12-19 Qualcomm Incorporated Systems and methods for chip operation using serial peripheral interface (SPI) with reduced pin options
US11609877B1 (en) * 2021-09-24 2023-03-21 Qualcomm Incorporated Systems and methods for chip operation using serial peripheral interface (SPI) without a chip select pin
CN115996434B (zh) * 2021-10-18 2025-11-28 大唐移动通信设备有限公司 一种参数配置方法及装置
US11847083B2 (en) * 2021-12-16 2023-12-19 Himax Technologies Limited Daisy-chain SPI integrated circuit and operation method thereof
TWI812194B (zh) * 2022-04-27 2023-08-11 凌通科技股份有限公司 序列周邊介面相容性擴展切換方法與使用其之嵌入式系統
CN114996184B (zh) * 2022-06-13 2024-01-30 南京观海微电子有限公司 兼容实现spi或i2c从机的接口模块及数据传输方法
US12056078B2 (en) * 2022-07-29 2024-08-06 Semiconductor Components Industries, Llc Addressing multiphase power stage modules for power state and thermal management
US12130765B2 (en) 2022-10-10 2024-10-29 Hewlett Packard Enterprise Development Lp Sharing communication lines among multiple buses
EP4386570A1 (en) * 2022-12-14 2024-06-19 Televic Rail Improved circuit integration
JP2024118727A (ja) * 2023-02-21 2024-09-02 シャープセミコンダクターイノベーション株式会社 電子機器
CN116166594B (zh) * 2023-04-26 2023-07-18 闪极科技(深圳)有限公司 一种单地址多从机的iic总线电路及其传输方法和装置
KR102844371B1 (ko) 2023-06-07 2025-08-08 한국알프스 주식회사 다중 스위치 신호의 단일 핀 입력에 의한 웨이크업 기능을 갖는 디바이스

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107832250A (zh) * 2017-11-02 2018-03-23 北京中电华大电子设计有限责任公司 一种基于spi的主从通讯时序方法及可靠传输方法
CN107832250B (zh) * 2017-11-02 2020-10-30 北京中电华大电子设计有限责任公司 一种基于spi的主从通讯时序方法
CN112882979A (zh) * 2021-03-15 2021-06-01 广东拓斯达科技股份有限公司 一种通信系统和方法
WO2022193444A1 (zh) * 2021-03-15 2022-09-22 广东拓斯达科技股份有限公司 一种通信系统和方法
CN112882979B (zh) * 2021-03-15 2024-08-30 广东拓斯达科技股份有限公司 一种通信系统和方法

Also Published As

Publication number Publication date
US10289582B2 (en) 2019-05-14
EP3353668A1 (en) 2018-08-01
US20180267916A1 (en) 2018-09-20
TWI701555B (zh) 2020-08-11
US9990316B2 (en) 2018-06-05
TW201712555A (zh) 2017-04-01
CA2996419A1 (en) 2017-03-30
JP2018527678A (ja) 2018-09-20
US20170083467A1 (en) 2017-03-23
EP3353668B1 (en) 2020-02-26
WO2017053010A1 (en) 2017-03-30
KR20180054780A (ko) 2018-05-24

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Application publication date: 20180511