CN110871610B - 碳纳米管复合材料覆铜板 - Google Patents

碳纳米管复合材料覆铜板 Download PDF

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CN110871610B
CN110871610B CN201811002804.XA CN201811002804A CN110871610B CN 110871610 B CN110871610 B CN 110871610B CN 201811002804 A CN201811002804 A CN 201811002804A CN 110871610 B CN110871610 B CN 110871610B
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刘玉群
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Shenzhen Yu'an Xuci Electronic Technology Co ltd
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Abstract

本发明公开了一种纳米碳纤维复合材料覆铜板，属于电路板技术领域，主要包括基板，基板包括树脂和设置在树脂上下两侧的铜箔，树脂包括导电树脂和绝缘树脂，所述绝缘树脂材料包括环氧树脂、氧化铝和碳纳米管，所述导电树脂材料包括环氧树脂、铝粉和碳纳米管；本发明提供了一种加工成本低、散热效果好、制作工艺简单和环保等特点的纳米碳纤维复合材料覆铜板。

Description

碳纳米管复合材料覆铜板
技术领域
本发明涉及电路板技术领域，尤其涉及碳纳米管复合材料覆铜板。
背景技术
目前在LED及大功率模块领域使用的散热基板一般采用铝基板、铜基板等导热金属作为导热材料，因为金属的导电性能，无法直接实现双面、多层结构的电路板制造；金属的加工性能较之传统的覆铜板来说，具有在钻孔、V割等方面不好加工的特殊性，也限制了金属基覆铜板的使用范围。
双面及多层金属基覆铜板因为要做两次钻孔处理和孔壁填充树脂，具有下面几个方面的缺陷：
一、在第一次钻孔的孔内填充树脂，降低了金属基板的导热性能；
二、在第二次钻孔时对钻孔精度要求比较高，稍有偏差就会造成板材短路；
三、工艺复杂，产品成本很高。
因此，大部分金属基覆铜板都是采用的单面结构。
目前使用的金属基覆铜板，主要应用了金属的导热性能，在绝缘材料中添加一定量的导热填料，将电子元器件在使用过程中产生的热量通过散热器等导出。但是，金属表面的热辐射系数很低，在没有对流传热的条件下，聚集到金属表面的热量很难散发出去。所以需要在金属基板的背面用散热器及风扇散热，占用空间大、不利于小型、精细化生产。
发明内容
本发明的目的是为了解决现有技术中存在的缺点，而提出的一种占用空间小，实现电路板小型化和精细化等特点的复合材料覆铜板。
为了实现上述目的，本发明采用了如下技术方案：
碳纳米管复合材料覆铜板，包括基板，其特征在于：所述基板包括树脂和设置在树脂上下两侧的铜箔，树脂包括导电树脂和绝缘树脂，所述绝缘树脂材料包括环氧树脂、氧化铝和碳纳米管，所述导电树脂材料包括环氧树脂、铝粉和碳纳米管。
进一步地，所述绝缘树脂各原材料百分比为环氧树脂25％-30％,氧化铝60％-75％，碳纳米管0.1％-4％。
进一步地，所述绝缘树脂制备方法为，将以上所有材料在树脂罐中充分搅拌，熟化后备用；再用涂布机将绝缘树脂材料分别涂布在PET膜或玻璃纤维布上，裁剪备用；最后经过叠板、真空压合和剪切工艺制作成型。
进一步地，所述导电树脂各原材料百分比为环氧树脂25％-30％,铝粉60％-75％，碳纳米管3％-10％。
进一步地，所述导电树脂制备方法为，将以上所有材料在树脂罐中充分搅拌，熟化后备用；再用涂布机将导电树脂材料分别涂布在PET膜或玻璃纤维布上，裁剪备用；最后经过叠板、真空压合和剪切工艺制作成型。
进一步地，环氧树脂可以用聚酰亚胺、BT树脂、丙烯酸树脂、酚醛树脂替代。
进一步地，所述导电树脂内含有金属成分。
进一步地，覆铜板为单面板或双面板。
进一步地，所述碳纳米管包括单壁碳纳米管和多壁碳纳米管，单壁碳纳米管导热系数为6600W/m.K，多壁碳纳米管导热系数达3000W/m.K。
本发明具有以下有益效果：
本发明的碳纳米管复合材料覆铜板，主要依靠板材自身的散热性能，将电子元器件产生的热量通过热辐射散热的方式散发出去，省去了散热器及风扇辅助散热，节省了元件装配空间及成本。
本发明的覆铜板提高了传统铝基覆铜板等金属基覆铜板的加工性能，降低了钻孔、V割等工序的加工难度，对刀具的要求降低，增长了刀具的使用寿命，同时也提高了产品的散热能力及产品的使用范围，可以用于潮湿环境，避免了金属基板在潮湿、酸碱、盐雾等环境中因腐蚀造成的基板受损、功能下降；采用碳纳米材料对树脂进行改性，具有良好的散热特性。
附图说明
图1为本发明双面覆铜板A的结构示意图；
图2为本发明双面覆铜板B的结构示意图；
图3为本发明单面覆铜板A的结构示意图；
图4为本发明单面覆铜板B的结构示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。
实施例1
参照图1，碳纳米管复合材料覆铜板，覆铜板为双面板。
包括基板10，基板10包括树脂100和设置在树脂100上下两侧的铜箔200，树脂包括导电树脂101和绝缘树脂102，绝缘树脂101设于导电树脂101上下两侧，导电树脂101设于覆铜板中部。
绝缘树脂102材料包括环氧树脂、氧化铝或碳纳米管，绝缘树脂各原材料百分比为环氧树脂28％,氧化铝70％，碳纳米管2％，其中氧化铝可以用氮化铝替代；绝缘树脂制备方法为，将以上所有材料在树脂罐中充分搅拌，熟化后备用；再用涂布机将绝缘树脂材料分别涂布在PET膜或玻璃纤维布上，裁剪备用；最后经过叠板、真空压合和剪切工艺制作成型。
导电树脂101材料包括环氧树脂、铝粉或碳纳米管，导电树脂各原材料百分比为环氧树脂27％,铝粉68％，碳纳米管5％；导电树脂制备方法为，将以上所有材料在树脂罐中充分搅拌，熟化后备用；再用涂布机将导电树脂材料分别涂布在PET膜或玻璃纤维布上，裁剪备用；最后经过叠板、真空压合和剪切工艺制作成型。
环氧树脂可以用聚酰亚胺、BT树脂、丙烯酸树脂、酚醛树脂等替代。
碳纳米管包括单壁碳纳米管和多壁碳纳米管，单壁碳纳米管导热系数为6600W/m.K，多壁碳纳米管导热系数达3000W/m.K。
实施例2
参照图2，碳纳米管复合材料覆铜板，覆铜板为双面板。
包括基板10，基板10包括树脂100和设置在树脂100上下两侧的铜箔200，其中，树脂为绝缘树脂102。
绝缘树脂102材料包括环氧树脂、氧化铝或碳纳米管，绝缘树脂各原材料百分比为环氧树脂25％,氧化铝73％，碳纳米管2％，其中氧化铝可以用氮化铝替代；绝缘树脂制备方法为，将以上所有材料在树脂罐中充分搅拌，熟化后备用；再用涂布机将绝缘树脂材料分别涂布在PET膜或玻璃纤维布上，裁剪备用；最后经过叠板、真空压合和剪切工艺制作成型。
环氧树脂可以用聚酰亚胺、BT树脂、丙烯酸树脂、酚醛树脂等替代。
碳纳米管包括单壁碳纳米管和多壁碳纳米管，单壁碳纳米管导热系数为6600W/m.K，多壁碳纳米管导热系数达3000W/m.K。
实施例3
参照图3，碳纳米管复合材料覆铜板，覆铜板为单面板。
包括基板10，基板10包括树脂100和设置在树脂100上侧的铜箔200，树脂包括一层导电树脂101和两层绝缘树脂102，绝缘树脂102设于导电树脂101上下两侧。
绝缘树脂102材料包括环氧树脂、氧化铝或碳纳米管，绝缘树脂各原材料百分比为环氧树脂25％,氧化铝71％，碳纳米管4％，其中氧化铝可以用氮化铝替代；绝缘树脂制备方法为，将以上所有材料在树脂罐中充分搅拌，熟化后备用；再用涂布机将绝缘树脂材料分别涂布在PET膜或玻璃纤维布上，裁剪备用；最后经过叠板、真空压合和剪切工艺制作成型。
导电树脂101材料包括环氧树脂、铝粉或碳纳米管，导电树脂各原材料百分比为环氧树脂28％,铝粉66％，碳纳米管6％；导电树脂制备方法为，将以上所有材料在树脂罐中充分搅拌，熟化后备用；再用涂布机将导电树脂材料分别涂布在PET膜或玻璃纤维布上，裁剪备用；最后经过叠板、真空压合和剪切工艺制作成型。
环氧树脂可以用聚酰亚胺、BT树脂、丙烯酸树脂、酚醛树脂等替代。
碳纳米管包括单壁碳纳米管和多壁碳纳米管，单壁碳纳米管导热系数为6600W/m.K，多壁碳纳米管导热系数达3000W/m.K。
实施例4
参照图4，碳纳米管复合材料覆铜板，覆铜板为单面板。
包括基板10，基板10包括树脂100和设置在树脂100上侧的铜箔200，其中，树脂为绝缘树脂102。
绝缘树脂102材料包括环氧树脂、氧化铝或碳纳米管，绝缘树脂各原材料百分比为环氧树脂26％,氧化铝70％，碳纳米管4％，其中氧化铝可以用氮化铝替代；绝缘树脂制备方法为，将以上所有材料在树脂罐中充分搅拌，熟化后备用；再用涂布机将绝缘树脂材料分别涂布在PET膜或玻璃纤维布上，裁剪备用；最后经过叠板、真空压合和剪切工艺制作成型。
环氧树脂可以用聚酰亚胺、BT树脂、丙烯酸树脂、酚醛树脂等替代。
碳纳米管包括单壁碳纳米管和多壁碳纳米管，单壁碳纳米管导热系数为6600W/m.K，多壁碳纳米管导热系数达3000W/m.K。
综上，本发明的覆铜板采用碳纳米材料对树脂进行改性，所制造的产品具有黑色的外观，实施例1和实施例3中的导电树脂材料在经过钻、铣、剪切后端断面呈现深灰色金属光泽，碳纳米管CNTs是树脂的功能填料，也是目前市场上较好的导热材料之一。
碳纳米管通过辐射或吸收的能量与它的温度、表面积和黑度等因素有关。碳纳米管是一种纳米材料，表面积大，颜色较黑，对光线的折射率只有0.045％，吸收率可以达到99.5％以上，辐射系数接近1，因此具有良好的辐射散热能力。同时，碳纳米管是一种具有纳米直径的管状碳纤维，它具有超强的韧性和强度，因此可以取代在绝缘层中起增韧作用的橡胶，提高绝缘树脂的导热性能。
本发明相对于传统的金属基覆铜板具有如下优点：
1、传统的金属基线路板在钻、铣工序中需要特殊的刀具完成，而且钻孔、铣边、槽时易产生毛刺(俗称披锋)。加工过程中因为金属的特性，易局部过热，引起刀具损坏，钻、铣处毛刺加大甚至烧坏金属基板。
本发明提高了后续产品(印制电路板)的加工性能，所有层都采用树脂混合结构，加工工艺与FR-4相同，节省了加工成本。
2、传统的金属基覆铜板(铝基板)为了增加绝缘性能及表面耐磨性能，必须进行阳极氧化，铝氧化工艺对环境有很大污染。
本发明不采用阳极氧化，板面因为树脂固化有较好的耐磨性能，完全可以满足线路板在后续使用中的要求。
3、传统的金属基覆铜板因为金属本身的特性，不耐酸、碱等溶液，印制电路板的制造工艺中蚀刻、退膜等工序需经过酸、碱溶液，必须贴保护膜进行保护。
本发明不采用金属作为基板层，不需要贴膜，节省了板材成本；金属基板依靠热传导将热量导出，在没有对流的条件下，热量很难散发出去，本发明中导入了散热材料，使产品的散热性能增强。
以上所述，仅为本发明较佳的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，根据本发明的技术方案及其发明构思加以等同替换或改变，都应涵盖在本发明的保护范围之内。

Claims (3)

1.一种碳纳米管复合材料覆铜板，包括基板，其特征在于：所述基板包括树脂复合材料层和设置在树脂复合材料层上下两侧的铜箔，所述树脂复合材料层包括导电树脂复合材料层和绝缘树脂复合材料层，绝缘树脂复合材料层设于导电树脂复合材料层的上下两侧，导电树脂复合材料层设于覆铜板的中部；所述绝缘树脂复合材料层的制备方法为，将28％的环氧树脂、70％的氧化铝和2％的碳纳米管在树脂罐中充分搅拌，熟化后备用，再用涂布机将绝缘树脂材料涂布在玻璃纤维布上，裁剪备用，最后经过叠板、真空压合和剪切工艺制作成型；所述导电树脂复合材料层的制备方法为，将27％的环氧树脂，68％的铝粉和5％的碳纳米管在树脂罐中充分搅拌，熟化后备用，再用涂布机将导电树脂材料涂布在玻璃纤维布上，裁剪备用，最后经过叠板、真空压合和剪切工艺制作成型。
2.根据权利要求1所述的碳纳米管复合材料覆铜板，其特征在于，所述环氧树脂用聚酰亚胺、BT树脂、丙烯酸树脂、酚醛树脂替代。
3.根据权利要求1所述的碳纳米管复合材料覆铜板，其特征在于，所述碳纳米管包括单壁碳纳米管和多壁碳纳米管，单壁碳纳米管导热系数为6600W/m.K，多壁碳纳米管导热系数为3000W/m.K。
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