CN106455308B - 一种石墨烯碳纤维复合高导热线路板及其制备方法 - Google Patents

一种石墨烯碳纤维复合高导热线路板及其制备方法 Download PDF

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CN106455308B
CN106455308B CN201610738730.0A CN201610738730A CN106455308B CN 106455308 B CN106455308 B CN 106455308B CN 201610738730 A CN201610738730 A CN 201610738730A CN 106455308 B CN106455308 B CN 106455308B
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wiring board
carbon fiber
heat conduction
fiber composite
aluminum nitride
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金银
金俊
金俊一
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Qingdao Graphene Carbon New Material Technology Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/02—Coating on the layer surface on fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/28—Multiple coating on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/106—Carbon fibres, e.g. graphite fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0175—Inorganic, non-metallic layer, e.g. resist or dielectric for printed capacitor

Abstract

本发明涉及一种电器导热板的制造技术，具体地说是一种石墨烯碳纤维复合高导热线路板及其制备方法。由石墨烯涂料、石墨粉、氮化铝粉、碳纤维布、环氧树脂等材料组成。其制造方法是：1)将环氧树脂、氮化铝粉、石墨粉以重量比进行混合，得到混合物；2)采用浸胶机将步骤(1)所得混合物浸渍到碳纤维布上；3)将步骤(2)中浸胶后的碳纤维布叠合，采用热压机进行压合；4)将步骤(3)所得进行剪切成板，再在碳化炉上进行烘干碳化。5)将步骤(4)碳化后的板两面喷涂石墨烯涂料，完成高石墨烯碳纤维复合线路板。本发明具有高导热、高强度、耐高温、耐腐蚀、工艺简单、成本低等优点，可广泛应用到电器导热线路板，LED导热线路板等。

Description

一种石墨烯碳纤维复合高导热线路板及其制备方法
技术领域
本发明涉及一种电器导热板的制造技术，具体地说是一种石墨烯碳纤维复合高导热线路板及其制备方法。
背景技术
石墨烯是一种二维的单层碳原子结构材料，是世界上最强、最坚硬、质量轻、最薄的物质，同时在已知的材料中电阻率最小、传导电子最块、导热最快、散热最快的纳米半导体材料，因此也是最理想的导热散热电器材料的应用。碳纤维是一种含碳量在95％以上的高强度、高模量纤维材料，它是由片状石墨微晶等有机纤维沿纤维轴向方向堆砌而成，经碳化及石墨化处理而得到的微晶石墨材料。碳纤维″外柔内刚″，质量比轻，但强度却高于钢铁，并且具有耐腐蚀、耐高温、高模量、高导电、高导热、高散热特性，在国防军工和民用方面都是重要材料。
目前，环氧树脂电路板是用来制作印刷电路板的一种特殊基板材料，具有尺寸稳定性和良好绝缘性，广泛应用于电器件线路板，LED线路板等。但是其缺点在于：导热率低，只有0.2W/mk，耐温性低，满足不了高负载的电子元器件中的发热的散热性，是目前技术上的一大缺陷。
发明内容
本发明要解决的技术问题是如何克服现有技术的不足，提供一种石墨烯碳纤维复合高导热线路板。
本发明为实现上述目的采用的技术方案是：一种石墨烯碳纤维复合高导热线路板，由左向右依次包括：石墨烯涂料层；环氧树脂、氮化铝粉和石墨粉的混合层；导电层；环氧树脂、氮化铝粉和石墨粉的混合层；石墨烯涂料层。
进一步的，所述石墨烯涂料是5-10层纳米级水性氧化石墨烯涂料，所述石墨粉是纳米级石墨粉。
进一步的，所述氮化铝粉是规格300目～400目，含量在99.8％的氮化铝粉。
进一步的，所述导电层是50g/m2～100g/m2的碳纤维布或碳纤维导电纸。
进一步的，所述环氧树脂为(E-44)6101型环氧树脂胶。
进一步的，所述环氧树脂、氮化铝粉、石墨粉的混合重量比为30～40∶50～40∶15～20。
进一步的，本发明还提供了一种石墨烯碳纤维复合高导热线路板的制备方法，包括以下步骤：
1)将环氧树脂、氮化铝粉、石墨粉以重量比为30～40∶50～40∶15～20进行混合，超声分散30min，得到环氧树脂、氮化铝粉和石墨粉的混合物；
2)采用浸胶机将步骤(1)所得混合物浸渍到碳纤维布上；
3)将步骤(2)中浸胶后的碳纤维布叠合6～8层，采用热压机于160℃～180℃下进行压合；
4)将步骤(3)所得进行剪切成板，再在碳化炉上于350℃450℃进行烘干碳化。
5)将步骤(4)碳化后的板两面喷涂石墨烯涂料，完成高石墨烯碳纤维复合线路板。
上述中，步骤(1)中石墨粉为纳米级石墨粉；所述步骤(1)中氮化铝粉采用300～400目之间，含量99.8％的氮化铝粉；所述步骤(1)中环氧树脂采用(E-44)6101型环氧树脂；所述步骤(1)中环氧树脂、石墨粉和氮化铝粉的重量比为30～40∶50～400∶10～20；所述步骤(2)中碳纤维布重量为50g/m2～100g/m2。
本发明的石墨烯碳纤维复合高导热线路具有高导热、高强度、耐高温、耐腐蚀、工艺简单、成本低等，能够广泛应用到电板器导热线路板以及LED高功率线路板等，是导热线路板创新性革命。本发明结构设计科学合理，简单，使用效果好，具有很好的推广价值，具有巨大的市场经济前景。
附图说明
图1为本发明石墨烯碳纤维复合高导热线路板结构示意图。
图2为本发明石墨烯高导热线路板与铝合金线路板热性能对比测试图
具体实施方式
一、下面结合附图详细说明本发明。
如图1所示，一种石墨烯碳纤维复合高导热线路板，由左向右依次包括：石墨烯涂料层1；环氧树脂、氮化铝粉和石墨粉的混合层2；导电层3；环氧树脂、氮化铝粉和石墨粉的混合层4；石墨烯涂料层5。
一、上述石墨烯碳纤维复合高导热线路板的制备过程如下：
1)将环氧树脂、氮化铝粉、石墨粉以重量比为30～40∶50～40∶15～20进行混合，超声分散30min，得到环氧树脂、氮化铝粉和石墨粉的混合物；
2)采用浸胶机将步骤(1)所得混合物浸渍到碳纤维布上；
3)将步骤(2)中浸胶后的碳纤维布叠合6～8层，采用热压机于160℃～180℃下进行压合；
4)将步骤(3)所得进行剪切成板，再在碳化炉上于350℃-450℃进行烘干碳化。
5)将步骤(4)碳化后的板两面喷涂石墨烯涂料，完成高石墨烯碳纤维复合线路板。
二、表征数据
对比试验在自然对流散热中进行，分别采用相同厚度和面积的石墨烯高导热线路板和铝合金线路板的6W白光LED嵌入式灯具，其热性能对比测试(点亮8h)结果见图2和表1。
图2是石墨烯高导热线路板和铝合金线路板温升曲线图，石墨烯高导热线路板与铝制线路板、在LED灯上表征数据如下；
表1两种材质线路板实验测试数据
注：室温25℃，防风罩；测试仪器为多通道温度测试仪。
由结合图2以及表1得到，在相同体积下，石墨烯碳纤维复合高导热线路板比铝合金线路板材料上升温度更低，测试温度为54.8℃，上升温度为29.8℃，而且重量更轻，仅为81g。上述石墨烯高导热线路板材料的密度大约为1.75g/cm3，由此得到，本发明石墨烯碳纤维复合高导热线路板具有高导热率、高散热率。
以上本发明石墨烯碳纤维复合高导热线路板有效的提高了线路板的导热率，散热率，提高了线路板机械强度、抗腐蚀性、降低了成本，加大了LED灯使用功率，延长了使用寿命。
尽管上面对本发明的优选实例进行了描述，但是本发明并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，并不是限制性的，本领域的普通技术人员在本发明的启示下，在不脱离本发明宗旨和权利要求所保护的范围情况下，还可以做出很多形式，这些均属于本发明的保护范围之内。

Claims (3)

1.一种石墨烯碳纤维复合高导热线路板的制备方法，其特征在于：包括以下步骤：
(1)将环氧树脂、氮化铝粉、石墨粉以重量比为30～40：50～40：15～20进行混合，超声分散30min，得到环氧树脂、氮化铝粉和石墨粉的混合物；
(2)采用浸胶机将步骤(1)所得混合物浸渍到碳纤维布上；
(3)将步骤(2)中浸胶后的碳纤维布叠合6～8层，采用热压机于160℃～180℃下进行压合；
(4)将步骤(3)所得进行剪切成板，再在碳化炉上于350℃-450℃进行烘干碳化；
(5)将步骤(4)碳化后的板两面喷涂石墨烯涂料，完成高石墨烯碳纤维复合线路板。
2.根据权利要求1所述的一种石墨烯碳纤维复合高导热线路板的制备方法，其特征在于：所述步骤(5)中碳化后的板两面可喷涂5～10层水性氧化石墨烯涂料。
3.根据权利要求1所述的一种石墨烯碳纤维复合高导热线路板的制备方法，其特征在于：所述步骤(1)中石墨粉为纳米级石墨粉；所述步骤(1)中氮化铝粉采用300～400目之间，含量99.8％的氮化铝粉；所述步骤(1)中环氧树脂采用(E-44)6101型环氧树脂；所述步骤(1)中环氧树脂、石墨粉和氮化铝粉的重量比为30～40：50～400：10～20；所述步骤(2)中碳纤维布重量为50g/m2～100g/m2。
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CN102958266A (zh) * 2011-08-19 2013-03-06 黄义勇 金属基板结构与制作方法

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