CN107622980B - 半导体装置及其制造方法、半导体密封用环氧树脂组合物 - Google Patents

半导体装置及其制造方法、半导体密封用环氧树脂组合物 Download PDF

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Publication number
CN107622980B
CN107622980B CN201710574007.8A CN201710574007A CN107622980B CN 107622980 B CN107622980 B CN 107622980B CN 201710574007 A CN201710574007 A CN 201710574007A CN 107622980 B CN107622980 B CN 107622980B
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China
Prior art keywords
resin composition
thermosetting resin
sealing material
semiconductor device
filler
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Chinese (zh)
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CN107622980A (zh
Inventor
高本真
中岛数矢
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
CN201710574007.8A 2016-07-14 2017-07-14 半导体装置及其制造方法、半导体密封用环氧树脂组合物 Active CN107622980B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016139402 2016-07-14
JP2016-139402 2016-07-14

Publications (2)

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CN107622980A CN107622980A (zh) 2018-01-23
CN107622980B true CN107622980B (zh) 2023-02-14

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Country Link
JP (1) JP6891639B2 (ja)
KR (1) KR102394084B1 (ja)
CN (1) CN107622980B (ja)
TW (1) TWI755402B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018024832A (ja) * 2016-07-29 2018-02-15 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物および半導体装置
KR102506974B1 (ko) * 2018-07-31 2023-03-07 교세라 가부시키가이샤 플레이크 형상 밀봉용 수지 조성물, 및 반도체 장치
JP7366538B2 (ja) * 2018-12-27 2023-10-23 住友ベークライト株式会社 中空パッケージおよびその製造方法
JP7098052B2 (ja) * 2019-04-05 2022-07-08 三菱電機株式会社 半導体装置およびその製造方法
JP7236326B2 (ja) * 2019-05-30 2023-03-09 東洋紡株式会社 電子部品の封止体、及び電子部品の封止体の製造方法
CN113993938A (zh) * 2019-06-05 2022-01-28 巴斯夫欧洲公司 电磁波吸收材料
JP7476595B2 (ja) 2020-03-18 2024-05-01 富士電機株式会社 半導体装置
JP2023551315A (ja) 2020-11-30 2023-12-07 ビーエーエスエフ ソシエタス・ヨーロピア 電磁波を吸収する吸収体材料

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030024723A1 (en) * 2001-06-12 2003-02-06 Nitto Denko Corporation Epoxy resin composition used for encapsulating semiconductor and semiconductor device using the composition
JP2007287937A (ja) * 2006-04-17 2007-11-01 Kyocera Chemical Corp 樹脂封止型半導体装置及びその製造方法
CN102339763A (zh) * 2010-07-21 2012-02-01 飞思卡尔半导体公司 装配集成电路器件的方法
US20140204550A1 (en) * 2013-01-22 2014-07-24 Murata Manufacturing Co., Ltd. Module board

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275741A (ja) * 1993-03-19 1994-09-30 Toppan Printing Co Ltd 半導体装置
US20040265596A1 (en) * 2003-04-28 2004-12-30 Sumitomo Bakelite Co., Ltd. Epoxy resin composition for semiconductor sealing and semiconductor device
US7170188B2 (en) * 2004-06-30 2007-01-30 Intel Corporation Package stress management
US20070267737A1 (en) * 2006-05-17 2007-11-22 Taiwan Semiconductor Manufacturing Co., Ltd. Packaged devices and methods for forming packaged devices
JP5095136B2 (ja) * 2006-06-20 2012-12-12 京セラケミカル株式会社 半導体封止用樹脂組成物の製造方法
CN106471035B (zh) * 2014-07-02 2019-04-16 Dic株式会社 电子材料用环氧树脂组合物、其固化物及电子构件

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030024723A1 (en) * 2001-06-12 2003-02-06 Nitto Denko Corporation Epoxy resin composition used for encapsulating semiconductor and semiconductor device using the composition
JP2007287937A (ja) * 2006-04-17 2007-11-01 Kyocera Chemical Corp 樹脂封止型半導体装置及びその製造方法
CN102339763A (zh) * 2010-07-21 2012-02-01 飞思卡尔半导体公司 装配集成电路器件的方法
US20140204550A1 (en) * 2013-01-22 2014-07-24 Murata Manufacturing Co., Ltd. Module board

Also Published As

Publication number Publication date
TWI755402B (zh) 2022-02-21
JP2018019067A (ja) 2018-02-01
CN107622980A (zh) 2018-01-23
KR20180008307A (ko) 2018-01-24
KR102394084B1 (ko) 2022-05-04
JP6891639B2 (ja) 2021-06-18
TW201804574A (zh) 2018-02-01

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