CN107068641A - 双侧冷却集成功率装置封装和模块及其制造方法 - Google Patents

双侧冷却集成功率装置封装和模块及其制造方法 Download PDF

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Publication number
CN107068641A
CN107068641A CN201710166570.1A CN201710166570A CN107068641A CN 107068641 A CN107068641 A CN 107068641A CN 201710166570 A CN201710166570 A CN 201710166570A CN 107068641 A CN107068641 A CN 107068641A
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Prior art keywords
module
drain
clip
leads
transistors
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CN201710166570.1A
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Chinese (zh)
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乔纳森·A·诺奎尔
鲁宾·马德里
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Fairchild Semiconductor Corp
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Fairchild Semiconductor Corp
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Publication of CN107068641A publication Critical patent/CN107068641A/zh
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    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
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    • H01L2924/181—Encapsulation
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201710166570.1A 2007-07-27 2008-07-21 双侧冷却集成功率装置封装和模块及其制造方法 Pending CN107068641A (zh)

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US20080023807A1 (en) 2008-01-31
US7663211B2 (en) 2010-02-16
WO2009017999A3 (en) 2009-04-02
JP2010534937A (ja) 2010-11-11
TWI450373B (zh) 2014-08-21
WO2009017999A2 (en) 2009-02-05
CN101681897A (zh) 2010-03-24
CN101681897B (zh) 2017-04-12
TW200913201A (en) 2009-03-16

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