CN107046003B - 低温多晶硅tft基板及其制作方法 - Google Patents
低温多晶硅tft基板及其制作方法 Download PDFInfo
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- CN107046003B CN107046003B CN201710412498.6A CN201710412498A CN107046003B CN 107046003 B CN107046003 B CN 107046003B CN 201710412498 A CN201710412498 A CN 201710412498A CN 107046003 B CN107046003 B CN 107046003B
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
- H01L29/78621—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
- H01L29/78627—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile with a significant overlap between the lightly doped drain and the gate electrode, e.g. GOLDD
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/7866—Non-monocrystalline silicon transistors
- H01L29/78672—Polycrystalline or microcrystalline silicon transistor
- H01L29/78675—Polycrystalline or microcrystalline silicon transistor with normal-type structure, e.g. with top gate
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133345—Insulating layers
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133357—Planarisation layers
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
- G02F1/13685—Top gates
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/10—Materials and properties semiconductor
- G02F2202/104—Materials and properties semiconductor poly-Si
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CN201710412498.6A CN107046003B (zh) | 2017-06-02 | 2017-06-02 | 低温多晶硅tft基板及其制作方法 |
US15/735,614 US10355138B2 (en) | 2017-06-02 | 2017-06-22 | LTPS TFT substrate and method for manufacturing the same |
PCT/CN2017/089620 WO2018218712A1 (fr) | 2017-06-02 | 2017-06-22 | Substrat de transistor à couches minces (tft) en polysilicium basse température et son procédé de fabrication |
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CN201710412498.6A CN107046003B (zh) | 2017-06-02 | 2017-06-02 | 低温多晶硅tft基板及其制作方法 |
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CN108010909B (zh) * | 2017-11-21 | 2020-06-30 | 武汉华星光电技术有限公司 | 阵列基板及oled显示装置 |
CN108183125B (zh) * | 2017-12-28 | 2020-12-29 | 武汉华星光电半导体显示技术有限公司 | 有机发光二极管显示面板 |
CN109037037B (zh) * | 2018-09-27 | 2023-09-01 | 武汉华星光电技术有限公司 | 低温多晶硅层、薄膜晶体管及其制作方法 |
TWI813420B (zh) * | 2022-08-19 | 2023-08-21 | 世界先進積體電路股份有限公司 | 半導體結構 |
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CN1612358A (zh) * | 2003-10-28 | 2005-05-04 | 统宝光电股份有限公司 | 薄膜晶体管及其制作方法 |
CN105470195A (zh) * | 2016-01-04 | 2016-04-06 | 武汉华星光电技术有限公司 | Tft基板的制作方法 |
CN105514119A (zh) * | 2016-01-04 | 2016-04-20 | 武汉华星光电技术有限公司 | Tft基板的制作方法及tft基板 |
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US6511870B2 (en) * | 2001-05-08 | 2003-01-28 | Industrial Technology Research Institute | Self-aligned LDD poly-Si thin-film transistor |
TW554538B (en) * | 2002-05-29 | 2003-09-21 | Toppoly Optoelectronics Corp | TFT planar display panel structure and process for producing same |
CN102683354B (zh) * | 2012-03-22 | 2014-12-17 | 京东方科技集团股份有限公司 | 顶栅型n-tft、阵列基板及其制备方法和显示装置 |
CN103985637B (zh) * | 2014-04-30 | 2017-02-01 | 京东方科技集团股份有限公司 | 低温多晶硅薄膜晶体管及其制作方法和显示装置 |
CN105070724A (zh) * | 2015-07-16 | 2015-11-18 | 深圳市华星光电技术有限公司 | Tft基板的制作方法及制得的tft基板 |
CN105655391B (zh) * | 2016-01-28 | 2018-10-26 | 武汉华星光电技术有限公司 | Tft阵列基板及其制作方法 |
CN105552027B (zh) * | 2016-02-14 | 2018-08-14 | 武汉华星光电技术有限公司 | 阵列基板的制作方法及阵列基板 |
CN105742240B (zh) * | 2016-04-05 | 2019-09-13 | 武汉华星光电技术有限公司 | 一种ltps阵列基板的制造方法 |
CN106252234A (zh) * | 2016-08-26 | 2016-12-21 | 武汉华星光电技术有限公司 | Nmos晶体管及其制作方法、cmos晶体管 |
CN106531692A (zh) * | 2016-12-01 | 2017-03-22 | 京东方科技集团股份有限公司 | 阵列基板的制备方法、阵列基板及显示装置 |
CN106783734B (zh) * | 2016-12-27 | 2019-11-26 | 武汉华星光电技术有限公司 | 一种低温多晶硅阵列基板及其制作方法 |
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CN1612358A (zh) * | 2003-10-28 | 2005-05-04 | 统宝光电股份有限公司 | 薄膜晶体管及其制作方法 |
CN105470195A (zh) * | 2016-01-04 | 2016-04-06 | 武汉华星光电技术有限公司 | Tft基板的制作方法 |
CN105514119A (zh) * | 2016-01-04 | 2016-04-20 | 武汉华星光电技术有限公司 | Tft基板的制作方法及tft基板 |
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