CN116896819B - 一种高导热的覆铜板及其制备方法 - Google Patents
一种高导热的覆铜板及其制备方法 Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 239000007822 coupling agent Substances 0.000 claims abstract description 29
- 239000002994 raw material Substances 0.000 claims abstract description 26
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052794 bromium Inorganic materials 0.000 claims abstract description 22
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 21
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- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
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- 238000006243 chemical reaction Methods 0.000 claims description 47
- 239000000243 solution Substances 0.000 claims description 42
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 36
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 26
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 24
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 24
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- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 19
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 19
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- 239000011737 fluorine Substances 0.000 claims description 19
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- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 claims description 18
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- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 17
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- CAVCGVPGBKGDTG-UHFFFAOYSA-N alumanylidynemethyl(alumanylidynemethylalumanylidenemethylidene)alumane Chemical group [Al]#C[Al]=C=[Al]C#[Al] CAVCGVPGBKGDTG-UHFFFAOYSA-N 0.000 claims description 13
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- QABCGOSYZHCPGN-UHFFFAOYSA-N chloro(dimethyl)silicon Chemical compound C[Si](C)Cl QABCGOSYZHCPGN-UHFFFAOYSA-N 0.000 claims description 13
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- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical group CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 12
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- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical group CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 6
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- ANUZKYYBDVLEEI-UHFFFAOYSA-N butane;hexane;lithium Chemical compound [Li]CCCC.CCCCCC ANUZKYYBDVLEEI-UHFFFAOYSA-N 0.000 description 4
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Abstract
本发明提供了一种高导热的覆铜板,由以下重量份的原料制成:低溴环氧树脂20‑25份,线性酚醛树脂24‑27份,酚醛固化剂6‑8份,固化促进剂0.05‑0.1份,偶联剂4‑4.5份,导热填料85‑90份,溶剂75‑80份。本发明还提供了该覆铜板的制备方法。本发明提供的高导热的覆铜板具有较好的导热性能和耐热性能。
Description
技术领域
本发明涉及覆铜板,特别是涉及一种高导热的覆铜板及其制备方法。
背景技术
电子工业的迅速发展对覆铜板提出了更高更新的要求,尤其在一些大功率、高负载的电子元器件中,要求覆铜板在100-250℃的温度下仍能保持良好的机械电气性能,即要求绝缘层要有更高的耐热性,所以基板如何释放产生的大量热量及高导热性成为了关键。
常规的覆铜板是热的不良导体,热量不易及时散出。因此,开发一种新型高导热覆铜板是业界研究人员研究热点之一。碳化铝覆铜板在热特性方面具有非常高的热导率,散热快;在应力方面,热膨胀系数与硅相近,整个模块内部应力较低,在高功率IGBT模块方面使用非常可靠,这些优异的性能使得碳化铝覆铜板成为大功率、高负载的电子元器件模块封装的首选之一。
发明内容
本发明要解决的技术问题是提供一种高导热的覆铜板,其具有较好的导热性能和耐热性能。
为解决上述技术问题,本发明的技术方案是:
一种高导热的覆铜板,由以下重量份的原料制成:由以下重量份的原料制成:低溴环氧树脂20-25份,线性酚醛树脂24-27份,酚醛固化剂6-8份,固化促进剂0.05-0.1份,偶联剂4-4.5份,导热填料85-90份,溶剂75-80份。
进一步地,本发明所述低溴环氧树脂的环氧当量为420g/eq,溴含量为20%wt。
进一步地,本发明所述线性酚醛树脂的羟基当量为260g/eq。
进一步地,本发明所述酚醛固化剂为羟基当量为110g/eq的酚醛树脂。
进一步地,本发明所述固化促进剂为2-甲基咪唑。
进一步地,本发明所述偶联剂由以下步骤制成:
A1.通氮气保护下将1,3,5-三(3,3,3-三氟丙基)-1,3,5-三甲基环三硅氧烷、四氢呋喃加入反应瓶中,将反应瓶置于冰水浴中,然后将正丁基锂正己烷溶液加入反应瓶中,反应2-3小时后将二甲基氯硅烷加入反应瓶中,继续反应10-12小时得到反应液,将反应液离心得到有机相,将有机相用去离子水洗涤3次后减压蒸除溶剂得到含氟硅烷;
A2.通氮气保护下将乙烯基三乙氧基硅烷、甲苯、卡斯特铂金催化剂加入反应瓶中,升温至85℃后滴加入步骤A1得到的含氟硅烷,保温反应20-24小时得到反应液,将反应液蒸除溶剂后得到偶联剂。
进一步地,本发明所述偶联剂的制备步骤A1中,正丁基锂正己烷溶液的浓度为2mol/L,1,3,5-三(3,3,3-三氟丙基)-1,3,5-三甲基环三硅氧烷、四氢呋喃、正丁基锂正己烷溶液、二甲基氯硅烷的比例为0.1mol:40mL:50mL:12mL,离心的速度为5000rpm,离心的时间为20分钟;所述偶联剂的制备步骤A2中,乙烯基三乙氧基硅烷、甲苯、卡斯特铂金催化剂、步骤A1得到的含氟硅烷的比例为3g:9mL:1mg:6g。
进一步地,本发明所述导热填料为碳化铝。
进一步地,本发明所述溶剂为丁酮。
本发明要解决的另一个技术问题是提供上述高导热的覆铜板的制备方法。
为解决上述技术问题,技术方案是:
一种高导热的覆铜板的制备方法,包括以下步骤:
B1.按重量份称取各原料,将低溴环氧树脂、线性酚醛树脂、酚醛固化剂加入搅拌釜中,升温至55-65℃后200rpm转速下搅拌至混合均匀,静置30分钟后加入其他原料,500rpm转速下搅拌至混合均匀得到树脂胶液;
B2.将玻纤布浸渍于步骤B1得到的树脂胶液中,转入烘箱中170-190℃下烘5-8分钟得到半固化片,控制含胶量为45-55%,流动度为10-20%;
B3.取8张步骤B2得到的半固化片叠加在一起后在上面覆盖一张铜箔,转入真空热压机中160-220℃下热压2-3小时得到高导热的覆铜板。
与现有技术相比,本发明具有以下有益效果:
(1)本发明采用了低溴环氧树脂——酚醛固化体系以确保高导热的覆铜板能满足PCB无铅制程的需求;本发明还使用了线性酚醛树脂,其能够提高覆铜板的耐热性以及基材与铜箔的粘合性。
(2)本发明使用的导热填料为碳化铝,其具有较高的热导率,使成型后的覆铜板具有高效的导热性能,其导热率>1.6W/m·k,可以很好地解决大电流基板快速散热问题,而且碳化铝的耐热性和力学性能较好,因而还能提高覆铜板的耐热性能和机械强度。
(3)本发明使用的偶联剂是先将1,3,5-三(3,3,3-三氟丙基)-1,3,5-三甲基环三硅氧烷在正丁基锂的催化作用下引发开环聚合反应,然后用二甲基氯硅烷进行封端制成含氟硅烷,再将含氟硅烷与乙烯基三乙氧基硅烷在卡斯特铂金催化剂的催化作用下通过硅氢加成反应制得,与乙烯基三乙氧基硅烷相比,本发明制得的偶联剂对各原料之间相容性的提高效果更佳、粘合性也更好,因而能进一步提高覆铜板的导热性能、耐热性能、机械强度、粘合性能。
具体实施方式
下面将结合具体实施例来详细说明本发明,在此本发明的示意性实施例及其说明用来解释本发明,但并不作为对本发明的限定。
实施例1
高导热的覆铜板,由以下重量份的原料制成:环氧当量为420g/eq、溴含量为20%wt的低溴环氧树脂23份,羟基当量为260g/eq的线性酚醛树脂25份,羟基当量为110g/eq的酚醛树脂7份,2-甲基咪唑0.06份,偶联剂4.2份,碳化铝88份,丁酮78份。偶联剂由以下步骤制成:
A1.通氮气保护下将1,3,5-三(3,3,3-三氟丙基)-1,3,5-三甲基环三硅氧烷、四氢呋喃加入反应瓶中,将反应瓶置于冰水浴中,然后将浓度为2mol/L的正丁基锂正己烷溶液加入反应瓶中,反应2.5小时后将二甲基氯硅烷加入反应瓶中,继续反应11小时得到反应液,将反应液5000rpm速度下离心20分钟得到有机相,将有机相用去离子水洗涤3次后减压蒸除溶剂得到含氟硅烷,1,3,5-三(3,3,3-三氟丙基)-1,3,5-三甲基环三硅氧烷、四氢呋喃、正丁基锂正己烷溶液、二甲基氯硅烷的比例为0.1mol:40mL:50mL:12mL;
A2.通氮气保护下将乙烯基三乙氧基硅烷、甲苯、卡斯特铂金催化剂加入反应瓶中,升温至85℃后滴加入步骤A1得到的含氟硅烷,保温反应22小时得到反应液,将反应液蒸除溶剂后得到偶联剂,乙烯基三乙氧基硅烷、甲苯、卡斯特铂金催化剂、步骤A1得到的含氟硅烷的比例为3g:9mL:1mg:6g。
本实施例的制备方法包括以下步骤:
B1.按重量份称取各原料,将低溴环氧树脂、线性酚醛树脂、酚醛固化剂加入搅拌釜中,升温至60℃后200rpm转速下搅拌至混合均匀,静置30分钟后加入其他原料,500rpm转速下搅拌至混合均匀得到树脂胶液;
B2.将玻纤布浸渍于步骤B1得到的树脂胶液中,转入烘箱中180℃下烘7分钟得到半固化片,控制含胶量为45-55%,流动度为10-20%;
B3.取8张步骤B2得到的半固化片叠加在一起后在上面覆盖一张铜箔,转入真空热压机中200℃下热压2.5小时得到高导热的覆铜板。
实施例2
高导热的覆铜板,由以下重量份的原料制成:环氧当量为420g/eq、溴含量为20%wt的低溴环氧树脂20份,羟基当量为260g/eq的线性酚醛树脂27份,羟基当量为110g/eq的酚醛树脂6.5份,2-甲基咪唑0.09份,偶联剂4.5份,碳化铝85份,丁酮80份。偶联剂由以下步骤制成:
A1.通氮气保护下将1,3,5-三(3,3,3-三氟丙基)-1,3,5-三甲基环三硅氧烷、四氢呋喃加入反应瓶中,将反应瓶置于冰水浴中,然后将浓度为2mol/L的正丁基锂正己烷溶液加入反应瓶中,反应2小时后将二甲基氯硅烷加入反应瓶中,继续反应10小时得到反应液,将反应液5000rpm速度下离心20分钟得到有机相,将有机相用去离子水洗涤3次后减压蒸除溶剂得到含氟硅烷,1,3,5-三(3,3,3-三氟丙基)-1,3,5-三甲基环三硅氧烷、四氢呋喃、正丁基锂正己烷溶液、二甲基氯硅烷的比例为0.1mol:40mL:50mL:12mL;
A2.通氮气保护下将乙烯基三乙氧基硅烷、甲苯、卡斯特铂金催化剂加入反应瓶中,升温至85℃后滴加入步骤A1得到的含氟硅烷,保温反应20小时得到反应液,将反应液蒸除溶剂后得到偶联剂,乙烯基三乙氧基硅烷、甲苯、卡斯特铂金催化剂、步骤A1得到的含氟硅烷的比例为3g:9mL:lmg:6g。
本实施例的制备方法包括以下步骤:
B1.按重量份称取各原料,将低溴环氧树脂、线性酚醛树脂、酚醛固化剂加入搅拌釜中,升温至55℃后200rpm转速下搅拌至混合均匀,静置30分钟后加入其他原料,500rpm转速下搅拌至混合均匀得到树脂胶液;
B2.将玻纤布浸渍于步骤B1得到的树脂胶液中,转入烘箱中170℃下烘8分钟得到半固化片,控制含胶量为45-55%,流动度为10-20%;
B3.取8张步骤B2得到的半固化片叠加在一起后在上面覆盖一张铜箔,转入真空热压机中160℃下热压3小时得到高导热的覆铜板。
实施例3
高导热的覆铜板,由以下重量份的原料制成:环氧当量为420g/eq、溴含量为20%wt的低溴环氧树脂21份,羟基当量为260g/eq的线性酚醛树脂24份,羟基当量为110g/eq的酚醛树脂6份,2-甲基咪唑0.1份,偶联剂4份,碳化铝90份,丁酮76份。偶联剂由以下步骤制成:
A1.通氮气保护下将1,3,5-三(3,3,3-三氟丙基)-1,3,5-三甲基环三硅氧烷、四氢呋喃加入反应瓶中,将反应瓶置于冰水浴中,然后将浓度为2mol/L的正丁基锂正己烷溶液加入反应瓶中,反应2.5小时后将二甲基氯硅烷加入反应瓶中,继续反应10.5小时得到反应液,将反应液5000rpm速度下离心20分钟得到有机相,将有机相用去离子水洗涤3次后减压蒸除溶剂得到含氟硅烷,1,3,5-三(3,3,3-三氟丙基)-1,3,5-三甲基环三硅氧烷、四氢呋喃、正丁基锂正己烷溶液、二甲基氯硅烷的比例为0.1mol:40mL:50mL:12mL;
A2.通氮气保护下将乙烯基三乙氧基硅烷、甲苯、卡斯特铂金催化剂加入反应瓶中,升温至85℃后滴加入步骤A1得到的含氟硅烷,保温反应21小时得到反应液,将反应液蒸除溶剂后得到偶联剂,乙烯基三乙氧基硅烷、甲苯、卡斯特铂金催化剂、步骤A1得到的含氟硅烷的比例为3g:9mL:1mg:6g。
本实施例的制备方法包括以下步骤:
B1.按重量份称取各原料,将低溴环氧树脂、线性酚醛树脂、酚醛固化剂加入搅拌釜中,升温至60℃后200rpm转速下搅拌至混合均匀,静置30分钟后加入其他原料,500rpm转速下搅拌至混合均匀得到树脂胶液;
B2.将玻纤布浸渍于步骤B1得到的树脂胶液中,转入烘箱中175℃下烘6分钟得到半固化片,控制含胶量为45-55%,流动度为10-20%;
B3.取8张步骤B2得到的半固化片叠加在一起后在上面覆盖一张铜箔,转入真空热压机中180℃下热压2.4小时得到高导热的覆铜板。
实施例4
高导热的覆铜板,由以下重量份的原料制成:环氧当量为420g/e q、溴含量为20%wt的低溴环氧树脂25份,羟基当量为260g/eq的线性酚醛树脂26份,羟基当量为110g/eq的酚醛树脂8份,2-甲基咪唑0.05份,偶联剂4.3份,碳化铝87份,丁酮75份。偶联剂由以下步骤制成:
A1.通氮气保护下将1,3,5-三(3,3,3-三氟丙基)-1,3,5-三甲基环三硅氧烷、四氢呋喃加入反应瓶中,将反应瓶置于冰水浴中,然后将浓度为2mol/L的正丁基锂正己烷溶液加入反应瓶中,反应3小时后将二甲基氯硅烷加入反应瓶中,继续反应12小时得到反应液,将反应液5000rpm速度下离心20分钟得到有机相,将有机相用去离子水洗涤3次后减压蒸除溶剂得到含氟硅烷,1,3,5-三(3,3,3-三氟丙基)-1,3,5-三甲基环三硅氧烷、四氢呋喃、正丁基锂正己烷溶液、二甲基氯硅烷的比例为0.1mol:40mL:50mL:12mL;
A2.通氮气保护下将乙烯基三乙氧基硅烷、甲苯、卡斯特铂金催化剂加入反应瓶中,升温至85℃后滴加入步骤A1得到的含氟硅烷,保温反应24小时得到反应液,将反应液蒸除溶剂后得到偶联剂,乙烯基三乙氧基硅烷、甲苯、卡斯特铂金催化剂、步骤A1得到的含氟硅烷的比例为3g:9mL:1mg:6g。
本实施例的制备方法包括以下步骤:
B1.按重量份称取各原料,将低溴环氧树脂、线性酚醛树脂、酚醛固化剂加入搅拌釜中,升温至65℃后200rpm转速下搅拌至混合均匀,静置30分钟后加入其他原料,500rpm转速下搅拌至混合均匀得到树脂胶液;
B2.将玻纤布浸渍于步骤B1得到的树脂胶液中,转入烘箱中190℃下烘5分钟得到半固化片,控制含胶量为45-55%,流动度为10-20%;
B3.取8张步骤B2得到的半固化片叠加在一起后在上面覆盖一张铜箔,转入真空热压机中220℃下热压2小时得到高导热的覆铜板。
对比例1
与实施例1不同的是:原料中不包括环氧当量为260g/eq的线性酚醛树脂26份。
对比例2
与实施例1的不同的是:原料中的偶联剂替换为乙烯基三乙氧基硅烷,省略偶联剂的制备步骤。
对比例3
与实施例1不同的是:原料中不包括碳化铝。
实验例一:导热性能测试
测试参考标准/方法:ASTM D5470-2006标准。
测试仪器:导热系数测试仪。
测试对象、目标:实施例1-4、对比例2-3制得的覆铜板的热导率。
热导率越高表明导热性能越好,测试结果如表1所示:
热导率(W/m·k) | |
实施例1 | 1.65 |
实施例2 | 1.62 |
实施例3 | 1.67 |
实施例4 | 1.63 |
对比例2 | 1.58 |
对比例3 | 0.44 |
表1
由表1可以看出,本发明实施例1-4的热导率均较高,表明本发明具有较好的导热性能。对比例2-3使用的部分原料、制备步骤与实施例1不同,与实施例1相比,对比例2的热导率有所降低,表明与乙烯基三乙氧基硅烷相比,本发明使用的偶联剂对覆铜板导热性能的提高效果更佳;与实施例1相比,对比例3的热导率下降很多,表明本发明使用的碳化铝是提高覆铜板导热性能的主因。
实验例二:耐热性能测试
测试参考标准/方法:DSC法。
测试仪器:差示扫描量热仪。
测试对象、目标:实施例1-4、对比例1-3制得的覆铜板的玻璃化转变温度。
玻璃化转变温度越高表明耐热性能越好,测试结果如表2所示:
玻璃化转变温度(℃) | |
实施例1 | 203 |
实施例2 | 198 |
实施例3 | 205 |
实施例4 | 201 |
对比例1 | 183 |
对比例2 | 194 |
对比例3 | 179 |
表2
由表2可以看出,本发明实施例1-4的玻璃化转变温度均较高,表明本发明具有较好的耐热性能。对比例1-3使用的部分原料、制备步骤与实施例1不同,与实施例1相比,对比例2的玻璃化转变温度有所降低,表明与乙烯基三乙氧基硅烷相比,本发明使用的偶联剂对覆铜板耐热性能的提高效果更佳;与实施例1相比,对比例1、3的玻璃化转变温度均下降不少,表明本发明使用的线性酚醛树脂和碳化铝均能提高覆铜板的耐热性能。
实验例三:粘合性能测试
测试参考标准/方法:IPC-TM-650测试标准。
测试仪器:剥离强度测试仪。
测试对象、目标:实施例1-4、对比例1-2制得的覆铜板的剥离强度。
剥离强度越高表明粘合性能越好。测试结果如表3所示:
剥离强度(N·mm-1) | |
实施例1 | 1.72 |
实施例2 | 1.78 |
实施例3 | 1.70 |
实施例4 | 1.75 |
对比例1 | 1.66 |
对比例2 | 1.63 |
表3
由表3可以看出,本发明实施例1-4的剥离强度均较高,表明本发明具有较好的粘合性能。对比例1、2使用的部分原料、制备步骤与实施例1不同,与实施例1相比,与实施例1相比,对比例1的剥离强度有所降低,表明本发明使用的线型酚醛树脂能提高覆铜板的粘合性能;对比例2的剥离强度也有所降低,表明与乙烯基三乙氧基硅烷相比,本发明使用的偶联剂对覆铜板粘合性能的提高效果更佳。
上述实施例仅例示性说明本发明的原理及其功效,而非用于限制本发明。任何熟悉此技术的人士皆可在不违背本发明的精神及范畴下,对上述实施例进行修饰或改变。因此,举凡所属技术领域中具有通常知识者在未脱离本发明所揭示的精神与技术思想下所完成的一切等效修饰或改变,仍应由本发明的权利要求所涵盖。
Claims (6)
1.一种高导热的覆铜板,其特征在于:由以下重量份的原料制成:低溴环氧树脂20-25份,线性酚醛树脂24-27份,酚醛固化剂6-8份,固化促进剂0.05-0.1份,偶联剂4-4.5份,导热填料85-90份,溶剂75-80份;所述低溴环氧树脂的环氧当量为420g/eq,溴含量为20%wt;所述线性酚醛树脂的羟基当量为260g/eq;所述导热填料为碳化铝;
所述偶联剂由以下步骤制成:
A1.通氮气保护下将1,3,5-三(3,3,3-三氟丙基)-1,3,5-三甲基环三硅氧烷、四氢呋喃加入反应瓶中,将反应瓶置于冰水浴中,然后将正丁基锂正己烷溶液加入反应瓶中,反应2-3小时后将二甲基氯硅烷加入反应瓶中,继续反应10-12小时得到反应液,将反应液离心得到有机相,将有机相用去离子水洗涤3次后减压蒸除溶剂得到含氟硅烷;
A2.通氮气保护下将乙烯基三乙氧基硅烷、甲苯、卡斯特铂金催化剂加入反应瓶中,升温至85℃后滴加入步骤A1得到的含氟硅烷,保温反应20-24小时得到反应液,将反应液蒸除溶剂后得到偶联剂。
2.根据权利要求1所述的一种高导热的覆铜板,其特征在于:所述酚醛固化剂为羟基当量为110g/eq的酚醛树脂。
3.根据权利要求1所述的一种高导热的覆铜板,其特征在于:所述固化促进剂为2-甲基咪唑。
4.根据权利要求1所述的一种高导热的覆铜板,其特征在于:所述偶联剂的制备步骤A1中,正丁基锂正己烷溶液的浓度为2mol/L,1,3,5-三(3,3,3-三氟丙基)-1,3,5-三甲基环三硅氧烷、四氢呋喃、正丁基锂正己烷溶液、二甲基氯硅烷的比例为0.1mol:40mL:50mL:12mL,离心的速度为5000rpm,离心的时间为20分钟;所述偶联剂的制备步骤A2中,乙烯基三乙氧基硅烷、甲苯、卡斯特铂金催化剂、步骤A1得到的含氟硅烷的比例为3g:9mL:1mg:6g。
5.根据权利要求1所述的一种高导热的覆铜板,其特征在于:所述溶剂为丁酮。
6.一种制备根据权利要求1~5任意一项所述的一种高导热的覆铜板的制备方法,其特征在于:包括以下步骤:
B1.按重量份称取各原料,将低溴环氧树脂、线性酚醛树脂、酚醛固化剂加入搅拌釜中,升温至55-65℃后200rpm转速下搅拌至混合均匀,静置30分钟后加入其他原料,500rpm转速下搅拌至混合均匀得到树脂胶液;
B2.将玻纤布浸渍于步骤B1得到的树脂胶液中,转入烘箱中170-190℃下烘5-8分钟得到半固化片,控制含胶量为45-55%,流动度为10-20%;
B3.取8张步骤B2得到的半固化片叠加在一起后在上面覆盖一张铜箔,转入真空热压机中160-220℃下热压2-3小时得到高导热的覆铜板。
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