CN101816221A - Circuit connecting material, circuit connection structure, and method for producing the same - Google Patents
Circuit connecting material, circuit connection structure, and method for producing the same Download PDFInfo
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- CN101816221A CN101816221A CN200880110198A CN200880110198A CN101816221A CN 101816221 A CN101816221 A CN 101816221A CN 200880110198 A CN200880110198 A CN 200880110198A CN 200880110198 A CN200880110198 A CN 200880110198A CN 101816221 A CN101816221 A CN 101816221A
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Adhesive Tapes (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
Abstract
Disclosed is a circuit connecting material for connecting a first circuit member obtained by forming a first circuit electrode on a major surface of a first substrate with a second circuit member obtained by forming a second circuit electrode on a major surface of a second substrate in such a manner that the first circuit electrode and the second circuit electrode face each other. This circuit connecting material contains an adhesive composition having a maximum light absorption wavelength within the range of 800-1200 nm.
Description
Technical field
The present invention relates to a kind of circuit connection material, syndeton body and manufacture method thereof.
Background technology
Make circuit member each other or electronic unit such as IC chip and circuit member when being electrically connected, use the anisotropic conductive binding agent that in binding agent, has disperseed conducting particles as required and formed.This binding agent is disposed between the electrode of opposed circuit member, by heating and pressurization circuit member is interconnected, and can make between the electrode of opposite in the insulating properties thus to be electrically connected between the maintenance adjacent electrode.As this anisotropic conductive binding agent, having proposed is the circuit connection material (for example, referring to patent documentation 1) of matrix with epoxy resin.
Patent documentation 1: Japanese kokai publication hei 3-16147 communique
Summary of the invention
Invent problem to be solved
Use the method for attachment of the circuit member of such as mentioned above circuit connection material, be under the state of clamping anisotropic conductive binding agent between the circuit member or between electronic unit such as IC chip and the circuit member, circuit member is superimposed with each other or electronic unit such as IC chip and circuit member is superimposed, uses the pressing instrument to implement hot pressing by heating and pressurization.The heating and pressurizing condition that carry out this moment is for example 150～220 ℃, and 1～5MPa is about 15～4 seconds.
Along with miniaturization, the precise treatment of electronic equipment in recent years, the anisotropic conductive binding agent also needs to have the high de-agglomeration energy, so that it can connect the circuit member with micro-electrode structure with enough reliabilities.
In order to satisfy above-mentioned requirements, the inventor is conceived to utilize the short time heating to connect, and reduces the influence of material coefficient of thermal expansion and thermal contraction.Usually, in order to connect at short notice, need be heated to higher temperature.But, if in the past anisotropic conductive binding agent is applied heat and connects, then exist the connection resistance value of the syndeton body that obtains to rise, or the tendency of the rising of the connection resistance value in the reliability tests such as shock test or high temperature and humidity test.Above-mentioned tendency will form obstacle to the circuit connection material that needs the high de-agglomeration energy when realizing that the short time connects.
For example, when using epoxy resin and imidazoles to be in the past circuit connection material such as mixture, the condition of carrying out heating and pressurizing is generally 170～220 ℃, about 15～4 seconds.For connection can be formed, need be heated to temperature herein, in the short time below 4 seconds above 220 ℃.Under this high temperature, if by the anisotropic conductive binding agent IC chip being connected substrate with polymeric membrane base materials such as polyimides or polyester, Merlon or glass substrate etc. connects, the coefficient of thermal expansion difference that then connects back IC chip and substrate causes internal stress, thereby the increase of connection resistance, the binding agent of connecting portion are peeled off.In addition, the coefficient of thermal expansion difference that connects back IC chip and substrate causes the generation of warpage, for the liquid crystal panel of the narrow frame of needs etc., may make the display quality variation.
On the other hand, can in the short time below 4 seconds, form the means that connect below 220 ℃ in heating-up temperature, can consider the latent curing agent that uses the sulfonium salt isoreactivity high as being used for.But the curing reaction of circuit connection material carries out rapidly under the heating-up temperature more than 180 ℃, insufficient, the low inferior problem of electrically conducting of resin flows when therefore pressing occurring easily.
The present invention makes in view of above situation, purpose provide can be at short notice with high de-agglomeration can interconnect the electrode that is relative to the configuration, connection reliability is very excellent circuit connection material.Another object of the present invention is to use sort circuit connection material to connect, thereby provides generation, the connection reliability that can fully suppress warpage very high syndeton body, and the manufacture method that this syndeton body is provided.
The means of dealing with problems
In order to achieve the above object, the invention provides a kind of circuit connection material, it is used at first circuit member that has formed first circuit electrode on the interarea of first substrate with formed the second circuit member of second circuit electrode on the interarea of second substrate, according to first circuit electrode state relative with the second circuit electrode direction is connected, this circuit connection material contains the adhesive composition of maximum light absorption wavelength in 800～1200nm scope.
Sort circuit connect material can by wavelength be 800～1200nm the near infrared ray irradiation and at short notice can the connecting circuit electrode with high de-agglomeration.That is owing to promoted the curing reaction of adhesive composition by near infrared ray irradiation, even if for need high de-agglomeration can the interconnecting of the circuit member with fine structure, also can finish at short notice.Thermal expansion and thermal contraction take place in electronic units such as the shortening of the reduction of heating-up temperature and heating time in the time of in addition, can also realizing connecting, inhibition circuit member and IC chip etc.Thus, just suppressed to connect the generation of back warpage and the generation of residual stress, can circuit member interconnected and improve connection reliability between the circuit member simultaneously.
Above-mentioned adhesive composition among the present invention preferably contains the near infrared absorbing coloring matter of maximum light absorption wavelength in 800～1200nm scope.
Because sort circuit connects material and contains the near infrared absorption pigment, can utilize the near infrared ray irradiation to make the near infrared absorbing coloring matter heating, thereby promote the curing reaction of adhesive composition.Therefore, can be at short notice can the connecting circuit electrode with high de-agglomeration, can finish at short notice need high de-agglomeration can the interconnecting of the circuit member with fine structure.
In the present invention, the content of preferred above-mentioned near infrared absorbing coloring matter is 0.1～10 quality % with respect to all resins solid content of adhesive composition.Thus, can at low temperatures with in the short time circuit connection material be solidified, more effectively mutually connecting circuit member and the further simultaneously connection reliability that improves.
In the present invention, the preferred binder composition contains conducting particles.Thus, can easily make the direction circuit electrode mutual conduction of configuration relatively.Sort circuit connects the operation excellence of material.
In the present invention, the preferred binder composition contains the film forming macromolecule.Thus, can make circuit connection material have very good film forming.In addition, containing under the situation of conducting particles, can make this conducting particles keep more uniform dispersity.Sort circuit connects material more easily makes the direction circuit electrode mutual conduction of configuration relatively by conducting particles, can make simultaneously to reach insulation effectively between circuit electrode adjacent on the same substrate.It is just more excellent that sort circuit connects the operation of material.
In addition, the present invention also provides a kind of syndeton body, it possesses first circuit member that has formed first circuit electrode on the interarea of first substrate, on the interarea of second substrate, formed the second circuit electrode and according to the second circuit member that the second circuit electrode and first circuit electrode are disposed in the relative mode of direction, and be arranged between first substrate and second substrate and connect the circuit connecting section of first circuit member and second circuit member, the light that circuit connecting section contains by connect irradiation near infrared range on the material at foregoing circuit makes above-mentioned adhesive composition solidify formed resin cured matter.
Because the light that this syndeton body possesses by the circuit connection material with above-mentioned feature being shone near infrared range solidifies formed resin cured matter, can suppress distortion and residual stress that thermal expansion and thermal contraction cause fully.Therefore, reduced the generation of warpage etc., connection reliability is very excellent.In addition, this syndeton body is particularly useful for liquid crystal panel of the narrow frame of needs etc., the display quality excellence.
The present invention also provides a kind of manufacture method of syndeton body, it possesses following operation: will and form the second circuit member of second circuit electrode on the interarea of second substrate at first circuit member that has formed first circuit electrode on the interarea of first substrate, first circuit electrode is configured in the relative mode of direction with the second circuit electrode, make foregoing circuit connect material between between them, make first circuit member, the state of above-mentioned second circuit member and circuit connection material driving fit is the light of irradiation near infrared range down, the adhesive composition of circuit connection material is solidified, thereby connect first circuit member and second circuit member.
In this manufacture method, by connect the light of irradiation near infrared range on the material at foregoing circuit, first circuit electrode and second circuit electrode are electrically connected, therefore can connect with high de-agglomeration at short notice.The syndeton body that obtains by this manufacture method is because distortion and residual stress that thermal expansion and thermal contraction cause have been subjected to inhibition, so the generation of warpage etc. just is able to abundant reduction.Therefore, can circuit member be interconnected.In addition, connection reliability is also very excellent.This manufacture method is useful especially for the liquid crystal panel of the narrow frame of needs, can obtain the syndeton body of display quality excellence.
The invention effect
According to the present invention, can provide: can make the direction circuit connection material that electrode is interconnective, connection reliability is very excellent of configuration relatively with high de-agglomeration at short notice.In addition, can also provide by using sort circuit to connect material and carry out high reliability of connecting syndeton body, and the manufacture method that possesses the syndeton body of above-mentioned feature.That is, connect material in a circuit according to the invention, can circuit member be interconnected or electronic units such as IC chip are connected with circuit member, can obtain the syndeton body that is fully suppressed of thermal expansion and thermal contraction.Thus, the warpage that can reduce the syndeton body fully takes place, and obtains the very excellent syndeton body of connection reliability.
Description of drawings
Fig. 1 is the schematic cross-section of a preferred implementation of expression circuit connection material of the present invention.
Fig. 2 is the schematic cross-section of another execution mode of expression circuit connection material of the present invention.
Fig. 3 is the schematic cross-section of the another execution mode of expression circuit connection material of the present invention.
Fig. 4 is the schematic cross-section of a preferred implementation of the syndeton body of expression circuit member of the present invention.
Symbol description
1... conducting particles, 2... binding agent composition, 3... near infrared absorbing coloring matter, 5... resinous principle, 40... conductive adhesive layer, 50... insulating properties adhesive layer, 10... first circuit member, 11... first substrate, 12... first circuit electrode, 20... the second circuit member, 21... second substrate, 22... second circuit electrode, 30,32... adhesive composition, 100,110, the 120... circuit connection material, 150... circuit connecting section, 200... syndeton body
Embodiment
Followingly preferred implementation of the present invention is elaborated with reference to accompanying drawing.Also have, identical or considerable part is given same-sign in the accompanying drawing, saves repeat specification.In addition, dimensional ratios is not limited to the ratio of accompanying drawing.
Fig. 1 is the schematic cross-section of a preferred embodiment of expression circuit connection material of the present invention.Membranaceous circuit connection material 100 as one of embodiments of the present invention is made up of the adhesive composition 30 that contains conducting particles 1, binding agent composition 2 and near infrared absorbing coloring matter 3.As shown in Figure 1, to be evenly dispersed in binding agent composition 2 be in the adhesive composition 30 of principal component for conducting particles 1 and near infrared absorbing coloring matter 3.
Fig. 2 is the schematic cross-section of another execution mode of expression circuit connection material of the present invention.Membranaceous circuit connection material 110 has conductive adhesive layer 40 and the laminated successively structure of insulating properties adhesive layer 50.Promptly, circuit connection material 110 has the insulating properties adhesive layer 50 of conductive adhesive layer 40 and insulating properties, conductive adhesive layer 40 is made up of the adhesive composition 30 that contains conducting particles 1, binding agent composition 2 and near infrared absorbing coloring matter 3, and insulating properties adhesive layer 50 forms according to the mode that contacts with a face of conductive adhesive layer 40 and is made up of the adhesive composition 32 that contains binding agent composition 2 and near infrared absorbing coloring matter 3.
Fig. 3 is the schematic cross-section of the another execution mode of expression circuit connection material of the present invention.Membranaceous circuit connection material 120 has by the laminated successively laminate structures that forms of insulating properties adhesive layer 50, conductive adhesive layer 40 and insulating properties adhesive layer 50.Promptly, circuit connection material 120 has conductive adhesive layer 40 and is formed at insulating properties adhesive layer 50 on two faces of this conductive adhesive layer 40 in the mode of this conductive adhesive layer 40 of clamping respectively, conductive adhesive layer 40 is made up of the adhesive composition 30 that contains conducting particles 1, binding agent composition 2 and near infrared absorbing coloring matter 3, and insulating properties adhesive layer 50 is made up of the adhesive composition 32 that contains binding agent composition 2 and near infrared absorbing coloring matter 3.
Also have, in Fig. 2 and Fig. 3, all layers that constitute membranaceous circuit connection material all contain near infrared absorbing coloring matter 3, but circuit connection material also can have the layer that does not contain near infrared absorbing coloring matter 3.
In addition, though not shown among Fig. 1, Fig. 2 and Fig. 3, membranaceous circuit connection material 100,110 and 120 can have the fissility base material (supporting film) that is used to improve operation or prevents to adhere to dust, can peel off at least one side's surface.
The circuit connection material 100,110 and 120 that the respective embodiments described above relate to contains the near infrared absorbing coloring matter of maximum absorption wavelength in 800～1200nm scope.This near infrared absorbing coloring matter absorbs the light that sends from the near infrared luminescence source.The luminous energy that is absorbed discharges heat, promotes the curing of circuit connection material, can obtain resin cured matter.Thus, for example when circuit connection material interconnects, use pressing instrument etc., can obtain the resin cured matter that adhesive composition solidify to form without heating.So the circuit connection material that present embodiment relates to can make circuit electrode interconnect at short notice and with high de-agglomeration.Utilize sort circuit to connect material connecting circuit member and can obtain the syndeton that thermal expansion and thermal contraction are subjected to the circuit member that fully suppresses.In this syndeton, warpage be subjected to abundant inhibition, can circuit electrode be interconnected.And connection reliability is also very excellent.
Also have, circuit connection material of the present invention also can not contain conducting particles.In this case, directly contact between the circuit electrode that direction is disposed relatively, thereby reach electrically conducting.
Below to shown in Figure 2 being elaborated by conductive adhesive layer 40 and the insulating properties adhesive layer 50 laminated circuit connection materials that form 110.
The adhesive composition 30 that constitutes conductive adhesive layer 40 contains conducting particles 1, binding agent composition 2 and near infrared absorbing coloring matter 3.Conducting particles 1 and near infrared absorbing coloring matter 3 are dispersed in the binding agent composition 2.When a pair of circuit member of configuration connected relatively with direction, conductive adhesive layer 40 can carry out electrically conducting each other by the circuit electrode that conducting particles 1 makes on the interarea that is arranged on each circuit member and direction is relative.That is, make in the insulating properties between the circuit electrode that conductive adhesive layer 40 is can be on keeping same circuit member adjacent direction relatively the circuit electrode of configuration carry out electrically conducting each other.
As above-mentioned epoxy resin, can use a kind of in the following material separately or be used in combination below two kinds: the bisphenol-type epoxy resin of deriving by chloropropylene oxide and bisphenol-A or F, AD etc., the novolac-type epoxy resin of deriving by chloropropylene oxide and phenol novolac or cresols novolac, having the naphthalene that contains the naphthalene nucleus skeleton is epoxy resin, and contains various epoxy compoundss that have two above glycidyls in the per molecules such as glycidyl amine, glycidol ether, biphenyl, ester ring type etc.
For these epoxy resin, consider from preventing the electron transfer aspect, preferably use foreign ion (Na+, Cl
-Deng), hydrolysis chlorine etc. is reduced to the high purity product below the 300ppm.
Consider that from making adhesive composition 30 have better film forming aspect preferred binder composition 30 contains the film forming macromolecule as binding agent composition 2.As the film forming macromolecule, can enumerate thermoplastic resins such as phenoxy resin, mylar, polyamide.These film forming macromolecules have the effect of slowing down the stress that produces when thermosetting resin cured.In addition, consider that from improving the cementability aspect preferred film forming macromolecule contains functional groups such as hydroxyl.
For adhesive composition 30,, preferably contain curing agent such as latent curing agent as binding agent composition 2.As curing agent, for example can use hardener for epoxy resin.As above-mentioned curing agent, can enumerate amine system, phenol system, acid anhydrides system, imidazoles system, hydrazides system, dicyandiamide, boron trifluoride-amine complex, sulfonium salt, salt compounded of iodine, aminimide etc.These curing agent can be used alone, and also can be used in combination more than 2 kinds, can also sneak into decomposition accelerating agent, inhibitor etc. and use.
As the near infrared absorbing coloring matter of maximum light absorption wavelength in 800～1200nm scope, can enumerate azo system, amine (aminium) and be, anthraquinone system, cyanine system, diimine system, side's acid system, naphthalene phthalocyanine system, phthalocyanine based compound etc.Can use a kind of in these materials separately or be used in combination more than 2 kinds.At this moment, the maximum absorption wavelength of near infrared absorbing coloring matter can use commercially available spectrophotometer, measures by measuring spectrophotometric transmittance.
As the object lesson of near infrared absorbing coloring matter, can enumerate " YKR " series of Yamamoto Chemicals Co., Ltd's manufacturing, " EX Color " series that Nippon Shokubai Co., Ltd makes, " Epolight " series that " IRG " is serial, EPOLIN company makes that Nippon Kayaku K. K makes etc.In these products, from to the dissolubility height of all kinds of solvents, have thermal endurance and light resistance and near infrared ray absorbing and can consider excellent aspect, especially preferably " YKR " series of making as the Yamamoto Chemicals Co., Ltd of phthalocyanine based compound, " EX Color " series that Nippon Shokubai Co., Ltd makes.
The content of preferred near infrared absorbing coloring matter is 0.1～10 quality % based on all resins solid content contained in the adhesive composition 30.If it contains quantity not sufficient 0.1 quality %, then the abundant irradiates light of absorption near infrared ray light emitting source causes easily solidifying and can not fully carry out.Also have, solidifying the degree of carrying out can judge by obtaining the curing reaction rate.For the curing reaction rate, can use DSC (differential scanning calorimetry), by measuring the caloric value before circuit connection material solidifies, the caloric value after the curing, obtain from both differences.From considering that with sufficient reliability connecting circuit member aspect the preferred consolidation reactivity is more than 80%.
On the other hand, if the content of near infrared absorbing coloring matter surpasses 10 quality %, then the light of near infrared range shines whole circuit connection materials unevenly, causes producing on the solid state inhomogeneous easily.In this case, be easy to generate the part that curing is not fully carried out.Also have, " the resin solid content " in this specification is meant the composition that is insoluble to toluene under normal temperature (20 ℃).
In conductive adhesive layer 40, disperse to be used for giving energetically the conducting particles 1 of anisotropic conductive.Like this, by the dispersion of conducting particles 1,, also can make between the relative circuit electrode of direction and carry out electrically conducting with high reliability even existence such as the projection of the chip that is connected by circuit connection material 110 and electrode of substrate highly differ.
As conducting particles 1, for example can enumerate the particle with conductivity of metals such as containing Au, Ag, Ni, Cu, soft solder.Preferred conducting particles 1 has by contour molecular globose nucleus material of polystyrene and the lip-deep conductive layer of being made up of metals such as Au, Ag, Ni, Cu, soft solders of this nuclear material.In addition, also can further have superficial layers such as Sn, Au, soft solder on the conductive layer surface with conductivity of conducting particles 1.
The particle diameter of conducting particles 1 must be less than the minimum interval that is arranged at the circuit electrode on the same circuit member (on the same circuit member adjacent electrode gap).In addition, under the height of these circuit electrodes situation devious, the particle diameter of preferred conducting particles 1 is greater than this height tolerance.From the above considerations, the average grain diameter of preferred conducting particles 1 is 1～10 μ m, more preferably 2～5 μ m.If average grain diameter less than 1 μ m, then can not fully solve the height tolerance of circuit electrode, damage the sufficient conductivity between circuit electrode easily, if surpass 10 μ m, then damage the interelectrode abundant insulating properties of adjacent circuit easily.
Conducting particles 1 content in the preferred conductive adhesive layer 40 is 0.1～30 volume % based on the cumulative volume of adhesive composition 30.If this containing ratio less than 0.1 volume %, then the conducting particles number on the circuit electrode that is connected reduces, and therefore contacts the deficiency of counting, and damages the sufficient conductivity between the circuit electrode that is connected easily.On the other hand, if this containing ratio surpasses 30 volume %, then the surface area of conducting particles significantly increases, and conducting particles connects because of the secondary aggegation easily, damages the interelectrode abundant insulating properties of adjacent circuit on the same circuit member easily.
The insulating properties adhesive layer 50 that forming circuit connects material 110 is the layers with insulating properties.For insulating properties adhesive layer 50,, guarantee to have between the circuit electrode adjacent on the same substrate sufficient insulating properties and (preferably make the insulating resistance value between adjacent electrode reach 1 * 10 as long as when making direction relatively the circuit member of configuration interconnecting
8More than the Ω), its composition has no particular limits, and for example can be set at identical with the composition removed behind the conducting particles 1 in the above-mentioned conductive adhesive layer 40.
Can further sneak into, disperse inorganic filling material and rubber particles in conductive adhesive layer 40 and the insulating properties adhesive layer 50.These compositions can sneak into, disperse with conducting particles 1 and near infrared absorbing coloring matter.Also have, can in not containing the insulating properties adhesive layer 50 of conducting particles 1, sneak into, disperse these compositions, but preferably in having the conductive adhesive layer 40 of conducting particles, sneak into, disperse these compositions.By in adhesive composition 30, adding inorganic filling material and rubber particles, can be so that the melt viscosity of the conductive adhesive layer 40 when relatively the circuit member of configuration interconnects, compared with the melt viscosity of insulating properties adhesive layer 50, can be improved more easily and fully.Thus, with the circuit member of configuration relatively when interconnecting, can suppress to be arranged on the electrode on the interarea of circuit member and flow out conducting particles.Therefore, can take into account high de-agglomeration energy and long-term connection reliability high-levelly.
As inorganic filling material, have no particular limits, for example can enumerate powders such as fused silica, crystalline silica, calcium silicates, aluminium oxide, calcium carbonate.Consider that from preventing connecting portion poor flow aspect the average grain diameter of inorganic filling material is preferably below the 3 μ m.
When using inorganic filling material, its use level, in conductive adhesive layer 40 and insulating properties adhesive layer 50 each layers, all reaching 32 all (100 mass parts) with adhesive composition 30 respectively is benchmark, is preferably 5～100 mass parts.Also have,, can improve the melt viscosity of conductive adhesive layer 40 and insulating properties adhesive layer 50 by increasing the use level of inorganic filling material.
As the rubber particles that is scattered in conductive adhesive layer 40 and the insulating properties adhesive layer 50, the preferred glass transition temperature is at the particle below 25 ℃.Specifically, preferably use butadiene rubber, acrylic rubber, s-B-S rubber, nitrile-butadiene rubber, organic silicon rubber etc.As rubber particles, preferably it has the average grain diameter of 0.1～10 μ m, and more preferably the following particle of average grain diameter accounts for more than 80% of particle size distribution.In addition, as rubber particles, more preferably it has the average grain diameter of 0.10～5 μ m.In addition, aspect improving dispersed adhesive composition, consider that the surface of preferred rubber particle is through the processing of silane coupler.
Organic silicon rubber particle in the rubber particles also has excellent dispersiveness except that the solvent resistance excellence, therefore preferred the use.Also have, the organic silicon rubber particle can be adjusted in the aqueous solution that pH is the alcohol more than 9 by silane compound or methyl trialkoxysilane and/or its partial hydrolysis condensation product are added to alkaline matters such as caustic soda, ammonia, be hydrolyzed, the method for polycondensation, or the copolymerization of organosiloxane etc. obtains.In addition, have functional groups such as hydroxyl, epoxy radicals, ketimide base, carboxyl, sulfydryl on the side chain in the molecular end of organosilicon particle or the molecule, can improve its dispersiveness in adhesive composition thus.Therefore, preferably use this organosilicon particle.
When using rubber particles, its use level, in any one deck of conductive adhesive layer 40 and insulating properties adhesive layer 50, with binding agent composition 2 all be benchmark (100 mass parts), be preferably 5～50 mass parts.
In circuit connection material 110, the thickness of conductive adhesive layer 40 is preferably 3～15 μ m, more preferably 5～10 μ m.If this thickness less than 3 μ m then adopt when having the conducting particles of preferred average grain diameter, cause the formation variation of conductive adhesive layer easily.On the other hand, then many if this thickness surpasses 15 μ m from the conducting particles that circuit electrode flows out, cause being difficult to guarantee insulating properties enough between the adjacent circuit electrode easily and the circuit electrode that connected between enough conductivity.
The thickness of preferred insulating properties adhesive layer 50 is to be formed at below the summation of the thickness of first circuit electrode on the first substrate interarea and the thickness that is formed at the second circuit electrode on the second substrate interarea.If the thickness of insulating properties adhesive layer 50 is greater than the summation of the thickness of the thickness of first circuit electrode and second circuit electrode, then the conducting particles that flows out from circuit electrode is many, cause being difficult to take into account the interelectrode insulating properties of adjacent circuit easily high-levelly and the circuit electrode that connected between the conductivity of (direction relative circuit electrode between).
Preferably in circuit connection material 110, the melt viscosity of conductive adhesive layer 40 was higher than insulating properties adhesive layer 50 when the circuit member of configuration interconnected relatively with direction.Herein, the melt viscosity during so-called the connection is meant the melt viscosity under the heating-up temperature when using 110 pairs of directions of circuit connection material the circuit member of configuration connects relatively.Also have, the temperature of the circuit connection material 110 the when circuit member that disposes is relatively interconnected can suitably be regulated according to the curable of the binding agent in the circuit connection material 110, for example in 120 ℃～250 ℃ scope.Therefore, in this temperature range, the melt viscosity of preferred conductive adhesive layer 40 is higher than the melt viscosity of insulating properties adhesive layer 50.
Below, one of the manufacture method of circuit connection material 110 example is described.
At first, preparation is used to form the coating fluid of conductive adhesive layer 40.Specifically, with binding agent composition 2, conducting particles 1 and near infrared absorbing coloring matter 3 dissolvings or be dispersed in the organic solvent, carry out liquid stateization and be mixed with coating fluid.Consider that from the dissolubility aspect that improves material the solvent that uses this moment is preferably the aromatic series hydrocarbon system and contains the mixed solvent of oxygen system.As binding agent composition 2, except thermosetting resin, can also contain curing agent, film forming macromolecules etc. such as latent curing agent.
Then, this coating fluid is coated on the common fissility base material (supporting film), following the removing of activation temperature that is heated to curing agent desolvated, thereby forms the conductive adhesive layer of being made up of adhesive composition 30 40 on supporting film.Also have,, preferably use and passed through surface-treated PET film etc. in order to have release property as the fissility base material.
For insulating properties adhesive layer 50,, can form according to the mode identical with the formation method of conductive adhesive layer 40 except not allocating into the conducting particles.
By will be according to the method described above formed conductive adhesive layer 40 and insulating properties adhesive layer 50 carry out laminated method or apply the known methods such as method of each layer successively, can make by conductive adhesive layer 40 and not contain the insulating properties adhesive layer 50 laminated circuit connection materials that form 110 of conducting particles.
The syndeton of using the circuit member that circuit connection material 110 that above-mentioned execution mode relates to forms is described.
Fig. 4 is the schematic cross-section of a preferred implementation of the syndeton body of the circuit member that the present invention relates to of expression.As syndeton body 200, first circuit member 10 with first substrate 11 and first circuit electrode 12 is connected by circuit connecting section 150 with the second circuit member 20 with second substrate 21 and second circuit electrode 22.First circuit electrode 12 is formed on the face (interarea) of first substrate 11, and second circuit electrode 22 is formed on the face (interarea) of second substrate 21.Like this, for first circuit member 10 and second circuit member 20, first circuit electrode 12 is connected in the relative mode of direction with second circuit electrode 22.Circuit connecting section 150 is made up of the resin cured matter of resin combination 30,32, and this resin cured matter contains resinous principle 5, conducting particles 1 and near infrared absorbing coloring matter 3.
That is, in the circuit connecting section 150 of syndeton body 200, on the relative direction of first circuit member 10 and second circuit member 20, undertaken laminated by the mutually different a plurality of resin cured matter layers of the content of conducting particles 1.
In syndeton body 200, relative first circuit electrode 12 and second circuit electrode 22 are electrically connected by conducting particles 1.Also have, do not contain in circuit connecting section under the situation of conducting particles, the circuit electrode directly contact mutually that direction is relative, thus the circuit member that direction is disposed relatively is electrically connected.
As the object lesson of first circuit member 10 and second circuit member 20, can enumerate glass substrate that ITO of using in the LCD etc. formed electrode, plastic base, printed substrate, ceramic wiring board, flexible circuit board, semiconductor wafers etc.There is high spectrophotometric transmittance aspect to consider from light, preferred glass substrate and plastic base wherein to wavelength 800～1200nm.Also can be used in combination these substrates as required.In addition, the surface of first circuit member 10 and second circuit member 20 also can have metals such as copper, aluminium or ITO (indium tin oxide, tin indium oxide), silicon nitride (SiNx), silicon dioxide (SiO
2) wait the inorganic layer.
One of the manufacture method of syndeton body 200 example is described.
At first, first circuit electrode 12 and second circuit electrode 22 are opposed mutually, make circuit connection material 110 between first circuit member 10 and second circuit member 20.Specifically, for example will be formed at circuit connection material 110 on the fissility base material is fitted on the face that the second circuit electrode 22 of second circuit member 20 forms.Heating and pressurizing is pressed together on circuit connection material 110 on the second circuit member 20 temporarily in this state.Then, peel off the fissility base material from circuit connection material 110, second circuit member 10 is loaded on the circuit connection material 110 in that first circuit electrode 12 and second circuit electrode position 22 are put under the situation of alignment, makes and carry out laminated lamilated body in this order by second circuit member 20, circuit connection material 110 and first circuit member 10.
Then, from the below of second circuit member 20, the light of promptly opposite with circuit connection material 110 1 sides of second circuit member 20 side irradiation near infrared range pressurizes to second circuit member 20 directions to first circuit member 10.Thus, circuit connection material 110 solidifies, and first circuit member 10 forms with second circuit member 20 and is connected, and first circuit electrode 12 and second circuit electrode 22 form and be electrically connected simultaneously, can obtain syndeton body 200.Also have, the spectrophotometric transmittance of the light in preferred 20 couples of wavelength 800～1200nm of second circuit member scope is more than 50%.Therefore, preferred second substrate 21 is glass substrate or plastic base.
Can suitably regulate with the above-mentioned lamilated body of the rayed of near infrared range and the condition of pressurizeing, so that circuit connection material 110 solidifies and obtains enough adhesive strengths.Also have, the time of pressurization and irradiation near infrared range light needn't limit, as long as in the light time of irradiation near infrared range, first circuit member 10 and the driving fit of second circuit member get final product on circuit connection material 110.In addition, the light time of irradiation near infrared range, preferably use pressing instrument etc. simultaneously, lamilated body is heated to for example 120～250 ℃.Thus, the circuit member of relative configuration is connected more effectively.
Also have, when syndeton body 200 and manufacture method thereof are described, though the situation that is to use circuit connection material 110 of explanation also can be used circuit connection material 100 or 120 replacement circuit connection materials 110.
More than preferred implementation of the present invention is illustrated, but the present invention is not subjected to the qualification of above-mentioned execution mode.For example, circuit connection material of the present invention can be the membranaceous form shown in Fig. 1～3, also can be paste-like.Also have, the circuit connection material that present embodiment relates to is applicable to being connected of electronic units such as the connection between the circuit substrate, IC chip and wiring substrate etc.
Embodiment
Below based on embodiment and comparative example the present invention is described more specifically, but the present invention never is subjected to the qualification of following examples.
Embodiment 1
With phenoxy resin (Union Carbide Corporation's system, trade name PKHC) 32 mass parts, in bisphenol A type epoxy resin, disperse acrylic acid (ァ Network リ Le) particle (20 quality %, average grain diameter 0.2 μ m) resin that contains acrylic particles (Nippon Shokubai Co., Ltd's system of Xing Chenging, trade name: BPA328) 10 mass parts, bisphenol A type epoxy resin (oiling Shell Epoxy Co., Ltd. system, trade name: YL980) 20 mass parts, imidazoles is curing agent (Asahi Kasei Corporation's system, trade name: 34 mass parts NOVACURE HX-3941), near infrared absorbing coloring matter (Nippon Shokubai Co., Ltd's system as the phthalocyanine based compound, trade name: 1 mass parts and silane coupler (Japan Unicar Co., Ltd. system EX Color HA-1), trade name: A187) 3 mass parts are dissolved in the toluene as solvent, and the insulating properties adhesive layer that obtains the resin solid content and be 50 quality % forms uses coating fluid A.The mix proportion of each raw material is illustrated in the table 1.
Then, with apparatus for coating this insulating properties adhesive layer formation being coated on the thickness that has applied demoulding processing on the single face (face of coating coating fluid) with coating fluid A is on the PET film of 50 μ m, 70 ℃ of following heated-air dryings 10 minutes, be the insulating properties adhesive layer (a) of 13 μ m thereby on the PET film, form thickness.
Then, with phenoxy resin (Union Carbide Corporation's system, trade name PKHC) 32 mass parts, in bisphenol A type epoxy resin, disperse acrylic particles (20 quality %, average grain diameter 0.2 μ m) resin that contains acrylic particles (Nippon Shokubai Co., Ltd's system of Xing Chenging, trade name: BPA328) 20 mass parts, imidazoles is curing agent (Asahi Kasei Corporation's system, trade name: 34 mass parts NOVACURE HX-3941), near infrared absorbing coloring matter (Nippon Shokubai Co., Ltd's system as the phthalocyanine based compound, trade name: HA-1) 1 mass parts, silane coupler (Japan Unicar Co., Ltd. system, trade name: A187) 3 mass parts and organic silicon rubber (Toray Dow Corning Co., Ltd. system, trade name: EP2100) 30 mass parts are dissolved in the toluene as solvent, and being mixed with solid content is the binder liquid B of 50 quality %.The mix proportion of each raw material is illustrated in the table 1.
Conducting particles (Sekisui Chemical Co., Ltd's system of Ni and Au layer will have been formed on polystyrene karyoid (the diameter 3 μ m) surface, trade name: Micropearl AU, average grain diameter: 3.2 μ m, outermost layer: AU) 20 mass parts are dispersed among this binder liquid B of 100 mass parts, obtain conductive adhesive layer formation coating fluid.
With apparatus for coating this conductive adhesive layer formation being coated on the thickness that has applied demoulding processing on the single face (face of coating coating fluid) with coating fluid is on the PET film of 50 μ m, 70 ℃ of following heated-air dryings 10 minutes, be the conductive adhesive layer (b) of 10 μ m thereby on the PET film, form thickness.
With insulating properties adhesive layer (a) and the conductive adhesive layer (b) that is formed at respectively on the PET film, be heated to 40 ℃ according to the mode that insulating properties adhesive layer (a) is contacted with conductive adhesive layer (b), carry out lamination with the roll-type laminating machine simultaneously, the thickness that obtains insulating properties adhesive layer (a) is 13 μ m, and the thickness of conductive adhesive layer (b) is the circuit connection material of 2 layers of structure of 10 μ m.This circuit connection material has by the adhesive layer that contains conducting particles and does not contain the laminated structure that forms of adhesive layer of conducting particles.
Use this circuit connection material, connect by the following stated mode and to have golden projection (area: 30 * 50 μ m, bump height: 15 μ m, number of lugs: chip (1.2 * 19mm 300), 500 μ m) and on a face of glass substrate, formed band ITO circuit glass substrate (the ITO circuit thickness: 0.15 μ m, thickness of glass substrate: 0.5mm) of ITO circuit thickness:.
By at 80 ℃, 0.98MPa (10kgf/cm
2) condition under heating and pressurizing 1 second, (circuit connection material of 2 layers of structure of 1.5 * 20mm) sticks on the glass substrate of band ITO circuit, obtains lamilated body will to cut into preliminary dimension.Also have, after this moment the PET film on the conductive adhesive layer (b) being peeled off, be bonded in mode on the ITO circuit, circuit connection material is sticked on the glass substrate of band ITO circuit according to the conductive adhesive layer (b) of the circuit connection material that makes 2 layers of structure.
Then, stripper circuit connects the PET film of insulating properties adhesive layer (a) side of material, make glass substrate aligned in position with the projection and the band ITO circuit of golden projection chip, then from the light of the glass substrate one side irradiation near infrared range of the band ITO circuit of above-mentioned lamilated body, make the insulating properties adhesive layer (a) of the face with projection of chip simultaneously towards circuit connection material, pressurize with the pressing instrument, thereby lamilated body is connected fully with the chip that has golden projection.Thus, can obtain the syndeton body that the glass substrate of chip and band ITO circuit is connected to form by circuit connection material.The condition of Lian Jieing is a heating-up temperature fully: 230 ℃, and moulding pressure: 40g/ projection, heating and pressurizing time: 3 seconds.It is the semiconductor laser of 904nm that near infrared irradiation is to use wavelength, and the employing light quantity is 2.5W/mm
2Near infrared light implement.Also have, above-mentioned heating-up temperature (230 ℃) temperature of circuit connection material when being heating and pressurizing is the temperature that reaches by the near infrared ray irradiation.
[mensuration of curing reaction rate]
According to the method for the following stated, obtain the above-mentioned curing reaction rate of circuit connection material when connecting fully.At first, use DSC (differential scanning calorimetry) to measure the caloric value that connects front and back fully respectively, use this measurement result and utilize following formula (1) to calculate.Result of calculation is shown in Table 3.Also have, the caloric value after connecting fully is the circuit connecting section branch of the syndeton body after connecting to be taken a sample measure.
Curing reaction rate (%)=(Q
0-Q
T)/Q
0* 100 (1)
[in the formula (1), Q
0Be the caloric value before connecting fully, Q
TIt is the caloric value after connecting fully.]
Then, at 85 ℃, the environment of 85%RH was preserved 1000 hours down with the syndeton body that obtains.After the preservation, measure connection resistance value and amount of warpage as described below.The results are shown in the table 3.
[mensuration that connects resistance value]
Whether use digital multimeter, adopt 4 terminal methods to be determined at the connection resistance value of per 1 projection of the syndeton body after preserving under the above-mentioned environment, it is good to estimate conduction.The connection resistance value of all projections is that 20 Ω are evaluated as " A " when following, is evaluated as " B " when resistance value surpasses the projection of 20 Ω if include to connect.
[mensuration of amount of warpage]
Use surface shape measuring machine ((strain) little Ban Yanjiusuoshe system, trade name: surface roughness measurement machine/SE3500), be determined at the maximum amount of warpage at the syndeton body top glass substrate back side (dividing the surface of that opposite side of a side) after preserving under the above-mentioned environment with the circuit connecting section of the glass substrate of being with ITO.It the results are shown in the table 3.
With near infrared absorbing coloring matter (the Nippon Shokubai Co., Ltd's system among coating fluid A and the binder liquid B, trade name: use level EX Color HA-1) is set at 0.1 mass parts respectively, in addition prepare the circuit connection material of 2 layers of structure by the mode identical, make the syndeton body with embodiment 1.Estimate by the mode identical then with embodiment 1.The mix proportion of each raw material is illustrated in the table 1, and evaluation result is shown in Table 3.
With (the Nippon Shokubai Co., Ltd's system of the near infrared absorbing coloring matter among the coating fluid A, trade name: use level EXColor HA-1) is set at 9.6 mass parts, with (the Nippon Shokubai Co., Ltd's system of the near infrared absorbing coloring matter among the binder liquid B, trade name: use level EX Color HA-1) is set at 8.6 mass parts, in addition prepare the circuit connection material of 2 layers of structure by the mode identical, make the syndeton body with embodiment 1.Estimate by the mode identical then with embodiment 1.The mix proportion of each raw material is illustrated in the table 1, and evaluation result is shown in Table 3.
Comparative example 1
With near infrared absorbing coloring matter (the Nippon Shokubai Co., Ltd's system among coating fluid A and the binder liquid B, trade name: use level EX Color HA-1) is set at 0.03 mass parts, in addition prepare the circuit connection material of 2 layers of structure by the mode identical, make the syndeton body with embodiment 1.Estimate by the mode identical then with embodiment 1.The mix proportion of each raw material is illustrated in the table 2, and evaluation result is shown in Table 3.
Comparative example 2
With near infrared absorbing coloring matter (the Nippon Shokubai Co., Ltd's system among coating fluid A and the binder liquid B, trade name: use level EX Color HA-1) is set at 15 mass parts, in addition prepare the circuit connection material of 2 layers of structure by the mode identical, make the syndeton body with embodiment 1.Then, use the circuit member identical, under same condition, connect with embodiment 1.Estimate by the mode identical then with embodiment 1.The mix proportion of each raw material is illustrated in the table 2, and evaluation result is shown in Table 3.
Comparative example 3
Prepare the circuit connection material of 2 layers of structure and obtain lamilated body by the mode identical with embodiment 1.Then with lamilated body when chip with golden projection is connected fully, do not shine the light of near infrared range, use the pressing instrument to carry out heating and pressurizing, thereby carry out lamilated body and being connected fully with the chip of golden projection, in addition, connect fully by the mode identical with embodiment 1.Thus, obtained connecting the syndeton body that the glass substrate of chip and band ITO circuit forms by circuit connection material.The condition of Lian Jieing is a heating-up temperature fully: 230 ℃, and moulding pressure: 40g/ projection, heating and pressurizing time: 3 seconds.Estimate by the mode identical then with embodiment 1.The mix proportion of each raw material is illustrated in the table 2, and evaluation result is shown in Table 3.
Comparative example 4
Except not allocating near infrared absorbing coloring matter into, be that (Asahi Kasei Corporation's system, trade name: use level NOVACURE HX-3941) is set at outside 35 mass parts curing agent, prepares coating fluid A and binder liquid B by the mode identical with embodiment 1 with imidazoles.Then, prepare the circuit connection material of 2 layers of structure, make the syndeton body, and estimate by the mode identical with embodiment 1.The mix proportion of each raw material is illustrated in the table 2, and evaluation result is shown in Table 3.
Table 1
※ 1: the expression near infrared absorbing coloring matter is with respect to the ratio (quality %) of resin solid content.
Table 2
※ 1: the expression near infrared absorbing coloring matter is with respect to the ratio (quality %) of resin solid content.
Table 3
| Connect resistance value (maximum) | Curing reaction rate (%) | Maximum amount of warpage (μ m) | |
| Embodiment 1 | ??A(10Ω) | ??90 | ??3 |
| |
??A(13Ω) | ??81 | ??2 |
| |
??A(12Ω) | ??98 | ??3 |
| Comparative example 1 | B (open circuit) | ??58 | ??3 |
| Comparative example 2 | ??B(35Ω) | ??86 | ??3 |
| Comparative example 3 | ??B(28Ω) | ??90 | ??11 |
| Connect resistance value (maximum) | Curing reaction rate (%) | Maximum amount of warpage (μ m) | |
| Comparative example 4 | B (open circuit) | ??35 | ??2 |
In the table, so-called open circuit is more than expression 1000 Ω (the mensuration upper limit).
The result shows shown in the table 3, use with respect to all resins solid content contain the circuit connection material that in 800～1200nm optical wavelength range, has the near infrared absorbing coloring matter of maximum absorption wavelength of 0.1～10 quality %, connection resistance value and the curing reaction rate of syndeton body after humidity test of solidifying by the irradiation of near infrared light is well.In addition, can confirm that the syndeton body also has little amount of warpage.
On the other hand, use when not containing the circuit connection material (comparative example 4) of near infrared absorbing coloring matter, can confirm connection resistance value, curing reaction rate variance after the humidity test.In addition, for the circuit connection material that contains quantity not sufficient 0.1 quality % (comparative example 1) of near infrared absorbing coloring matter, also can confirm connection resistance value, curing reaction rate variance after the humidity test.And, for the content of near infrared absorbing coloring matter circuit connection material (comparative example 2), also can confirm connection resistance value, curing reaction rate variance after the humidity test more than 10 quality %.
In addition, contain the syndeton body (comparative example 3) that in 800～1200nm optical wavelength range, has the circuit connection material of the near infrared absorbing coloring matter of maximum absorption wavelength, only adhesive composition is solidify to form of thermosetting resin, conducting particles and 0.1～10 quality % for use, can confirm that connection resistance value difference, the connector amount of warpage after humidity test is also big by pressing instrument heating.Owing to use the pressing instrument from circuit member one side (with the chip of golden projection) heating, the amount of warpage of connector is big like this.
Can be confirmed that by above result the circuit connection material of the application of the invention can make between the circuit member to connect effectively at short notice, the connection reliability excellence of resulting syndeton body has reduced the amount of warpage of syndeton body fully.
Industrial applicibility
According to the present invention, can with high de-agglomeration the electrode of relative configuration be interconnected at short notice, can provide connection reliability very excellent circuit connection material. In addition, connect by using the sort circuit connecting material, the syndeton body of high reliability can be provided and possess the manufacture method of the syndeton body of above-mentioned characteristic. That is, connecting material in a circuit according to the invention can make at short notice circuit member interconnect or the electronic unit such as IC chip is connected with circuit member, can obtain the syndeton body that fully suppresses of being subject to of thermal expansion and thermal contraction. Thus, can provide fully being reduced of warpage, syndeton body that connection reliability is very excellent.
Claims (7)
1. circuit connection material, it is used at first circuit member that has formed first circuit electrode on the interarea of first substrate with formed the second circuit member of second circuit electrode on the interarea of second substrate, be connected making under above-mentioned first circuit electrode state relative with above-mentioned second circuit electrode
Wherein, this circuit connection material contains the adhesive composition of maximum light absorption wavelength in 800～1200nm scope.
2. circuit connection material according to claim 1, above-mentioned adhesive composition contain the near infrared absorbing coloring matter of maximum light absorption wavelength in 800～1200nm scope.
3. circuit connection material according to claim 2, the content of above-mentioned near infrared absorbing coloring matter is 0.1～10 quality % with respect to all resins solid content of above-mentioned adhesive composition.
4. circuit connection material according to claim 1, above-mentioned adhesive composition contains conducting particles.
5. circuit connection material according to claim 1, above-mentioned adhesive composition contains the film forming macromolecule.
6. syndeton body, it possesses:
On the interarea of first substrate, formed first circuit electrode first circuit member,
On the interarea of second substrate, formed the second circuit electrode and according to the second circuit member that above-mentioned second circuit electrode and the relative mode of above-mentioned first circuit electrode are disposed and
Be arranged between above-mentioned first substrate and above-mentioned second substrate and connect the circuit connecting section of above-mentioned first circuit member and above-mentioned second circuit member,
The foregoing circuit connecting portion contains the resin cured matter that above-mentioned adhesive composition is solidify to form by the light to the described circuit connection material irradiation of claim 1 near infrared range.
7. the manufacture method of syndeton body, it possesses following operation: will form the second circuit member of second circuit electrode on first circuit member that has formed first circuit electrode on the interarea of first substrate and the interarea at second circuit, according to above-mentioned first circuit electrode is configured with the relative mode of above-mentioned second circuit electrode, and make in the claim 1～5 each described circuit connection material between between them, make above-mentioned first circuit member, above-mentioned second circuit member is connected the light of the following irradiation of the state near infrared range of material driving fit with foregoing circuit, the above-mentioned adhesive composition that makes foregoing circuit connect material solidifies, thereby connects above-mentioned first circuit member and above-mentioned second circuit member.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-261994 | 2007-10-05 | ||
| JP2007261994 | 2007-10-05 | ||
| JP2008-026731 | 2008-02-06 | ||
| JP2008026731A JP4978493B2 (en) | 2007-10-05 | 2008-02-06 | Circuit connection material, connection structure and manufacturing method thereof |
| PCT/JP2008/067491 WO2009044678A1 (en) | 2007-10-05 | 2008-09-26 | Circuit connecting material, circuit connection structure, and method for producing the same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102225114A Division CN102382594A (en) | 2007-10-05 | 2008-09-26 | Application of adhesive compond |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101816221A true CN101816221A (en) | 2010-08-25 |
| CN101816221B CN101816221B (en) | 2011-09-21 |
Family
ID=40706735
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102225114A Pending CN102382594A (en) | 2007-10-05 | 2008-09-26 | Application of adhesive compond |
| CN2008801101981A Expired - Fee Related CN101816221B (en) | 2007-10-05 | 2008-09-26 | Circuit connecting material, circuit connection structure, and method for producing the same |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102225114A Pending CN102382594A (en) | 2007-10-05 | 2008-09-26 | Application of adhesive compond |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4978493B2 (en) |
| KR (1) | KR20090052303A (en) |
| CN (2) | CN102382594A (en) |
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| CN102905473A (en) * | 2011-07-29 | 2013-01-30 | 富泰华工业（深圳）有限公司 | Circuit board and producing method thereof |
| CN103079343A (en) * | 2011-10-26 | 2013-05-01 | 日立化成工业株式会社 | Circuit component |
| CN106062118A (en) * | 2014-03-11 | 2016-10-26 | 迪睿合株式会社 | Anisotropic conductive adhesive, method for producing connector and method for connecting electronic component |
| CN109068958A (en) * | 2016-04-07 | 2018-12-21 | 奥林巴斯株式会社 | Medical instrument and medical instrument heat curable adhesive |
| CN109082262A (en) * | 2018-08-13 | 2018-12-25 | 广东泰强化工实业有限公司 | A kind of infrared fast curable water-borne based on CuS photothermal conversion mechanism crosses machine glue and coating method |
| TWI715542B (en) * | 2014-11-12 | 2021-01-11 | 日商迪睿合股份有限公司 | Light curing anisotropic conductive adhesive, method for producing connector and method for connecting electronic components |
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| JP2011062963A (en) * | 2009-09-18 | 2011-03-31 | Canon Inc | Manufacturing method of liquid discharging head |
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| JP2017179128A (en) * | 2016-03-30 | 2017-10-05 | Jnc株式会社 | Cured article of thermosetting resin composition, substrate having cured article and manufacturing method of electronic component |
| JP6428841B2 (en) * | 2017-04-26 | 2018-11-28 | 大日本印刷株式会社 | Battery packaging materials |
| KR102603157B1 (en) * | 2017-09-11 | 2023-11-17 | 가부시끼가이샤 레조낙 | Adhesive film receiving set and method for manufacturing the same |
| WO2024070436A1 (en) * | 2022-09-28 | 2024-04-04 | 綜研化学株式会社 | Anisotropic conductive material, anisotropic conductive sheet, anisotropic conductive paste, connection structure, and method for producing connection structure |
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| JP4867069B2 (en) * | 2000-12-28 | 2012-02-01 | 日立化成工業株式会社 | Adhesive composition, circuit terminal connection method using the same, and circuit terminal connection structure |
| JP4788038B2 (en) * | 2000-12-28 | 2011-10-05 | 日立化成工業株式会社 | Adhesive composition, circuit terminal connection method using the same, and circuit terminal connection structure |
| JP2004160676A (en) * | 2002-11-08 | 2004-06-10 | Hitachi Chem Co Ltd | Electromagnetic wave shielding laminate having near infrared shielding property and its manufacturing method |
| JP4389471B2 (en) * | 2003-05-19 | 2009-12-24 | パナソニック株式会社 | Electronic circuit connection structure and connection method |
| JP2005320491A (en) * | 2004-05-11 | 2005-11-17 | Hitachi Chem Co Ltd | Adhesive composition, film-like adhesive and circuit connecting material using the same, connecting structure of circuit member and its manufacturing method |
| JP2006199778A (en) * | 2005-01-19 | 2006-08-03 | Hitachi Chem Co Ltd | Adhesive composition, adhesive for use in circuit connection, method for connecting circuits using the same, and connected body |
| EP1907498A1 (en) * | 2005-05-10 | 2008-04-09 | Nippon Shokubai Co.,Ltd. | Pressure-sensitive adhesive composition comprising near infrared ray absorption agent |
| WO2007023834A1 (en) * | 2005-08-23 | 2007-03-01 | Bridgestone Corporation | Adhesive composition |
-
2008
- 2008-02-06 JP JP2008026731A patent/JP4978493B2/en not_active Expired - Fee Related
- 2008-09-26 CN CN2011102225114A patent/CN102382594A/en active Pending
- 2008-09-26 KR KR1020087029026A patent/KR20090052303A/en not_active Application Discontinuation
- 2008-09-26 CN CN2008801101981A patent/CN101816221B/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102905473A (en) * | 2011-07-29 | 2013-01-30 | 富泰华工业（深圳）有限公司 | Circuit board and producing method thereof |
| CN102905473B (en) * | 2011-07-29 | 2017-06-06 | 富泰华工业（深圳）有限公司 | The preparation method of circuit board and circuit board |
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| CN109082262A (en) * | 2018-08-13 | 2018-12-25 | 广东泰强化工实业有限公司 | A kind of infrared fast curable water-borne based on CuS photothermal conversion mechanism crosses machine glue and coating method |
| CN109082262B (en) * | 2018-08-13 | 2020-11-03 | 广东泰强化工实业有限公司 | Infrared fast-curing water-based organic adhesive based on CuS photo-thermal conversion mechanism and coating method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102382594A (en) | 2012-03-21 |
| KR20090052303A (en) | 2009-05-25 |
| JP4978493B2 (en) | 2012-07-18 |
| JP2009105361A (en) | 2009-05-14 |
| CN101816221B (en) | 2011-09-21 |
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