CN107001886B - 粘合剂树脂组合物、粘合膜和柔性金属层合体 - Google Patents

粘合剂树脂组合物、粘合膜和柔性金属层合体 Download PDF

Info

Publication number
CN107001886B
CN107001886B CN201580060901.2A CN201580060901A CN107001886B CN 107001886 B CN107001886 B CN 107001886B CN 201580060901 A CN201580060901 A CN 201580060901A CN 107001886 B CN107001886 B CN 107001886B
Authority
CN
China
Prior art keywords
weight
adhesive resin
styrene
resin composition
anhydride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580060901.2A
Other languages
English (en)
Other versions
CN107001886A (zh
Inventor
太泳智
朴永锡
安秉寅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shengyi Technology Co Ltd
Original Assignee
Shengyi Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=56107706&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN107001886(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Shengyi Technology Co Ltd filed Critical Shengyi Technology Co Ltd
Publication of CN107001886A publication Critical patent/CN107001886A/zh
Application granted granted Critical
Publication of CN107001886B publication Critical patent/CN107001886B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/04—Homopolymers or copolymers of styrene
    • C09J125/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/006—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to block copolymers containing at least one sequence of polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J155/00—Adhesives based on homopolymers or copolymers, obtained by polymerisation reactions only involving carbon-to-carbon unsaturated bonds, not provided for in groups C09J123/00 - C09J153/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/08—Dimensions, e.g. volume
    • B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
    • B32B2309/105—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2425/00—Presence of styrenic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2451/00—Presence of graft polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)

Abstract

本发明涉及粘合剂树脂组合物、由所述树脂组合物获得的粘合膜及包括所述粘合膜的柔性金属层合体，所述粘合剂树脂组合物包含具有特定化学结构的苯乙烯‑乙烯‑丁烯‑苯乙烯共聚物、环氧树脂、酸酐化合物和固化催化剂。

Description

粘合剂树脂组合物、粘合膜和柔性金属层合体
相关领域的交叉引用
本申请要求于2014年12月8日向韩国知识产权局提交的韩国专利申请第10-2014-0174976号的权益，其公开内容通过引用整体并入本文。
技术领域
本发明涉及粘合剂树脂组合物、粘合膜和柔性金属层合体，更具体地，涉及具有高耐热性和机械特性、可应用于柔性印刷电路板的制造过程以确保高可靠性、并且表现出低介电常数和低介质损耗因数的粘合剂树脂组合物和粘合膜，以及包括所述粘合膜的柔性金属层合体。
背景技术
随着近来电子器件及其各种功能的组合的小型化和速度增加的趋势，电子器件中的信号传输速度或向电子器件外部的信号传输速度日益增加。因此，需要使用具有比现有绝缘体的介电常数和介电损耗因数更低的绝缘体的印刷电路板。
先前已知的粘合片和覆盖层一般由粘合剂环氧树脂组合物制成，但是介电常数由于环氧树脂的独特特性而增加，因此不容易降低最终产品的介电常数和介质损耗因数。此外，由于通常用于粘合剂环氧树脂组合物中的弹性体(如具有羧基末端的丁二烯/丙烯腈(CTBN)等)也具有高介电常数和介质损耗因数，所以对用于更微型化和高度集成的半导体器件的应用存在一定的限制。
例如，韩国注册专利第0072808号公开了一种粘合带，其包含：液体环氧树脂；固体树脂；和微胶囊型固化剂，并且该粘合带可以确保高耐热性或对基底的粘合性，但是由于使用高含量的具有高电介质的环氧树脂，难以确保低介电常数，并且没有提出用于降低介电常数或介质损耗因数的方法。
此外，日本专利特开第2013-170214号公开了一种环氧树脂组合物，其包含环氧树脂、包含马来酸酐改性的氢化丁苯橡胶作为主要成分的橡胶组分、聚苯醚和磷化合物的无机金属盐，并且该环氧树脂组合物对聚酰亚胺基底具有高粘合性并且可以确保高耐湿性，但是没有提出用于降低介电常数或介质损耗因数的方法。
现有技术
专利文件
(专利文件1)韩国注册专利第0072808号
(专利文件2)日本特开专利申请第2013-170214号
发明内容
技术问题
本发明的一个目的是提供一种粘合剂树脂组合物，其具有高耐热性和机械特性，可应用于柔性印刷电路板的制造过程以确保高可靠性，并且表现出低介电常数和低介质损耗因数。
本发明的另一个目的是提供一种粘合膜，其具有高耐热性和机械特性，可应用于柔性印刷电路板的制造过程以确保高可靠性，并且表现出低介电常数和低介质损耗因数。
本发明的仍另一个目的是提供表现出低介电常数和低介质损耗因数以及高耐热性和机械特性的柔性金属层合体。
技术方案
提供了一种粘合剂树脂组合物，其包含与0.1重量％至15重量％的二羧酸或其酸酐结合的苯乙烯-乙烯-丁烯-苯乙烯共聚物；环氧树脂；固化催化剂，其包含选自以下的一种或更多种化合物：基于咪唑的化合物、基于亚胺的化合物和基于胺的化合物；和酸酐化合物，并且其中所述粘合剂树脂组合物在干燥状态下在5GHz下的介电常数(Dk)为2.8或更低。
还提供了一种粘合膜，其包含粘合剂树脂组合物的固化产物，并且在干燥状态下在5GHz下的介电常数(Dk)为2.8或更低。
还提供了一种柔性金属层合体，其包括：聚酰亚胺树脂膜；金属薄膜，所述金属薄膜包含选自以下的一种或更多种：铜、铁、镍、钛、铝、银、金及其两种或更多种的合金；以及在聚酰亚胺膜与金属薄膜之间形成的上述粘合膜。
在下文中，将详细说明根据本发明的具体实施方案的粘合剂树脂组合物和粘合膜。
根据本发明的一个实施方案，提供了一种粘合剂树脂组合物，其包含与0.1重量％至15重量％的二羧酸或其酸酐结合的苯乙烯-乙烯-丁烯-苯乙烯共聚物；环氧树脂；固化催化剂，其包含选自以下的一种或更多种化合物：基于咪唑的化合物、基于亚胺的化合物和基于胺的化合物；和酸酐化合物，并且在干燥状态下在5GHz下的介电常数(Dk)为2.8或更低。
本发明人通过实验证实，通过使用与0.1重量％至15重量％的二羧酸或其酸酐结合的苯乙烯-乙烯-丁烯-苯乙烯共聚物、特定的酸酐化合物和固化催化剂连同环氧树脂一起而获得的粘合剂树脂组合物可具有高耐热性和机械特性，可应用于柔性印刷电路板的制造过程以确保高可靠性，并且可表现出低介电常数和低介质损耗因数，并完成了本发明。
由于粘合剂树脂组合物包含与0.1重量％至15重量％的二羧酸或其酸酐结合的苯乙烯-乙烯-丁烯-苯乙烯共聚物，最终制备的粘合膜可确保高机械特性以及高弹性，同时使环氧树脂的耐热性保持在相当或更高的程度，并且粘合剂树脂组合物或由其制备的粘合膜可具有低介电常数和低介质损耗因数。
二羧酸或其酸酐可以以0.1重量％至15重量％或0.2重量％至10重量％的含量取代在苯乙烯-乙烯-丁烯-苯乙烯共聚物的末端上，或者以0.1重量％至15重量％或0.2重量％至10重量％的含量接枝在该共聚物的主链上。
二羧酸可包括选自以下的一种或更多种化合物：马来酸、邻苯二甲酸、衣康酸、柠康酸、烯基琥珀酸、顺-1，2，3，6-四氢邻苯二甲酸和4-甲基-1，2，3，6-四氢邻苯二甲酸。
与0.1重量％至15重量％的二羧酸或其酸酐结合的苯乙烯-乙烯-丁烯-苯乙烯共聚物的重均分子量可为30000至800000，优选20000至200000。
与0.1重量％至15重量％的二羧酸或其酸酐结合的苯乙烯-乙烯-丁烯-苯乙烯共聚物可包含5重量％至50重量％的苯乙烯衍生的重复单元。如果苯乙烯-乙烯-丁烯-苯乙烯共聚物中苯乙烯衍生的重复单元的含量太低，则粘合剂树脂组合物和由其制备的产品的耐热性可能会大大劣化。此外，如果苯乙烯-乙烯-丁烯-苯乙烯共聚物中苯乙烯衍生的重复单元的含量太高，则可能使与包含在粘合剂树脂组合物中的环氧树脂的相容性劣化。
与0.1重量％至15重量％的二羧酸或其酸酐结合的苯乙烯-乙烯-丁烯-苯乙烯共聚物可构成粘合剂树脂组合物的固含量(除有机溶剂、水或水溶性组分以外的其余组分)的30重量％至80重量％，或25重量％至75重量％。
同时，基于100重量份的与0.1重量％至15重量％的二羧酸或其酸酐结合的苯乙烯-乙烯-丁烯-苯乙烯共聚物，粘合剂树脂组合物可包含10重量份至80重量份或20重量份至60重量份的环氧树脂。
环氧树脂使得粘合剂树脂组合物或由其制备的粘合膜具有高耐热性和机械特性。
此外，基于100重量份的苯乙烯-乙烯-丁烯-苯乙烯共聚物，通过包含10重量份至80重量份或20重量份至60重量份的环氧树脂，粘合剂树脂组合物或由其制备的粘合膜可具有低介电常数和低介质损耗因数。具体地，粘合剂树脂组合物在干燥状态下在5GHz下的介电常数(Dk)可为2.8或更低，或2.2至2.8，并且介质损耗因数(Df)可为0.010或更低，或0.010至0.001。
如果与苯乙烯-乙烯-丁烯-苯乙烯共聚物相比，粘合剂树脂组合物中的环氧树脂的含量太高，则粘合剂树脂组合物或由其制备的粘合膜可具有高介电常数和高电介质损耗因子，并且当实际使用时，树脂流动可能变得过大。如果与苯乙烯-乙烯-丁烯-苯乙烯共聚物相比，粘合剂树脂组合物中的环氧树脂的含量太低，则粘合剂树脂组合物和由其制备的粘合膜的耐热性或机械特性可能劣化，并且粘合强度本身可能劣化。
环氧树脂可包括选自以下的一种或更多种：联苯酚醛清漆环氧树脂、双酚A型环氧树脂和二环戊二烯苯酚加成反应型环氧树脂，并且环氧树脂的优选实例可包括联苯酚醛清漆环氧树脂或二环戊二烯苯酚加成反应型环氧树脂。
为了降低介电常数和介质损耗因数同时增加粘合剂树脂组合物的耐热性，优选的环氧当量为200g/eq至500g/eq。
同时，酸酸酐可包括选自以下的一种或更多种化合物：苯乙烯-马来酸酐共聚物、甲基四氢邻苯二甲酸酐、邻苯二甲酸酐、六氢邻苯二甲酸酐、四氢邻苯二甲酸酐、甲基六氢邻苯二甲酸酐、甲基降冰片烯二酸酐、甲基纳迪克酸酐、纳迪克酸酐和十二碳烯基琥珀酸酐。
这样的酸酐化合物不仅降低了粘合剂树脂组合物和由其制备的粘合膜的介电常数，而且确保了高粘合强度和耐热性，并且如果粘合剂树脂组合物以清漆的状态存在或以半固化粘合膜的状态存在，则允许粘合剂树脂组合物确保高储存稳定性。
通常已知固化剂、固化促进剂、固化催化剂等使树脂组合物或由其制备的粘合膜的介电常数或介质损耗因数显著增加，而当上述特定的酸酐化合物连同上述苯乙烯-乙烯-丁烯-苯乙烯共聚物和环氧树脂一起使用时，允许一个实施方案的树脂组合物或由其制备的粘合膜在干燥状态下在5GHz下具有2.8或更低的介电常数，并且在干燥状态下在5GHz下具有0.010或更低的介质损耗因数(Df)。
在酸酐化合物中，作为苯乙烯-马来酸酐共聚物，可使用重均分子量为1000至50000或5000至25000的苯乙烯-马来酸酐共聚物。
苯乙烯-马来酸酐共聚物可包含50重量％至95重量％或60重量％至90重量％的苯乙烯衍生的重复单元。
基于100重量份的与0.1重量％至15重量％的二羧酸或其酸酐结合的苯乙烯-乙烯-丁烯-苯乙烯共聚物，粘合剂树脂组合物可包含10重量份至80重量份或20重量份至60重量份的酸酐化合物。
如果粘合剂树脂组合物中酸酐化合物的含量太低，则由粘合剂树脂组合物制备的粘合膜的涂覆特性或耐热性和机械特性可能不足，并且可能难以充分降低粘合膜的介电常数和介质损耗因数。如果粘合剂树脂组合物中酸酐化合物的含量太高，则吸湿性可能增加，耐热性可能劣化，并且由粘合剂树脂组合物制备的产物的介电常数和介质损耗因数可能增加。
具体地，环氧树脂与酸酐化合物的重量比可为2.0至0.05、1.5至0.10、1.0至0.12或0.75至0.15。环氧树脂与酸酐化合物的重量比是环氧树脂的固含量与酸酐化合物的固含量的重量比。如果环氧树脂与酸酐化合物的重量比过高，则可能难以充分降低由粘合剂树脂组合物制备的粘合膜的介电常数和介质损耗因数，并且树脂流动可能变得过高。如果环氧树脂与酸酐化合物的重量比太低，则粘合剂树脂组合物的粘合强度可能劣化，或者耐热性和耐化学性可能劣化。
粘合剂树脂组合物还可包含有机溶剂。具体地，基于100重量份的苯乙烯-乙烯-丁烯-苯乙烯共聚物，粘合剂树脂组合物还可包含50重量份至1000重量份的有机溶剂。
有机溶剂可控制粘合剂树脂组合物的粘度以便于制备粘合膜。考虑到粘合剂树脂组合物的特定组分、粘度等，可使用有机溶剂如甲苯、二甲苯、丙二醇单甲醚乙酸酯、苯、丙酮、甲基乙基酮、四氢呋喃、二甲基甲醛、环己酮、甲基溶纤剂、甲醇、乙醇等。
粘合剂树脂组合物在上述构成组分之间具有高相容性和优异的分散性，因此即使还包含有机溶剂也可长时间保持稳定的组成。具体地，当在室温下暴露于外部时，与初始粘度相比，粘合剂树脂组合物在72小时内的粘度变化可为2倍或1.5倍或更小，或1.1倍或更小。在包含环氧树脂、胺类固化剂和有机溶剂的粘合剂树脂的情况下，当在室温下暴露于外部时，与初始粘度相比，粘度的变化为3倍或更大，而一个实施方案的该粘合剂树脂组合物在室温下具有相对高的储存稳定性。
粘合剂树脂组合物可包含通常已知的固化催化剂，例如包含选自以下的一种或更多种化合物的固化催化剂：基于咪唑的化合物、基于亚胺的化合物和基于胺的化合物。
具体地，基于100重量份的与0.1重量％至15重量％的二羧酸或其酸酐结合的苯乙烯-乙烯-丁烯-苯乙烯共聚物，粘合剂树脂组合物可包含0.05重量份至5重量份或0.1重量份至2重量份的固化催化剂。
除了上述组分之外，粘合剂树脂组合物可包含通常已知的添加剂，例如阻燃剂、填料等。作为阻燃剂，可使用常用阻燃剂而没有特别限制，例如可使用磷阻燃剂OP-935(Clariant Company)、非离子型磷阻燃剂FP系列(Fushimi Company)等。作为填料，可使用无机颗粒(如二氧化硅等)而没有特别限制，例如可使用SFP-30MHE(DENKA Company)等；可使用有机填料(如聚环氧丙烷等)；并且可使用有机-无机复合填料。
根据本发明的另一个实施方案，提供了一种粘合膜，其包含上述粘合剂树脂组合物的固化产物，并且在干燥状态下在5GHz下的介电常数(Dk)为2.8或更低。
如上所述，如果使用了包含与0.1重量％至15重量％的二羧酸或其酸酐结合的苯乙烯-乙烯-丁烯-苯乙烯共聚物、上述酸酐化合物和固化催化剂连同环氧树脂一起的粘合剂树脂组合物，则可提供这样的粘合膜：所述粘合膜可具有高耐热性和机械特性，可应用于柔性印刷电路板的制造过程以确保高可靠性，并且可表现出低介电常数和低介质损耗因数。
具体地，粘合膜在干燥状态下在5GHz下的介电常数(Dk)可为2.2至2.8。
粘合膜在干燥状态下在5GHz下的介质损耗因数(Df)可为0.010或更低，或0.010至0.001。
粘合膜的形状、厚度等没有特别限制，可考虑所施加的电路板等的尺寸、用途、特性等进行调整，例如，粘合膜的厚度可为1μm至100μm。
粘合膜可使用已知用于制备聚合物膜或粘合膜的各种方法和装置来制备而没有特别限制，例如可通过将一个实施方案的粘合剂树脂组合物施加在预定的基底上并在40℃或更高的温度下干燥来制备。
根据本发明的又一个实施方案，提供了一种柔性金属层合体，其包括：聚酰亚胺树脂膜；金属薄膜，所述金属薄膜包含选自以下的一种或更多种：铜、铁、镍、钛、铝、银、金及其两种或更多种的合金；以及在聚酰亚胺膜与金属薄膜之间形成的上述粘合膜。
通过包括上述粘合膜，柔性金属层合体不仅具有高耐热性和机械特性，而且具有低介电常数和低介质损耗因数。粘合膜可实现对聚酰亚胺树脂膜以及金属薄膜的高粘合强度。
具体地，柔性金属层合体在干燥状态下在5GHz下的介电常数(Dk)可为2.2至2.8。
此外，柔性金属层合体在干燥状态下在5GHz下的介质损耗因数(Df)可为0.010或更低。
同时，包含在聚酰亚胺树脂膜中的聚酰亚胺树脂的重均分子量可为3000至600000，或50000至300000。当应用于柔性金属层合体等中时，如果聚酰亚胺树脂的重均分子量太低，则不能充分确保所需的机械特性等。如果聚酰亚胺树脂的重均分子量太高，则聚酰亚胺树脂膜的弹性可能劣化。
聚酰亚胺树脂膜的厚度可为1μm至50μm。
连同聚酰亚胺树脂一起，聚酰亚胺树脂膜还可包含5重量％至75重量％的基于氟的树脂。
基于氟的树脂的实例可包括聚四氟乙烯(PTFE)、四氟乙烯-全氟烷基乙烯基醚共聚物(PFA)、四氟乙烯-六氟丙烯共聚物(FEP)、乙烯-四氟乙烯共聚物树脂(ETFE)、四氟乙烯-三氟氯乙烯共聚物(TFE/CTFE)、乙烯-三氟氯乙烯树脂(ECTFE)其两种或更多种的混合物，或其两种或更多种的共聚物。基于氟的树脂可包含最大直径为0.05μm至20μm，或0.1μm至10μm的颗粒。
金属薄膜的厚度可为0.1μm至50μm。
柔性金属层合体可包括一个金属薄膜，或者柔性金属层合体可包括彼此相对的两个金属薄膜，在这种情况下，聚酰亚胺树脂膜可位于彼此相对的两个金属薄膜之间。
有益效果
根据本发明，可提供可具有高耐热性和机械特性、可应用于柔性印刷电路板的制造过程以确保高可靠性、并且表现出低介电常数和低介质损耗因数的粘合剂树脂组合物和粘合膜。
具体实施方式
以下实施例将更详细地说明本发明的具体实施方案。但是，以下实施例仅作为本发明的说明而呈现，并且本发明的范围不受以下实施例的限制。
[实施例和比较例：粘合剂树脂组合物和粘合膜的制备]
实施例1
(1)粘合剂树脂溶液的制备
使以下溶液在室温下混合以制备粘合剂树脂组合物(溶液)：20g 20重量％的接枝有1.81重量％马来酸酐(M1913，由Asahi Kasei Corporation制造)的苯乙烯-乙烯-丁烯-苯乙烯共聚物的二甲苯溶液、0.814g 70重量％的联苯酚醛清漆类环氧树脂(NC-3000H，Nippon Kayaku Co.Ltd.制造，环氧当量288g/eq)的二甲苯溶液、5.0g 40重量％的苯乙烯-马来酸酐共聚物(EF-40，由Sartomer公司制造，苯乙烯：马来酸酐的重量比＝4∶1)的二甲苯溶液、以及0.13g 25％的2-甲基咪唑的甲醇溶液。
(2)粘合膜的制备
将粘合剂树脂溶液施加在待进行剥离处理的PET膜上，并在100℃下干燥10分钟，以制备厚度为约25μm的粘合膜。
实施例2
(1)粘合剂树脂溶液的制备
使以下溶液混合以制备粘合剂树脂组合物(溶液)：20g 20重量％的接枝有0.36重量％马来酸酐(M1911，由Asahi Kasei Corporation制造)的苯乙烯-乙烯-丁烯-苯乙烯共聚物的二甲苯溶液、0.814g 70重量％的环氧树脂的二甲苯溶液、5.0g 40重量％的甲基纳迪克酸酐的二甲苯溶液和0.13g 25％的2-甲基咪唑的甲醇溶液。
(2)粘合膜的制备
将粘合剂树脂溶液施加在待进行剥离处理的PET膜上，并在100℃下干燥10分钟，以制备厚度为约25μm的粘合膜。
比较例1至3
(1)粘合剂树脂溶液的制备
使下表1的组分混合以制备比较例1至3的粘合剂树脂组合物(溶液)。
[表1]
(2)粘合膜的制备
将比较例1至3中获得的粘合剂树脂溶液分别施加在待进行剥离处理的PET膜上，并在100℃下干燥10分钟，以制备各自厚度为约25μm的粘合膜。
[实验例：粘合剂树脂组合物和粘合膜的特性评估]
实验例1：粘合剂树脂组合物(溶液)的储存稳定性评估
将实施例和比较例中获得的各粘合剂树脂溶液在室温(25℃)下以密封状态保持3天，并确认粘度是否增加或减少。如果暴露之后的最终粘度在初始粘度的100％以内，则评估为良好，而如果超过初始粘度的100％，则将其标记为有缺陷。
实验例2：粘合膜吸水后的耐热性评估
将实施例和比较例中获得的各粘合膜从PET膜上层离并插入聚酰亚胺膜和铜箔之间，在160℃下施加30MPa的压力1小时以将其压制。此外，使获得的聚酰亚胺膜-粘合膜-铜箔复合物在85℃的温度和85％的相对湿度的条件下老化24小时，然后使其漂浮在铅浴中，并评估耐热性。
如果粘合膜的表面上产生泡，则粘合膜被评估为有缺陷，而如果不产生泡，则评估为良好。
实验例3：介电常数和介质损耗因数的测量
将实施例和比较例中获得的各粘合膜放入手套箱中，并在氮气吹扫下干燥24小时，然后在5GHz的条件下使用Agilent E5071B ENA设备测量介电常数和介质损耗因数。
实验例1至3的结果示于下表2中。
[表2]
如表1所示，确认了实施例中获得的粘合膜具有高的储存稳定性和耐热性，并且在干燥状态下在5GHz下其介电常数(Dk)为2.5，介质损耗因数(Df)为0.007。
相反，与实施例相比，确认了比较例中获得的粘合膜具有较低的储存稳定性或耐热性，特别是在比较例3的情况下，耐热性不足以用作柔性印刷电路板的粘合剂材料，并且储存稳定性非常低，因此难以制备成商品。还确认了比较例1和2的粘合膜表现出相对高的介电常数和介质损耗因数。

Claims (17)

1.一种粘合剂树脂组合物，包含：与0.1重量％至15重量％的二羧酸或其酸酐结合的苯乙烯-乙烯-丁烯-苯乙烯共聚物；
环氧树脂；
固化催化剂，所述固化催化剂包含选自以下的一种或更多种化合物：基于咪唑的化合物、基于亚胺的化合物和基于胺的化合物；和
酸酐化合物，并且
其中所述粘合剂树脂组合物在干燥状态下在5GHz下的介电常数(Dk)为2.8或更低；
其中基于100重量份的与0.1重量％至15重量％的二羧酸或其酸酐结合的所述苯乙烯-乙烯-丁烯-苯乙烯共聚物，所述粘合剂树脂组合物包含
10重量份至80重量份的所述环氧树脂；
10重量份至80重量份的所述酸酐化合物；和
0.05重量份至5重量份的所述固化催化剂；
其中所述环氧树脂与所述酸酐化合物的重量比为2.0至0.05；
其中与0.1重量％至15重量％的二羧酸或其酸酐结合的所述苯乙烯-乙烯-丁烯-苯乙烯共聚物包含5重量％至50重量％的苯乙烯衍生的重复单元。
2.根据权利要求1所述的粘合剂树脂组合物，其中所述酸酐化合物包括选自以下的一种或更多种化合物：苯乙烯-马来酸酐共聚物、甲基四氢邻苯二甲酸酐、邻苯二甲酸酐、六氢邻苯二甲酸酐、四氢邻苯二甲酸酐、甲基六氢邻苯二甲酸酐、甲基降冰片烯二酸酐、甲基纳迪克酸酐、纳迪克酸酐和十二碳烯基琥珀酸酐。
3.根据权利要求1所述的粘合剂树脂组合物，其中所述粘合剂树脂组合物在干燥状态下在5GHz下的介质损耗因数为0.010或更低。
4.根据权利要求1所述的粘合剂树脂组合物，基于100重量份的所述苯乙烯-乙烯-丁烯-苯乙烯共聚物，还包含50重量份至1000重量份的有机溶剂。
5.根据权利要求4所述的粘合剂树脂组合物，其中当在室温下暴露于外部时，与初始粘度相比，所述粘合剂树脂组合物在72小时内的粘度变化比率为2倍或更小。
6.根据权利要求1所述的粘合剂树脂组合物，其中与0.1重量％至15重量％的二羧酸或其酸酐结合的所述苯乙烯-乙烯-丁烯-苯乙烯共聚物的重均分子量为30000至800000。
7.根据权利要求1所述的粘合剂树脂组合物，其中所述二羧酸包括选自以下的一种或更多种：马来酸、邻苯二甲酸、衣康酸、柠康酸、烯基琥珀酸、顺-1,2,3,6-四氢邻苯二甲酸和4-甲基-1,2,3,6-四氢邻苯二甲酸。
8.根据权利要求1所述的粘合剂树脂组合物，其中所述环氧树脂包括选自以下的一种或更多种：联苯酚醛清漆环氧树脂、双酚A型环氧树脂和二环戊二烯苯酚加成反应型环氧树脂。
9.根据权利要求2所述的粘合剂树脂组合物，其中所述苯乙烯-马来酸酐共聚物的重均分子量为1000至50000。
10.根据权利要求2所述的粘合剂树脂组合物，其中所述苯乙烯-马来酸酐共聚物包含50重量％至95重量％的苯乙烯衍生的重复单元。
11.一种粘合膜，包含根据权利要求1所述的粘合剂树脂组合物的固化产物，并且在干燥状态下在5GHz下的介电常数为2.8或更小。
12.根据权利要求11所述的粘合膜，其中所述粘合膜在干燥状态下在5GHz下的介质损耗因数为0.010或更小。
13.根据权利要求11所述的粘合膜，其中所述粘合膜的厚度为1μm至100μm。
14.一种柔性金属层合体，包括：聚酰亚胺树脂膜；金属薄膜，所述金属薄膜包含选自以下的一种或更多种：铜、铁、镍、钛、铝、银、金及其两种或更多种的合金；和在聚酰亚胺膜与所述金属薄膜之间形成的根据权利要求11所述的粘合膜。
15.根据权利要求14所述的柔性金属层合体，其中所述聚酰亚胺树脂膜的厚度为1μm至50μm，并且所述聚酰亚胺树脂膜包含5重量％至75重量％的基于氟的树脂。
16.根据权利要求14所述的柔性金属层合体，其中所述粘合膜在干燥状态下在5GHz下的介电常数为2.2至2.8。
17.根据权利要求14所述的柔性金属层合体，其中所述粘合膜在干燥状态下在5GHz下的介质损耗因数为0.010或更小。
CN201580060901.2A 2014-12-08 2015-12-08 粘合剂树脂组合物、粘合膜和柔性金属层合体 Active CN107001886B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2014-0174976 2014-12-08
KR1020140174976A KR101797723B1 (ko) 2014-12-08 2014-12-08 접착용 수지 조성물, 접착용 필름 및 연성 금속 적층체
PCT/KR2015/013384 WO2016093593A1 (ko) 2014-12-08 2015-12-08 접착용 수지 조성물, 접착용 필름 및 연성 금속 적층체

Publications (2)

Publication Number Publication Date
CN107001886A CN107001886A (zh) 2017-08-01
CN107001886B true CN107001886B (zh) 2019-06-14

Family

ID=56107706

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580060901.2A Active CN107001886B (zh) 2014-12-08 2015-12-08 粘合剂树脂组合物、粘合膜和柔性金属层合体

Country Status (5)

Country Link
US (1) US10280343B2 (zh)
JP (1) JP6409251B2 (zh)
KR (1) KR101797723B1 (zh)
CN (1) CN107001886B (zh)
WO (1) WO2016093593A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7129968B2 (ja) * 2016-08-23 2022-09-02 ダウ グローバル テクノロジーズ エルエルシー ポリオレフィンメンブレンをガラス繊維に結合するための接着剤
KR102254212B1 (ko) * 2019-12-20 2021-05-21 율촌화학 주식회사 저유전 특성이 우수한 폴리올레핀계 접착제 조성물, 이를 이용한 본딩 시트, 인쇄회로기판 및 그 제조 방법
WO2023199738A1 (ja) * 2022-04-11 2023-10-19 株式会社Adeka 組成物及び硬化物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1715353A (zh) * 2004-06-28 2006-01-04 蒂萨股份公司 用于粘结电子元件和导体轨迹的可热活化胶粘带
WO2008043660A1 (de) * 2006-10-06 2008-04-17 Tesa Ag Hitzeaktivierbares klebeband insbesondere für die verklebung von elektronischen bauteilen und leiterbahnen

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3970608A (en) * 1974-04-05 1976-07-20 Bridgestone Tire Company Limited Epoxidized acetylene-conjugated diene random copolymer and the curable composition comprising the same
JP2651223B2 (ja) * 1988-11-29 1997-09-10 サンスター技研株式会社 二液型プライマー
US5001542A (en) 1988-12-05 1991-03-19 Hitachi Chemical Company Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
JP2833111B2 (ja) 1989-03-09 1998-12-09 日立化成工業株式会社 回路の接続方法及びそれに用いる接着剤フィルム
US6534181B2 (en) * 2000-03-27 2003-03-18 Neltec, Inc. Styrene-maleic anhydride copolymer and epoxy resin blend crosslinked with multifunctional amine compounds
JP2005248004A (ja) 2004-03-04 2005-09-15 Toray Ind Inc 半導体装置用接着剤組成物およびそれを用いたカバーレイフィルム及び接着剤シート並びに銅張りポリイミドフィルム
TWI419949B (zh) * 2006-09-28 2013-12-21 Jsr Corp 黏著劑組成物及撓性印刷電路板用基板
JP5008536B2 (ja) * 2007-11-28 2012-08-22 信越化学工業株式会社 接着剤組成物ならびにそれを用いたカバーレイフィルムおよび接着シート
KR101013074B1 (ko) 2009-03-16 2011-02-14 (주)켐텍 에폭시 수지 조성물 및 이를 이용하여 제조된 프린트 배선판용 접착 필름
KR20120040153A (ko) * 2009-06-22 2012-04-26 다우 글로벌 테크놀로지스 엘엘씨 에폭시 수지용 경화제 조성물
JP5463110B2 (ja) 2009-09-24 2014-04-09 ナミックス株式会社 カバーレイフィルム
CN102906211B (zh) 2010-07-23 2014-11-05 大自达电线股份有限公司 导电性粘合剂组合物及导电性粘合膜
US9462688B2 (en) * 2011-09-07 2016-10-04 Lg Chem, Ltd. Flexible metal laminate containing fluoropolymer
KR101299652B1 (ko) * 2011-09-07 2013-08-23 주식회사 엘지화학 불소수지 함유 연성 금속 적층판
US20140335341A1 (en) 2011-12-12 2014-11-13 Lg Chem, Ltd. Cyanate esters-based adhesive resin composition for fabrication of circuit board and flexible metal clad laminate comprising the same
JP5943461B2 (ja) 2012-02-21 2016-07-05 株式会社Adeka ポリイミド用絶縁接着剤
JP5955156B2 (ja) 2012-08-10 2016-07-20 ナミックス株式会社 樹脂組成物、ならびに、それによる接着フィルムおよびカバーレイフィルム
JP5925094B2 (ja) 2012-09-27 2016-05-25 ヘンケルジャパン株式会社 ラベル用ホットメルト粘着剤
JP6022893B2 (ja) 2012-10-24 2016-11-09 ナミックス株式会社 カバーレイフィルム、及びそれを用いたフレキシブルプリント配線板、並びにそれらの製造方法
WO2014147903A1 (ja) * 2013-03-22 2014-09-25 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1715353A (zh) * 2004-06-28 2006-01-04 蒂萨股份公司 用于粘结电子元件和导体轨迹的可热活化胶粘带
WO2008043660A1 (de) * 2006-10-06 2008-04-17 Tesa Ag Hitzeaktivierbares klebeband insbesondere für die verklebung von elektronischen bauteilen und leiterbahnen

Also Published As

Publication number Publication date
WO2016093593A1 (ko) 2016-06-16
US10280343B2 (en) 2019-05-07
JP2017538800A (ja) 2017-12-28
CN107001886A (zh) 2017-08-01
US20170313916A1 (en) 2017-11-02
KR20160069248A (ko) 2016-06-16
JP6409251B2 (ja) 2018-10-24
KR101797723B1 (ko) 2017-11-14

Similar Documents

Publication Publication Date Title
WO2010073885A1 (ja) フィルム状接着剤及び異方導電性接着剤
KR20110044744A (ko) 도전성 접착제 및 그것을 이용한 ｌｅｄ 기판
KR20070011493A (ko) 에폭시 수지 조성물
KR101477353B1 (ko) 수지 조성물 및 이를 포함하는 인쇄 회로 기판용 적층체
CN107001886B (zh) 粘合剂树脂组合物、粘合膜和柔性金属层合体
US20180079856A1 (en) Resin composition, conductive resin conposition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor device
CN103923585A (zh) 一种导电粘接剂组合物和导电粘接膜
CN107112658B (zh) 各向异性导电膜和连接方法
CN102093667B (zh) 环氧树脂组合物及用其制备的覆盖膜
US20200308457A1 (en) Conductive paste composition and ceramic electronic component having external electrodes formed using the same
JP2010275374A (ja) フレキシブルプリント配線板用樹脂組成物、樹脂フィルム、プリプレグ、樹脂付き金属箔、フレキシブルプリント配線板
JP2007056209A (ja) 回路接続用接着剤
JP2004217861A (ja) 耐熱性接着剤ならびにこの接着剤を用いた積層物、接着剤付き放熱板および接着剤付金属箔
TW593611B (en) Adhesive composition for semiconductor device and adhesive sheet for semiconductor device using the same
JP2006232984A (ja) 接着剤組成物ならびにそれを用いたカバーレイフィルムおよび接着シート
JP2007277384A (ja) 導電性接着剤
KR102390263B1 (ko) 본딩 시트 및 연성 인쇄 회로 기판
JP4867805B2 (ja) 電極接続用接着剤
JP2004256678A (ja) 樹脂組成物、カバーレイ及びそれを用いたフレキシブルプリント配線板用銅張積層板
KR102378121B1 (ko) 커버 레이 및 연성 인쇄 회로
KR101862734B1 (ko) 전자 부품 접착 재료 및 전자 부품의 접착 방법
KR20180041697A (ko) 도전성 접착제 조성물, 도전성 접착 시트 및 그것을 이용한 배선 디바이스
KR102388287B1 (ko) 커버 레이 및 연성 인쇄 회로
JP2010141265A (ja) プリント配線板の接続構造および接続方法
JP2013254922A (ja) 金属ベース回路基板

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
TA01 Transfer of patent application right

Effective date of registration: 20171123

Address after: No. 5 industrial West Road, Songshan Lake hi tech Industrial Development Zone, Dongguan, Guangdong

Applicant after: Shengyi Science and Technology Co., Ltd, Guangdong

Address before: Seoul, South Kerean

Applicant before: LG Chemical Ltd.

TA01 Transfer of patent application right
GR01 Patent grant
GR01 Patent grant