CN106537683B - 多层基板上信号的耦合 - Google Patents

多层基板上信号的耦合 Download PDF

Info

Publication number
CN106537683B
CN106537683B CN201580034311.2A CN201580034311A CN106537683B CN 106537683 B CN106537683 B CN 106537683B CN 201580034311 A CN201580034311 A CN 201580034311A CN 106537683 B CN106537683 B CN 106537683B
Authority
CN
China
Prior art keywords
coupler
conductive layer
dielectric material
signal
signal line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201580034311.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN106537683A (zh
Inventor
罗伯特·C·弗莱
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Blue Danube Systems Inc
Original Assignee
Blue Danube Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blue Danube Systems Inc filed Critical Blue Danube Systems Inc
Publication of CN106537683A publication Critical patent/CN106537683A/zh
Application granted granted Critical
Publication of CN106537683B publication Critical patent/CN106537683B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/026—Coplanar striplines [CPS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H01P5/022—Transitions between lines of the same kind and shape, but with different dimensions
    • H01P5/028—Transitions between lines of the same kind and shape, but with different dimensions between strip lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
CN201580034311.2A 2014-06-23 2015-06-22 多层基板上信号的耦合 Active CN106537683B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462015604P 2014-06-23 2014-06-23
US62/015,604 2014-06-23
PCT/US2015/036891 WO2015200171A1 (en) 2014-06-23 2015-06-22 Coupling of signals on multi-layer substrates

Publications (2)

Publication Number Publication Date
CN106537683A CN106537683A (zh) 2017-03-22
CN106537683B true CN106537683B (zh) 2020-03-13

Family

ID=53541916

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580034311.2A Active CN106537683B (zh) 2014-06-23 2015-06-22 多层基板上信号的耦合

Country Status (6)

Country Link
US (2) US9653768B2 (OSRAM)
EP (1) EP3158605A1 (OSRAM)
JP (2) JP6526069B2 (OSRAM)
KR (1) KR20170023095A (OSRAM)
CN (1) CN106537683B (OSRAM)
WO (2) WO2015200163A1 (OSRAM)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015192150A2 (en) 2014-06-12 2015-12-17 Skyworks Solutions, Inc. Devices and methods related to directional couplers
US9496902B2 (en) 2014-07-24 2016-11-15 Skyworks Solutions, Inc. Apparatus and methods for reconfigurable directional couplers in an RF transceiver with selectable phase shifters
TWI720014B (zh) 2015-09-10 2021-03-01 美商西凱渥資訊處理科技公司 用於多頻功率偵測之電磁耦合器及具有電磁耦合器之系統
TWI716539B (zh) 2016-02-05 2021-01-21 美商天工方案公司 具有多波段濾波的電磁耦合器
WO2017151321A1 (en) 2016-02-29 2017-09-08 Skyworks Solutions, Inc. Integrated filter and directional coupler assemblies
TW201801360A (zh) 2016-03-30 2018-01-01 天工方案公司 用於耦合器線性改良及重組態的可調主動矽
CN109314299B (zh) * 2016-04-29 2021-09-21 天工方案公司 可调谐电磁耦合器和使用其的模块和装置
CN109314298B (zh) * 2016-04-29 2023-05-02 天工方案公司 补偿电磁耦合器
CN109417215B (zh) 2016-05-09 2021-08-24 天工方案公司 具有自动频率检测的自调节电磁耦合器
US10164681B2 (en) 2016-06-06 2018-12-25 Skyworks Solutions, Inc. Isolating noise sources and coupling fields in RF chips
WO2017223141A1 (en) 2016-06-22 2017-12-28 Skyworks Solutions, Inc. Electromagnetic coupler arrangements for multi-frequency power detection, and devices including same
CN107546486B (zh) * 2016-06-23 2021-06-29 康普技术有限责任公司 具有恒定反转相位的天线馈送元件
US10426023B2 (en) * 2017-02-14 2019-09-24 The Regents Of The University Of California Systematic coupling balance scheme to enhance amplitude and phase matching for long-traveling multi-phase signals
US10742189B2 (en) 2017-06-06 2020-08-11 Skyworks Solutions, Inc. Switched multi-coupler apparatus and modules and devices using same
WO2019235558A1 (ja) * 2018-06-07 2019-12-12 株式会社村田製作所 多層基板、電子機器および多層基板の製造方法
US10813211B2 (en) * 2018-12-14 2020-10-20 Dell Products L.P. Printed circuit board layout for mitigating near-end crosstalk
US11057078B2 (en) * 2019-05-23 2021-07-06 Canon Kabushiki Kaisha Wireless communication system
JP7510262B2 (ja) * 2019-05-23 2024-07-03 キヤノン株式会社 無線通信システムおよび制御方法
JP2021034536A (ja) * 2019-08-23 2021-03-01 日本特殊陶業株式会社 配線基板
CN111430863A (zh) * 2019-12-16 2020-07-17 瑞声科技(新加坡)有限公司 传输线以及终端设备
JP2022128597A (ja) 2021-02-23 2022-09-02 スカイワークス ソリューションズ，インコーポレイテッド スイッチング可能インダクタを備えたスマート双方向性結合器
US20240188209A1 (en) * 2021-03-31 2024-06-06 Jabil Inc. Differential pair impedance matching for a printed circuit board
CN115377071B (zh) * 2021-05-19 2025-12-02 圣邦微电子（北京）股份有限公司 一种信号线全包裹隔离的芯片、方法及芯片制造方法
CN115441146A (zh) 2021-06-02 2022-12-06 天工方案公司 具有多个终端布置的定向耦合器
US11774475B2 (en) * 2021-07-13 2023-10-03 National Instruments Corporation Dual directional asymmetric coupler with a shared through-line
CN114552155B (zh) * 2022-04-25 2022-07-05 电子科技大学成都学院 双模传输线

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5638402A (en) * 1993-09-27 1997-06-10 Hitachi, Ltd. Fast data transfer bus
US6600790B1 (en) * 1996-10-30 2003-07-29 Hitachi, Ltd. Gap-coupling bus system
CN1659499A (zh) * 2002-07-01 2005-08-24 株式会社瑞萨科技 等振幅方向性耦合式总线系统
US7271985B1 (en) * 2004-09-24 2007-09-18 Storage Technology Corporation System and method for crosstalk reduction in a flexible trace interconnect array
CN102484505A (zh) * 2009-09-01 2012-05-30 日本电气株式会社 通信系统和通信装置

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3942164A (en) * 1975-01-30 1976-03-02 Semi, Inc. Sense line coupling reduction system
US5430247A (en) 1993-08-31 1995-07-04 Motorola, Inc. Twisted-pair planar conductor line off-set structure
US5389735A (en) * 1993-08-31 1995-02-14 Motorola, Inc. Vertically twisted-pair planar conductor line structure
EP1014471A1 (en) * 1998-12-24 2000-06-28 Kabushiki Kaisha Toyota Chuo Kenkyusho Waveguide-transmission line transition
JP3880286B2 (ja) * 1999-05-12 2007-02-14 エルピーダメモリ株式会社 方向性結合式メモリシステム
JP2001044712A (ja) * 1999-07-28 2001-02-16 Ricoh Co Ltd ストリップ線路
US7170361B1 (en) * 2000-04-13 2007-01-30 Micron Technology, Inc. Method and apparatus of interposing voltage reference traces between signal traces in semiconductor devices
US6573801B1 (en) 2000-11-15 2003-06-03 Intel Corporation Electromagnetic coupler
US6703907B1 (en) 2002-08-26 2004-03-09 Inphi Corporation Circuit technique for increasing effective inductance of differential transmission lines
US7307492B2 (en) * 2002-11-27 2007-12-11 Intel Corporation Design, layout and method of manufacture for a circuit that taps a differential signal
US7002430B2 (en) * 2003-05-30 2006-02-21 Intel Corporation Compact non-linear geometry electromagnetic coupler for use with digital transmission systems
US7265647B2 (en) * 2004-03-12 2007-09-04 The Regents Of The University Of California High isolation tunable MEMS capacitive switch
FI121516B (fi) * 2004-03-25 2010-12-15 Filtronic Comtek Oy Suuntakytkin
US7280808B2 (en) * 2004-04-12 2007-10-09 Sony Ericsson Mobile Communications, Ab Wireless communications devices including circuit substrates with partially overlapping conductors thereon coupling power to/from power amplifier systems
EP1788765B1 (en) * 2005-11-18 2012-08-01 STMicroelectronics Srl Transmission system of a digital signal
FI20065144L (fi) * 2006-02-28 2007-08-29 Filtronic Comtek Oy Suuntakytkin
DE102007021615A1 (de) * 2006-05-12 2007-11-15 Denso Corp., Kariya Dielektrisches Substrat für einen Wellenhohlleiter und einen Übertragungsleitungsübergang, die dieses verwenden
EP2854326A1 (en) 2007-07-20 2015-04-01 Blue Danube Labs Inc Method and system for multi-point signal generation with phase synchronized local carriers
EP2068391A3 (de) 2007-12-04 2010-01-20 Rohde & Schwarz GmbH & Co. KG Einrichtung mit überkreutzter Streifenleitung
US7830221B2 (en) * 2008-01-25 2010-11-09 Micron Technology, Inc. Coupling cancellation scheme
US9288893B2 (en) * 2009-02-11 2016-03-15 Broadcom Corporation Implementations of twisted differential pairs on a circuit board
JP5225188B2 (ja) * 2009-04-23 2013-07-03 三菱電機株式会社 方向性結合器
AU2010306171B2 (en) * 2009-10-14 2015-06-18 Landis+Gyr (Europe) Ag Antenna coupler
TR201807974T4 (tr) 2010-07-01 2018-06-21 Blue Danube Systems Inc Uygun maliyetli, aktif anten dizilimleri.
KR101375938B1 (ko) * 2012-12-27 2014-03-21 한국과학기술원 저전력, 고속 멀티-채널 유전체 웨이브가이드를 이용한 칩-대-칩 인터페이스

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5638402A (en) * 1993-09-27 1997-06-10 Hitachi, Ltd. Fast data transfer bus
US6600790B1 (en) * 1996-10-30 2003-07-29 Hitachi, Ltd. Gap-coupling bus system
CN1659499A (zh) * 2002-07-01 2005-08-24 株式会社瑞萨科技 等振幅方向性耦合式总线系统
US7271985B1 (en) * 2004-09-24 2007-09-18 Storage Technology Corporation System and method for crosstalk reduction in a flexible trace interconnect array
CN102484505A (zh) * 2009-09-01 2012-05-30 日本电气株式会社 通信系统和通信装置

Also Published As

Publication number Publication date
JP2019165213A (ja) 2019-09-26
EP3158605A1 (en) 2017-04-26
KR20170023095A (ko) 2017-03-02
CN106537683A (zh) 2017-03-22
JP2017520923A (ja) 2017-07-27
JP6526069B2 (ja) 2019-06-05
WO2015200163A1 (en) 2015-12-30
WO2015200171A1 (en) 2015-12-30
US20150373837A1 (en) 2015-12-24
US20150372366A1 (en) 2015-12-24
US9653768B2 (en) 2017-05-16

Similar Documents

Publication Publication Date Title
CN106537683B (zh) 多层基板上信号的耦合
US8063316B2 (en) Split wave compensation for open stubs
JP4371065B2 (ja) 伝送線路、通信装置及び配線形成方法
US7288723B2 (en) Circuit board including isolated signal transmission channels
US6420778B1 (en) Differential electrical transmission line structures employing crosstalk compensation and related methods
JP4373531B2 (ja) 差動平衡信号伝送基板
CN103477567B (zh) 模块间通信装置
CN102056400B (zh) 印刷电路板
US10056669B2 (en) Transmission line
US20150229016A1 (en) Multi-layer transmission lines
US10524351B2 (en) Printed circuit board (PCB) with stubs coupled to electromagnetic absorbing material
CN103098567B (zh) 结构体和配线基板
CN101662882B (zh) 高频宽带阻抗匹配的传输孔
JP4659087B2 (ja) 差動平衡信号伝送基板
CN100556243C (zh) 高频宽带阻抗匹配的传输孔
JPH09191205A (ja) 信号分離マイクロ波スプリッタ／コンバイナ
EP1568099B1 (en) A circuit that taps a differential signal
US20240356190A1 (en) Transmission line
CN113131165B (zh) 电路结构
JP2016207834A (ja) 印刷配線板
US20250385417A1 (en) Impedance transformer with non-coupled transmission line paths for high frequency operation
JP2005347924A (ja) 高周波信号伝送線路基板
JP2005286436A (ja) 高周波用配線基板
JP6115305B2 (ja) 終端器
JP2019145660A (ja) 電気回路積層基板

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant