CN106489205A - 具有柔性衬底的光电装置 - Google Patents
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Abstract
公开了一种光电装置(40)。光电装置包括柔性衬底(34),设置在柔性衬底的第一表面上的薄膜晶体管(TFT)阵列(42),设置在TFT阵列上的光电二极管层(44),以及连接至TFT阵列并且设置在柔性衬底的第一表面上的多个数据线(52)和扫描线(54)。装置进一步包括设置在柔性衬底的与TFT阵列相反的第二表面上的电子设备信号模块组合件(30,32),以及穿过柔性衬底设置、将数据线和扫描线连接至电子设备信号模块组合件的互连(58)。
Description
背景技术
便携式x射线检测器是在医疗和工业市场中快速增长的市场。数字x射线(DXR)检测器通常制造在厚玻璃衬底上。结果,当前的便携式产品具有有限的坚固性(ruggedness)规范,包括最大30cm落差。玻璃衬底要求显著的封装厚度和重量以保护脆弱的玻璃衬底破裂。可以要求权衡以针对检测器重量和厚度平衡检测器坚固性。
因此,对于高度便携、前线部署的数字x射线检测器而言关键的限制是玻璃衬底。诸如电子阅读器和电子书的显示器技术为轻重量和坚固衬底提供了机遇。对于有源矩阵显示器的许多需求与对于数字x射线检测器的需求重叠。结果,柔性显示器可能集成至坚固数字x射线检测器中。柔性、不可破裂、薄的衬底将实现薄的、坚固的、轻重量的x射线检测器以及先前不可能的新的处理能力。
发明内容
本发明通过提供一种光电装置而满足这些和其他需求,该光电装置包括柔性衬底,其具有穿透衬底并且允许至衬底背面的电连接的电互连。
因此,在一个方面中,本发明涉及一种光电装置。光电装置包括柔性衬底,设置在柔性衬底的第一表面上的薄膜晶体管(TFT)阵列,设置在TFT阵列上的光电二极管层,以及连接至TFT阵列并且设置在柔性衬底的第一表面上的多个数据线和扫描线。装置进一步包括设置在柔性衬底的与TFT阵列相反的第二表面上的电子设备信号模块,以及穿过柔性衬底而设置、将数据线和扫描线连接至电子设备信号模块组合件的互连。
附图说明
图1是现有技术的光电装置的示意表示;
图2是根据本发明一个实施例的具有柔性衬底的光电装置的示意表示;以及
图3是根据本发明一个实施例的TFT阵列、数据线、扫描线和通孔的顶视图。
具体实施方式
在下面说明书中,相似参考字符遍及附图示出若干视图中指示相似或对应的部分。也应该理解的是,诸如“顶部”、“在……上方”、“在……之上”、“在……上”等的术语是方便性词汇并且不应构造为限定性术语。
本发明的一个方面提供了一种便携式光电装置,例如,但不限于发光制造(LED),有机发光制造(OLED),光伏制造,光成像器,光发射器以及x射线检测器。
通常现有的电-光(备选地光电)装置10如图1中所示。装置包括衬底14上的有源区域(阵列)12。通常,在诸如光学成像器的通用光学装置中衬底14主要由玻璃制成。玻璃衬底14通常具有机械支承16,使得最小化由玻璃衬底经受的负载和冲击。装置10可以进一步具有反向散射屏蔽18以最小化光波至周围环境的散射。装置10的电子设备20通常组装在衬底14的背面处,优选地反向散射屏蔽18的背面,以便最大化在衬底14正面中的有源区域12。
在具有玻璃衬底14的装置中,通过柔性互连(备选地TAB接合)20形成从有源区域12至电子设备20的电连接。柔性互连22接合至衬底14正面中的有源阵列12,并且卷绕衬底14的边缘、衬底支承16以及反向散射屏蔽18以连接至包括在背面上的数据模块组合件30和扫描模块组合件32的电子设备信号模块组合件,并且进一步连接至电子设备20模块。采用装置外侧盖(外壳)24覆盖有源区域12、衬底14、以及电子设备20。在顶部、侧面和底部上在装置外壳24内添加支承和冲击吸收材料26以保护衬底14玻璃免于破裂。
在外侧外壳24的外部与有源区域12之间的距离“d”是对于许多成像应用指示了有源区域的有用效用的重要参数。可以由最小“d”辅助可用的有源区域12的最大化。采用玻璃衬底14,由柔性互连22以及面板支承26增大距离d。也由支承结构26和面板支承16增大装置的厚度“t”。采用柔性衬底替换玻璃衬底14将减小对于面板支承16以及支承结构和冲击吸收材料的需要。
在本发明的一个实施例中,光电装置40如图2中所示地那样公开。光电装置40具有设置在柔性衬底34上的有源区域12。如本文所使用的,“柔性衬底”是能够弯曲至等于或小于约1厘米半径的衬底,无需影响衬底34的性能的任何裂痕或材料层离。
合适的柔性衬底34包括诸如薄塑料片、复合塑料片和金属箔的柔性片。在一个特定实施例中,柔性衬底包括聚碳酸酯。用于柔性衬底的合适的材料的示例是柔性玻璃,聚合物,包括聚酯,诸如聚对苯二甲酸乙二醇酯、聚对苯二甲酸丁二醇酯、聚对萘二甲酸乙二醇酯、聚苯乙烯、聚碳酸酯、聚甲基丙烯酸甲酯、聚醚砜、聚烯丙酯、聚酰亚胺、聚环烯烃、降冰片烯树脂以及含氟聚合物,金属箔,诸如不锈钢、铝、银和金,金属氧化物,诸如氧化钛和氧化锌,以及诸如硅的半导体。衬底材料可以包括复合材料,诸如纤维增强塑料或碳复合物。也可以使用材料的组合。通过使用不可破裂的材料取代脆弱玻璃衬底用于x射线检测器,能够减小或消除设计成吸收弯曲应力或跌落冲击的组件和材料的大小和重量,并且能够减小检测器的总重量和厚度。
在一个实施例中,采用装置外侧外壳24覆盖有源区域12、衬底14以及电子设备20。在备选实施例中,电子设备20可以设置在外壳外部。因为柔性衬底由冲击弹回性材料制成,对于在上部外壳24和有源区域12之间、在电子设备组合件20和下部外壳24之间以及在侧面中衬底34和外壳24之间的衬底34无需附加的机械支承。可以存在如图2中所示地那样设置在柔性支承34的背面处的任选的反向散射屏蔽18。在一个实施例中,在柔性衬底34的背面上的数据模块组合件30和扫描模块组合件32设置在外壳24内并且连接至电子设备20模块。在另外实施例中,数据模块组合件30和/或扫描模块组合件32可以通过柔性模块与电子设备20模块连接。
在一个实施例中,光电装置40的有源区域12包括薄膜晶体管(TFT)阵列42和光电二极管层44。在一个实施例中,TFT阵列42设置在柔性衬底34的第一表面上并且光电二极管层44设置在TFT阵列42上。TFT阵列42可以包括以特定顺序布置在衬底34的第一表面上的多个薄膜晶体管。TFT阵列的薄膜晶体管可以以并排方式布置或者可以布置有个别薄膜晶体管之间的间隙。
光电二极管层可以包括一批光电二极管,或者可以是具有以层形式布置的多个个别光电二极管。光电二极管层44可以包括有机光电二极管或无机光电二极管。取决于应用和设计变化,光电二极管层44可以是单个层或者可以包括多个层。此外,光电二极管层44可以直接地设置在TFT阵列42上,或者设计可以包括设置在光电二极管层44与TFT阵列42之间的一个或多个层。在一个实施例中,多个光电二极管布置在TFT阵列42上的光电二极管层44中。在一个实施例中,TFT阵列42电连接至光电二极管层44。
取决于光电装置40的功能,可以存在附加的层作为有源区域12的一部分。例如,在一个实施例中,光学装置是光成像器。在一个实施例中,光成像器是具有闪烁体材料的x射线检测器。在该实施例中,闪烁体材料46可以设置在光电二极管层42上。
在一个特定实施例中,光电装置40是便携式x射线检测器并且包括由撞击x射线激励并且产生可见光的闪烁体层46。闪烁体层46可以是单片闪烁体或像素化闪烁体阵列。GOS(Gd2O2S)是通常使用的低成本闪烁体,其采取具有毫米范围厚度的薄膜的形式。碘化铯(CsI)是能够用于高灵敏度闪烁体的另一闪烁体材料,并且可以由热蒸发而沉积。可以使用的另一闪烁体是PIB(粘合剂中颗粒)闪烁体,其中闪烁颗粒可以包括在粘合剂矩阵材料中并且平坦化在衬底上。由闪烁体生成的可见光照射设置在TFT阵列42上的光电二极管层44。
撞击在光电二极管层44上的可见光将光电二极管层44的二极管的电容部分地放电。光电二极管放电量正比于入射光的量。TFT阵列42的每个像素包括用于控制电荷何时恢复至光电二极管电容的开关场效应晶体管(FET)。恢复电容所要求的电荷由外部电荷测量电路系统提供并测量。与TFT阵列42耦合的该电路系统允许依次扫描并读出阵列44中所有光电二极管。定制的A/D积分器/转换器通常用于测量将光电二极管恢复至其初始未放电状态所要求的电荷。放电的幅度正比于在x射线曝露长度期间由闪烁体层46和光电二极管层44集成的每个像素处的入射x射线剂量。使用光电二极管层44放电水平逐个像素地重构最终的x射线图像以设置图像像素强度。
为了由外部电路系统提供并测量恢复光电二极管的电容所要求的电荷,多个数据线52和扫描线54可以连接至TFT阵列42并且设置在柔性衬底的第一表面上,如图3中所描绘在TFT阵列42的顶视图中所示(未示出TFT阵列42顶部上的任何其他有源层)。数据线52和扫描线54可以连接至TFT阵列42的每个晶体管。因此,取决于TFT阵列中晶体管的数目,在柔性衬底34的第一表面上可以存在数百个数据线52和扫描线54。在一个实施例中,存在的数据线52的数目大于1000。在一个实施例中,存在的扫描线54的数目大于1000。
数据线52和扫描线54需要分别连接至数据模块组合件30和扫描模块组合件32(图2)。在一个实施例中,电子信号模块(未示出)包括数据模块组合件30和扫描模块组合件32,并且设置在柔性衬底34的背面(第二表面)中。在一个实施例中,数据模块组合件30设置在柔性衬底34的第一表面上,并且扫描模块组件32设置在柔性衬底34的背面中。在备选实施例中,扫描模块组合件32设置在柔性衬底34的第一表面上,以及数据模块组合件30设置在柔性衬底34的背面中。在一个实施例中,数据模块组合件30和扫描模块组合件32通过柔性接合分别连接至数据线52和扫描线54。考虑到本光学装置40的适应柔性衬底34,通孔56(图2和图3)可以穿过衬底34连接第一表面和第二表面而形成。数据线52可以通过穿过通孔56而连接至数据模块组合件30而无需围绕衬底34的边缘行走。类似地,扫描线54可以通过传统通孔56连接至扫描模块组合件32而无需围绕衬底34的边缘行走。
取决于需求可以存在设置于衬底34上的多个通孔56。用于将数据信息(包括数据信号)传输至数据模块组合件30和将扫描信息(包括扫描信号)传输至扫描模块组合件32的通孔56可以相同或不同。例如,一组通孔56可以排他地用于将数据线52信息传输至数据模块组合件30,以及另一组通孔56可以用于传输扫描线54信息至扫描模块组合件32。互连58(图2)可以穿过通孔56用于将数据线52与数据模块组合件30连接以及通过标签翼片粘合垫(tab bond pad)36而将扫描线54与扫描模块组合件32连接。用于将数据信息传输至数据模块组合件30的互连58可以不同于用于将扫描信息传输至扫描模块组合件32的互连58。在一个实施例中,数据模块组合件30和/或扫描模块组合件32可以通过柔性模块与互连58连接。
柔性衬底34上的通孔56可以设置在衬底34上任意位置。在一个实施例中,通孔56靠近柔性衬底34的边缘部分,并且因此,互连58设置靠近衬底的边缘部分,远离有源区域12。在备选实施例中,通孔56和互连58设置在柔性衬底34的其中设置TFT阵列42的阵列部分(未示出)中。
在具有柔性衬底34的光电装置40的一个实施例中,在垂直于通孔56(并且平行于衬底34第一表面和第二表面)的方向的外壳24与柔性衬底34之间间距小于约0.5mm。在一个实施例中,外壳24的外侧部分与有源区域12之间的距离d小于约5毫米。
本书面描述使用包括最佳模式的示例来公开本发明,并且使本领域的技术人员能够实施本发明,包括制作和使用任何装置或系统,以及执行任何合并方法。本发明的可取得专利范围由权利要求书来定义,并且可包括本领域的技术人员想到的其他示例。如果这类其他示例具有与权利要求的文字语言完全相同的结构单元,或者如果它们包括具有与权利要求的文字语言的非实质差异的等效结构单元,则预计它们处于权利要求的范围之内。
Claims (14)
1.一种光电装置,包括:
薄膜晶体管(TFT)阵列,设置在柔性衬底的第一表面上;
光电二极管层,设置在所述TFT阵列上;
多个数据线和扫描线,连接至所述TFT阵列并且设置在所述柔性衬底的所述第一表面上;
电子设备信号模块组合件,设置在所述柔性衬底的与所述TFT阵列相反的第二表面上;以及
穿过所述柔性衬底,将所述数据线和扫描线连接至所述电子设备信号模块组合件的互连。
2.根据权利要求1所述的装置,其中,所述电子设备信号模块组合件包括数据扫描模块组合件和扫描模块组合件。
3.根据权利要求1所述的装置,其中,所述TFT阵列包括多个晶体管并且所述TFT阵列的每个晶体管连接至所述电子设备信号模块组合件。
4.根据权利要求1所述的装置,其中,所述光电二极管层包括多个光电二极管。
5.根据权利要求1所述的装置,其中,所述TFT阵列电连接至所述光电二极管层。
6.根据权利要求1所述的装置,其中,所述多个数据线包括大于约100个数据线。
7.根据权利要求1所述的装置,其中,所述多个数据线包括大于约100个扫描线。
8.根据权利要求1所述的装置,其中,所述互连设置靠近所述柔性衬底的边缘部分。
9.根据权利要求1所述的装置,其中,所述互连设置在所述柔性衬底的所述阵列部分中。
10.根据权利要求1所述的装置,进一步包括设置在所述光电二极管层上的闪烁体材料。
11.根据权利要求9所述的装置,其中,所述柔性衬底、闪烁体、TFT阵列、光电二极管层、多个数据线以及多个扫描线设置在外壳内。
12.根据权利要求11所述的装置,其中,所述电子设备信号模块组合件设置在外壳内。
13.根据权利要求10所述的装置,其中,在所述外壳和所述柔性衬底之间的间距小于约0.5mm。
14.根据权利要求1所述的装置,其中,所述装置是便携式X射线检测器。
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US9917133B2 (en) | 2018-03-13 |
EP3080846A1 (en) | 2016-10-19 |
CN106489205B (zh) | 2020-08-21 |
US20150171134A1 (en) | 2015-06-18 |
WO2015088605A1 (en) | 2015-06-18 |
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