CN106856179A - 一种新型集成电路封装工艺 - Google Patents
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- 238000012536 packaging technology Methods 0.000 title claims description 10
- 239000010949 copper Substances 0.000 claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 claims abstract description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 42
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 18
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 238000005538 encapsulation Methods 0.000 claims abstract description 11
- 230000003647 oxidation Effects 0.000 claims abstract description 11
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 11
- 238000006243 chemical reaction Methods 0.000 claims abstract description 10
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- 239000000835 fiber Substances 0.000 claims abstract description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 claims description 8
- 239000010935 stainless steel Substances 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
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- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 150000002148 esters Chemical class 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 238000003486 chemical etching Methods 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 238000012986 modification Methods 0.000 claims description 2
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- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 238000006557 surface reaction Methods 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 abstract 1
- 238000012858 packaging process Methods 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 description 5
- 229920000058 polyacrylate Polymers 0.000 description 5
- 229920002125 Sokalan® Polymers 0.000 description 4
- 230000010412 perfusion Effects 0.000 description 4
- 239000004584 polyacrylic acid Substances 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- -1 finally Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- 239000004744 fabric Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- XEMZLVDIUVCKGL-UHFFFAOYSA-N hydrogen peroxide;sulfuric acid Chemical compound OO.OS(O)(=O)=O XEMZLVDIUVCKGL-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- 229910052698 phosphorus Inorganic materials 0.000 description 1
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- 230000003746 surface roughness Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- SOBHUZYZLFQYFK-UHFFFAOYSA-K trisodium;hydroxy-[[phosphonatomethyl(phosphonomethyl)amino]methyl]phosphinate Chemical compound [Na+].[Na+].[Na+].OP(O)(=O)CN(CP(O)([O-])=O)CP([O-])([O-])=O SOBHUZYZLFQYFK-UHFFFAOYSA-K 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
本发明提出了一种新型自由平面无引脚封装的集成电路封装工艺过程包括:(1)在金属基板上涂覆感光材料;(2)感光材料图形转移,露出线路槽;(3)在图形化区金属基板露出部分镀底电极;(4)在底电极上继续镀铜层;(5)在铜层上镀顶电极;(6)去除剩余感光材料;(7)在铜层侧面修饰有机金属转化膜;(8)将芯片邦定在顶电极上并灌注封装树脂材料;(9)树脂固化成型后去除掉金属基板,露出底电极,完成封装。本发明可解决线宽设计,布线设计以及孤岛电极设计自由性的缺点,可显著增加集成电路封装I/O数,另外,通过顶电极和底电极之间的铜表面黑氧化或棕氧化,大大增强了与封装树脂材料的结合,提升封装散热能力与封装电路可靠性。
Description
技术领域
本发明涉及一种新型集成电路封装工艺,本发明属于电子技术领域。
背景技术
集成电路产业是信息化社会的基础性和先导性产业,集成电路封装测试是整个产业链中的重要一环,表面贴装技术(SMT)是目前广泛采用的中高端封装技术,也是许多先进封装技术的基础。
方形扁平无引脚封装(Quad Flat No-lead Package,QFN)技术是一种重要的集成电路封装工艺,具有表面贴装式封装,焊盘尺寸小、体积小、占有PCB区域小、元件厚度薄、非常低的阻抗、自感,可满足高速或者微波的应用等优点。由于底部中央的大面积裸露焊盘被焊接到PCB的散热焊盘上,使得QFN具有极佳的电和热性能。但缺点在于QFN中部向四周连续布线,线宽受限于铜厚、且难以设计孤岛电极,增加I/0数会带来的生产成本和可靠性问题,限制了芯片和PCB板的设计自由度。
发明内容
针对现有技术的不足,本发明提出了一种新型自由平面无引脚封装的集成电路封装工艺,其特征在于:工艺过程包括:(1)在金属基板上涂覆感光材料;(2)感光材料图形转移,露出线路槽;(3)在图形化区金属基板露出部分镀底电极;(4)在底电极上继续镀铜层;(5)在铜层上镀顶电极;(6)去除剩余感光材料;(7)在铜层侧面修饰有机金属转化膜;(8)将芯片邦定在顶电极上并灌注封装树脂材料;(9)树脂固化成型后去除掉金属基板,露出底电极,完成封装。
感光材料优选聚丙烯酸酯类的干膜、湿膜。
所述底电极为标准电极电势高于铜的金属材料,优选金、银、钯或其合金,顶电极为标准电极电势高于铜且易于焊接的金属,优选银、钯或其合金。
铜层侧面修饰有机金属转化膜优选采用棕氧化或黑氧化工艺在铜的表面反应来获取。
封装树脂材料优选环氧树脂。
所述金属基板为标准电极电势不高于铜的金属或者表面为镜面级不锈钢金属,标准电极电势不高于铜的金属优选铜、铁、铝或其合金,树脂固化成型后采用化学蚀刻方式去除,镜面级不锈钢金属表面粗糙度小于0.04,树脂固化成型后采用物理剥离方式去除。
本发明相比于目前的QFN封装工艺,保留了原有QFN的优势,同时解决线宽设计,布线设计以及孤岛电极设计自由性的缺点,可显著增加集成电路封装I/0数,另外,通过顶电极和底电极之间的铜表面黑氧化或棕氧化,大大增强了与封装树脂材料的结合,提升封装散热能力与封装电路可靠性。
附图说明
图1采用本发明侧面金属镀层结构示意图。1-金属基板;2-底电极;3-铜层;4-顶电极。
图2采用本发明工艺流程图。a-在金属基板上涂覆感光材料;b-在图形化获得线路槽;c-镀底电极;d-镀铜层;e-镀顶电极;f-去除剩余感光材料并在铜层侧面修饰有机金属转化膜;g-邦线;h-灌注封装树脂;i-去除掉金属基板。
具体实施方式
实施例1:
在铜基板上涂覆聚丙烯酸酯干膜,通过曝光图形转移,露出线路槽;在图形化区铜基板露出部分镀3μm银作为底电极,在银底电极上继续镀40μm铜层;在铜层上再镀3μm银作为顶电极,金属层侧面结构如图1所示。去除剩余聚丙烯酸酯干膜,将全部材料浸入硫酸-过氧化氢棕氧化溶液中使得铜表面生成有机金属转化膜,在芯片邦定在顶电极上后灌注环氧封装树脂材料,最后,将铜基板完全腐蚀掉露出银底电极完成封装。工艺流程如图2所示。
实施例2:
在铁基板上涂覆聚丙烯酸酯湿膜,通过曝光图形转移,露出线路槽;在图形化区铁基板露出部分镀2μm金作为底电极,在金底电极上继续镀50μm铜层;在铜层上再镀3μm银作为顶电极。去除剩余聚丙烯酸酯湿膜,将全部材料浸入硫酸-过氧化氢棕氧化溶液中使得顶电机和底电机之间铜层侧表面生成有机金属转化膜,在芯片邦定在顶电极上后灌注环氧封装树脂材料,最后,将铁基板完全腐蚀掉露出金底电极完成封装。
实施例3:
在铝基板上涂覆聚丙烯酸酯湿膜,通过曝光图形转移,露出线路槽;在图形化区铝基板露出部分镀2μm银作为底电极,在银底电极上继续镀45μm铜层;在铜层上再镀2μm银作为顶电极。去除剩余聚丙烯酸酯湿膜,将全部材料浸入氢氧化钠-亚硝酸钠-磷酸三钠黑氧化溶液中使得铜表面生成有机金属转化膜,在芯片邦定在顶电极上后灌注环氧封装树脂材料,最后,将铝基板完全腐蚀掉露出银底电极完成封装。
实施例4:
在镜面不锈钢基板上涂覆聚丙烯酸酯湿膜,通过曝光图形转移,露出线路槽;在图形化区不锈钢基板露出部分镀1μm金作为底电极,在金底电极上继续镀30μm铜层;在铜层上再镀1μm银作为顶电极。去除剩余聚丙烯酸酯湿膜,将全部材料浸入氢氧化钠-亚硝酸钠-磷酸三钠黑氧化溶液中使得铜表面生成有机金属转化膜,在芯片邦定在顶电极上后灌注环氧封装树脂材料,最后,将镜面不锈钢基板物理剥离露出金底电极完成封装。
Claims (6)
1.一种新型集成电路封装工艺,其特征在于:工艺过程包括:(1)在金属基板上涂覆感光材料;(2)感光材料图形转移,露出线路槽;(3)在图形化区金属基板露出部分镀底电极;(4)在底电极上继续镀铜层;(5)在铜层上镀顶电极;(6)去除剩余感光材料;(7)在铜层侧面修饰有机金属转化膜;(8)将芯片邦定在顶电极上并灌注封装树脂材料;(9)树脂固化成型后去除掉金属基板,露出底电极,完成封装。
2.根据权利要求1所述一种新型集成电路封装工艺,其特征在于:所述感光材料优选聚丙烯酸酯类的干膜、湿膜。
3.根据权利要求1所述一种新型集成电路封装工艺,其特征在于:所述底电极为标准电极电势高于铜的金属材料,优选金、银、钯或其合金,顶电极为标准电极电势高于铜且易于焊接的金属,优选银、钯或其合金。
4.根据权利要求1所述一种新型集成电路封装工艺,其特征在于:铜层侧面修饰有机金属转化膜优选采用棕氧化或黑氧化工艺在铜的表面反应来获取。
5.根据权利要求1所述一种新型集成电路封装工艺,其特征在于:封装树脂材料优选环氧树脂。
6.根据权利要求1所述一种新型集成电路封装工艺,其特征在于:所述金属基板为标准电极电势不高于铜的金属或者表面为镜面级不锈钢金属,标准电极电势不高于铜的金属优选铜、铁、铝或其合金,树脂固化成型后采用化学蚀刻方式去除,镜面级不锈钢金属表面粗糙度小于0.04,树脂固化成型后采用物理剥离方式去除。
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Citations (3)
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CN1538518A (zh) * | 2003-04-16 | 2004-10-20 | �¹������ҵ��ʽ���� | 导体衬底,半导体器件及其制造方法 |
CN1599046A (zh) * | 2004-08-09 | 2005-03-23 | 江苏长电科技股份有限公司 | 集成电路或分立元件超薄无脚封装工艺及其封装结构 |
CN1702846A (zh) * | 2005-04-07 | 2005-11-30 | 江苏长电科技股份有限公司 | 新型集成电路或分立元件超薄无脚封装工艺及其封装结构 |
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CN1538518A (zh) * | 2003-04-16 | 2004-10-20 | �¹������ҵ��ʽ���� | 导体衬底,半导体器件及其制造方法 |
CN1599046A (zh) * | 2004-08-09 | 2005-03-23 | 江苏长电科技股份有限公司 | 集成电路或分立元件超薄无脚封装工艺及其封装结构 |
CN1702846A (zh) * | 2005-04-07 | 2005-11-30 | 江苏长电科技股份有限公司 | 新型集成电路或分立元件超薄无脚封装工艺及其封装结构 |
Non-Patent Citations (1)
Title |
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潘江桥: "《航天电子互联技术》", 31 December 2015, 中国宇航出版社 * |
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