CN106482720B - 传感器单元、电子设备以及移动体 - Google Patents

传感器单元、电子设备以及移动体 Download PDF

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Publication number
CN106482720B
CN106482720B CN201610792313.4A CN201610792313A CN106482720B CN 106482720 B CN106482720 B CN 106482720B CN 201610792313 A CN201610792313 A CN 201610792313A CN 106482720 B CN106482720 B CN 106482720B
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Prior art keywords
sensor device
substrate
sensor
sensor unit
base
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Chinese (zh)
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CN106482720A (zh
Inventor
斋藤佳邦
木下裕介
伊藤慧太
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Seiko Epson Corp
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Seiko Epson Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Gyroscopes (AREA)
CN201610792313.4A 2015-09-02 2016-08-31 传感器单元、电子设备以及移动体 Active CN106482720B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110641918.4A CN113340290B (zh) 2015-09-02 2016-08-31 传感器单元、电子设备以及移动体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-172605 2015-09-02
JP2015172605A JP6597069B2 (ja) 2015-09-02 2015-09-02 センサーユニット、電子機器、および移動体

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CN202110641918.4A Division CN113340290B (zh) 2015-09-02 2016-08-31 传感器单元、电子设备以及移动体

Publications (2)

Publication Number Publication Date
CN106482720A CN106482720A (zh) 2017-03-08
CN106482720B true CN106482720B (zh) 2021-10-29

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CN202110641918.4A Active CN113340290B (zh) 2015-09-02 2016-08-31 传感器单元、电子设备以及移动体

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US (1) US10228269B2 (https=)
JP (1) JP6597069B2 (https=)
CN (2) CN106482720B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101980888B1 (ko) * 2018-01-24 2019-05-22 최운선 유량계
WO2020012647A1 (ja) * 2018-07-13 2020-01-16 株式会社日立ハイテクファインシステムズ 交通路設備の検測装置のセンサーユニット冷却装置及びセンサーユニット冷却方法
JP2020101484A (ja) * 2018-12-25 2020-07-02 セイコーエプソン株式会社 慣性センサー、電子機器および移動体
US11372018B2 (en) * 2019-11-29 2022-06-28 Seiko Epson Corporation Sensor unit, electronic apparatus, and moving object
US20210165010A1 (en) * 2019-11-29 2021-06-03 Seiko Epson Corporation Sensor unit, electronic apparatus, and moving object
CN115461627A (zh) * 2020-05-12 2022-12-09 株式会社村田制作所 加速度检测装置
WO2022239347A1 (ja) * 2021-05-12 2022-11-17 ソニーグループ株式会社 保持構造及び保持方法
JP7786125B2 (ja) * 2021-10-27 2025-12-16 セイコーエプソン株式会社 慣性計測装置
WO2023079896A1 (ja) * 2021-11-04 2023-05-11 株式会社村田製作所 加速度検出装置
JP7779093B2 (ja) 2021-11-10 2025-12-03 セイコーエプソン株式会社 慣性計測装置
JP2024017550A (ja) 2022-07-28 2024-02-08 セイコーエプソン株式会社 慣性計測装置、慣性計測装置の製造方法
JP2024042246A (ja) * 2022-09-15 2024-03-28 セイコーエプソン株式会社 慣性計測装置
JP2024042245A (ja) * 2022-09-15 2024-03-28 セイコーエプソン株式会社 慣性計測装置

Citations (3)

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US6316840B1 (en) * 2000-02-16 2001-11-13 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
CN103528579A (zh) * 2012-07-03 2014-01-22 索尼公司 传感器装置
CN104344820A (zh) * 2013-08-09 2015-02-11 精工爱普生株式会社 传感器单元、电子设备、以及移动体

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JPH0572227A (ja) * 1991-09-12 1993-03-23 Sumitomo Electric Ind Ltd 加速度検出器
JPH09318652A (ja) * 1996-05-28 1997-12-12 Mitsubishi Electric Corp 加速度センサ装置
JP2002181550A (ja) * 2000-10-02 2002-06-26 Ngk Insulators Ltd 角速度測定装置
JP4525153B2 (ja) * 2003-06-05 2010-08-18 オムロン株式会社 端子のシール構造およびそれに用いるシール材
JP2006153799A (ja) * 2004-12-01 2006-06-15 Denso Corp 角速度センサ装置およびその製造方法
JP2008028017A (ja) * 2006-07-19 2008-02-07 Sharp Corp 樹脂封止型半導体装置
JP4244235B2 (ja) * 2006-10-10 2009-03-25 株式会社日立製作所 電子回路装置
JP2008170295A (ja) 2007-01-12 2008-07-24 Matsushita Electric Ind Co Ltd 角速度センサ
KR20110036961A (ko) * 2008-08-27 2011-04-12 히다치 가세고교 가부시끼가이샤 양면 접착 필름 및 이것을 사용한 전자 부품 모듈
US20110110792A1 (en) * 2009-11-12 2011-05-12 Joseph Kendall Mauro Sensors and methods and apparatus relating to same
JP5463173B2 (ja) * 2010-03-12 2014-04-09 日立オートモティブシステムズ株式会社 角速度検出装置
JP2012117933A (ja) 2010-12-01 2012-06-21 Denso Corp 接着構造体の製造方法
JP5845672B2 (ja) * 2011-07-13 2016-01-20 セイコーエプソン株式会社 センサーデバイスおよび電子機器
JP2013030850A (ja) * 2011-07-26 2013-02-07 Seiko Epson Corp 振動デバイスおよび電子機器
US20130073248A1 (en) * 2011-09-20 2013-03-21 Noel Perkins Apparatus and method for employing miniature inertial measurement units for deducing forces and moments on bodies
WO2013046705A1 (ja) * 2011-09-30 2013-04-04 パナソニック株式会社 慣性力センサ
JP6255865B2 (ja) * 2013-10-04 2018-01-10 セイコーエプソン株式会社 センサーユニット、電子機器、および移動体
JP2015094645A (ja) * 2013-11-12 2015-05-18 日立オートモティブシステムズ株式会社 慣性力センサ装置
JP2015108558A (ja) * 2013-12-05 2015-06-11 日立オートモティブシステムズ株式会社 樹脂封止型センサ装置
EP3171131A4 (en) * 2014-07-16 2018-03-07 Seiko Epson Corporation Sensor unit, electronic apparatus, and mobile body

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316840B1 (en) * 2000-02-16 2001-11-13 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
CN103528579A (zh) * 2012-07-03 2014-01-22 索尼公司 传感器装置
CN104344820A (zh) * 2013-08-09 2015-02-11 精工爱普生株式会社 传感器单元、电子设备、以及移动体

Also Published As

Publication number Publication date
JP6597069B2 (ja) 2019-10-30
CN113340290A (zh) 2021-09-03
CN106482720A (zh) 2017-03-08
US10228269B2 (en) 2019-03-12
US20170059605A1 (en) 2017-03-02
CN113340290B (zh) 2024-01-05
JP2017049122A (ja) 2017-03-09

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