CN107112141B - 电容器模块 - Google Patents
电容器模块 Download PDFInfo
- Publication number
- CN107112141B CN107112141B CN201580071054.XA CN201580071054A CN107112141B CN 107112141 B CN107112141 B CN 107112141B CN 201580071054 A CN201580071054 A CN 201580071054A CN 107112141 B CN107112141 B CN 107112141B
- Authority
- CN
- China
- Prior art keywords
- capacitor
- press
- case
- circuit substrate
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/10—Multiple hybrid or EDL capacitors, e.g. arrays or modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/08—Structural combinations, e.g. assembly or connection, of hybrid or EDL capacitors with other electric components, at least one hybrid or EDL capacitor being the main component
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/74—Terminals, e.g. extensions of current collectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/74—Terminals, e.g. extensions of current collectors
- H01G11/76—Terminals, e.g. extensions of current collectors specially adapted for integration in multiple or stacked hybrid or EDL capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/78—Cases; Housings; Encapsulations; Mountings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G11/00—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof
- H01G11/78—Cases; Housings; Encapsulations; Mountings
- H01G11/82—Fixing or assembling a capacitive element in a housing, e.g. mounting electrodes, current collectors or terminals in containers or encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/04—Mountings specially adapted for mounting on a chassis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/28—Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices with other electric components not covered by this subclass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
- H05K5/0056—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for protecting electronic components against vibration and moisture, e.g. potting, holders for relatively large capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015002101A JP6421601B2 (ja) | 2015-01-08 | 2015-01-08 | キャパシタモジュール |
| JP2015-002101 | 2015-01-08 | ||
| PCT/JP2015/085650 WO2016111154A1 (ja) | 2015-01-08 | 2015-12-21 | キャパシタモジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107112141A CN107112141A (zh) | 2017-08-29 |
| CN107112141B true CN107112141B (zh) | 2019-03-29 |
Family
ID=56355854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580071054.XA Expired - Fee Related CN107112141B (zh) | 2015-01-08 | 2015-12-21 | 电容器模块 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20170352495A1 (enExample) |
| JP (1) | JP6421601B2 (enExample) |
| CN (1) | CN107112141B (enExample) |
| WO (1) | WO2016111154A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019225187A1 (ja) * | 2018-05-25 | 2019-11-28 | パナソニックIpマネジメント株式会社 | コンデンサ |
| EP3982384B1 (en) * | 2020-10-06 | 2023-07-26 | Veoneer Passive Co. AB | Electronic control unit |
| CN112768228B (zh) * | 2020-12-18 | 2023-04-07 | 东佳电子(郴州)有限公司 | 一种具有断电保护功能的电容器 |
| JP7491242B2 (ja) * | 2021-03-09 | 2024-05-28 | 住友電装株式会社 | 電子機器 |
| JPWO2022202579A1 (enExample) * | 2021-03-25 | 2022-09-29 | ||
| US11839035B2 (en) * | 2021-12-20 | 2023-12-05 | Veoneer Us Safety Systems, Llc | Electronic control unit housing with electronic component holder |
| US11804336B2 (en) * | 2022-03-11 | 2023-10-31 | General Electric Company | Ultracapacitor module with integrated bypass diode and related systems |
| EP4312240A1 (en) * | 2022-07-27 | 2024-01-31 | Veoneer Sweden Safety Systems AB | Mounting structure for a capacitor in a housing part of a housing |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6163460A (en) * | 1997-10-11 | 2000-12-19 | Temic Telefunken Microelectronic Gmbh | Housing for electronic assemblies including board-mounted components and separate discrete components |
| CN101678744A (zh) * | 2007-04-27 | 2010-03-24 | 美铝公司 | 储能装置 |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3087982A (en) * | 1959-12-01 | 1963-04-30 | Northrop Corp | Vacuum tube mounts |
| JPH0530381Y2 (enExample) * | 1985-06-12 | 1993-08-03 | ||
| US5204498A (en) * | 1991-12-30 | 1993-04-20 | Therm-O-Disc, Incorporated | Packaging assembly |
| GB2353844B (en) * | 1996-08-29 | 2001-04-11 | Matsushita Electric Industrial Co Ltd | Vibrator holding device |
| DE19813639A1 (de) * | 1998-03-27 | 1999-11-25 | Danfoss As | Leistungsmodul für einen Stromrichter |
| US6300564B1 (en) * | 1998-09-16 | 2001-10-09 | Carrier Corporation | Mounting of capacitors in electrical control box |
| JP4038899B2 (ja) * | 1998-11-04 | 2008-01-30 | 株式会社デンソー | 電源平滑用コンデンサ搭載型インバータ装置 |
| DE19959632B4 (de) * | 1998-12-11 | 2009-11-26 | DENSO CORPORATION, Kariya-shi | Hydraulische Steuervorrichtung mit integrierter Motorantriebsschaltung |
| DE19857840C2 (de) * | 1998-12-15 | 2003-10-02 | Siemens Ag | Elektronische Einrichtung |
| JP2000340920A (ja) * | 1999-05-31 | 2000-12-08 | Kyocera Corp | 回路基板および集積回路装置 |
| DE19941690C2 (de) * | 1999-09-01 | 2001-12-06 | Siemens Ag | Steuergerät und Lötverfahren |
| JP2003031449A (ja) * | 2001-07-11 | 2003-01-31 | Casio Comput Co Ltd | 蓄電構造およびそれを備えた電子機器 |
| DE10162600A1 (de) * | 2001-12-20 | 2003-07-10 | Bosch Gmbh Robert | Gehäuseanordnung für ein elektrisches Gerät |
| JP3864873B2 (ja) * | 2002-08-09 | 2007-01-10 | 株式会社デンソー | 電子制御装置 |
| US6717797B1 (en) * | 2002-11-22 | 2004-04-06 | Tyco Electronics Corporation | Apparatus, methods and articles of manufacture for a module box with integrated components |
| JP2005026270A (ja) * | 2003-06-30 | 2005-01-27 | Murata Mfg Co Ltd | 高圧用可変抵抗器 |
| EP1589547A4 (en) * | 2003-09-18 | 2009-11-25 | Panasonic Corp | CAPACITOR UNIT |
| ITTO20030754A1 (it) * | 2003-09-29 | 2005-03-30 | Gate Srl | Unita' elettronica di controllo, in particolare unita' |
| JP4859443B2 (ja) * | 2005-11-17 | 2012-01-25 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
| JP4853077B2 (ja) * | 2006-03-29 | 2012-01-11 | 株式会社豊田自動織機 | 電動コンプレッサ |
| JP2007281127A (ja) * | 2006-04-05 | 2007-10-25 | Shindengen Electric Mfg Co Ltd | コンデンサを備える回路装置及びコンデンサモジュール |
| US8149567B2 (en) * | 2006-04-27 | 2012-04-03 | Komatsu Ltd. | Capacitor module |
| US7903417B2 (en) * | 2006-10-10 | 2011-03-08 | Deere & Company | Electrical circuit assembly for high-power electronics |
| JP4751810B2 (ja) * | 2006-11-02 | 2011-08-17 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
| JP4702311B2 (ja) * | 2007-03-19 | 2011-06-15 | トヨタ自動車株式会社 | コンデンサを備えた電気ユニット |
| CN101802952A (zh) * | 2007-09-20 | 2010-08-11 | 松下电工株式会社 | 近程式传感器用的检测部及近程式传感器 |
| JP5095459B2 (ja) * | 2008-03-25 | 2012-12-12 | 株式会社小松製作所 | キャパシタモジュール |
| JP4638923B2 (ja) * | 2008-03-31 | 2011-02-23 | 日立オートモティブシステムズ株式会社 | 制御装置 |
| DE102008023714B4 (de) * | 2008-05-15 | 2011-01-20 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit einem Hauptträger und einer Leiterplatte mit Bauelementen |
| JP4657329B2 (ja) * | 2008-07-29 | 2011-03-23 | 日立オートモティブシステムズ株式会社 | 電力変換装置および電動車両 |
| JP5232047B2 (ja) * | 2009-03-10 | 2013-07-10 | 矢崎総業株式会社 | コンデンサの取り付け構造 |
| ITTO20100064U1 (it) * | 2010-04-13 | 2011-10-14 | Gate Srl | Unita' elettronica di controllo, in particolare unita' di controllo della velocita' di un elettroventilatore |
| US8149589B2 (en) * | 2010-08-19 | 2012-04-03 | Lien Chang Electronic Enterprise Co., Ltd. | Capacitor holder |
| CN202221699U (zh) * | 2011-08-16 | 2012-05-16 | 许文豪 | 一种电容固定装置及应用该电容固定装置的线路板结构 |
| JP5945710B2 (ja) * | 2011-10-28 | 2016-07-05 | パナソニックIpマネジメント株式会社 | キャパシタモジュール |
| JP6098767B2 (ja) * | 2014-09-11 | 2017-03-22 | 日本精工株式会社 | 多極リード部品及び基板の接続装置 |
-
2015
- 2015-01-08 JP JP2015002101A patent/JP6421601B2/ja not_active Expired - Fee Related
- 2015-12-21 WO PCT/JP2015/085650 patent/WO2016111154A1/ja not_active Ceased
- 2015-12-21 US US15/541,779 patent/US20170352495A1/en not_active Abandoned
- 2015-12-21 CN CN201580071054.XA patent/CN107112141B/zh not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6163460A (en) * | 1997-10-11 | 2000-12-19 | Temic Telefunken Microelectronic Gmbh | Housing for electronic assemblies including board-mounted components and separate discrete components |
| CN101678744A (zh) * | 2007-04-27 | 2010-03-24 | 美铝公司 | 储能装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016127227A (ja) | 2016-07-11 |
| CN107112141A (zh) | 2017-08-29 |
| US20170352495A1 (en) | 2017-12-07 |
| JP6421601B2 (ja) | 2018-11-14 |
| WO2016111154A1 (ja) | 2016-07-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190329 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |