CN106258575B

CN106258575B - Double-layer substrate for radish lateral branch cuttage and application method

Info

Publication number: CN106258575B
Application number: CN201610585713.8A
Authority: CN
Inventors: 吕晓惠; 王克安; 王淑芬; 刘贤娴; 孙凯宁; 杨宁
Original assignee: Vegetable Research Institute of Shandong Academy of Agricultural Sciences
Current assignee: Jining Wenfeng Agricultural Tourism Development Co., Ltd; Shandong shenchuang Agricultural Technology Co., Ltd; Vegetable Research Institute of Shandong Academy of Agricultural Sciences
Priority date: 2016-07-22
Filing date: 2016-07-22
Publication date: 2020-03-27
Anticipated expiration: 2036-07-22
Also published as: CN106258575A

Abstract

The invention discloses a double-layer substrate for radish lateral branch cuttage and an application method thereof. The upper layer rooting matrix is made of peat materials with determined physicochemical properties, and is matched with a proper eluant (an aqueous solution of a green plant growth regulator, naphthylacetic acid, indoleacetic acid, boric acid and sucrose) for treatment, so that the rooting requirement of the lateral branches of the cuttings is ensured, the rooting survival rate is improved, the lower layer reproductive growth matrix adopts organic fermentation materials, peat and perlite to ensure that the lateral branches of the radish enter reproductive growth, and the seeds are obtained through pod formation smoothly. By adopting the double-layer substrate to carry out radish lateral branch cutting propagation, lateral branches with different grades and different lengths can be selected as cutting lateral branches, so that the selection range of radish lateral branch cutting propagation materials is expanded. The plant cuttage substrate has developed root system, strong plant and high survival rate, and the plant can continue to grow until blooming and pod bearing without transplanting again after cuttage survival.

Description

Double-layer substrate for radish lateral branch cuttage and application method

Technical Field

The invention belongs to the field of agricultural planting, and particularly relates to a double-layer substrate for radish side branch cuttage and an application method thereof.

Background

Radish (raphanus sativus L), also known as radish, is one of popular vegetables with a long cultivation history in China, and has a cultivation history of more than 2700 years to date. Radish is not only a vegetable, but also has certain curative effect on more than 30 diseases of human body, so that radish is popular with people. The collection and preservation of radish germplasm resources are the basis for breeding new varieties. Due to the high water content and the long growth period of the radish, during the reproductive growth period, the fleshy roots are easily affected by insect pests, excessive growth and other factors, so that the fleshy roots are wounded, and the radish is infected by germs.

In order to ensure that the valuable germplasm resources cannot be harvested absolutely due to rotting of the fleshy roots after the fleshy roots are infected and rotted by germs, seed pods are mainly obtained by a side branch cuttage method previously developed by the applicant at present (the name of the patent number ZL 201410504696.1 is a spring bolting-resistant white radish side branch cuttage seed propagation method), and a substrate formula related in the patent document is a simple substrate formula of rotten straws, rice husks, vermiculite and rotten cow dung. However, the characteristics of the cutting medium are not good enough in the radish cutting propagation, so that the requirements on the grade and length of the cutting shoot are high (the requirement on grade 1 lateral branch with the length of 20-30cm, the stem thickness of 0.5-1cm and 3-6 leaves as the cutting lateral branch) during cutting, and the survival rate is 80-85%. Meanwhile, the pH value, EC value, porosity and the like of the substrate for cuttage in current research reports or production are greatly different, no clear substrate parameter standard exists, the physicochemical properties of the substrate are poor, the substrate is lack of nutrient components, the strong grade-1 lateral branches need to be selected, and clear requirements are provided for the length and thickness of the lateral branches. The requirements on the radish cutting grade, the length, the thickness and the like are high, and the preservation strength of excellent germplasm resources is influenced, so that an excellent culture medium is urgently needed to be continuously searched, the range of cutting materials is expanded, and the cutting survival rate is improved.

Disclosure of Invention

Aiming at the problems that the properties of the conventional radish cutting substrate are not excellent enough and no clear substrate parameter standard exists, so that the requirements on the grade, length and the like of cutting slips are high during cutting, the invention provides a double-layer substrate for radish side branch cutting. The invention adopts double-layer matrix synergistic action, the upper layer selects peat materials with determined physical and chemical properties, and is matched with proper eluent for treatment, so that the requirement of rooting of the cutting lateral branches is ensured, the survival rate of the rooting is improved, and the lower layer adopts organic fermentation products, peat and perlite to ensure that the radish lateral branches enter reproductive growth, pod formation is smoothly carried out, and seeds are obtained. The double-layer substrate is adopted for radish lateral branch cutting propagation, so that the cutting shoot skin can be induced to root, the cutting survival rate of the cutting shoots of various grades and lengths is improved, and the pod bearing number of the cutting shoots is increased.

The technical scheme of the invention is as follows: a double-layer matrix for radish lateral branch cuttage is characterized by comprising an upper layer rooting matrix, a lower layer reproductive growth matrix and an eluent;

(1) preparation of upper rooting matrix

Selecting peat substrate with the grain diameter less than or equal to 5mm and meeting the following requirements; before use, peat is wetted by 1000-1200 times of compound fertilizer with the proportion of nitrogen, phosphorus and potassium being 9:45:15, so that the water content of the matrix reaches 50-60%;

peat substrate requirements: the volume weight is 0.12-0.14g/cm³Total porosity 45-55%, water holding pore 40-50%, air vent pore 3-5%, pH 6.0-6.5, and EC 0.3-0.5; the cation exchange capacity is 99.2-99.8cmol/kg, the organic matter content is more than or equal to 97.5 percent, and the C/N ratio is 46-50; the nitrogen content of peat is 1.03-1.10%, phosphorus content is 1.08-1.18%, potassium content is 0.23-0.30%, calcium content is 1.60-1.86%, and magnesium content is 0.9-1.0%. The physical properties of German klasmann TS 3 peat meet the above requirements, and when the peat is used, 1000 times of 1200 times of compound fertilizer containing 9-45-15 of nitrogen, phosphorus and potassium is used for wetting the peat. If the nutrient content is not suitable, the nitrogen content can be adjusted by using a urea solution, the potassium content can be adjusted by using a potassium sulfate solution, and the calcium and magnesium contents can be adjusted by using commercially available CaMgle from Shanghai Yongtong chemical Co.

(2) Preparation of lower layer reproductive growth matrix

Mixing the mushroom dregs and cow dung according to a volume ratio of 1:0.9-1.1 (preferably 1: 1), stacking and fermenting according to a strip-stack type fermentation method, and after complete fermentation, according to a volume ratio, organic fermentation products: preparing a reproductive growth substrate by using peat and perlite in a ratio of 4.5-6.5:3.5-2.5:2-1 (preferably organic fermentation product: peat and perlite are 6:3: 1); after the preparation is finished, 200g/l of carbendazim is added and fully mixed with the matrix before use, and the water content of the matrix is kept between 50 and 60 percent;

the indexes of the peat are the same as those of the step (1), namely the particle size is less than or equal to 5mm and meets the requirements; the mushroom dregs are mushroom dregs of oyster mushroom, mushroom and needle mushroom.

(3) Eluent

Green plant growth regulator (GGR)50mg/l + naphthylacetic acid (NAA)100mg/l + indoleacetic acid (IBA)50mg/l + 0.2% boric acid + sucrose 1g/l in water.

The using method comprises the following steps: and (3) filling the lower reproductive growth substrate in the seedling pot, filling the upper rooting substrate with the same thickness, and thoroughly pouring the substrate in the whole seedling pot by adopting eluent before cuttage.

The invention also discloses a method for radish lateral branch cutting propagation by adopting the double-layer matrix, which is characterized in that,

(1) basin containing two kinds of substrates

Selecting a seedling pot of 6 inches, filling 5cm of reproductive growth matrix, and then filling 5cm of rooting matrix for later use;

(2) cutting of cutting slips

Selecting any robust and disease-free lateral branch with the length of more than 6cm as a cutting shoot, pouring the eluent to thoroughly penetrate a matrix before cuttage, and cuttage the cutting shoot on a rooting matrix with the cuttage depth of 2.5-3.5 cm;

(3) post-cuttage management

After cutting, the cutting can be placed in a small arched shed, and the air temperature is kept at 20-25 ℃; spraying for 3-4 times every day at the initial stage, and keeping the relative humidity of the environment above 85%; after 3-4 days of cuttage, 70% thiophanate methyl wettable powder can be sprayed to dilute 800-fold liquid for 1000 times; then, the relative humidity of the environment is kept to be not less than 70%, the surface of the plug substrate is kept from drying to whitening, and the bottom of the plug is moist and free of waterlogging. Watering is not needed before cuttage and rooting; after rooting, the substrate is kept wet without other nutrient supply. After 10 days of cuttage, the rooting rate of the lateral branches of the basic radish can reach more than 94%, and the root systems are fully distributed with the cuttings after 30 days of cuttage.

The mechanism of the invention is as follows: the cutting survival rate is influenced by the branch grade, length, thickness and the like of the cutting slips, and factors such as rooting inhibitors, hormones, matrix physical and chemical properties and the like in the cutting slips also influence the cutting survival rate. The invention can eliminate the function of the rooting inhibitor by adding the eluent into the matrix. Reasonable hormone proportion and excellent matrix physical and chemical properties can induce the bark of the cutting shoot to root and improve the cutting survival rate of the cutting shoot of each grade and length. The peat is an excellent substrate material, so the peat material with determined physicochemical properties is selected and is matched with a proper eluant for treatment, and the survival rate of the radish cutting lateral branches is obviously improved.

The invention has the advantages and positive effects that:

(1) the invention adopts the synergistic effect of the double-layer matrix, the upper layer ensures the need of rooting of the cutting lateral branches, the survival rate of rooting is improved, the lower layer ensures that the lateral branches of the radish enter reproductive growth, pod formation is smooth and seeds are obtained, the trouble that the radish needs to be transplanted again after rooting in the traditional method is saved, the time is saved, and the expenditure is saved.

(2) According to the formula of the substrate, the substrate is rich in organic matters, humic acid and various nutrient substances, and the physicochemical properties and the nutrient content are suitable for rooting of radish lateral branches; the substrate replaces the traditional cutting substrate, solves the requirements on the grade and the length of the lateral branches during the original radish lateral branch cutting, and enlarges the range of the radish lateral branch cutting propagation material.

(3) The plants which are cottage by adopting the substrate have developed root systems, stronger plants and high survival rate, do not need to be transplanted again after the cottage survives, and can continue to grow until the plants bloom and pod. The method is simple to operate and easy to learn, and the used materials and reagents are cheap, so that the method is suitable for all cuttage workers.

Drawings

FIG. 1 is a drawing of lateral branch cuttage propagation, FIG. 1a is a photograph of lateral branches with different thicknesses and different grades undergoing cuttage rooting, and FIG. 1b is a photograph of lateral branches with different thicknesses and different grades undergoing pod bearing; as can be seen from fig. 1: the matrix can enlarge the sampling range and can successfully survive to obtain seeds;

FIG. 2 is a lateral branch cutting rooting diagram, which can be seen from FIG. 2: the lateral branches with different specifications, which are cut by the substrate, can smoothly root at the bark.

Detailed Description

The radish lateral branch cutting variety selected in the embodiment is 'Chunbaiyu', and is the variety with the lowest survival rate in the traditional lateral branch cutting test.

Example 1: preparing rooting matrix

Peat substrate with the grain size less than or equal to 5mm is selected, 1000 times of compound fertilizer solution with the proportion of nitrogen, phosphorus and potassium being 9:45:15 is used for wetting peat, and the water content of the substrate reaches 50-60%.

Peat substrate requirements: the volume weight is 0.12-0.14g/cm³Total porosity 45-55%, water holding pore 40-50%, air permeable pore 3-5%, pH 6.0-6.5, EC 0.3-0.5, and cationThe ion exchange capacity was 99.6cmol/kg, the organic matter content was 97.9%, and the C/N ratio was 48. The nitrogen content of peat is 1.03-1.10%, phosphorus content is 1.08-1.18%, potassium content is 0.23-0.30%, calcium content is 1.60-1.86%, and magnesium content is 0.9-1.0%. Klasmann TS 3 peat, germany.

Taking 8-15cm of radish first-level lateral branches as a cutting material, comparing different rooting matrixes, and setting 5 treatments in total as follows. The influence of the addition of the eluent on the rooting rate of the cuttage by peat with different grain diameters is shown in the table 1.

Formula 1: peat with the grain diameter less than or equal to 5mm is thoroughly poured by clear water;

and (2) formula: peat with the grain diameter less than or equal to 5mm, 50mg/l of green plant growth regulator (GGR), 100mg/l of naphthylacetic acid (NAA), 50mg/l of indoleacetic acid (IBA), 0.2 percent of boric acid and 1g/l of sucrose are thoroughly poured;

and (3) formula: peat with the grain diameter less than or equal to 25mm, 50mg/l of green plant growth regulator (GGR), 100mg/l of naphthylacetic acid (NAA), 50mg/l of indoleacetic acid (IBA), 0.2 percent of boric acid and 1g/l of sucrose are thoroughly poured;

CK 1: decomposed straw: rice hull: vermiculite: thoroughly decomposed cow dung is 4:3:3: 1;

CK 2: peat, vermiculite and perlite are 6:3: 1.

TABLE 1 physicochemical properties of different cutting media and cutting survival rates

As can be seen from table 1: the formula 2 of the invention adopts peat with the grain diameter less than or equal to 5mm, 50mg/l of green plant growth regulator (GGR), 100mg/l of naphthylacetic acid (NAA), 50mg/l of indoleacetic acid (IBA), 0.2 percent of boric acid and 1g/l of sucrose to be thoroughly poured, the rooting effect is best, and the cuttage survival rate reaches 96 percent.

Example 2: cutting rooting condition of radish lateral branches with different lengths and grades

Cutting tests are carried out by adopting the substrate of the formula 2 in the embodiment 1 and taking radish lateral branches with different grades and lengths and unlimited stem thicknesses as cutting materials. The days of sprouting and survival of the new leaves are shown in Table 2 and FIG. 2.

TABLE 2 Effect of formulation 2 on radish side shoot cuttings of different lengths and grades

As can be seen from Table 2, the rooting substrate of the invention is adopted, the radish lateral branches with different grades and lengths and unlimited stem thickness are used as cuttage materials, the germination days of new leaves are less than or equal to 12 days, and the survival rate is more than or equal to 94 percent. Therefore, the substrate used by the invention has the physicochemical properties and nutrient content suitable for rooting of the radish lateral branches, has no requirements on the grade and length of the radish lateral branches, and enlarges the range of the cutting material. As can be seen from fig. 2: the lateral branches with different specifications, which are cut by the substrate, can smoothly root at the bark.

Example 3: preparing growth substrate

Mixing the bacterial residues and the cow dung according to the volume ratio of 1:1, adjusting the C/N ratio of the materials to be 25-30, spraying urea solution with proper solubility if the C/N ratio is high, properly adding crushed straws if the C/N ratio is low, adjusting the water content to be 70-80%, and stacking and fermenting in a strip stack shape. Stacking the mixture in a strip shape (the bottom is 1.5-2m wide, the top is 0.8-1.2m wide and the height is 0.8-1.2m, and the length is determined according to the situation), covering with plastic cloth, opening the plastic cloth to turn over when the stacking temperature reaches 55-60 ℃ and keeping for 7 days, covering and fermenting again until the temperature of the material stack is reduced to normal temperature. Mixing the fermented material with peat and perlite at a volume ratio of 4.5-6.5:3.5-2.5:2-1, and adding carbendazim 200g/m per cubic meter before using the reproductive growth medium³And the mixture is fully and uniformly mixed to achieve the aim of disinfecting the substrate, so that the influence on the rooting process of the rooting substrate is avoided. Setting 3 formulas according to different proportions, performing cuttage test by taking a common substrate and an original culture substrate as a reference and a radish first-level lateral branch with the length of 15-20cm and the stem thickness of 0.5-0.8cm as a material, and setting 4 treatments in total:

formula 1: organic fermentation product peat and perlite which are 4.5:3.5: 2;

and (2) formula: organic fermentation product peat and perlite which are 6:3: 1;

and (3) formula: organic fermentation product peat and perlite which are 6.5:2.5: 1;

CK 1: peat, vermiculite and perlite are 6:3: 1.

The nutrient content and pod number of each treatment substrate formulation are shown in table 3. As can be seen from table 3: by adopting the formula of the invention, the radish lateral branches can be ensured to enter reproduction and growth, pod formation is smooth, and seeds are obtained, wherein the best effect is achieved when the formula 2, namely the organic fermentation product, namely peat and perlite, is 6:3:1, and the pod formation number reaches 120.

TABLE 3 nutrient content and pod number for different substrate formulations

Processing items	Content of N%	Content of P%	Content of K%	Number of pod bearing
					Formulation 1	1.18	1.74	1.00	108
Formulation 2	1.23	1.85	1.00	120
					Formulation 3	1.59	2.02	0.99	98
CK1	1.03	1.18	0.23	74

Example 4: cuttage and management after cuttage

Filling the growth and reproduction substrate in a No. 6 basin, wherein the thickness is 5 cm; 5cm of rooting substrate is covered on the surface. Before cuttage, the mixture is thoroughly watered with a green plant growth regulator (GGR) solution of 50mg/l, naphthylacetic acid (NAA) solution of 100mg/l, indoleacetic acid (IBA) solution of 50mg/l, 0.2% boric acid and 1g/l sucrose. Selecting strong and disease-free radish lateral branches with the length of more than 6cm and any grade for cuttage, wherein the cuttage depth is 2.5-3.5 cm. Placing in a small arched shed after cuttage, keeping the temperature at 20-25 deg.C, spraying for 3-4 times per day, keeping the relative humidity of the environment above 85%, and watering before rooting. After 3 days of cuttage, 800 times of solution of 70 percent thiophanate methyl wettable powder can be sprayed once. Then, the relative humidity of the environment is kept to be not less than 70%, the surface of the plug substrate is kept from drying to whitening, and the bottom of the plug is moist and free of waterlogging. After 10 days of cutting, the rooting rate of the radish side branch cutting can reach more than 94%, and the root systems are fully distributed with cutting slips after 30 days of cutting. The rooting rate of the first-level lateral branches of the original cutting medium is more than 70 percent, the rooting rate of the other-level lateral branches is only 10 to 15 percent, and the root system is only arranged around the callus at the base part of the cutting slips.

The lateral branch cutting propagation is shown in figure 1, and it can be seen from the figure that the lateral branch cuttings of different levels can root and survive (figure 1a), and when the pod can be grown successfully, seeds can be obtained (figure 1 b).

Claims

1. A double-layer matrix for radish lateral branch cuttage is characterized by comprising an upper layer rooting matrix, a lower layer reproductive growth matrix and an eluent;

(1) preparation of upper rooting matrix

Selecting peat substrate with the grain diameter less than or equal to 5mm and meeting the following requirements; before use, peat is wetted by 1000-1200 times of compound fertilizer with the proportion of nitrogen, phosphorus and potassium being 9:45:15, so that the water content of the peat reaches 50-60%;

peat substrate requirements: the volume weight is 0.12-0.14g/cm³Total porosity 45-55%, water holding pore 40-50%, air vent pore 3-5%, pH 6.0-6.5, and EC 0.3-0.5; the cation exchange capacity is 99.2-99.8cmol/kg, the organic matter content is more than or equal to 97.5 percent, and the C/N ratio is 46-50; the nitrogen content of the peat is 1.03-1.10%, the phosphorus content is 1.08-1.18%, the potassium content is 0.23-0.30%, the calcium content is 1.60-1.86%, and the magnesium content is 0.9-1.0%;

(2) preparation of lower layer reproductive growth matrix

Mixing the bacterial residues and the cow dung according to the volume ratio of 1:0.9-1.1, stacking and fermenting according to a stacking fermentation method, and after the fermentation is finished, preparing an organic fermentation product according to the volume ratio: preparing a lower layer reproductive growth substrate by peat and perlite according to the proportion of 4.5-6.5:3.5-2.5: 2-1; after the preparation is finished, 200g/l of carbendazim is added and fully mixed with the matrix before use, and the water content of the matrix is kept between 50 and 60 percent;

the indexes of the peat are the same as the step (1);

(3) eluent

A green plant growth regulator GGR 50mg/l, naphthylacetic acid 100mg/l, indoleacetic acid 50mg/l, 0.2% boric acid and sucrose 1 g/l;

filling a lower reproductive growth substrate and an upper rooting substrate in the seedling pot, wherein the thicknesses of the lower reproductive growth substrate and the upper rooting substrate are the same; before cuttage, eluent is adopted to thoroughly pour the matrix in the whole seedling raising pot.

2. The double-layer substrate for radish lateral shoot cuttage according to claim 1, wherein the volume ratio of the mushroom dregs to the cow dung is 1: 1.

3. The double-layer substrate for radish side branch cuttage of claim 1, wherein the organic fermentation product is peat, perlite and 6:3: 1.

4. The method for radish lateral branch cutting propagation by using the double-layer matrix of any one of claims 1 to 3, which is characterized in that,

(1) basin containing two kinds of substrates

Selecting a seedling pot of 6 inches, filling a lower reproductive growth substrate of 5cm, and then filling an upper rooting substrate of 5cm for later use;

(2) cutting of cutting slips

Selecting any robust and disease-free lateral branch with the length of more than 6cm as a cutting shoot, pouring eluent to thoroughly penetrate a matrix before cuttage, and cuttage the cutting shoot on a rooting matrix with the cuttage depth of 2.5-3.5 cm;

(3) post-cuttage management

Placing in a small arched shed after cuttage, and keeping the temperature at 20-25 ℃; spraying for 3-4 times every day at the initial stage, and keeping the relative humidity of the environment above 85%; after 3-4 days of cuttage, spraying 70% thiophanate methyl wettable powder once to dilute 800-fold liquid; then, the relative humidity of the environment is kept to be not less than 70%, the surface of the plug substrate is kept from drying to whitening, and the bottom of the plug is moist and free of waterlogging.