CN106816419B - 薄膜上芯片封装 - Google Patents

薄膜上芯片封装 Download PDF

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CN106816419B
CN106816419B CN201611099295.8A CN201611099295A CN106816419B CN 106816419 B CN106816419 B CN 106816419B CN 201611099295 A CN201611099295 A CN 201611099295A CN 106816419 B CN106816419 B CN 106816419B
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CN106816419A (zh
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黄文静
林泰宏
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Novatek Microelectronics Corp
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Abstract

本发明公开一种薄膜上芯片封装，包括薄膜基板、芯片及散热片材。所述薄膜基板包括第一表面。所述芯片安置于所述第一表面上且沿所述芯片的第一轴线具有芯片长度。所述散热片材包括覆盖部及第一延伸部，所述第一延伸部连接至所述覆盖部并贴附至所述第一表面。所述覆盖部至少局部地覆盖所述芯片并沿所述第一轴线具有第一长度。所述第一延伸部沿所述第一轴线具有第二长度，所述第二长度实质上长于所述覆盖部的所述第一长度，且所述覆盖部暴露出所述芯片的侧表面，其中所述侧表面连接所述芯片的顶表面与底表面。

Description

薄膜上芯片封装
技术领域
本发明大体来说涉及一种芯片封装。更具体来说，本发明涉及一种薄膜上芯片封装。
背景技术
在半导体生产中，集成电路(integrated circuit，IC)的制造可被划分为三个不同的阶段，即，晶片制作阶段、集成电路制作阶段及例如应用薄膜上芯片(chip-on-film，COF)封装等的集成电路封装阶段。
为加快自薄膜上芯片封装的晶片散热，在将芯片通过凸块(bump)电连接至薄膜基板之后，通常利用导热胶(thermal conductive glue)将散热片材贴附至薄膜基板的顶表面以覆盖整个芯片或贴附至薄膜基板的与晶片相对的底表面。传统上，在将散热片材贴附于薄膜基板上以对芯片进行覆盖的过程期间，难以使散热片材与芯片紧密贴附在一起，因此，在芯片与散热片材之间常常存在气隙(air gap)。由此，在后续的热处理期间，在芯片与散热片材之间截留的空气将会膨胀，这可能会造成散热片材与芯片分离且降低芯片封装的可靠性。此外，由于空气的导热性相当低，因此在芯片与散热片材之间的空间中截留的空气也将影响自芯片产生的热传导至散热片材的效率。
发明内容
因此，本发明的目的在于提供一种具有优良的散热效率的薄膜上芯片封装。
本发明提供一种薄膜上芯片封装，所述薄膜上芯片封装包括薄膜基板、芯片及散热片材。所述薄膜基板包括第一表面。所述芯片安置于所述第一表面上且沿所述芯片的第一轴线具有芯片长度。所述散热片材包括覆盖部及第一延伸部，所述第一延伸部连接至所述覆盖部并贴附至所述第一表面。所述覆盖部至少局部地覆盖所述芯片并沿所述第一轴线具有第一长度。所述第一延伸部沿所述第一轴线具有第二长度，所述第二长度实质上长于所述覆盖部的所述第一长度，且所述覆盖部暴露出所述芯片的侧表面，其中所述侧表面连接所述芯片的顶表面与底表面。
根据本发明的实施例，所述第一长度等于或短于所述芯片长度，使得所述覆盖部暴露出所述芯片的所述侧表面。
根据本发明的实施例，所述第一长度长于所述芯片长度，且所述覆盖部在所述芯片的所述顶表面上方悬伸以暴露出所述芯片的所述侧表面。
根据本发明的实施例，所述芯片安置于所述薄膜基板的外围区上。
根据本发明的实施例，所述芯片安置于所述薄膜基板的中心区处。
根据本发明的实施例，所述散热片材还包括第二延伸部，且所述覆盖部连接于所述第一延伸部与所述第二延伸部之间。
根据本发明的实施例，所述散热片材包括散热层及保护层，所述散热层贴附至所述薄膜基板及所述芯片，且所述保护层完全覆盖所述散热层。
根据本发明的实施例，所述保护层包括绝缘膜。
根据本发明的实施例，所述散热层包括金属箔或石墨薄膜。
根据本发明的实施例，所述散热片材还包括第一粘合层，且所述散热层通过所述第一粘合层贴附至所述薄膜基板及所述芯片。
根据本发明的实施例，所述保护层的尺寸大于所述散热层的尺寸，且在所述保护层的轮廓线与所述散热层的轮廓线之间保持有保护距离。
根据本发明的实施例，所述散热片材还包括第二粘合层，所述第二粘合层形成于所述保护层的附着表面上且粘着至所述散热层。
根据本发明的实施例，所述保护层包括边界区，所述边界区环绕所述保护层的所述附着表面的边界，且所述第二粘合层暴露出所述保护层的所述边界区。
根据本发明的实施例，所述薄膜上芯片封装还包括辅助散热片材，所述辅助散热片材安置于所述薄膜基板的第二表面上，其中所述第二表面上与所述薄膜基板的所述第一表面相对。
根据上述，在本发明中，所述薄膜上芯片封装利用所述散热片材，所述散热片材包括覆盖部及至少一个延伸部，其中所述覆盖部覆盖所述芯片并暴露出所述芯片的侧表面，且所述延伸部连接所述覆盖部并贴附至所述薄膜基板。利用这种配置，由于所述散热片材的覆盖部并非完全包围所述芯片，而是暴露出所述芯片的侧表面，因而可使芯片与散热片材之间的空气轻易地排出。如此，可防止所述散热片材在后续热处理期间变形或甚至与所述芯片分离的问题发生，从而提高薄膜上芯片封装的可靠性。
附图说明
为提供对本发明的进一步理解，在本说明书中包含附图，所述附图并入本说明书中并构成本说明书的一部分。所述附图示出本发明的实施例并与本说明一起用于阐释本发明的原理。
图1A为本发明实施例的薄膜上芯片封装的俯视图；
图1B为图1A所示薄膜上芯片封装的透视图；
图2A为本发明另一实施例的薄膜上芯片封装的俯视图；
图2B为图2A所示薄膜上芯片封装的透视图；
图3为本发明又一实施例的薄膜上芯片封装的俯视图；
图4为本发明又一实施例的薄膜上芯片封装的俯视图；
图5为本发明实施例的薄膜上芯片封装的薄膜基板的俯视图；
图6为本发明实施例的薄膜上芯片封装的剖视图；
图7为本发明实施例的薄膜上芯片封装及用于贴附散热片材的夹具的正视图。
符号的说明
100、200、300、400：薄膜上芯片封装
110：薄膜基板
112：第一表面
114：第二表面
118：经图案化电路层
119：阻焊层
120：芯片
122：侧表面
124：顶表面
125：底表面
130：散热片材
132：覆盖部
134、134a：第一延伸部
134b：第二延伸部
135、142：第一粘合层
136、144：散热层
137、146：第二粘合层
138、148：保护层
140：辅助散热片材
700：夹具
A1：第一轴线
A2：第二轴线
B-B’：线
L1：芯片长度
L2：第一长度/长度
L3：第二长度/长度
R1：中心区
R2：外围区
具体实施方式
现将详细参照本发明的当前优选实施例，在附图中示出所述优选实施例的实例。尽可能地，在附图及说明中使用相同的参考编号指代相同或相似的部件。
图1A为本发明实施例的薄膜上芯片封装的俯视图。图1B为图1A所示薄膜上芯片封装的透视图。图5为本发明实施例的薄膜上芯片封装的薄膜基板的俯视图。图6为本发明实施例的薄膜上芯片封装的剖视图，即，在图1A中薄膜上芯片封装100的沿线B-B'的剖视图。参照图1A、图1B、图5及图6，在本实施例中，薄膜上芯片封装(chip on film package)100包括薄膜基板110、芯片120及散热片材130。薄膜基板110包括第一表面112及与第一表面112相对的第二表面114。芯片120安置于第一表面112上且沿芯片120的第一轴线A1具有芯片长度L1，其中第一轴线A1可为芯片120的纵向轴线，但本发明并非仅限于此。在本实施例中，薄膜基板110还可包括图案化电路层118及阻焊层119。图案化电路层118安置于薄膜基板110的第一表面112上。阻焊层119覆盖图案化电路层118并暴露出图案化电路层118的一部分，使得芯片120可电连接至被阻焊层119所暴露的图案化电路层118。
如图1A中所示，散热片材130包括覆盖部132及第一延伸部134。覆盖部132至少局部地覆盖芯片120并贴附至薄膜基板110。例如树脂等填充材料可填充于芯片120、薄膜基板110与散热片材130之间以进一步固定芯片120的位置。覆盖部132沿第一轴线A1具有第一长度L2(以下被称为长度L2)。第一延伸部134连接至覆盖部132且贴附至薄膜基板110的第一表面112。第一延伸部134沿第一轴线A1具有第二长度L3(以下被称为长度L3)，且第一延伸部134的长度L3实质上长于覆盖部132的长度L2，且覆盖部132暴露出芯片120的如图1B中所示的侧表面122。在本实施例中，如图6中所示，所述芯片的侧表面122连接芯片120的顶表面124与底表面125。
利用这种配置，可使芯片120与散热片材130之间的空间中的空气及/或水气轻易地排出，因为散热片材130的覆盖部132并非完全包围芯片120，而是暴露出芯片120的侧表面122。如此，可避免散热片材130在高温及/或高湿度条件下变形或甚至与芯片120分离的问题，从而提高薄膜上芯片封装的可靠性。
更具体而言，覆盖部132的长度L2约可等于或短于芯片长度L1。在本实施例中，如图1A中所示，覆盖部132的长度L2短于芯片长度L1，使得覆盖部132暴露出芯片120的顶表面124的一部分及侧表面122。在其他实施例中，覆盖部132的长度L2可约等于芯片长度L1。也就是说，覆盖部132的边缘与芯片120的边缘对齐，使得覆盖部132暴露出芯片120的侧表面122。如图5中所示，薄膜基板110包括中心区R1及环绕中心区R1的外围区R2。在本实施例中，芯片120安置于薄膜基板110的外围区R2。散热片材130利用其覆盖部132来覆盖芯片120且利用其第一延伸部134来贴附至薄膜基板110。应注意的是，上述例如中心区R1及外围区R2等定向术语为相对性用语，且中心区R1未必位于薄膜基板110的中心处。本发明的组件可定位于许多不同的定向上。由此，所述定向术语是用于说明目的且不具有任何限制性。
详细来说，如图6中所示，散热片材130还可包括第一粘合层135、散热层136、第二粘合层137、及保护层138，其中散热层136通过第一粘合层135而贴附至薄膜基板110及芯片120，保护层138完全覆盖散热层136、且第二粘合层137形成于保护层138的附着表面上且粘着至散热层136。在本实施例中，保护层138可包括绝缘膜，且散热层136可包括金属箔或石墨薄膜，但本发明并非仅限于此。
在本实施例中，如图6中所示，保护层138的尺寸大于散热层136的尺寸，且在保护层138的轮廓线与散热层136的轮廓线之间保持有保护距离。也就是说，散热层136暴露出保护层138的边界区。相似地，如图6中所示，保护层138的尺寸大于第二粘合层137的尺寸，且在保护层138的轮廓线与第二粘合层137的轮廓线之间保持有保护距离。也就是，保护层138包括边界区，所述边界区环绕保护层138的附着表面的边界，且第二粘合层137暴露出保护层138的边界区。由此，当散热片材130被压合以贴附于薄膜基板110时，可避免粘合剂溢出的问题。
此外，如图6中所示，薄膜上芯片封装100还可包括辅助散热片材140，辅助散热片材140安置于薄膜基板110的第二表面114上。辅助散热片材140的结构可与散热片材130的结构相同或相似。也就是说，如图6中所示，辅助散热片材140也可包括第一粘合层142、散热层144、第二粘合层146及保护层148，其中散热层144通过第一粘合层142而贴附至薄膜基板110的第二表面114，保护层148完全覆盖散热层144，且第二粘合层146形成于保护层148的附着表面上且粘着至散热层144。
相似地，如图6中所示，保护层148的尺寸大于散热层144的尺寸，因此，在保护层148的轮廓线与散热层144的轮廓线之间保持有保护距离。保护层148的尺寸大于第二粘合层146的尺寸，使得第二粘合层146暴露出保护层148的边界区。如此，当辅助散热片材140被压合以贴附至薄膜基板110时可避免粘合剂溢出的问题。
图2A为本发明另一实施例的薄膜上芯片封装的俯视图。应注意，图2A中所示的薄膜上芯片封装200含有许多与先前图1A所公开的薄膜上芯片封装100相同或相似的特征。图2B为图2A所示薄膜上芯片封装200的透视图。薄膜上芯片封装200的沿线B-B'的剖视图与图6相似。出于清晰及简明的目的，可不再对相同或相似的特征予以赘述，且相同的参考编号表示相同或相似的组件。以下将针对图2A中所示的薄膜上芯片封装200与图1A中所示的薄膜上芯片封装100之间的主要差异进行阐述。
在本实施例中，如图2A中所示，覆盖部132的长度L2约长于芯片长度L1。由此，覆盖部132在芯片120的顶表面124上方悬伸以暴露出芯片120的如图2B中所示的侧表面122。根据所示，本发明并不限制覆盖部132沿第一轴线A1的长度L2，只要覆盖部132暴露出芯片120的侧表面122即可。
图3为本发明又一实施例的薄膜上芯片封装的俯视图。应注意的是，图3中所示的薄膜上芯片封装300含有许多与先前图1A所公开的薄膜上芯片封装100相同或相似的特征。薄膜上芯片封装300的沿线B-B'的剖视图与图6相似。出于清晰及简明的目的，可不再对相同或相似的特征予以赘述，且相同的参考编号表示相同或相似的组件。以下将对图3中所示的薄膜上芯片封装300与图1A中所示的薄膜上芯片封装100之间的主要差异进行阐述。
在本实施例中，芯片120安置于薄膜基板110的中心区(例如，图5中所示的中心区R1)上。利用这种配置，散热片材130可包括第一延伸部134a及第二延伸部134b，且第一延伸部134a及第二延伸部134b二者均贴附至薄膜基板110。覆盖部132连接于第一延伸部134a与第二延伸部134b之间。也就是说，第一延伸部134a及第二延伸部134b沿垂直于第一轴线A1的第二轴线A2分别连接覆盖部132的相对两侧。
更具体来说，覆盖部132的长度L2约等于或短于芯片120的芯片长度L1。在本实施例中，覆盖部132的长度L2短于芯片120的芯片长度L1，使得覆盖部132暴露出芯片120的顶表面124与侧表面122的一部分。当然，在另一实施例中，覆盖部132的长度L2可约等于芯片120的芯片长度L1，使得覆盖部132暴露出芯片120的侧表面122。也就是说，覆盖部132的边缘与芯片120的边缘对齐，因此，覆盖部132暴露出芯片120的侧表面122。
图4为本发明又一实施例的薄膜上芯片封装的俯视图。应注意，图4中所示的薄膜上芯片封装400含有许多与先前图3所公开的薄膜上芯片封装300相同或相似的特征。薄膜上芯片封装400的沿线B-B'的剖视图与图6相似。出于清晰及简明的目的，可不再对相同或相似的特征予以赘述，且相同的参考编号表示相同或相似的组件。以下将对图4中所示的薄膜上芯片封装400与图3中所示的薄膜上芯片封装300之间的主要差异进行阐述。
在本实施例中，如图4中所示，覆盖部132的长度L2约长于芯片120的芯片长度L1。由此，覆盖部132在芯片120的顶表面124上方悬伸以暴露出芯片120的侧表面122。根据所示，本发明并不限制覆盖部132沿第一轴线A1的长度L2，只要覆盖部132暴露出芯片120的侧表面122即可。
图7为本发明实施例的薄膜上芯片封装(例如，薄膜上芯片封装100、200、300或400)及用于贴附散热片材的夹具的正视图。参照图7，在本实施例中，散热片材130可通过夹具(fixture)700被压合且贴附至薄膜基板110。夹具700可由柔性材料制成以避免损坏薄膜上芯片封装。在本实施例中，夹具700包括与芯片120的位置对应的空腔，因此，所述空腔用以在夹具700将散热片材130压合至薄膜基板110上时容纳芯片120。夹具700可沿纵向轴线自芯片120的一侧移动(例如，滚动)至芯片120的另一侧，以压合散热片材130以使其贴附于薄膜基板110上并覆盖芯片120。在本实施例中，在夹具700的空腔与芯片120之间可存在间距，且所述间距可处于自0.5mm至1mm的范围中，但本发明并非仅限于此。
综上所述，本发明的薄膜上芯片封装具有散热片材，所述散热片材包括覆盖部及至少一个延伸部，其中所述覆盖部覆盖芯片并暴露出所述芯片的侧表面，且所述延伸部连接所述覆盖部并贴附至所述薄膜基板。利用这种配置，由于所述散热片材的覆盖部并非完全包围所述芯片，而是暴露出所述芯片的侧表面，因而使芯片与散热片材之间的空气及/或水气可轻易地被排出。如此，可避免所述散热片材在高温及/或高湿度条件下变形或甚至与所述芯片分离的问题，从而提高薄膜上芯片封装的可靠性。
对于所属领域中的技术人员而言将显而易见的是，在不背离本发明的范围或精神的条件下，可对本发明的结构作出各种润饰及变化。根据上述，意欲使本发明涵盖本发明的润饰及变化，只要其落于以上权利要求及其等效范围的范围内即可。

Claims (14)

1.一种薄膜上芯片封装，其特征在于，包括：
薄膜基板，包括第一表面；
芯片，安置于所述第一表面上且沿所述芯片的第一轴线具有芯片长度；以及
散热片材，包括覆盖部及第一延伸部，所述第一延伸部连接至所述覆盖部并贴附至所述第一表面，所述覆盖部至少局部地覆盖所述芯片并沿所述第一轴线具有第一长度，所述第一延伸部沿所述第一轴线具有第二长度，所述第二长度长于所述覆盖部的所述第一长度，且所述覆盖部暴露出所述芯片的侧表面，其中所述侧表面连接所述芯片的顶表面与底表面。
2.根据权利要求1所述的薄膜上芯片封装，其特征在于，所述第一长度等于或短于所述芯片长度，使得所述覆盖部暴露出所述芯片的所述侧表面。
3.根据权利要求1所述的薄膜上芯片封装，所述第一长度长于所述芯片长度，且所述覆盖部在所述芯片的所述顶表面上方悬伸以暴露出所述芯片的所述侧表面。
4.根据权利要求1所述的薄膜上芯片封装，所述芯片安置于所述薄膜基板的外围区。
5.根据权利要求1所述的薄膜上芯片封装，所述芯片安置于所述薄膜基板的中心区。
6.根据权利要求1所述的薄膜上芯片封装，所述散热片材还包括第二延伸部，且所述覆盖部连接于所述第一延伸部与所述第二延伸部之间。
7.根据权利要求1所述的薄膜上芯片封装，所述散热片材包括散热层及保护层，所述散热层貼附于所述薄膜基板及所述芯片上，且所述保护层完全覆盖所述散热层。
8.根据权利要求7所述的薄膜上芯片封装，所述保护层包括绝缘膜。
9.根据权利要求7所述的薄膜上芯片封装，所述散热层包括金属箔或石墨薄膜。
10.根据权利要求7所述的薄膜上芯片封装，所述散热片材还包括第一粘合层，且所述散热层通过所述第一粘合层贴附至所述薄膜基板及所述芯片。
11.根据权利要求7所述的薄膜上芯片封装，所述保护层的尺寸大于所述散热层的尺寸，且在所述保护层的轮廓线与所述散热层的轮廓线之间保持有保护距离。
12.根据权利要求11所述的薄膜上芯片封装，所述散热片材还包括第二粘合层，所述第二粘合层形成于所述保护层的附着表面上且粘着至所述散热层。
13.根据权利要求12所述的薄膜上芯片封装，所述保护层包括边界区，所述边界区环绕所述保护层的所述附着表面的边界，且所述第二粘合层暴露出所述保护层的所述边界区。
14.根据权利要求1所述的薄膜上芯片封装，还包括辅助散热片材，所述辅助散热片材安置于所述薄膜基板的第二表面上，其中所述第二表面与所述第一表面相对。
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