CN106671548B - 一种cem-1覆铜板的制备方法 - Google Patents
一种cem-1覆铜板的制备方法 Download PDFInfo
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- CN106671548B CN106671548B CN201611102752.4A CN201611102752A CN106671548B CN 106671548 B CN106671548 B CN 106671548B CN 201611102752 A CN201611102752 A CN 201611102752A CN 106671548 B CN106671548 B CN 106671548B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B29/005—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to another layer of paper or cardboard layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/02—Layered products comprising a layer of paper or cardboard next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/12—Coating on the layer surface on paper layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Laminated Bodies (AREA)
Abstract
Description
指标名称 | 单位 | 普通 | 实施例1 | 实施例2 | 实施例3 |
剥离强度 | N/mm | 1.80 | 1.76 | 1.73 | 1.75 |
浸焊性 | 288℃/s | 20 | 60 | 57 | 53 |
阻燃性 | s | FV0 | FV0 | FV0 | FV0 |
冲孔性 | — | 良 | 良 | 良 | 良 |
CTI | V | 200 | 600 | 600 | 600 |
热导率 | W/m·K | 0.35 | 0.91 | 0.97 | 1.01 |
Claims (9)
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CN201611102752.4A CN106671548B (zh) | 2016-12-05 | 2016-12-05 | 一种cem-1覆铜板的制备方法 |
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CN201611102752.4A CN106671548B (zh) | 2016-12-05 | 2016-12-05 | 一种cem-1覆铜板的制备方法 |
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CN106671548A CN106671548A (zh) | 2017-05-17 |
CN106671548B true CN106671548B (zh) | 2018-10-02 |
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Families Citing this family (17)
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CN107629748A (zh) * | 2017-09-30 | 2018-01-26 | 苏州万润绝缘材料有限公司 | 一种钛白色半固化片的胶液 |
CN107805474A (zh) * | 2017-11-21 | 2018-03-16 | 苏州市宽道模具机械有限公司 | 一种金属与非金属粘合用粘合剂及其制备方法 |
CN108566726A (zh) * | 2018-05-30 | 2018-09-21 | 奇酷互联网络科技(深圳)有限公司 | 半固化片、半固化片的制作方法、电路板及电子设备 |
CN110871610B (zh) * | 2018-08-30 | 2022-01-07 | 深圳市昱谷科技有限公司 | 碳纳米管复合材料覆铜板 |
CN109265926A (zh) * | 2018-09-10 | 2019-01-25 | 南亚电子材料(昆山)有限公司 | 一种用于覆铜板韧性的材料及用于覆铜板树脂组合物 |
CN110027290B (zh) * | 2019-05-07 | 2019-11-29 | 莱州鹏洲电子有限公司 | 一种白色复合基覆铜箔层压板及其制备方法 |
CN110435254B (zh) * | 2019-08-29 | 2021-12-03 | 山东金宝电子股份有限公司 | 一种高耐热、高cti的cem-3覆铜板的制备方法 |
CN110551472A (zh) * | 2019-10-23 | 2019-12-10 | 常州澳弘电子股份有限公司 | 一种铝基覆铜板专用高导热粘结片的制备方法 |
CN114068794A (zh) * | 2021-11-11 | 2022-02-18 | 深圳市中美欧光电科技有限公司 | 一种cob封装镜面铝基板及其加工工艺 |
CN114434904A (zh) * | 2021-11-22 | 2022-05-06 | 安徽鸿海新材料股份有限公司 | 一种环氧树脂覆铜板及其制备方法 |
CN114393891B (zh) * | 2022-03-10 | 2023-10-20 | 江苏高驰新材料科技有限公司 | 一种高导热覆铜板及其制备方法 |
CN114649123B (zh) * | 2022-04-11 | 2022-10-14 | 贝迪斯电子有限公司 | 一种耐高温阻燃型精密金属膜电阻器的制造方法 |
CN114907135B (zh) * | 2022-05-16 | 2023-04-07 | 江苏富乐华半导体科技股份有限公司 | 一种氮化铝覆铜陶瓷基板的制备方法 |
CN115302885B (zh) * | 2022-08-10 | 2023-12-19 | 江门建滔积层板有限公司 | 一种高耐热高导热覆铜板及其制备方法 |
CN115521731A (zh) * | 2022-10-11 | 2022-12-27 | 江苏联瑞新材料股份有限公司 | 一种高导热、低机械加工磨损性的功能填料及其制备方法 |
CN116080213A (zh) * | 2022-11-11 | 2023-05-09 | 山东金宝电子有限公司 | 一种led用高导热高耐热cem-3覆铜板的制备方法 |
CN116896819B (zh) * | 2023-06-14 | 2024-05-14 | 江门建滔积层板有限公司 | 一种高导热的覆铜板及其制备方法 |
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CN104210181A (zh) * | 2014-08-14 | 2014-12-17 | 金安国纪科技股份有限公司 | Led灯用高导热覆铜板及其制备方法 |
CN105034492A (zh) * | 2015-07-24 | 2015-11-11 | 山东金宝电子股份有限公司 | 一种高cti、无卤型cem-1覆铜板的制备方法 |
CN105838028A (zh) * | 2016-03-25 | 2016-08-10 | 金安国纪科技(杭州)有限公司 | 一种高导热树脂组合物及其制备方法 |
Family Cites Families (1)
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JP2000015746A (ja) * | 1998-07-02 | 2000-01-18 | Toshiba Chem Corp | 銅張積層板および銅張積層板の製造方法 |
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- 2016-12-05 CN CN201611102752.4A patent/CN106671548B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN104210181A (zh) * | 2014-08-14 | 2014-12-17 | 金安国纪科技股份有限公司 | Led灯用高导热覆铜板及其制备方法 |
CN105034492A (zh) * | 2015-07-24 | 2015-11-11 | 山东金宝电子股份有限公司 | 一种高cti、无卤型cem-1覆铜板的制备方法 |
CN105838028A (zh) * | 2016-03-25 | 2016-08-10 | 金安国纪科技(杭州)有限公司 | 一种高导热树脂组合物及其制备方法 |
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Address after: 265400 No.268, Guoda Road, Zhaoyuan City, Yantai City, Shandong Province Patentee after: Shandong Jinbao Electronics Co.,Ltd. Address before: 265400 No. 128, Wenquan Road, Zhaoyuan, Shandong, Yantai Patentee before: SHANDONG JINBAO ELECTRONICS Co.,Ltd. |