CN106463464B - 电子部件收纳用封装件以及具备其的电子装置 - Google Patents
电子部件收纳用封装件以及具备其的电子装置 Download PDFInfo
- Publication number
- CN106463464B CN106463464B CN201580033271.XA CN201580033271A CN106463464B CN 106463464 B CN106463464 B CN 106463464B CN 201580033271 A CN201580033271 A CN 201580033271A CN 106463464 B CN106463464 B CN 106463464B
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- China
- Prior art keywords
- wiring conductor
- cutout unit
- electronic component
- insulating body
- wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 51
- 238000003860 storage Methods 0.000 title claims abstract description 48
- 239000004020 conductor Substances 0.000 claims abstract description 140
- 238000009434 installation Methods 0.000 claims abstract description 17
- 239000011159 matrix material Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 description 12
- 239000010931 gold Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 9
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 238000001465 metallisation Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
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- Structure Of Printed Boards (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
电子部件收纳用封装件(10)具备绝缘基体(1),该绝缘基体(1)在上表面(2)具有电子部件的安装区域(2a),并在下表面(3)具有第1切除部(5)以及第2切除部(6)。第1切除部(5)切入绝缘基体(1)的侧面(4)的下部,并从侧面(4)的下部被切除到下表面(3)。在第1切除部(5)形成多个布线导体(7),该多个布线导体(7)从绝缘基体(1)的下表面(3)经由第1切除部(5)的内壁面,贯通绝缘基体(1)并被导出到绝缘基体(1)的上表面(2)。第2切除部(6)从第1切除部(5)的内壁面到下表面(3),被设置于布线导体(7)之间。通过具备第2切除部(6)从而能够将布线导体(7)紧密地配置。
Description
技术领域
本发明涉及用于收纳电子部件的电子部件收纳用封装件以及电子装置。更详细地,涉及在侧面设置外部连接用导体的高频用的电子部件收纳用封装件以及电子装置。
背景技术
作为电子部件收纳用封装件的例子,例如存在专利文献1中公开的电子部件收纳用封装件。该电子部件收纳用封装件在绝缘基体的侧面设置外部连接用导体。
图6所示的电子部件收纳用封装件100具有侧面104的一部分从侧面104到下表面103被切除的切除部105。此外,形成从绝缘基体101的下表面103到上表面102被导出的布线导体107。布线导体107从下表面103经由被设置于切除部105内的凹部106的内壁面而被导出到上表面102。
由于布线导体107被设置于切除部105的内侧,因此能够在比绝缘基体101的外周更靠内的一侧进行与外部电路基板的接合。由此,能够在不设置缝隙的情况下将多个电子部件收纳用封装件100并排安装于外部电路基板。
此外,专利文献2中表示了在排列多个线路导体的情况下,为了减少线路导体间的电干扰导致的高频特性的恶化,在线路导体之间设置槽。
在先技术文献
专利文献
专利文献1:日本特开2012-174713号公报
专利文献2:日本特开平11-214556号公报
发明内容
-发明要解决的课题-
但是,在排列多个布线导体107来传送高频信号的情况下,若将布线导体107的特性阻抗设为规定的值,则存在不能将布线导体107配置为某个布线密度以上的课题。因此,存在电子部件收纳用封装件100大型化的问题。
本发明鉴于上述课题而作出,其目的在于,使电子部件收纳用封装件以及具备该电子部件收纳用封装件的电子装置小型化。
-解决课题的手段-
本发明的一实施方式所涉及的电子部件收纳用封装件具备:绝缘基体,在上表面具有电子部件的安装区域,并具有切入侧面的下部而从侧面的下部到下表面被切除的第1切除部;多个布线导体,从该绝缘基体的下表面经由所述第1切除部的内壁面,贯通所述绝缘基体并被导出到所述绝缘基体的上表面;和第2切除部,从所述第1切除部的内壁面到所述绝缘基体的所述下表面,被设置于所述布线导体之间。
在上述电子部件收纳用封装件中,因从所述侧面起的所述第1切除部的切除的深度不同,形成于所述内壁面的多个所述布线导体的位置在所述第1切除部的切除的深度方向上可以被配置于不同的面。
在上述电子部件收纳用封装件中,也可以所述第1切除部由从所述绝缘基体的所述侧面被切除的第1部分、和将该第1部分的内壁的里面中央部进一步被切除的第2部分构成,所述布线导体被配置于所述第2部分的内壁面,并且最外部的布线导体从所述第2部分的里面遍及所述第1部分的边界而被配置,所述里面在所述第2部分被切除的深度方向上,被配置于比中央部的所述布线导体深的位置。
此外,在上述电子部件收纳用封装件中,也可以多个所述布线导体构成高频差动信号线路,被配置于最外侧的布线导体是接地导体。
此外,本发明的一实施方式所涉及的电子装置具备:上述电子部件收纳用封装件、和被安装于所述安装区域并与所述布线导体电连接的电子部件。
-发明效果-
根据本发明的一实施方式所涉及的电子部件收纳用封装件,由于具备:从绝缘基体的下表面经由第1切除部的内壁面,贯通绝缘基体并被导出到绝缘基体的上表面的多个布线导体、和从第1切除部的内壁面到绝缘基体的下表面并被设置于布线导体之间的第2切除部,因此能够将布线导体紧密地配置,能够使电子部件收纳用封装件小型化。
此外,在上述电子部件收纳用封装件中,若通过从侧面起的第1切除部的切除的深度不同,从而形成于内壁面的多个上述布线导体的位置在切除的深度方向上被配置于不同的面,则能够减小布线导体彼此的电容性耦合,能够将布线导体进一步紧密地配置。
此外,在上述电子部件收纳用封装件中,若第1切除部由从绝缘基体的侧面被切除的第1部分、和将该第1部分的内壁的里面中央部进一步切除的第2部分构成,布线导体被配置于第2部分的内壁面,并且最外部的布线导体从第2部分的里面遍及第1部分的边界而被配置,里面在第2部分被切除的深度方向上,被配置于比中央部的布线导体深的位置,则能够减小中央部的布线导体与最外部的布线导体之间的电容性耦合,能够将布线导体紧密地配置。
此外,在上述电子部件收纳用封装件中,在多个布线导体构成高频差动信号线路,被配置于最外侧的布线导体是接地导体的情况下,能够将高频差动信号线路紧密地配置,能够设为小型且高性能的电子部件收纳用封装件。
此外,根据本发明的一实施方式所涉及的电子装置,能够设为小型且高频特性优良的电子装置。
附图说明
图1是从斜下方来观察本发明的一实施方式所涉及的电子部件收纳用封装件的立体图。
图2是图1所示的电子部件收纳用封装件的仰视图。
图3是从斜下方来观察本发明的另一实施方式的例子所涉及的电子部件收纳用封装件的立体图。
图4是图3所示的电子部件收纳用封装件的仰视图。
图5是从斜上方来观察本发明的一实施方式所涉及的电子部件收纳用封装件的立体图。
图6是表示现有的电子部件收纳用封装件的例子的立体图。
具体实施方式
以下,参照附图来对本发明的一实施方式所涉及的电子部件收纳用封装件(以下,也简称为封装件)以及具备该电子部件收纳用封装件的电子装置进行说明。
图1是从斜下方来观察电子部件收纳用封装件10的立体图。图2是图1所示的电子部件收纳用封装件10的仰视图。此外,图5是从斜上方来观察该电子部件收纳用封装件10的立体图。另外,在这些图中,为了容易区分观察,将布线导体7其他的金属化层形成部分阴影化。该阴影并不是表示剖面。此外,在这些图中,对相同的部位付与相同的符号。为了防止附图变得繁琐,在相同的部位在一个图内存在多个的情况下,可能对代表性的部分付与符号,并省略对全部部位付与相同的符号。
例如如图1所示,电子部件收纳用封装件10具有俯视时外形为四边形的绝缘基体1。绝缘基体1例如是1边的长度为2mm~20mm的正方形,是厚度为0.2mm~2mm的板状。除此以外能够根据需要来设为长方形、多边形等各种形状或大小。
在绝缘基体1,在侧面4的下部形成第1切除部5。在图1所示的实施方式中,第1切除部5被设置为将侧面4的下半部分切入。第1切除部5被切除到绝缘基体1的下表面3,在侧面4以及下表面3具有开口。
另外,第1切除部5也可以不仅被设置于侧面4,还被设置于其他侧面,例如如图1所示,也被设置于与侧面4相反的一侧的侧面。进一步地,第1切除部5也可以被设置于全部侧面。此外,第1切除部5也可以沿着绝缘基体1的厚度方向比侧面4的下半部分更薄地被切入设置。由此,能够提高形成有第1切除部5的部位的绝缘基体1的抗折强度。其结果,能够难以产生在绝缘基体1产生的应力或者弯曲所导致的裂缝或者破裂。
布线导体7从下表面3经由第1切除部5的里侧内壁面,贯通绝缘基体1的内部而被导出到绝缘基体1的上表面2。布线导体7具有使高频信号在下表面3与上表面2之间导通的功能。被配置于布线导体7的下表面3以及第1切除部5的内壁面的部分经由金(Au)-锡(Sn)焊料、银(Ag)-锡(Sn)焊料或者金(Au)-锗(Ge)焊料等来与外部布线基板的电极连接。另外,布线导体7被并行设置多个。在以下的说明中,在区分这些各个布线导体7的情况下,付与布线导体7a、7b等的下标。
此外,在多个布线导体7之间设置第2切除部6。通过设置第2切除部6,能够减少相邻的布线导体7之间的电容性耦合,能够将布线导体7紧密地配置。并且,能够缩小配置多个布线导体7的区域,使封装件小型化。进一步地,在将绝缘基体1切除的第2切除部6中,由于相邻的布线导体7之间不产生应力,因此能够抑制在布线导体7的周围的绝缘基体1产生的裂缝或者破裂的发生。
此外,能够使将电子部件收纳用封装件10电连接于外部布线基板的焊料等接合材料在相邻的布线导体7之间难以形成桥接。其结果,能够将相邻的布线导体7彼此更加紧密地配置。
第2切除部6被设置于第1切除部5的里面与下表面3之间,在第1切除部5和下表面3具有开口。第2切除部6可以被较深地设置到比布线导体7的下表面3的末端更里侧。第2切除部6的宽度例如是0.25mm,被设置为从布线导体7的边缘到相邻的布线导体7的边缘。在不设置第2切除部6的情况下,在绝缘基体1的介电常数为9.5F/m时,需要在布线导体7之间设置2.375mm的间隔。另外,尺寸例是基于使用28GHz附近的高频信号的情况的尺寸。
另外,也可以使形成布线导体7的第1切除部5的从侧面4起的切除的深度不同,在该表面形成布线导体7。例如,将布线导体7a配置于第1切除部5的里侧内壁面。布线导体7a与布线导体7b高度不同,未被配置在同一平面上。由此,能够减小在布线导体7a与布线导体7b之间产生的电容性耦合。此外,由此,能够进一步紧密地配置布线导体7。进一步地,能够在布线导体7a与布线导体7b之间难以形成焊料桥接。
根据图2所示的例子可知,中央部的布线导体7a与最外部的布线导体7b的从侧面4起的第1切除部5的切除的深度仅相差D1。中央部的布线导体7a的从侧面4起的距离比最外部的布线导体7b仅长D1。并且,中央部的布线导体7a与最外部的布线导体7b被配置在高度不同的平面上。
从减小电容性耦合的观点出发,距离D1最好较大。但是,若使距离D1过大,则在布线导体7a与布线导体7b之间产生的电容性耦合变小,而通过布线导体7a与布线导体7b之间的线间距离不能充分调整该部分,可能不能充分发挥作为高频线路的功能。例如,若由布线导体7a与布线导体7b的配置关系而决定的高频阻抗超过了规定范围,则由形成于第1切除部5的里面的布线导体7a和作为接地导体而起作用的布线导体7b形成的高频线路的传送特性恶化。因此,例如距离D1为0.01mm~0.1mm即可。具体地,在本实施方式的一个例子中,距离D1是0.05mm。
如图3以及图4所示,第1切除部5也可以由被从侧面4一侧切除的第1部分5a、和在里面的中央部被切除使得从第1部分5a的里面进一步设置阶梯的第2部分5b构成。第1部分5a的两端部被设为曲面,在侧面4开口。由此,能够在第1部分5a的内壁面,应力不集中到一部分。此外,第2部分5b的两端面相对于侧面4被设为直角的平面,与第1部分5a的两端曲面部分连接。此外,第2部分5b的里面5ba(里侧的内壁面)被设为与侧面4平行的平面。
并且,布线导体7从下表面3被配置到第2部分5b的里面5ba。由此,能够增多被设置于电子部件收纳用封装件10与外部布线基板之间的接合材料的量。其结果,能够提高将电子部件收纳用封装件10与外部布线基板接合时的接合可靠性。此外,从布线导体7之间的第2部分5b的里面5ba到绝缘基体1的下表面3,设置第2切除部6。
此外,布线导体7之中,被配置于最外部的布线导体7b的从侧面4起的切除的深度也可以被配置于比中央部的布线导体7a的从侧面4起的切除的深度仅深D2的位置。也就是说,根据图4所示的例子可知,最外部的布线导体7b的从侧面4起的距离被配置为比中央部的布线导体7a的从侧面4起的距离长D2。由此,能够更加缩短中央部的布线导体7a与最外部的布线导体7b的间隔,能够将布线导体7a以及布线导体7b紧密地配置。
从减小电容性耦合的观点出发,距离D2最好较大。但是,若使距离D2过大,则与上述的距离D1的情况相同地,可能不能发挥作为高频线路的功能。因此,例如距离D2设为0.01mm~0.2mm即可。具体地,在本实施方式的一个例子中,距离D2是0.1mm。
进一步地,布线导体7的位于排列的最外侧的布线导体7b可以形成为从第2部分5b的里面5ba到被直角地配置的端面5bb。端面5bb位于与第1部分5a的边界。通过最外部的布线导体7b形成于折弯为直角的第2部分5b的内壁面,能够减小在被配置为直角的该端面5bb与中央部的布线导体7a之间产生的电容性耦合。布线导体7a及其两侧的布线导体7b能够作为共面线路,使其传送高频信号,其中该共面线路中,布线导体7a作为高频信号的线路导体而起作用,形成于端面5bb的布线导体7b作为接地导体而起作用。
此外,在通过焊料等接合材料来将电子部件收纳用封装件10与外部布线基板电连接时,能够在设置于第2部分5b的里面5ba和端面5bb所构成的布线导体7b的角部,设置基于接合材料的弯月面。进一步地,能够增多设置于第2部分5b的接合材料的量。其结果,能够提高将电子部件收纳用封装件10与外部布线基板接合时的接合可靠性。
然而,在图1以及图3所示的电子部件收纳用封装件10的例子中,布线导体7形成高频差动信号线路。在该情况下,被配置于最外侧的两个布线导体7b是接地布线,在被其夹着的中央部的2根布线导体7a中导通高频差动信号。高频差动信号线路为了传送例如2.5GHz以上的高频信号而被适当地使用。另外,也可以形成在导通了高频差动信号的中央部的2根布线导体7a之间,进一步设置被第2切除部6夹着的接地布线导体的高频差动信号线路。
在绝缘基体1的上表面2安装电子部件(未图示)。在图5所示的例子中,在绝缘基体1的中央部设置电子部件的安装区域2a。对安装区域2a实施金属化层,使得能够通过金(Au)-锡(Sn)焊料或者金(Au)-锗(Ge)焊料等来固定电子部件。通过这样将电子部件安装于电子部件收纳用封装件10,来完成电子装置。另外,图5表示上表面2的实施方式的一个例子,根据上表面2的安装区域2a的配置等的情况,绝缘基体1、安装区域2a、导体焊盘2b以及布线导体7能够设为各种形状。
在安装区域2a的周围配置高频信号用的布线导体7、其他的电力供给用导体、接地布线等的导体焊盘2b。导体焊盘2b通过贯通绝缘基体1的导体来与设置于下表面3的电极焊盘连接。
并且,在安装区域2a安装IC、LSI等电子部件,通过接合引线或焊料等来将其电极与导体焊盘2b连接。然后,安装于绝缘基体1以使得覆盖安装区域2a,通过保护电子部件的密封部件来将电子部件密封。密封部件是将电子部件气密地密封的部件即可。例如,可以是树脂材料或者玻璃系材料等,也可以是由金属材料构成的盖体等。密封部件中例如使用环氧树脂、硅树脂或者低熔点玻璃等。此外,在密封部件是金属盖体的情况下,例如使用铁(Fe)-镍(Ni)-钴(Co)合金等。
另外,在上述的实施方式的例子中,绝缘基体1由树脂、玻璃、陶瓷等绝缘材料形成。若是陶瓷,例如能够使用氧化铝质陶瓷、氮化铝质陶瓷或者莫来石质陶瓷等陶瓷材料。优选绝缘基体1是将安装于安装区域2a的电子部件的发热迅速放热的材料。优选绝缘基体1的热传导率例如是15(W/m·K)以上且200(W/m·K)以下。此外,优选绝缘基体1的热膨胀系数例如是4(ppm/℃)以上且8(ppm/℃)以下。
若是陶瓷制的绝缘基体1,则使用金属模来对平板状的陶瓷生片实施冲裁,将这些层叠多片并通过烧制来制作。例如,图1、图2、图3、图4以及图5所示的绝缘基体1是将作为绝缘基体1的上半部分的长方形的陶瓷生片和作为下半部分的相同的长方形的陶瓷生片层叠而制作的。下半部分的陶瓷生片是将其侧面冲裁为第1切除部5以及第2切除部6的至少一个的形状而制作的。
接下来,在这些陶瓷生片表面的金属化层形成部分,通过丝网印刷法等来将例如向钨、钼或者锰等的金属粉末添加混合有机粘合剂或溶剂而成的金属糊膏印刷涂覆为规定图案。此外,通过贯通导体来将表里的金属糊膏彼此连结。最后,将这些上半部分以及下半部分的陶瓷生片彼此层叠,在烧制炉中进行烧制,得到绝缘基体1。
另外,在布线导体7、安装区域2a等的金属化层的露出表面,可以通过镀覆形成方法,依次覆盖镍镀层以及金镀层。镍镀层例如镀覆为0.5μm~10μm的厚度,金镀层例如镀覆为0.1μm~5μm的厚度。这些金属镀层,防止布线导体7等的金属化层氧化腐蚀。此外,能够使安装区域2a的周边的布线导体7与电子部件的电极的电连接良好。
布线导体7被设置于第1切除部5的内壁面,因此布线导体7与外部布线基板其他的周围的物体碰撞并损伤的可能性较小。此外,布线导体7被设置于第1切除部5内,因此在外部布线基板上能够将封装件10彼此紧密接触地配置。外部布线基板中能够使用例如树脂制的印刷电路基板、陶瓷制的电路基板等。
此外,在外部布线基板的封装件10的周围,能够将电容器等电子部件接近安装,能够使外部布线基板小型化。或者,能够提高外部基板的布线图案的设计的自由度。
另外,本发明并不限定于上述的实施方式,在不脱离本发明的主旨的范围内能够进行各种变更、改进等。
-符号说明-
1 绝缘基体
2 上表面
2a: 安装区域
2b: 导体焊盘
3 下表面
4 侧面
5 第1切除部
5a: 第1部分
5b: 第2部分
6 第2切除部
7 布线导体
7a: 中央部的布线导体
7b: 最外部的布线导体
10 电子部件收纳用封装件
Claims (4)
1.一种电子部件收纳用封装件,其特征在于,具备:
绝缘基体,在上表面具有电子部件的安装区域,并具有切入侧面的下部而从侧面的下部到下表面被切除的第1切除部;
多个布线导体,从该绝缘基体的下表面经由所述第1切除部的里侧内壁面,贯通所述绝缘基体并被导出到所述绝缘基体的上表面;和
第2切除部,被设置于所述布线导体之间,且从所述第1切除部的里侧内壁面设置到所述绝缘基体的所述下表面,
所述第1切除部由从所述绝缘基体的所述侧面被切除的第1部分、和将该第1部分的里侧内壁面的中央部切除使得从该第1部分的里侧内壁面进一步设置阶梯的第2部分构成,
所述布线导体被配置于所述第2部分的里侧内壁面,并且最外部的布线导体从所述第2部分的里侧内壁面配置到所述第1部分的边界,
所述第2部分的里侧内壁面在所述第2部分被切除的深度方向上,被配置于比中央部的所述布线导体深的位置。
2.根据权利要求1所述的电子部件收纳用封装件,其特征在于,
因从所述侧面起的所述第1切除部的切除的深度不同,形成于所述第1切除部的里侧内壁面的多个所述布线导体的位置在所述第1切除部的切除的深度方向上被配置于不同的面。
3.根据权利要求1或2所述的电子部件收纳用封装件,其特征在于,
多个所述布线导体构成高频差动信号线路,被配置于最外侧的布线导体是接地导体。
4.一种电子装置,其特征在于,具备:
权利要求1至3的任意一项所述的电子部件收纳用封装件;和
电子部件,被安装于所述安装区域并与所述布线导体电连接。
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EP3531449A4 (en) * | 2016-10-21 | 2020-04-08 | Kyocera Corporation | HIGH FREQUENCY BASE BODY, HIGH FREQUENCY HOUSING AND HIGH FREQUENCY MODULE |
JP6829106B2 (ja) * | 2017-02-22 | 2021-02-10 | 京セラ株式会社 | 電子部品実装用基板、電子部品実装用パッケージおよび電子装置 |
CN111316408B (zh) * | 2017-10-30 | 2023-07-18 | 三菱电机株式会社 | 电力用半导体装置以及电力用半导体装置的制造方法 |
JP6923431B2 (ja) * | 2017-12-25 | 2021-08-18 | 京セラ株式会社 | 高周波基体、高周波パッケージおよび高周波モジュール |
JP7021041B2 (ja) * | 2018-09-26 | 2022-02-16 | 京セラ株式会社 | 配線基板、電子部品パッケージおよび電子装置 |
JP7230251B2 (ja) * | 2018-09-26 | 2023-02-28 | 京セラ株式会社 | 配線基板、電子部品パッケージおよび電子装置 |
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