CN106062118B - The connection method of anisotropically conducting adhesive, the manufacturing method of connector and electronic component - Google Patents

The connection method of anisotropically conducting adhesive, the manufacturing method of connector and electronic component Download PDF

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Publication number
CN106062118B
CN106062118B CN201580013038.5A CN201580013038A CN106062118B CN 106062118 B CN106062118 B CN 106062118B CN 201580013038 A CN201580013038 A CN 201580013038A CN 106062118 B CN106062118 B CN 106062118B
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light
mentioned
absorption peak
photoepolymerizationinitiater initiater
peak wavelength
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CN106062118A (en
Inventor
稻濑圭亮
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Dexerials Corp
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Dexerials Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
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    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
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  • Adhesives Or Adhesive Processes (AREA)
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Abstract

By using light-cured type bonding agent, the connection of electronic component can be carried out at low temperature, while improve the bad connection of electronic component.With the adhesive resin layer supported on removing basis material, adhesive resin layer contains photopolymerizable compound, Photoepolymerizationinitiater initiater, light absorber and electroconductive particle, the light absorption peak wavelength of light absorber is longer than the light absorption peak wavelength of Photoepolymerizationinitiater initiater, and is separated by 20nm or more.

Description

The connection of anisotropically conducting adhesive, the manufacturing method of connector and electronic component Method
Technical field
The present invention relates to：Anisotropic conductive containing photopolymerizable compound, Photoepolymerizationinitiater initiater and light absorber is viscous Agent is connect, the manufacturing method of its connector and the connection method of electronic component are used.The application is on March 11st, 2014 in Japan State application Japanese patent application No. Japanese Patent Application 2014-047585 based on claim priority, this application by referring to and receive Enter in this application.
Background technique
In the past, as TV or PC display, smart phone, portable game machine, digital audio-frequency player, tablet PC, The various display units or display input unit of wearable terminal or vehicle-mounted display etc., mostly using liquid crystal display device or Touch-panel device.In recent years, in such display device or touch-panel device, from smart fine-pitch, weight light and thin type From the perspective of changing etc., using having：IC chip is mounted directly so-called COG (glass flip chip (chip on substrate Glass)) or by the flexible substrate for being formed with various circuits it is mounted directly so-called FOG (membrane of flip chip (film on substrate on glass))。
For example, playing as shown in fig. 7, being had using the liquid crystal display device 100 of COG mounting means for liquid crystal display The liquid crystal display panel 104 of the function of tonic chord, the liquid crystal display panel 104 have mutually opposed two piece being made of glass substrate etc. Transparent substrates 102,103.Moreover, the two transparent substrates 102,103 are close by frame-shaped for liquid crystal display panel 104 It seals 105 and is bonded to each other, while being equipped in the space surrounded by two transparent substrates 102,103 and sealing 105 and having enclosed liquid crystal 106 panel display unit 107.
Transparent substrates 102,103 are formed, on two mutually opposed inner surfaces, by structures such as ITO (tin indium oxide) At striated a pair of of transparent electrode 108,109 mutually intersect.Moreover, two transparent substrates 102,103 are transparent by the two The intersection area of electrode 108,109 and the pixel for constituting the minimum unit as liquid crystal display.
In two transparent substrates 102,103, a transparent substrates 103 compared with another transparent substrates 102 planar dimension compared with The earth is formed, and the edge 103a of the transparent substrates significantly formed 103 is formed with the portion of terminal 109a of transparent electrode 109.Separately Outside, the alignment films 111,112 for implementing set friction treatment are formed in two transparent electrodes 108,109, pass through the alignment films 111, the initial orientation of 112 regulation liquid crystal molecules.In addition, the outside of two transparent electrodes 108,109 is equipped with a pair of of polarization plates 118,119, the direction of vibration of the transmitted light of the light source 120 from backlight etc. is provided by the two polarization plates 118,119.
Liquid crystal drive IC 115 is connected to across 114 hot pressing of anisotropic conductive film on portion of terminal 109a.Anisotropy is led Electrolemma 114 is to be mixed into electroconductive particle in the adhesive resin of thermohardening type and be made membranaceous and obtain, by between 2 conductors Heating crimping is carried out, using conducting between conducting particles acquirement conductor, the machinery between conductor is kept to connect by adhesive resin It connects.Liquid crystal drive can be by pixel selection applying liquid crystal drive voltage, with making the alignment portion of liquid crystal with IC 115 Change and carries out set liquid crystal display.In addition, as the bonding agent for constituting anisotropic conductive film 114, usually using reliable The bonding agent of the highest Thermocurable of property.
The case where liquid crystal drive is connected to portion of terminal 109a with IC 115 across such anisotropic conductive film 114 Under, firstly, anisotropic conductive film 114 to be temporarily crimped on to the end of transparent electrode 109 by interim crimping unit (not shown) On sub-portion 109a.Then, liquid crystal drive is carried in anisotropic conductive film 114 with after IC 115, as shown in figure 8, passing through Be thermally compressed first-class thermo-compression bonding unit 121 by liquid crystal drive IC 115 with anisotropic conductive film 114 together towards portion of terminal The pressing of the side 109a, and make to be thermally compressed the fever of unit 121.Pass through the fever of the thermo-compression bonding unit 121, anisotropic conductive film 114 occur heat cure reaction, and liquid crystal drive IC 115 is adhered to portion of terminal across anisotropic conductive film 114 as a result, On 109a.
However, hot pressed temperature is high in the connection method using such anisotropic conductive film, liquid crystal drive is used The electronic component of IC 115 etc. or the thermal shock of transparent substrates 103 are big.It in addition to this, will after being connected to anisotropic conductive film When temperature is reduced to room temperature, due to abutting the electronic component (when connecing) with the thermo-compression bonding unit 121 and between transparent substrates 103 Temperature difference can produce warpage in the portion of terminal 109a of transparent substrates 103.Therefore, there is following worry：Cause portion of terminal 109a weeks The problem of the bad connection of the display spot or liquid crystal drive IC 115 that are generated on the liquid crystal panel on side etc..The tendency is along with saturating Bright substrate 103 holds frame (Jia Amount Greenization under the arm) or the slimming of glass and it is more significant.
Existing technical literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2008-252098 bulletin.
Summary of the invention
Problems to be solved by the invention
Therefore, instead of such anisotropic conductive film 114 using heat curable adhesive, also it is proposed that using The connection method of ultraviolet hardening bonding agent.In the connection method using ultraviolet hardening bonding agent, hot pressing is not used Order member presses the electronic component of liquid crystal drive IC 115 etc. at normal temperature, ultraviolet from the backside illuminated of transparent substrates 103 Thus line solidifies adhesive resin.Accordingly it is possible to prevent as caused by the heating temperature of electronic component or transparent substrates difference thoroughly The warpage of bright substrate 103 or liquid crystal drive IC 115.
However, the connection method for using ultraviolet hardening bonding agent, also there is following worry：If in adhesive tree It pressurizes in the state that the viscosity of rouge is high, then can not fully be pressed into electroconductive particle, even if good in connection initial connection resistance It is good, also due to after connection through when, the factor of environment, conducting resistance rises.
The present invention solves above-mentioned project, its purpose is to provide：By using light-cured type bonding agent, at low temperature The connection of electronic component is carried out, while improving the anisotropically conducting adhesive of the bad connection of electronic component；The system of connector Make the connection method of method and electronic component.
Means for solving the problems
In order to solve the above problems, anisotropically conducting adhesive of the invention contains photopolymerizable compound, photopolymerization Initiator and light absorber, the light absorption peak value wave of the light absorption peak wavelength of above-mentioned light absorber than above-mentioned Photoepolymerizationinitiater initiater It is long, and it is separated by (difference) 20nm or more.
In addition, in the manufacturing method of connector of the invention, across photocuring in the transparent substrates that carry on the table It is anisotropically conducting adhesive configuration electronic component, is pressed above-mentioned electronic component towards above-mentioned transparent substrates by crimping tool Pressure, while light irradiation is carried out by light illuminator, wherein above-mentioned photocuring system anisotropically conducting adhesive contains optical polymerism Compound, Photoepolymerizationinitiater initiater and light absorber, the light absorption peak wavelength of above-mentioned light absorber is than above-mentioned Photoepolymerizationinitiater initiater Light absorption peak wavelength it is long, and be separated by 20nm or more, above-mentioned light illuminator irradiation includes that the light of above-mentioned Photoepolymerizationinitiater initiater is inhaled Receive the light of the wavelength of the light absorption peak value of peak value and above-mentioned light absorber.
It is solid across light in the transparent substrates that carry on the table in addition, in the connection method of electronic component of the invention Change is anisotropically conducting adhesive configuration electronic component, by crimping tool by above-mentioned electronic component towards above-mentioned transparent substrates Pressing, while light irradiation is carried out by light illuminator, wherein above-mentioned photocuring system anisotropically conducting adhesive contains photopolymerization Property compound, Photoepolymerizationinitiater initiater and light absorber, the light absorption peak wavelength of above-mentioned light absorber cause than above-mentioned photopolymerization The light absorption peak wavelength of agent is long, and is separated by 20nm or more, and above-mentioned light illuminator irradiation includes the light of above-mentioned Photoepolymerizationinitiater initiater The light of the wavelength of the light absorption peak value of absorption peak and above-mentioned light absorber.
Invention effect
According to the present invention, using a kind of anisotropically conducting adhesive, wherein as Photoepolymerizationinitiater initiater and light absorption The light absorption peak wavelength of agent, light absorber is 20nm or more longer than the light absorption peak wavelength of Photoepolymerizationinitiater initiater.Thus, it is possible to In the case where the respective ultraviolet radiation absorption of Photoepolymerizationinitiater initiater and light absorber does not hinder mutually, carry out respectively：Adhesive The progress of the curing reaction of resin and the fusing of the adhesive resin based on fever.Therefore, it can manufacture with good connection The connector of property.
Detailed description of the invention
Fig. 1 is the sectional view for showing the liquid crystal display panel of an example as connector.
Fig. 2 is the sectional view for showing the connection process of liquid crystal drive IC and transparent substrates.
Fig. 3 is the sectional view for showing anisotropic conductive film.
Fig. 4 is the light absorption peak value wave for showing the Photoepolymerizationinitiater initiater and light absorber of anisotropic conductive film of the invention The chart of long relationship.
Fig. 5 is the side view for showing the process of the amount of warpage of connector sample of measurement Examples and Comparative Examples.
Fig. 6 is the oblique view for showing the process of connection resistance of the connector sample of measurement Examples and Comparative Examples.
Fig. 7 is the sectional view of liquid crystal display panel.
Fig. 8 is shown in the sectional view that the process of IC chip is connected in the transparent substrates of liquid crystal display panel.
Specific embodiment
Hereinafter, explaining the manufacture of anisotropically conducting adhesive, connector that the present invention is applicable in detail referring to attached drawing The connection method of method and electronic component.In addition, the present invention is not limited only to the following embodiments and the accompanying drawings, it is of the invention not departing from In the range of thought, various changes can be carried out certainly.In addition, attached drawing is schematically, ratio of each size etc. may be with reality Border is different.For specific size etc., should be judged referring to the following description.In addition, attached drawing also wraps certainly between each other Include the different part of mutual size relationship or ratio.
Hereinafter, be illustrated in case where carrying out so-called COG (glass flip chip (chiponglass)) installation, In, liquid crystal drive IC chip of the installation as electronic component in the glass substrate of liquid crystal display panel.The LCD display For plate 10 as shown in Figure 1, the two pieces of transparent substrates 11,12 being made of glass substrate etc. are arranged opposite, these transparent substrates 11,12 are logical It crosses the sealing 13 of frame-shaped and is bonded to each other.Moreover, liquid crystal display panel 10 passes through in the space surrounded by transparent substrates 11,12 It encloses liquid crystal 14 and is formed with panel display unit 15.
Transparent substrates 11,12 are formed, and on two mutually opposed inner surfaces, are made of ITO (tin indium oxide) etc. Striated a pair of of transparent electrode 16,17 mutually intersect.Moreover, two transparent electrodes 16,17 by the two transparent electrodes 16, 17 intersection area and the pixel for constituting the minimum unit as liquid crystal display.
In two transparent substrates 11,12, planar dimension is significantly compared with another transparent substrates 11 for a transparent substrates 12 It is formed, the edge 12a of the transparent substrates significantly formed 12 is equipped with：Installation liquid crystal drive use IC 18 as electronic component and The COG mounting portion 20 obtained, in addition, being equipped near the outside of COG mounting portion 20：Installation is formed with the liquid crystal as electronic component FOG mounting portion 22 obtained by the flexible substrate 21 of driving circuit.In addition, COG mounting portion 20 is formed with：The terminal of transparent electrode 17 Portion 17a, and the substrate side alignment mark 23 that the side the IC alignment mark 24 that is equipped with liquid crystal drive with IC 18 is Chong Die.
In addition, liquid crystal drive can make taking for liquid crystal by pixel selection applying liquid crystal drive voltage with IC 18 Set liquid crystal display is carried out to partly changing.In addition, as shown in Fig. 2, liquid crystal drive IC 18 be formed with across it is each to The electrode terminal 19 of connection is connected with the portion of terminal 17a of transparent electrode 17 for anisotropic conductive film 1.Electrode terminal 19 can be used suitably Such as copper bump or au bump or implemented on copper bump it is gold-plated obtained by terminal etc..
In addition, liquid crystal drive is formed on mounting surface 18a with IC 18：By it is Chong Die with substrate side alignment mark 23 come Carry out the side the IC alignment mark 24 of the alignment relative to transparent substrates 12.Further, since the transparent electrode 17 of transparent substrates 12 It is routed the propulsion of spacing or the liquid crystal drive smart fine-pitch of the electrode terminal 19 of IC 18, to liquid crystal drive with IC 18 and thoroughly Bright substrate 12 requires high-precision alignment to adjust.
Each mounting portion 20,22 is formed with the portion of terminal 17a of transparent electrode 17.On portion of terminal 17a, led using anisotropy Electrolemma 1 is connected with liquid crystal drive IC 18 or flexible substrate 21 as the adhesive for circuit connection containing Photoepolymerizationinitiater initiater. Anisotropic conductive film 1 contains electroconductive particle 4, and liquid crystal drive is with the electrode of IC 18 or flexible substrate 21 and in transparent substrates The portion of terminal 17a for the transparent electrode 17 that 12 edge 12a is formed is electrically connected via electroconductive particle 4.The anisotropic conductive film 1 It is ultraviolet hardening bonding agent, by utilizing crimp head while irradiating ultraviolet light using aftermentioned ultraviolet radiation device 35 33 press and flow, and electroconductive particle 4 is pressed into portion of terminal 17a and liquid crystal drive IC 18 or each electrode of flexible substrate 21 Between, and solidify in the state that electroconductive particle 4 is pressed into.Anisotropic conductive film 1 is to transparent substrates 12 and liquid crystal as a result, Driving carries out electricity, mechanical connection with IC 18 or flexible substrate 21.
In addition, being formed with the alignment films 24 for implementing set friction treatment in two transparent electrodes 16,17, taken by this The initial orientation of liquid crystal molecule is provided to film 24.In addition, the outside of two transparent substrates 11,12 is equipped with a pair of of polarization plates 25,26, The direction of vibration of the transmitted light of the light source (not shown) from backlight etc. is provided by the two polarization plates 25,26.
[photocuring system anisotropic conductive film]
Anisotropic conductive film (the ACF of photocuring system is used in the present invention：Anisotropic Conductive Film) 1.Anisotropic conductive film 1 can be any of light cationic system or optical free radical system, can be properly selected according to purpose.
As shown in figure 3, anisotropic conductive film 1 is formed with containing conductive grain on the stripping film 2 as basis material The adhesive resin layer (adhesive layer) 3 of son 4.As shown in Fig. 2, anisotropic conductive film 1 is by making adhesive resin layer 3 In the portion of terminal 17a and liquid crystal drive IC 18 of the transparent electrode 17 formed in the transparent substrates 12 in liquid crystal display panel 10 Electrode terminal 19 between, liquid crystal display panel 10 and liquid crystal drive IC 18 are connected, and both make to be connected.
As stripping film 2, it may be used at such as polyethylene terephthalate usually used in anisotropic conductive film The basis material of ester film etc..
Anisotropic conductive film 1 contains film-forming resin, Photoepolymerizationinitiater initiater, optical polymerism in adhesive resin layer 3 Close object, light absorber and electroconductive particle 4.Anisotropic conductive film 1 is due to containing light absorber, so driving in aftermentioned liquid crystal It employs in the connection process of IC 18, light absorber is irradiated by ultraviolet light and generated heat, and adhesive resin is softened.As a result, respectively to Electroconductive particle 4 can be fully pressed between portion of terminal 17a and electrode terminal 19 by anisotropic conductive film 1 by crimp head 33. The heating temperature of light absorber be made with degree sufficient for being pressed into electroconductive particle 4 adhesive resin soften it is same When, also there is no the determined temperatures to transparent substrates 13 or the liquid crystal drive thermal shock effect of IC 18, such as preferably 80~90 DEG C or so, it can be selected and be suitably set according to the material of light absorber.
[light cationic system]
The anisotropic conductive film 1 of light cationic system contains film-forming resin, light cationic polymerization in adhesive resin layer 3 Initiator, cationically photopolymerizable compound and light absorber.
As film-forming resin, preferably average molecular weight be 10000~80000 or so resin.As film-forming resin, can arrange Lift the various resins of phenoxy resin, epoxy resin, modification (deformation) epoxy resin, polyurethane resin etc..Wherein, it is formed from film From the perspective of state, connection reliability etc., phenoxy resin is particularly preferred.
As light cationic polymerization initiator, can be used for example：Salt compounded of iodine, sulfosalt, aromatic diazonium salt, phosphorus The complex compounds of the salt or metal-arene complex of salt, selenium salt etc., silanol/aluminium complex etc., benzoin toluene sulphur Acid esters (benzoin tosylate), toluenesulfonic acid adjacent nitro benzyl ester etc..In addition, balance anion when as forming salt, makes With propylene carbonate salt, hexafluoro antimonate, hexafluorophosphate, tetrafluoroborate, four (pentafluorophenyl group) borate salt etc..
Light cationic polymerization initiator can only be used alone a kind, can also be used in mixed way two or more.Wherein, aromatic series sulphur Salt also has Ultraviolet Light in the wavelength region of 300nm or more, and curability is excellent, therefore can suitably use.
Cationically photopolymerizable compound is can to enumerate ring with the compound of the functional group by cation kind polymerization Oxygen compound, vinyl ether compound, cyclic ether compound etc..
Epoxide is the compound in 1 molecule with 2 or more epoxy groups, it can be mentioned, for example：By epichlorohydrin With bisphenol-type epoxy resin, poly epihydric alcohol base ether, poly epihydric alcohol base ester, aromatic epoxies derived from bisphenol-A or Bisphenol F etc. Compound, cycloaliphatic epoxy, novolak type epoxy compounds, glycidyl amine system epoxide shrink sweet Oil base ester system epoxide etc..
Light absorber is generated heat in connection process of the liquid crystal drive with IC 18 by illuminated ultraviolet light, and adhesive is made It is resin melting.For light absorber, when using light cationic polymerization initiator as Photoepolymerizationinitiater initiater, can suitably use Such as the ultraviolet absorbing agent of enumerate BTA system, triazine system, benzophenone series etc., according to the absorption of light cationic polymerization initiator The compatibility of the other compositions of peak wavelength, the light splitting distribution of ultraviolet radiation device 35 and adhesive resin, ultraviolet radiation absorption energy Power etc. properly selects.In addition, when using cationic system polymerization initiator as Photoepolymerizationinitiater initiater, as ultraviolet by absorbing Line and the light absorber to generate heat, it is possible to use optical free radical polymerization initiator.
[optical free radical system]
The anisotropic conductive film 1 of optical free radical system polymerize in adhesive resin layer 3 containing film-forming resin, optical free radical Initiator, optical free radical polymerizable compound and light absorber.
As film-forming resin, film-forming resin same as light cationic system can be used.
As optical free radical polymerization initiator, have：The benzoin ether of benzoin ethyl ether, cumene asioinether etc., benzene The benzil ketals (benzyl ketal) of even acyl (benzil), hydroxycyclohexylphenylketone etc., benzophenone, acetophenone etc. Ketone and its derivative, thioxanthene ketone class, double imidazoles etc.；It can also be as needed in these Photoepolymerizationinitiater initiaters with arbitrary proportion Add the sensitizer of amine, sulphur compound, phosphorus compound etc..At this time, it may be necessary to according to the wavelength of light source used, desired solidification Characteristic etc. selects optimal photoinitiator.
In addition, the solidification of organic peroxide system can be used as the compound for generating living radical by light irradiation Agent.As organic peroxide, can be used following one kind or two or more：Diacyl peroxide, dialkyl peroxide, mistake Aoxidize two carbonic esters, peroxyester, ketal peroxide, hydrogen peroxide, silicyl peroxide etc..
Optical free radical polymerizable compound can be enumerated with the substance for the functional group being polymerize by living radical： Acrylate compounds, methacrylate compound, maleimide compound etc..
Optical free radical polymerizable compound can be used with any state of monomer, oligomer, also can be used together monomer and Oligomer.
As acrylate compounds, methacrylate compound, can enumerate：Epoxy acrylate oligomer, amino The optical polymerism oligomer of formic acid esters acrylate oligomer, polyether acrylate oligomer, polyester acrylate oligomers etc., Trimethylolpropane trimethacrylate, polyethyleneglycol diacrylate, polyalkylene glycol diacrylate, pentaerythrite propylene Acid esters, 2 cyanoethyl acrylate, cyclohexyl acrylate, acrylic acid dicyclopentenyl base ester, acrylic acid dicyclopentenyl oxygroup ethyl ester, Acrylic acid 2- (2- ethoxy ethoxy) ethyl ester, acrylic acid 2- ethoxy ethyl ester, 2-EHA, acrylic acid just oneself Ester, acrylic acid 2- hydroxy methacrylate, hydroxypropyl acrylate, isobornyl acrylate, isodecyl acrylate, Isooctyl acrylate monomer, It is acrylic acid n-dodecane base ester, acrylic acid 2- methoxy acrylate, acrylic acid 2- phenoxy ethyl, tetrahydrofurfuryl acrylate, new The simple function of the optical polymerism of Diacrylate, dipentaerythritol hexaacrylate etc. and polyfunctional acrylate list Body etc..They can be used a kind or more than 2 types will be used in mixed way.
Light absorber can suitably use the ultraviolet absorbing agent such as enumerate BTA system, triazine system, benzophenone series, According to the absorption peak wavelength of optical free radical polymerization initiator, the light splitting distribution of ultraviolet radiation device 35 and adhesive resin Compatibility, ultraviolet radiation absorption energy of other compositions etc. properly select.
In addition, additive of the adhesive resin containing silane coupling agent etc. or inorganic filler.As silane coupling agent, It can enumerate：Epoxy, amino system, sulfide-based, the urea groups system of sulfydryl-etc..By adding silane coupling agent, organic material can be improved With the cementability at the interface of inorganic material.
As electroconductive particle 4, well known any electroconductive particle used in anisotropic conductive film can be enumerated.Make For electroconductive particle 4, it can be mentioned, for example：The various metal or metal alloy of nickel, iron, copper, aluminium, tin, lead, chromium, cobalt, silver, gold etc. Particle, metal oxide, carbon, graphite, glass, ceramics, plastics etc. particle surface cladding metal obtained by particle, Huo Zhe These particle surfaces further coat particle obtained by insulation film etc..For the grain obtained by the surface clad of resin particle In the case where son, as resin particle, it can be mentioned, for example：Epoxy resin, phenolic resin, acrylic resin, acrylonitrile-styrene (AS) particle of resin, benzoguanamine resin, divinyl benzene series resin, phenylethylene resin series etc..
[the light absorption peak wavelength of Photoepolymerizationinitiater initiater and light absorber]
For the anisotropic conductive film 1 of photocuring system of the invention, the light absorption peak wavelength of light absorber is more poly- than light The light absorption peak wavelength for closing initiator is long, and is separated by 20nm or more.For anisotropic conductive film 1, if by aftermentioned 35 irradiating ultraviolet light of ultraviolet radiation device, then Photoepolymerizationinitiater initiater absorbs ultraviolet light and generates acid or free radical.In addition, light absorption Agent similarly absorbs ultraviolet light and generates heat.
Here, if the light absorption peak value of the light absorption peak value of Photoepolymerizationinitiater initiater and light absorber is close, ultraviolet light Absorption by mutual obstruction, curing reaction or fever are insufficient.There is following worry as a result,：It is not melted in adhesive resin Change, carry out the solidification of adhesive resin in the state that the indentation of electroconductive particle 4 is insufficient, in addition, due to after connection through time-varying Change or environmental change, conducting resistance rise.
In addition, the respective light absorption peak wavelength of light absorber and Photoepolymerizationinitiater initiater generally has song shown in Fig. 4 Line (profile), this is because if the light absorption peak wavelength of light absorber than Photoepolymerizationinitiater initiater light absorption peak value wave Length, then, even if being separated by 20nm or more, the repetition range of the absorbing wavelength other than peak value is big, and the absorption of ultraviolet light is by phase Mutual obstruction, curing reaction or fever are insufficient.
On the other hand, as light absorber and Photoepolymerizationinitiater initiater, by using the light absorption peak wavelength of light absorber Substance 20nm or more longer than the light absorption peak wavelength of Photoepolymerizationinitiater initiater can not hinder Photoepolymerizationinitiater initiater and light absorption In the case where the respective ultraviolet radiation absorption of agent, carry out respectively：The progress of the curing reaction of adhesive resin and based on fever The fusing of adhesive resin.
In addition, the light absorption peak wavelength of Photoepolymerizationinitiater initiater of the invention is preferably 290nm~330nm, light absorber Light absorption peak wavelength be preferably 320nm~360nm.
For example, the light cationic polymerization initiator for the use of the absorption peak of ultraviolet light being 310nm, and use the suction of ultraviolet light The ultraviolet absorbing agent that peak value is 340~360nm is received, it as a result, can be in light cationic polymerization initiator and ultraviolet absorbing agent phase Mutual UV Absorption promotes curing reaction and fever in the case where not hindered mutually.
[attachment device]
Next, to obtained by liquid crystal drive is connected to transparent substrates 12 with IC 18 across anisotropic conductive film 1 Attachment device 30 used in the manufacturing process of connector is illustrated.
As shown in Figure 1, attachment device 30 has：Workbench 31 with translucency is transparent to carrying on workbench 31 The crimp head 33 pressed across the liquid crystal drive that anisotropic conductive film 1 is carried with IC 18 on substrate 12, and it is located at work The ultraviolet radiation device 35 of the reverse side of platform 31.
Workbench 31 by such as quartz equal there is the material of translucency to be formed.In addition, workbench 31 is transparent in surface carrying The edge 12a of substrate 12, meanwhile, it is opposite with crimp head 33, overleaf it is configured with ultraviolet radiation device 35.
Crimp head 33 in transparent substrates 12 across anisotropic conductive film 1 carry liquid crystal drive with IC 18 carry out by Pressure, by being maintained on head moving mechanism (not shown), freely close, separate workbench 31.
Ultraviolet radiation device 35 is by the reverse side from workbench 31 to being arranged on the portion of terminal 17a of transparent substrates 12 1 irradiating ultraviolet light of anisotropic conductive film, makes light absorber generate heat, while in the portion of terminal 17a and liquid crystal by transparent electrode 17 Driving solidifies adhesive resin in the state of clamping electroconductive particle 4 with the electrode terminal 19 of IC 18, to make liquid crystal drive Connection is connected with the portion of terminal 17a of transparent substrates 12 with IC 18.
The absorption peak wavelength region that ultraviolet radiation device 35 may be used at Photoepolymerizationinitiater initiater has maximum luminous wavelength Ultraviolet radiator.In addition, ultraviolet radiation device 35 can also be used：With Photoepolymerizationinitiater initiater absorption peak wavelength region and The absorption peak wavelength region of light absorber has the mercury vapor lamp of the light splitting distribution of peak value, or is including Photoepolymerizationinitiater initiater and light The metal halide lamp etc. of irradiation ultraviolet light in the wavelength region of the absorption peak wavelength of both absorbents.In addition, ultraviolet light shines Emitter 35 can also be used in combination：There is the LED light of peak value in the absorption peak wavelength region of Photoepolymerizationinitiater initiater and in light absorber Absorption peak wavelength region has the LED light of peak value.
[connection process]
Next, to using the liquid crystal drive of above-mentioned attachment device 30 to be illustrated with the connection process of IC 18.Firstly, Transparent substrates 12 are carried on the workbench of interim fitting, and anisotropic conductive film 1 is temporarily crimped in transparent electrode 17. Method for temporarily crimping anisotropic conductive film 1, with adhesive resin layer 3 in the transparent electrode 17 of transparent substrates 12 Mode in 17 side of transparent electrode configures anisotropic conductive film 1.
Moreover, after adhesive resin layer 3 is configured in transparent electrode 17, by the thermocompression head of temporarily fitting from 2 side of stripping film is heated and is pressurizeed to adhesive resin layer 3, stripping film 2 is removed from adhesive resin layer 3, thus Fit in adhesive resin layer 3 temporarily in transparent electrode 17.For the interim pressure of the thermocompression head using interim fitting It connects, is pressed with a little pressure (such as 0.1MPa~2MPa or so) towards 17 side of transparent electrode in the upper surface of stripping film 2, Heated (such as 70~100 DEG C or so) simultaneously.
Then, transparent substrates 12 are carried on workbench 31, with the transparent electrode 17 and liquid crystal drive of transparent substrates 12 Liquid crystal drive IC 18 is configured across the opposed mode of adhesive resin layer 3 with the electrode terminal 19 of IC 18.
Then, set ultraviolet light is irradiated from the reverse side of workbench 31 by ultraviolet radiation device 35, passed through simultaneously Crimp head 33 is with the upper surface of set pressure pressing liquid crystal drive IC 18.Ultraviolet light transmission workbench 31, transparent substrates 12 After be incident in adhesive resin layer 3, be photopolymerized initiator and light absorber and absorb.Photoepolymerizationinitiater initiater is ultraviolet by absorbing Light and generate acid or free radical, thus carry out adhesive resin curing reaction.In addition, light absorber is by absorbing ultraviolet light It is generated heat (such as 80~90 DEG C) with set temperature, melts adhesive resin.
That is, melting adhesive resin by the fever of light absorber in this connection process, in this state, pass through pressure Connector 33 presses, and adhesive resin can be made from the electrode terminal of transparent electrode 17 and portion of terminal 17a and liquid crystal drive IC 18 It is flowed out between 19, is substantially simultaneously pressed into electroconductive particle 4.Moreover, the portion of terminal 17a and liquid crystal drive in transparent electrode 17 are used Solidify adhesive resin in the state of clamping electroconductive particle 4 between the electrode terminal 19 of IC 18.Therefore, this connection process In, it, can be in the influence of inhibition warpage or to liquid crystal drive IC 18 etc. by pressing liquid crystal drive IC 18 at room temperature Electronic component thermal shock influence while, manufacture and liquid crystal drive it is good with the conductance general character and mechanical connection of IC 18 Good connector.
At this point, using light to inhale as Photoepolymerizationinitiater initiater and light absorber as described previously for anisotropic conductive film 1 Receive the light absorption peak wavelength of agent substance 20nm or more longer than the light absorption peak wavelength of Photoepolymerizationinitiater initiater.Thus, it is possible to In the case where the respective ultraviolet radiation absorption of Photoepolymerizationinitiater initiater and light absorber is not by mutual hinder, carry out respectively：Bonding The progress of the curing reaction of agent resin and the fusing of the adhesive resin based on fever.
It is therefore, and logical in addition, the fever of light absorber is equably transmitted to transparent substrates 12 and liquid crystal drive IC 18 Difference when crossing the heating of crimp head 33, transparent substrates 12 and liquid crystal drive do not generate thermal gradient between IC 18, greatly improve and add The problems such as bad connection for the display spot or electronic component that warpage caused by hot temperature difference generates and warpage is associated.
In addition, for the irradiation time of ultraviolet radiation device 35, illumination, total exposure, according to the composition of adhesive resin, The pressure of crimp head 33 and time suitably set the pressure of the progress and crimp head 33 of realizing the curing reaction based on adhesive resin The condition of the raising of the connection reliability, adhesive strength that enter.
Thereafter, attachment device 30 by make crimp head 33 to the top of workbench 31 it is mobile and terminate liquid crystal drive IC 18 real crimping process.
After liquid crystal drive is connected in the transparent electrode 17 of transparent substrates 12 with IC 18, operate in the same way to carry out So-called FOG (membrane of flip chip (film on glass)) installation, wherein flexible substrate 21 is installed on the saturating of transparent substrates 12 On prescribed electrode 17.At this point, can also absorb likewise by anisotropic conductive film 1 is used from ultraviolet radiation device 35 Ultraviolet light, the curing reaction for carrying out the fusing of adhesive resin by the fever of light absorber and being generated based on acid or free radical.
Transparent substrates 12 and liquid crystal drive IC 18 or flexibility are connected across anisotropic conductive film 1 thus, it is possible to manufacture The connector of substrate 21.In addition, these COG installation and FOG installation can also carry out simultaneously.
More than, liquid crystal drive is directly mounted at the installation of the COG in the glass substrate of liquid crystal display panel with IC and is incited somebody to action Flexible substrate is illustrated for being directly mounted at the installation of the FOG on the substrate of liquid crystal display panel, still, as long as using The manufacturing process of the connector of light-cured type bonding agent, this technology can also be applied in addition to installing the ministry of electronics industry on a transparent substrate Various connections other than part.
[other]
In addition, the present invention also can be used for example logical other than using above-mentioned ultraviolet hardening conductive adhesive Cross the light of other wavelength such as infrared light and cured light-cured type conductive adhesive.
To as conductive adhesive there is the anisotropic conductive film 1 of film shape to be illustrated above, but paste Also there is no problem.In addition, adhesive resin layer 3 be also possible to by without containing electroconductive particle 4 adhesive resin constitute it is exhausted Edge adhesive layer and the knot being laminated by the conductive adhesive layer that the adhesive resin containing electroconductive particle 4 is constituted Structure.Preferably, in this case, insulating properties adhesive layer and conductive adhesive layer contain absorption peak wavelength interval respectively and open Light absorber and Photoepolymerizationinitiater initiater.
In addition, present invention may also apply to the connection processes based on insulating properties bonding paste, wherein insulating properties bonding paste makes With：The insulating properties adhesive film being made of the adhesive resin layer without containing electroconductive particle 4 and the paste without containing electroconductive particle 4 Shape adhesive resin.As long as bonding agent of the invention is the circuit connecting adhesive containing Photoepolymerizationinitiater initiater and light absorber Agent, just not concerning modes such as the presence or absence of electroconductive particle 4, film or pastes.
In addition, the heating mechanism of heater etc. can also be arranged on workbench 31 in this connection process, it is being based on light absorption Heating transparent substrate 12 at the heating temperature of agent temperature below.In addition, in this connection process, it can also be by crimp head 33 in base Liquid crystal drive IC 18 is heated at the heating temperature temperature below of light absorber.Thus, it is possible to the fever with light absorber Combining melts adhesive resin layer 3 fully, is reliably pressed into electroconductive particle between portion of terminal 17a and electrode terminal 19 4, improve connectivity.
Embodiment
Next, the embodiment to this technology is illustrated.The present embodiment changes the blending of anisotropic conductive film and consolidates Change condition and the connector sample for manufacturing transparent substrates and IC chip, and IC core is evaluated by conduction resistance value (Ω) and amount of warpage The connection status of piece and transparent substrates.
As the bonding agent for connection, prepare by containing light cationic polymerization initiator and cationically polymerizable compound Adhesive resin layer constitute anisotropic conductive film.
As evaluation element, shape 1.8mm × 34mm is used, thickness 0.5mm, has been formed with commenting for conducting measurement wiring Valence IC.
The evaluation basis material that IC is used as connection evaluation, uses the ITO cladding plate (コ ー テ ィ Application グ ラ of thickness 0.5mm ス)。
In the glass substrate across anisotropic conductive film configuration evaluation use IC, by crimping tool (10.0mm × It 40.0mm) pressurizes, while being connected by ultraviolet light irradiation, connector sample is consequently formed.It is real on the pressurized plane of crimping tool The fluororesin processing of thickness 0.05mm is applied.In addition, for ultraviolet radiation device (SP-9：USHIO Electric Co., Ltd system) Illumination is 300mW/cm at 365nm2, it is 210mW/cm at 310nm2, ultraviolet irradiation size is：Width about 4.0mm × length about 44.0mm.
[embodiment 1]
In embodiment 1, as the adhesive resin layer of anisotropic conductive film, the layer formed as follows is used：Production will under Resin solution made of material mixing is stated, it is on a pet film by resin solution coating, dry, it is configured to 20 μm of thickness membranaceous,
Phenoxy resin (YP-70：Nippon Steel & Sumitomo Metal Corporation's system)；20 mass parts
Liquid epoxy resin (EP828：Mitsubishi chemical Co., Ltd's system)；30 mass parts
Solid epoxy (YD014：Nippon Steel & Sumitomo Metal Corporation's system)；20 mass parts
Electroconductive particle (AUL704：Sekisui Chemical Co., Ltd's system)；30 mass parts
Light cationic polymerization initiator (SP-170：ADEKA Corp.'s system)；5 mass parts
Light absorber (LA-36：ADEKA Corp.'s system)；5 mass parts.
The absorption peak wavelength of light cationic polymerization initiator (SP-170) is about 310nm, the suction of light absorber (LA-36) Receiving peak wavelength is about 340nm, and difference is 30nm.
The press condition of crimping tool is：At room temperature, 70MPa, 5 seconds.The irradiation time of ultraviolet radiation device is 5 seconds.
[embodiment 2]
In embodiment 2, the light absorber (LA-31 of 5 mass parts is blended in adhesive resin layer：ADEKA Corp. System), it in addition to this, blends same as Example 1ly, uses the obtained anisotropic conductive film.
The absorption peak wavelength of light cationic polymerization initiator (SP-170) is about 310nm, the suction of light absorber (LA-31) Receipts peak wavelength is 345nm, and difference is 35nm.
The press condition of crimping tool and the irradiation time of ultraviolet radiation device are same as Example 1.
[embodiment 3]
In embodiment 3, the optical free radical polymerization initiator (OXE1 of 5 mass parts is blended in adhesive resin layer：BASF is public Department's system) it is in addition to this blended same as Example 1ly as light absorber, use the obtained anisotropic conductive film.
The absorption peak wavelength of light cationic polymerization initiator (SP-170) is about 310nm, the suction of light absorber (OXE01) Receipts peak value is 330nm, and difference is 20nm.
The press condition of crimping tool and the irradiation time of ultraviolet radiation device are same as Example 1.
[comparative example 1]
In comparative example 1, light absorber is not blended in adhesive resin layer, in addition to this, is mixed same as Example 1ly It is mixed, use the obtained anisotropic conductive film.
The press condition of crimping tool and the irradiation time of ultraviolet radiation device are same as Example 1.
[comparative example 2]
In comparative example 2, the light absorber (LA-46 of 5 mass parts is blended in adhesive resin layer：ADEKA Corp. System), it in addition to this, blends same as Example 1ly, uses the obtained anisotropic conductive film.
The absorption peak wavelength of light cationic polymerization initiator (SP-170) is about 310nm, the suction of light absorber (LA-46) Receiving peak wavelength is about 290nm, and the light absorption peak wavelength of light absorber is shorter than the light absorption peak wavelength of Photoepolymerizationinitiater initiater, Its difference is 20nm.
The press condition of crimping tool and the irradiation time of ultraviolet radiation device are same as Example 1.
[comparative example 3]
In comparative example 3, make 100 DEG C of the press condition of crimping tool, 70MPa, 5 seconds in addition to this with comparative example 1 Use the same terms.
[measurement of warpage]
For the measuring method of warpage, contact pin type surface roughness meter (SE-3H is used：The small slope research of Co., Ltd. is made), As shown in figure 5, contact pilotage 41 is scanned since 40 lower surface of glass substrate of conjugant sample, after measuring and evaluating the connection with IC The amount of warpage (μm) of glass lined bottom surface.
[measurement of conducting resistance]
It is initial and reliable that connection is determined using digital multimeter for embodiment 1,2, the connector of comparative example 1~3 Property experiment after conducting resistance (Ω).The measurement of conduction resistance value is as shown in fig. 6, digital multimeter is connected to and evaluation IC Salient point 42 connect ITO cladding plate wiring 43, conducting resistance when flowing through 2mA electric current is determined using so-called 4 terminal method Value.Failtests condition is：85℃ 85%RH 500hr.
[table 1]
As shown in table 1, for Examples 1 to 3, although amount of warpage is equal with comparative example 1, contain light absorber For Examples 1 to 3 compared with comparative example 1, the connection resistance after initial connection resistance and failtests is all low, it is shown that good Connectivity.This is because：In Examples 1 to 3, in the state that adhesive resin layer is melted by the fever of light absorber Lower pressing, it is possible to fully be pressed into electroconductive particle by excluding adhesive resin, can be consolidated in this state Change.On the other hand, in comparative example 1, because being crimped at room temperature, adhesive resin can not be carried out between electrode terminal Exclusion, from being unable to fully be pressed into electroconductive particle.Therefore, compared with embodiment 1 and 2, initial electric conduction is connected Resistance is high, and conducting resistance is further up after failtests.
In comparative example 2, although the difference of light absorber and the respective absorption peak wavelength of light cationic polymerization initiator is 20nm, but the light absorption peak wavelength of light absorber is shorter than the light absorption peak wavelength of Photoepolymerizationinitiater initiater, so absorbing wave Length exists in a wide range, obstruction of the UV Absorption of light cationic polymerization initiator by light absorber, curing reaction It carries out insufficient.Therefore, although amount of warpage substantially reduces, initial connection resistance is high, and conducting resistance is big after failtests Width rises.
In comparative example 3, heating pressing is carried out with IC to evaluation by crimping tool on one side, irradiates ultraviolet light on one side.Therefore, The heat that crimping tool generates is biased to evaluation and is transmitted with IC, after crimping tool leaves when quick refrigeration, the evaluation change of the side IC Shape is big compared with glass substrate.Moreover, the difference of the deflection is not fully absorbed by adhesive resin layer, amount of warpage in comparative example 3 Become larger.
On the other hand, in Examples 1 to 3, adhesive resin layer absorbs ultraviolet light by light absorber and generates heat, therefore, Roughly the same heat is applied with IC and glass substrate to evaluation.Therefore, the evaluation deflection substantially phase of IC and glass substrate Together, the difference of deflection can be absorbed by adhesive resin layer, it is possible to opposite to reduce amount of warpage.
By embodiment 1 compared with Example 2 compared with then embodiment 2 realizes low resistance compared with Example 1.This be because For：The absorbance of light absorber is high in embodiment 2, higher reaction heat is issued compared with Example 1, so adhesive resin layer Fusing significantly more carry out.As a result, in embodiment 2, electroconductive particle is easy to be pressed into, and further realizes compared with Example 1 Low resistance.
In addition, in embodiment 3, although having used optical free radical polymerization initiator as light absorber, due to being certainly By the initiator of base system, so open loop is also not involved in polymerization, and heat is only generated.Therefore, by making adhesive using heat at that time Resin layer fusing, can fully be pressed into electroconductive particle, be solidified in this state by light curing agent, thus can be good Ground connection.
Description of symbols
1 anisotropic conductive film, 2 stripping films, 3 adhesive resin layers, 4 electroconductive particles, 10 LCD display Plate, 11,12 transparent substrates, 13 sealings, 14 liquid crystal, 15 panel display units, 16,17 transparent electrodes, 18 liquid crystal drives are used IC, 20 COG mounting portions, 21 flexible substrates, 22 FOG mounting portions, 24 match thick film, 25,26 polarization plates, 30 attachment devices, 31 workbench, 33 crimp heads, 35 ultraviolet radiation devices.

Claims (9)

1. photocuring system anisotropically conducting adhesive, wherein contain photopolymerizable compound, Photoepolymerizationinitiater initiater and light absorption The light absorption peak wavelength of agent, above-mentioned light absorber is longer than the light absorption peak wavelength of above-mentioned Photoepolymerizationinitiater initiater, and is separated by 20nm or more, wherein above-mentioned Photoepolymerizationinitiater initiater is light cationic polymerization initiator.
2. photocuring system described in claim 1 anisotropically conducting adhesive, wherein above-mentioned light absorber is ultraviolet radiation absorption Agent or radical polymerization initiator.
3. photocuring system of any of claims 1 or 2 anisotropically conducting adhesive, wherein above-mentioned light absorber is ultraviolet light Absorbent.
4. photocuring system of any of claims 1 or 2 anisotropically conducting adhesive, wherein the light of above-mentioned Photoepolymerizationinitiater initiater Absorption peak wavelength is 290nm~330nm, and the light absorption peak wavelength of above-mentioned light absorber is 320nm~360nm.
5. photocuring system of any of claims 1 or 2 anisotropically conducting adhesive, wherein photocuring system anisotropy Electrically conducting adhesive is supported on removing basis material, is formed as membranaceous.
6. the manufacturing method of connector,
Wherein, the ministry of electronics industry is configured across photocuring system anisotropically conducting adhesive in the transparent substrates carried on the table Part,
Above-mentioned electronic component is pressed towards above-mentioned transparent substrates by crimping tool, while illumination is carried out by light illuminator It penetrates,
Wherein, above-mentioned photocuring system anisotropically conducting adhesive contains photopolymerizable compound, Photoepolymerizationinitiater initiater and light and inhales Agent is received, the light absorption peak wavelength of above-mentioned light absorber is longer than the light absorption peak wavelength of above-mentioned Photoepolymerizationinitiater initiater, and is separated by 20nm or more, wherein above-mentioned Photoepolymerizationinitiater initiater is light cationic polymerization initiator,
Above-mentioned light illuminator irradiation includes the light absorption peak value of above-mentioned Photoepolymerizationinitiater initiater and the optical absorption peak of above-mentioned light absorber The light of the wavelength of value.
7. the manufacturing method of connector as claimed in claim 6, wherein pass through crimping tool at room temperature for above-mentioned electronic component It is pressed towards above-mentioned transparent substrates, while light irradiation is carried out by light illuminator.
8. the manufacturing method of connector as claimed in claim 6, above-mentioned workbench and/or above-mentioned crimping tool are passing through above-mentioned light Absorbent absorption is heated at the temperature temperature below that the light that above-mentioned light illuminator irradiates generates heat.
9. the connection method of electronic component,
Wherein, the ministry of electronics industry is configured across photocuring system anisotropically conducting adhesive in the transparent substrates carried on the table Part,
Above-mentioned electronic component is pressed towards above-mentioned transparent substrates by crimping tool, while illumination is carried out by light illuminator It penetrates,
Wherein, above-mentioned photocuring system anisotropically conducting adhesive contains photopolymerizable compound, Photoepolymerizationinitiater initiater and light and inhales Agent is received, the light absorption peak wavelength of above-mentioned light absorber is longer than the light absorption peak wavelength of above-mentioned Photoepolymerizationinitiater initiater, and is separated by 20nm or more, wherein above-mentioned Photoepolymerizationinitiater initiater is light cationic polymerization initiator,
Above-mentioned light illuminator irradiation includes the light absorption peak value of above-mentioned Photoepolymerizationinitiater initiater and the optical absorption peak of above-mentioned light absorber The light of the wavelength of value.
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