CN110871610A - 纳米碳纤维复合材料覆铜板 - Google Patents
纳米碳纤维复合材料覆铜板 Download PDFInfo
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- CN110871610A CN110871610A CN201811002804.XA CN201811002804A CN110871610A CN 110871610 A CN110871610 A CN 110871610A CN 201811002804 A CN201811002804 A CN 201811002804A CN 110871610 A CN110871610 A CN 110871610A
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 title claims abstract description 22
- 239000002131 composite material Substances 0.000 title claims abstract description 21
- 229920000049 Carbon (fiber) Polymers 0.000 title description 3
- 239000004917 carbon fiber Substances 0.000 title description 3
- 229910021392 nanocarbon Inorganic materials 0.000 title description 2
- 229920005989 resin Polymers 0.000 claims abstract description 108
- 239000011347 resin Substances 0.000 claims abstract description 108
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 34
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 33
- 239000003822 epoxy resin Substances 0.000 claims abstract description 28
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- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000002134 carbon nanofiber Substances 0.000 claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000011889 copper foil Substances 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 25
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- 238000000034 method Methods 0.000 claims description 16
- 238000005520 cutting process Methods 0.000 claims description 12
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- 229920001721 polyimide Polymers 0.000 claims description 6
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract 1
- 230000007613 environmental effect Effects 0.000 abstract 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 9
- 238000005553 drilling Methods 0.000 description 9
- 239000002994 raw material Substances 0.000 description 6
- 238000003801 milling Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
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- 239000010949 copper Substances 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000002086 nanomaterial Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
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- 239000002253 acid Substances 0.000 description 2
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- 150000002739 metals Chemical class 0.000 description 2
- 239000002585 base Substances 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
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- 239000011810 insulating material Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
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Abstract
本发明公开了一种纳米碳纤维复合材料覆铜板,属于电路板技术领域,主要包括基板,基板包括树脂和设置在树脂上下两侧的铜箔,树脂包括导电树脂和绝缘树脂,所述绝缘树脂材料包括环氧树脂、氧化铝和碳纳米管,所述导电树脂材料包括环氧树脂、铝粉和碳纳米管;本发明提供了一种加工成本低、散热效果好、制作工艺简单和环保等特点的纳米碳纤维复合材料覆铜板。
Description
技术领域
本发明涉及电路板技术领域,尤其涉及纳米碳纤维复合材料覆铜板。
背景技术
目前在LED及大功率模块领域使用的散热基板一般采用铝基板、铜基板等导热金属作为导热材料,因为金属的导电性能,无法直接实现双面、多层结构的电路板制造;金属的加工性能较之传统的覆铜板来说,具有在钻孔、V割等方面不好加工的特殊性,也限制了金属基覆铜板的使用范围。
双面及多层金属基覆铜板因为要做两次钻孔处理和孔壁填充树脂,具有下面几个方面的缺陷:
一、在第一次钻孔的孔内填充树脂,降低了金属基板的导热性能;
二、在第二次钻孔时对钻孔精度要求比较高,稍有偏差就会造成板材短路;
三、工艺复杂,产品成本很高。
因此,大部分金属基覆铜板都是采用的单面结构。
目前使用的金属基覆铜板,主要应用了金属的导热性能,在绝缘材料中添加一定量的导热填料,将电子元器件在使用过程中产生的热量通过散热器等导出。但是,金属表面的热辐射系数很低,在没有对流传热的条件下,聚集到金属表面的热量很难散发出去。所以需要在金属基板的背面用散热器及风扇散热,占用空间大、不利于小型、精细化生产。
发明内容
本发明的目的是为了解决现有技术中存在的缺点,而提出的一种占用空间小,实现电路板小型化和精细化等特点的纳米碳纤维复合材料覆铜板。
为了实现上述目的,本发明采用了如下技术方案:
纳米碳纤维复合材料覆铜板,包括基板,其特征在于:所述基板包括树脂和设置在树脂上下两侧的铜箔,树脂包括导电树脂和绝缘树脂,所述绝缘树脂材料包括环氧树脂、氧化铝和碳纳米管,所述导电树脂材料包括环氧树脂、铝粉和碳纳米管。
进一步地,所述绝缘树脂各原材料百分比为环氧树脂25%-30%,氧化铝60%-75%,碳纳米管0.1%-4%。
进一步地,所述绝缘树脂制备方法为,将以上所有材料在树脂罐中充分搅拌,熟化后备用;再用涂布机将绝缘树脂材料分别涂布在PET膜或玻璃纤维布上,裁剪备用;最后经过叠板、真空压合和剪切工艺制作成型。
进一步地,所述导电树脂各原材料百分比为环氧树脂25%-30%,铝粉60%-75%,碳纳米管3%-10%。
进一步地,所述导电树脂制备方法为,将以上所有材料在树脂罐中充分搅拌,熟化后备用;再用涂布机将导电树脂材料分别涂布在PET膜或玻璃纤维布上,裁剪备用;最后经过叠板、真空压合和剪切工艺制作成型。
进一步地,环氧树脂可以用聚酰亚胺、BT树脂、丙烯酸树脂、酚醛树脂替代。
进一步地,所述导电树脂内含有金属成分。
进一步地,覆铜板为单面板或双面板。
进一步地,所述碳纳米管包括单壁碳纳米管和多壁碳纳米管,单壁碳纳米管导热系数为6600W/m.K,多壁碳纳米管导热系数达3000W/m.K。
本发明具有以下有益效果:
本发明的纳米碳纤维复合材料覆铜板,主要依靠板材自身的散热性能,将电子元器件产生的热量通过热辐射散热的方式散发出去,省去了散热器及风扇辅助散热,节省了元件装配空间及成本。
本发明的覆铜板提高了传统铝基覆铜板等金属基覆铜板的加工性能,降低了钻孔、V割等工序的加工难度,对刀具的要求降低,增长了刀具的使用寿命,同时也提高了产品的散热能力及产品的使用范围,可以用于潮湿环境,避免了金属基板在潮湿、酸碱、盐雾等环境中因腐蚀造成的基板受损、功能下降;采用碳纳米材料对树脂进行改性,具有良好的散热特性。
附图说明
图1为本发明双面覆铜板A的结构示意图;
图2为本发明双面覆铜板B的结构示意图;
图3为本发明单面覆铜板A的结构示意图;
图4为本发明单面覆铜板B的结构示意图。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。
实施例1
参照图1,纳米碳纤维复合材料覆铜板,覆铜板为双面板。
包括基板10,基板10包括树脂100和设置在树脂100上下两侧的铜箔200,树脂包括导电树脂101和绝缘树脂102,绝缘树脂101设于导电树脂101上下两侧,导电树脂101设于覆铜板中部。
绝缘树脂102材料包括环氧树脂、氧化铝或碳纳米管,绝缘树脂各原材料百分比为环氧树脂28%,氧化铝70%,碳纳米管2%,其中氧化铝可以用氮化铝替代;绝缘树脂制备方法为,将以上所有材料在树脂罐中充分搅拌,熟化后备用;再用涂布机将绝缘树脂材料分别涂布在PET膜或玻璃纤维布上,裁剪备用;最后经过叠板、真空压合和剪切工艺制作成型。
导电树脂101材料包括环氧树脂、铝粉或碳纳米管,导电树脂各原材料百分比为环氧树脂27%,铝粉68%,碳纳米管5%;导电树脂制备方法为,将以上所有材料在树脂罐中充分搅拌,熟化后备用;再用涂布机将导电树脂材料分别涂布在PET膜或玻璃纤维布上,裁剪备用;最后经过叠板、真空压合和剪切工艺制作成型。
环氧树脂可以用聚酰亚胺、BT树脂、丙烯酸树脂、酚醛树脂等替代。
碳纳米管包括单壁碳纳米管和多壁碳纳米管,单壁碳纳米管导热系数为6600W/m.K,多壁碳纳米管导热系数达3000W/m.K。
实施例2
参照图2,纳米碳纤维复合材料覆铜板,覆铜板为双面板。
包括基板10,基板10包括树脂100和设置在树脂100上下两侧的铜箔200,其中,树脂为绝缘树脂102。
绝缘树脂102材料包括环氧树脂、氧化铝或碳纳米管,绝缘树脂各原材料百分比为环氧树脂25%,氧化铝73%,碳纳米管2%,其中氧化铝可以用氮化铝替代;绝缘树脂制备方法为,将以上所有材料在树脂罐中充分搅拌,熟化后备用;再用涂布机将绝缘树脂材料分别涂布在PET膜或玻璃纤维布上,裁剪备用;最后经过叠板、真空压合和剪切工艺制作成型。
环氧树脂可以用聚酰亚胺、BT树脂、丙烯酸树脂、酚醛树脂等替代。
碳纳米管包括单壁碳纳米管和多壁碳纳米管,单壁碳纳米管导热系数为6600W/m.K,多壁碳纳米管导热系数达3000W/m.K。
实施例3
参照图3,纳米碳纤维复合材料覆铜板,覆铜板为单面板。
包括基板10,基板10包括树脂100和设置在树脂100上侧的铜箔200,树脂包括一层导电树脂101和两层绝缘树脂102,绝缘树脂102设于导电树脂101上下两侧。
绝缘树脂102材料包括环氧树脂、氧化铝或碳纳米管,绝缘树脂各原材料百分比为环氧树脂25%,氧化铝71%,碳纳米管4%,其中氧化铝可以用氮化铝替代;绝缘树脂制备方法为,将以上所有材料在树脂罐中充分搅拌,熟化后备用;再用涂布机将绝缘树脂材料分别涂布在PET膜或玻璃纤维布上,裁剪备用;最后经过叠板、真空压合和剪切工艺制作成型。
导电树脂101材料包括环氧树脂、铝粉或碳纳米管,导电树脂各原材料百分比为环氧树脂28%,铝粉66%,碳纳米管6%;导电树脂制备方法为,将以上所有材料在树脂罐中充分搅拌,熟化后备用;再用涂布机将导电树脂材料分别涂布在PET膜或玻璃纤维布上,裁剪备用;最后经过叠板、真空压合和剪切工艺制作成型。
环氧树脂可以用聚酰亚胺、BT树脂、丙烯酸树脂、酚醛树脂等替代。
碳纳米管包括单壁碳纳米管和多壁碳纳米管,单壁碳纳米管导热系数为6600W/m.K,多壁碳纳米管导热系数达3000W/m.K。
实施例4
参照图4,纳米碳纤维复合材料覆铜板,覆铜板为单面板。
包括基板10,基板10包括树脂100和设置在树脂100上侧的铜箔200,其中,树脂为绝缘树脂102。
绝缘树脂102材料包括环氧树脂、氧化铝或碳纳米管,绝缘树脂各原材料百分比为环氧树脂26%,氧化铝70%,碳纳米管4%,其中氧化铝可以用氮化铝替代;绝缘树脂制备方法为,将以上所有材料在树脂罐中充分搅拌,熟化后备用;再用涂布机将绝缘树脂材料分别涂布在PET膜或玻璃纤维布上,裁剪备用;最后经过叠板、真空压合和剪切工艺制作成型。
环氧树脂可以用聚酰亚胺、BT树脂、丙烯酸树脂、酚醛树脂等替代。
碳纳米管包括单壁碳纳米管和多壁碳纳米管,单壁碳纳米管导热系数为6600W/m.K,多壁碳纳米管导热系数达3000W/m.K。
综上,本发明的覆铜板采用碳纳米材料对树脂进行改性,所制造的产品具有黑色的外观,实施例1和实施例3中的导电树脂材料在经过钻、铣、剪切后端断面呈现深灰色金属光泽,碳纳米管CNTs是树脂的功能填料,也是目前市场上较好的导热材料之一。
碳纳米管通过辐射或吸收的能量与它的温度、表面积和黑度等因素有关。碳纳米管是一种纳米材料,表面积大,颜色较黑,对光线的折射率只有0.045%,吸收率可以达到99.5%以上,辐射系数接近1,因此具有良好的辐射散热能力。同时,碳纳米管是一种具有纳米直径的管状碳纤维,它具有超强的韧性和强度,因此可以取代在绝缘层中起增韧作用的橡胶,提高绝缘树脂的导热性能。
本发明相对于传统的金属基覆铜板具有如下优点:
1、传统的金属基线路板在钻、铣工序中需要特殊的刀具完成,而且钻孔、铣边、槽时易产生毛刺(俗称披锋)。加工过程中因为金属的特性,易局部过热,引起刀具损坏,钻、铣处毛刺加大甚至烧坏金属基板。
本发明提高了后续产品(印制电路板)的加工性能,所有层都采用树脂混合结构,加工工艺与FR-4相同,节省了加工成本。
2、传统的金属基覆铜板(铝基板)为了增加绝缘性能及表面耐磨性能,必须进行阳极氧化,铝氧化工艺对环境有很大污染。
本发明不采用阳极氧化,板面因为树脂固化有较好的耐磨性能,完全可以满足线路板在后续使用中的要求。
3、传统的金属基覆铜板因为金属本身的特性,不耐酸、碱等溶液,印制电路板的制造工艺中蚀刻、退膜等工序需经过酸、碱溶液,必须贴保护膜进行保护。
本发明不采用金属作为基板层,不需要贴膜,节省了板材成本;金属基板依靠热传导将热量导出,在没有对流的条件下,热量很难散发出去,本发明中导入了散热材料,使产品的散热性能增强。
以上所述,仅为本发明较佳的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,根据本发明的技术方案及其发明构思加以等同替换或改变,都应涵盖在本发明的保护范围之内。
Claims (9)
1.纳米碳纤维复合材料覆铜板,包括基板,其特征在于:所述基板包括树脂和设置在树脂上下两侧的铜箔,树脂包括导电树脂和绝缘树脂,所述绝缘树脂材料包括环氧树脂、氧化铝和碳纳米管,所述导电树脂材料包括环氧树脂、铝粉和碳纳米管。
2.根据权利要求1所述的纳米碳纤维复合材料覆铜板,其特征在于,所述绝缘树脂各原材料百分比为环氧树脂25%-30%,氧化铝60%-75%,碳纳米管0.1%-4%。
3.根据权利要求2所述的纳米碳纤维复合材料覆铜板,其特征在于,所述绝缘树脂制备方法为,将以上所有材料在树脂罐中充分搅拌,熟化后备用;再用涂布机将绝缘树脂材料分别涂布在PET膜或玻璃纤维布上,裁剪备用;最后经过叠板、真空压合和剪切工艺制作成型。
4.根据权利要求1所述的纳米碳纤维复合材料覆铜板,其特征在于,所述导电树脂各原材料百分比为环氧树脂25%-30%,铝粉60%-75%,碳纳米管3%-10%。
5.根据权利要求4所述的纳米碳纤维复合材料覆铜板,其特征在于,所述导电树脂制备方法为,将以上所有材料在树脂罐中充分搅拌,熟化后备用;再用涂布机将导电树脂材料分别涂布在PET膜或玻璃纤维布上,裁剪备用;最后经过叠板、真空压合和剪切工艺制作成型。
6.根据权利要求1所述的纳米碳纤维复合材料覆铜板,其特征在于,环氧树脂可以用聚酰亚胺、BT树脂、丙烯酸树脂、酚醛树脂替代。
7.根据权利要求1所述的纳米碳纤维复合材料覆铜板,其特征在于:所述导电树脂内含有金属成分。
8.根据权利要求1所述的纳米碳纤维复合材料覆铜板,其特征在于:覆铜板为单面板或双面板。
9.根据权利要求1所述的纳米碳纤维复合材料覆铜板,其特征在于,所述碳纳米管包括单壁碳纳米管和多壁碳纳米管,单壁碳纳米管导热系数为6600W/m.K,多壁碳纳米管导热系数达3000W/m.K。
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