CN107768242B - 被加工物的切削方法 - Google Patents

被加工物的切削方法 Download PDF

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Publication number
CN107768242B
CN107768242B CN201710655566.1A CN201710655566A CN107768242B CN 107768242 B CN107768242 B CN 107768242B CN 201710655566 A CN201710655566 A CN 201710655566A CN 107768242 B CN107768242 B CN 107768242B
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China
Prior art keywords
workpiece
cutting
chuck table
height
thickness
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CN201710655566.1A
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English (en)
Chinese (zh)
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CN107768242A (zh
Inventor
小松淳
高木敦史
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Disco Corp
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Disco Corp
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Publication of CN107768242A publication Critical patent/CN107768242A/zh
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Publication of CN107768242B publication Critical patent/CN107768242B/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
CN201710655566.1A 2016-08-18 2017-08-03 被加工物的切削方法 Active CN107768242B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016160864A JP6727719B2 (ja) 2016-08-18 2016-08-18 被加工物の切削方法
JP2016-160864 2016-08-18

Publications (2)

Publication Number Publication Date
CN107768242A CN107768242A (zh) 2018-03-06
CN107768242B true CN107768242B (zh) 2023-06-02

Family

ID=61248237

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710655566.1A Active CN107768242B (zh) 2016-08-18 2017-08-03 被加工物的切削方法

Country Status (4)

Country Link
JP (1) JP6727719B2 (ko)
KR (1) KR102271652B1 (ko)
CN (1) CN107768242B (ko)
TW (1) TWI738816B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7222636B2 (ja) * 2018-09-12 2023-02-15 株式会社ディスコ エッジトリミング装置
JP2020121374A (ja) * 2019-01-30 2020-08-13 株式会社ディスコ 切削装置の原点位置登録方法
JP7250637B2 (ja) * 2019-07-01 2023-04-03 株式会社ディスコ 加工装置及びチャックテーブル
JP7348037B2 (ja) * 2019-11-19 2023-09-20 株式会社ディスコ 加工装置
JP2021125592A (ja) * 2020-02-06 2021-08-30 株式会社東京精密 ダイシング装置
JP7394712B2 (ja) * 2020-06-24 2023-12-08 Ｔｏｗａ株式会社 切断装置及び切断品の製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06338564A (ja) * 1993-05-28 1994-12-06 Hitachi Ltd ダイシング方法および装置
JPH11345785A (ja) * 1998-06-03 1999-12-14 Hitachi Ltd ダイシング方法およびダイシング装置
JP2003168655A (ja) * 2001-12-03 2003-06-13 Tokyo Seimitsu Co Ltd ダイシング装置
TW200909768A (en) * 2007-02-27 2009-03-01 Disco Corp Device for measuring workpiece held in chuck table, and laser processing machine
JP2014041211A (ja) * 2012-08-21 2014-03-06 Canon Inc 露光システム、露光装置、それを用いたデバイスの製造方法
JP2015107535A (ja) * 2013-12-04 2015-06-11 株式会社ディスコ バイト切削装置のセットアップ方法
JP2015142022A (ja) * 2014-01-29 2015-08-03 株式会社ディスコ 切削装置
JP2015174205A (ja) * 2014-03-18 2015-10-05 株式会社ディスコ 検出方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4517269B2 (ja) 2001-06-04 2010-08-04 株式会社東京精密 Ｚ補正付ダイシング装置
JP4669162B2 (ja) 2001-06-28 2011-04-13 株式会社ディスコ 半導体ウェーハの分割システム及び分割方法
JP2003151923A (ja) 2001-11-14 2003-05-23 Tokyo Seimitsu Co Ltd ダイシング装置
JP6078272B2 (ja) 2012-09-10 2017-02-08 株式会社ディスコ ウエーハの加工方法
JP6170769B2 (ja) 2013-07-11 2017-07-26 株式会社ディスコ ウェーハの加工方法
JP6215666B2 (ja) * 2013-11-19 2017-10-18 株式会社ディスコ 加工装置
US9263352B2 (en) * 2014-01-03 2016-02-16 Asm Technology Singapore Pte Ltd Singulation apparatus comprising an imaging device
JP6220312B2 (ja) * 2014-04-30 2017-10-25 東京エレクトロン株式会社 基板処理装置、基板処理装置の基板検知方法および記憶媒体
JP6328513B2 (ja) * 2014-07-28 2018-05-23 株式会社ディスコ ウエーハの加工方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06338564A (ja) * 1993-05-28 1994-12-06 Hitachi Ltd ダイシング方法および装置
JPH11345785A (ja) * 1998-06-03 1999-12-14 Hitachi Ltd ダイシング方法およびダイシング装置
JP2003168655A (ja) * 2001-12-03 2003-06-13 Tokyo Seimitsu Co Ltd ダイシング装置
TW200909768A (en) * 2007-02-27 2009-03-01 Disco Corp Device for measuring workpiece held in chuck table, and laser processing machine
JP2014041211A (ja) * 2012-08-21 2014-03-06 Canon Inc 露光システム、露光装置、それを用いたデバイスの製造方法
JP2015107535A (ja) * 2013-12-04 2015-06-11 株式会社ディスコ バイト切削装置のセットアップ方法
JP2015142022A (ja) * 2014-01-29 2015-08-03 株式会社ディスコ 切削装置
JP2015174205A (ja) * 2014-03-18 2015-10-05 株式会社ディスコ 検出方法

Also Published As

Publication number Publication date
JP2018027601A (ja) 2018-02-22
KR20180020889A (ko) 2018-02-28
TWI738816B (zh) 2021-09-11
TW201812881A (zh) 2018-04-01
JP6727719B2 (ja) 2020-07-22
CN107768242A (zh) 2018-03-06
KR102271652B1 (ko) 2021-06-30

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