CN109461663A - 一种集成电路封装工艺 - Google Patents
一种集成电路封装工艺 Download PDFInfo
- Publication number
- CN109461663A CN109461663A CN201811267250.6A CN201811267250A CN109461663A CN 109461663 A CN109461663 A CN 109461663A CN 201811267250 A CN201811267250 A CN 201811267250A CN 109461663 A CN109461663 A CN 109461663A
- Authority
- CN
- China
- Prior art keywords
- electrode
- integrated circuit
- copper
- coating
- technique
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 11
- 238000000576 coating method Methods 0.000 claims abstract description 36
- 229910052802 copper Inorganic materials 0.000 claims abstract description 34
- 239000010949 copper Substances 0.000 claims abstract description 34
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000011248 coating agent Substances 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 16
- 238000004382 potting Methods 0.000 claims abstract description 15
- 239000002322 conducting polymer Substances 0.000 claims abstract description 14
- 229920001940 conductive polymer Polymers 0.000 claims abstract description 14
- 230000003647 oxidation Effects 0.000 claims abstract description 10
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 10
- 238000005516 engineering process Methods 0.000 claims abstract description 7
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 238000005538 encapsulation Methods 0.000 claims description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- 229920000767 polyaniline Polymers 0.000 claims description 6
- 229920000128 polypyrrole Polymers 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 150000002148 esters Chemical class 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 4
- 239000000835 fiber Substances 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 238000004528 spin coating Methods 0.000 claims description 4
- YMMGRPLNZPTZBS-UHFFFAOYSA-N 2,3-dihydrothieno[2,3-b][1,4]dioxine Chemical compound O1CCOC2=C1C=CS2 YMMGRPLNZPTZBS-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 claims 2
- SEPPVOUBHWNCAW-FNORWQNLSA-N (E)-4-oxonon-2-enal Chemical compound CCCCCC(=O)\C=C\C=O SEPPVOUBHWNCAW-FNORWQNLSA-N 0.000 claims 1
- LLBZPESJRQGYMB-UHFFFAOYSA-N 4-one Natural products O1C(C(=O)CC)CC(C)C11C2(C)CCC(C3(C)C(C(C)(CO)C(OC4C(C(O)C(O)C(COC5C(C(O)C(O)CO5)OC5C(C(OC6C(C(O)C(O)C(CO)O6)O)C(O)C(CO)O5)OC5C(C(O)C(O)C(C)O5)O)O4)O)CC3)CC3)=C3C2(C)CC1 LLBZPESJRQGYMB-UHFFFAOYSA-N 0.000 claims 1
- 239000004743 Polypropylene Substances 0.000 claims 1
- 229940074391 gallic acid Drugs 0.000 claims 1
- 235000004515 gallic acid Nutrition 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- -1 polypropylene Polymers 0.000 claims 1
- 229920001155 polypropylene Polymers 0.000 claims 1
- 238000005530 etching Methods 0.000 abstract description 3
- 238000006087 Brown hydroboration reaction Methods 0.000 abstract description 2
- 229920000058 polyacrylate Polymers 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 229920002125 Sokalan® Polymers 0.000 description 4
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 4
- 239000004584 polyacrylic acid Substances 0.000 description 4
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- 241000790917 Dioxys <bee> Species 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- XGZRAKBCYZIBKP-UHFFFAOYSA-L disodium;dihydroxide Chemical compound [OH-].[OH-].[Na+].[Na+] XGZRAKBCYZIBKP-UHFFFAOYSA-L 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- XEMZLVDIUVCKGL-UHFFFAOYSA-N hydrogen peroxide;sulfuric acid Chemical compound OO.OS(O)(=O)=O XEMZLVDIUVCKGL-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229930192474 thiophene Natural products 0.000 description 2
- SXMUSCUQMMSSKP-UHFFFAOYSA-N [O].C=1C=CSC=1 Chemical compound [O].C=1C=CSC=1 SXMUSCUQMMSSKP-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811267250.6A CN109461663A (zh) | 2018-10-29 | 2018-10-29 | 一种集成电路封装工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811267250.6A CN109461663A (zh) | 2018-10-29 | 2018-10-29 | 一种集成电路封装工艺 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109461663A true CN109461663A (zh) | 2019-03-12 |
Family
ID=65608644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811267250.6A Withdrawn CN109461663A (zh) | 2018-10-29 | 2018-10-29 | 一种集成电路封装工艺 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109461663A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4328355A2 (en) | 2022-08-23 | 2024-02-28 | Indian Oil Corporation Limited | Process of reusing bi-facial metal substrates for photoactive semiconductor materials for solar water splitting |
-
2018
- 2018-10-29 CN CN201811267250.6A patent/CN109461663A/zh not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4328355A2 (en) | 2022-08-23 | 2024-02-28 | Indian Oil Corporation Limited | Process of reusing bi-facial metal substrates for photoactive semiconductor materials for solar water splitting |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102354691B (zh) | 一种高密度四边扁平无引脚封装及制造方法 | |
CN103632979B (zh) | 芯片封装基板和结构及其制作方法 | |
US20190006196A1 (en) | Method for packaging chip and chip package structure | |
TW201126618A (en) | Method and system for manufacturing an IC package | |
CN203103285U (zh) | 一种高密度蚀刻引线框架fcaaqfn封装件 | |
JP2010238693A (ja) | 半導体素子用基板の製造方法および半導体装置 | |
JP2010086983A (ja) | リードフレーム型基板の製造方法と半導体装置 | |
CN107195555B (zh) | 一种芯片封装方法 | |
CN103021890A (zh) | 一种qfn封装器件的制造方法 | |
CN109461663A (zh) | 一种集成电路封装工艺 | |
CN104952741A (zh) | 柔性基板上的电气电路 | |
CN107342354B (zh) | 一种ic封装工艺 | |
CN104465575A (zh) | 半导体封装及其制造方法 | |
JP3879135B2 (ja) | 転写配線支持部材及びそれを使用した半導体パッケージの製造法 | |
WO2010106779A1 (ja) | 半導体素子用基板の製造方法および半導体装置 | |
JP3617072B2 (ja) | チップキャリア | |
JP2009147117A (ja) | リードフレーム型基板の製造方法及び半導体基板 | |
CN103065975A (zh) | 一种再布线qfn封装器件的制造方法 | |
CN219039975U (zh) | 一种防氧化的透明显示薄膜 | |
US6673656B2 (en) | Semiconductor chip package and manufacturing method thereof | |
CN100372084C (zh) | 热增强型球栅阵列集成电路封装基板制造方法及封装基板 | |
CN107068577B (zh) | 一种集成电路封装工艺 | |
CN206907754U (zh) | 一种ic封装用载板 | |
KR101674536B1 (ko) | 리드프레임을 이용한 회로 기판의 제조 방법 | |
US8846444B2 (en) | Semiconductor package and method for manufacturing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20191204 Address after: Qingpu District of Shanghai City Hua Pu Road 201799 No. 500 building 6 room 6137 E Applicant after: Shanghai Huili Electronic Technology Co., Ltd. Address before: Qingpu District of Shanghai City Hua Pu Road 201799 No. 500 building 6 room 6137 E Applicant before: Shanghai Huili Electronic Technology Co., Ltd. Applicant before: Shenzhen Huili Creative Intelligence Technology Co., Ltd. |
|
TA01 | Transfer of patent application right | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190312 |
|
WW01 | Invention patent application withdrawn after publication |