KR20090052303A - Circuit connecting material, connection structure and method for producing thereof - Google Patents

Abstract

The circuit connection material of the present invention comprises a first circuit member having a first circuit electrode formed on a main surface of a first substrate and a second circuit member having a second circuit electrode formed on a main surface of a second substrate having a first circuit electrode; It is for connecting in the state which the 2nd circuit electrode opposed. This circuit connection material comprises an adhesive composition having a maximum absorption wavelength of light in the range of 800 to 1200 nm.

1st circuit member, 2nd circuit member, 1st circuit electrode, 2nd circuit electrode, circuit connection material, connection structure

Description

CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THEREOF}

TECHNICAL FIELD This invention relates to a circuit connection material, a connection structure, and its manufacturing method.

When electrically connecting circuit members or electronic components, such as an IC chip, and a circuit member connection, the anisotropic conductive adhesive which disperse | distributed electroconductive particle to the adhesive agent as needed is used. By arranging such an adhesive between the electrodes of the circuit member which oppose each other, and connecting the circuit members by heating and pressurization, the electrical connection between the opposing electrodes can be performed while maintaining insulation between adjacent electrodes. As such an anisotropically conductive adhesive, the circuit connection material based on the epoxy resin is proposed (for example, refer patent document 1).

Patent Document 1: Japanese Patent Application Laid-Open No. 3-16147

<Start of invention>

Problems to be Solved by the Invention

The circuit member connection method using the above-mentioned circuit connection material is a circuit member or an electronic component such as an IC chip and a circuit between circuit members or an electronic component such as an IC chip and an anisotropic conductive adhesive interposed between the circuit member. The member is polymerized and thermally compressed by heating and pressing using a crimping tool. The conditions of the heating pressurization performed at this time are about 150-220 degreeC, 1-5 Mpa, and about 15 to 4 second, for example.

However, in recent years, with the miniaturization and precision of electronic devices, it has been required to have a high resolution so that a circuit member having a fine electrode structure can be connected to the anisotropic conductive adhesive with sufficient reliability.

In order to meet such demands, the inventors have noted that the connection by short time heating reduces the effects of thermal expansion and thermal contraction of the material. Usually, in order to connect in a short time, it is necessary to heat at high temperature. By the way, when the conventional anisotropic conductive adhesive is subjected to high temperature heating to make a connection, the connection resistance value of the bonded structure obtained tends to increase, or the connection resistance value in reliability tests, such as a thermal shock test and a high temperature and high humidity test, tended to increase. This tendency has been an obstacle in realizing short-time connection of the circuit connection material which requires high resolution.

For example, heating and pressurization conditions performed using conventional circuit connection materials, such as an epoxy resin and an imidazole series mixture, are about 170-220 degreeC and about 15 to 4 second normally. In order to enable short time connection of 4 seconds or less here, heating at the temperature exceeding 220 degreeC is required. Under such a high temperature, when the IC chip is connected to a polymer film base material such as polyimide, polyester, polycarbonate, or a connection substrate such as a glass substrate through an anisotropic conductive adhesive, the IC chip and the substrate have a difference in thermal expansion coefficient after connection. It is feared that the connection resistance of a connection part increases or peeling of an adhesive agent arises by internal stress which arises. In addition, warpage may occur due to a difference in thermal expansion between the IC chip and the substrate after connection, and there is a concern that the display quality may be deteriorated in a liquid crystal panel or the like requiring narrow liquid lead.

On the other hand, as a means for enabling a short time connection of 4 seconds or less by making heating temperature into 220 degrees C or less, using a highly reactive latent hardener, such as a sulfonium salt, is considered. However, since the hardening reaction of a circuit connection material advances rapidly at the heating temperature of 180 degreeC or more, there exists a tendency for the problem that resin flow at the time of crimping becomes inadequate, and electrical conductivity falls.

This invention is made | formed in view of the said situation, and an object of this invention is to provide the circuit connection material which can connect the mutually arrange | positioned electrodes with short time and high resolution, and was excellent in connection reliability sufficiently. Moreover, an object of the present invention is to provide a connection structure in which the occurrence of warpage is sufficiently suppressed and the connection reliability is sufficiently high by providing a connection using such a circuit connection material and a method of manufacturing the connection structure.

Means for solving the problem

In order to achieve the above object, the present invention provides a first circuit member including a first circuit member having a first circuit electrode formed on a main surface of a first substrate and a second circuit member having a second circuit electrode formed on a main surface of a second substrate. Provided is a circuit connecting material comprising an adhesive composition having a maximum absorption wavelength of light in a range of 800 to 1200 nm for connecting in a state where the electrode and the second circuit electrode are opposed to each other.

Such a circuit connection material can connect a circuit electrode with a short resolution and high resolution by performing near-infrared irradiation with a wavelength of 800-1200 nm. That is, since hardening reaction of an adhesive composition is accelerated | stimulated by near-infrared irradiation, even if it connects circuit members which have the microstructure which high resolution is calculated | required, it becomes possible to carry out in a short time. In addition, reduction of the heating temperature and shortening of the heating time at the time of connection can be aimed at, and generation | occurrence | production of thermal expansion and thermal contraction in electronic components, such as a circuit member and an IC chip, is suppressed. Thereby, generation | occurrence | production of the curvature after a connection and generation | occurrence | production of a residual stress are suppressed, it can reliably connect circuit members, and can improve the connection reliability of circuit members.

It is preferable that the said adhesive composition in this invention contains the near-infrared absorbing pigment which the maximum absorption wavelength of light exists in the range of 800-1200 nm.

Since such a circuit connection material contains a near-infrared absorbing dye, a near-infrared absorbing dye generates heat by near-infrared irradiation, and hardening reaction of an adhesive composition is accelerated | stimulated. Therefore, it is possible to connect the circuit electrodes with high resolution for a short time and to connect the circuit members having a fine structure requiring high resolution for a short time.

In this invention, it is preferable that content of the said near-infrared absorbing dye with respect to the whole resin solid content of an adhesive composition is 0.1-10 mass%. Thereby, it becomes possible to harden a circuit connection material in low temperature and a short time, and can connect a circuit member more reliably, and can improve connection reliability further.

In the present invention, it is preferable that the adhesive composition contains conductive particles. As a result, the oppositely arranged circuit electrodes can be easily conducted. Such a circuit connection material is excellent in workability.

In the present invention, it is preferable that the adhesive composition contains a film-forming polymer. Thereby, the film formability of a circuit connection material can be made favorable enough. Moreover, when it contains a conductive particle, the dispersion state of the said conductive particle can be kept more uniform. Such a circuit connection material can more easily conduct the circuit electrodes which are opposed to each other via conductive particles, and can reliably insulate between adjacent circuit electrodes on the same substrate. Such a circuit connection material is further excellent in workability.

In the present invention also

A first circuit member having a first circuit electrode formed on a main surface of the first substrate,

A second circuit member formed on a main surface of a second substrate, the second circuit member disposed so that the second circuit electrode and the first circuit electrode face each other, and

A circuit connecting portion provided between the first substrate and the second substrate to connect the first circuit member and the second circuit member.

And a resin cured product obtained by curing the adhesive composition by irradiating light in the near infrared region to the circuit connection material described above.

To provide.

Since such a bonded structure includes a circuit connecting portion containing a cured resin material which is cured by irradiating light in the near infrared region to the circuit connecting material having the above-mentioned characteristics, deformation and residual stress due to thermal expansion and thermal contraction are sufficiently suppressed. For this reason, generation | occurrence | production of a curvature etc. is reduced and connection reliability is fully excellent. Moreover, such a connection structure is especially useful in liquid crystal panels and the like where narrow liquid lead is required, and is excellent in display quality.

In the present invention also

The first circuit member and the second circuit electrode may include the first circuit member having the first circuit electrode formed on the main surface of the first substrate and the second circuit member having the second circuit electrode formed on the main surface of the second circuit. Arranging to face each other, and

By irradiating light of a near-infrared region in the state which the said 1st circuit member, the said 2nd circuit member, and the said circuit connection material contact | connected between these through the circuit connection material, and hardening the said adhesive composition of the said circuit connection material Connecting the first circuit member and the second circuit member

Method for manufacturing a bonded structure having a

To provide.

In this manufacturing method, since the 1st circuit electrode and the 2nd circuit electrode are electrically connected by irradiating light of a near-infrared region to the circuit connection material mentioned above, it can connect with short time and high resolution. Since the connection structure obtained by this manufacturing method suppresses deformation | transformation and residual stress by thermal expansion and thermal contraction, generation | occurrence | production of a curvature etc. is fully reduced. Therefore, circuit members can be connected reliably. Moreover, connection reliability is also excellent enough. This manufacturing method is particularly useful in liquid crystal panels and the like where narrow liquid lead is required, whereby a bonded structure excellent in display quality can be obtained.

Effect of the Invention

According to the present invention, it is possible to connect the electrodes arranged opposite to each other for a short time and with high resolution, and to provide a circuit connection material that is sufficiently excellent in connection reliability. Moreover, by connecting using such a circuit connection material, the highly reliable connection structure and the manufacturing method of the connection structure provided with such a characteristic can be provided. That is, according to the circuit connection material of this invention, the circuit members or an electronic component, such as an IC chip, and a circuit member can be connected in a short time, and the connection structure by which generation | occurrence | production of thermal expansion and thermal contraction was fully suppressed can be obtained. Thereby, generation | occurrence | production of the curvature of a bonded structure can fully be reduced, and the bonded structure excellent in connection reliability can be provided sufficiently.

1: is a schematic cross section which shows preferable one Embodiment of the circuit connection material of this invention.

It is a schematic cross section which shows other embodiment of the circuit connection material of this invention.

It is a schematic stage which shows further another embodiment of the circuit connection material of this invention.

It is a schematic cross section which shows preferable one Embodiment of the connection structure of the circuit member which concerns on this invention.

<Brief description of symbols for the main parts of the drawings>

1: conductive particles

2: adhesive components

3: near infrared absorption pigment

5: resin component

40: conductive adhesive layer

50: insulating adhesive layer

10: first circuit member

11: first substrate

12: first circuit electrode

20: second circuit member

21: second substrate

22: second circuit electrode

30, 32: adhesive composition

100, 110, 120: circuit connection material

150: circuit connection

200: connection structure

Best Mode for Carrying Out the Invention

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described in detail, referring drawings. In addition, the description which attaches | subjects the same code | symbol to the same or equivalent part in the figure, and overlaps is abbreviate | omitted. In addition, a dimension ratio is not limited to the ratio of drawing.

1: is a schematic cross section which shows preferable one Embodiment of the circuit connection material of this invention. The film-form circuit connection material 100 which is one Embodiment of this invention contains the adhesive composition 30 containing the electrically-conductive particle 1, the adhesive component 2, and the near-infrared absorbing pigment | dye (3). As shown in FIG. 1, the electroconductive particle 1 and the near-infrared absorbing dye 3 are disperse | distributed uniformly in the adhesive composition 30 which has the adhesive component 2 as a main component.

It is a schematic cross section which shows other embodiment of the circuit connection material of this invention. The circuit connection material 110 on a film has a structure in which the conductive adhesive layer 40 and the insulating adhesive layer 50 are sequentially stacked. That is, the circuit connection material 110 includes the conductive adhesive layer 40 including the adhesive composition 30 including the conductive particles 1, the adhesive component 2, and the near infrared absorbing dye 3, and the conductive adhesive layer ( It has an insulating insulating adhesive layer 50 containing the adhesive composition 2 containing the adhesive component 2 and the near-infrared absorbing pigment 3 formed in contact with one side of 40).

It is a schematic cross section which shows still another embodiment of the circuit connection material of this invention. The circuit connection material 120 on a film has a laminated structure in which the insulating adhesive layer 50, the conductive adhesive layer 40, and the insulating adhesive layer 50 are laminated one by one. That is, the circuit connection material 120 includes the conductive adhesive layer 40 containing the adhesive composition 30 containing the electrically-conductive particle 1, the adhesive component 2, and the near-infrared absorbing pigment 3, and the said conductive adhesive layer The insulating adhesive layer 50 including the adhesive composition 32 including the adhesive component 2 and the near-infrared absorbing dye 3 formed on both surfaces of the conductive adhesive layer 40 so as to sandwich the 40. Equipped.

In addition, although all the layers which comprise the film-form circuit connection material contained the near-infrared absorbing dye 3 in FIG. 2 and FIG. 3, the circuit connection material may have a layer which does not contain the near-infrared absorbing dye 3.

In addition, although not shown in FIG. 1, FIG. 2, and FIG. 3, the film-form circuit connection materials 100, 110, and 120 are peelable base materials which can peel on at least one surface for the improvement of workability and the prevention of dust adhesion. You may have a (support film).

The circuit connection materials 100, 110, and 120 which concern on said each embodiment contain the near-infrared absorbing pigment which has a maximum absorption wavelength in the range of 800-1200 nm. This near infrared absorbing dye absorbs light from the near infrared light emitting source. The absorbed light energy dissipates and accelerates hardening of the circuit connection material, thereby obtaining a cured resin. Thereby, the hardened | cured material of the adhesive composition can be obtained, for example, without heating using a crimping tool etc. at the time of connection of circuit members. For this reason, the circuit connection material which concerns on this embodiment can connect circuit electrodes with a short time and a high resolution. By connecting a circuit member with such a circuit connection material, the connection structure of the circuit member by which thermal expansion and thermal contraction were fully suppressed can be obtained. In such a connection structure, the occurrence of warpage is sufficiently suppressed, and the circuit electrodes can be surely connected to each other. Moreover, connection reliability is also excellent enough.

In addition, the circuit connection material of this invention may not contain electroconductive particle. In this case, the electrically arranged circuit electrodes can be electrically contacted by directly contacting each other.

Hereinafter, the circuit connection material 110 in which the conductive adhesive layer 40 and the insulating adhesive layer 50 which are shown in FIG. 2 are laminated | stacked is demonstrated in detail.

The adhesive composition 30 constituting the conductive adhesive layer 40 contains the conductive particles 1, the adhesive component 2, and the near infrared absorbing dye 3. The conductive particles 1 and the near infrared absorbing dye 3 are uniformly dispersed in the adhesive component 2. The electrically conductive adhesive layer 40 can electrically connect the opposing circuit electrodes provided on the main surface of each circuit member through the electrically-conductive particle 1, when connecting a pair of circuit members arrange | positioned opposingly. That is, the electrically conductive adhesive layer 40 can electrically connect the circuit electrodes arrange | positioned opposingly, maintaining insulation between adjacent circuit electrodes on the same circuit member.

It is preferable that the adhesive composition 30 contains a thermosetting resin as an adhesive component (2). The thermosetting resin is a mixture of an epoxy resin with a latent curing agent such as an imidazole-based, hydrazide-based, boron trifluoride-amine complex, sulfonium salt, amineimide, polyamine, or dicyandiamide, or a radical reactive resin. And a mixture of organic peroxides and the like are preferable. It is preferable that content of a thermosetting resin is 20-70 mass% based on the whole adhesive component (2).

Examples of the epoxy resins include bisphenol-type epoxy resins derived from epichlorohydrin and bisphenols A, F and AD, epoxy novolac resins derived from epichlorohydrin and phenol novolac or cresol novolac, and skeletons containing naphthalene ring. Among these naphthalene epoxy resins and various epoxy compounds having two or more glycidyl groups in one molecule such as glycidylamine, glycidyl ether, biphenyl, alicyclic, etc., one kind alone or two kinds or more Can be used in combination.

From the standpoint of preventing electromigration, these epoxy resins preferably use a high-purity product having reduced impurity ions (Na ⁺ , Cl ^−, etc.), hydrolyzable chlorine, or the like to 300 ppm or less.

It is preferable that the adhesive composition 30 contains a film forming polymer as the adhesive component 2 from the viewpoint of making the film formability of the adhesive composition 30 better. Examples of the film-forming polymer include thermoplastic resins such as phenoxy resins, polyester resins, and polyamide resins. These film-forming polymers have an effect of relieving stress generated during curing of the thermosetting resin. Moreover, it is preferable that a film formation polymer has functional groups, such as a hydroxyl group, from a viewpoint of improving adhesiveness.

Moreover, it is preferable that adhesive composition 30 contains hardening | curing agents, such as a latent hardening | curing agent, as adhesive component (2). As a hardening | curing agent, the hardening | curing agent for epoxy resins can be used, for example. Examples of such curing agents include amines, phenols, acid anhydrides, imidazoles, hydrazides, dicyandiamides, boron trifluoride-amine complexes, sulfonium salts, iodonium salts, and amineimides. These can be used individually by 1 type or in combination of 2 or more types, and can also mix and use a decomposition accelerator, an inhibitor, etc. further.

Examples of near-infrared absorbing dyes having a maximum absorption wavelength of light in the range of 800 to 1200 nm include azo, aluminum, anthraquinone, cyanine, dimonium, squarylium, naphthalocyanine, and phthalocyanine compounds. Can be. Among these, 1 type can be used individually or in combination of 2 or more types. At this time, the maximum absorption wavelength of a near-infrared absorbing dye can be calculated | required by measuring the spectral transmittance using a commercially available spectrophotometer.

As a specific example of a near-infrared absorbing pigment, the "YKR" series by Yamamoto Kasei Kabushiki Kaisha, the "EX Color" series by Nippon Shokubai, the "IRG" series by Nippon Kayak Kabushiki Kaisha, And the "Epolite" series manufactured by Porin Co., Ltd. may be mentioned. Among them, the "YKR" series manufactured by Yamamoto Kasei Kabuki Co., Ltd., a phthalocyanine compound, and the "YKR" manufactured by Nippon Shokubai Co., Ltd. Excalar "series are particularly preferred.

It is preferable that content of a near-infrared absorbing dye is 0.1-10 mass% based on the whole resin solid content contained in the adhesive composition 30. When this content is less than 0.1 mass%, the light irradiated from a near-infrared light emitting source cannot fully be absorbed, and there exists a tendency for hardening not to fully advance. In addition, the progress of hardening can be judged by calculating | requiring hardening reaction rate. The curing reaction rate can be determined from the difference between the two by measuring the calorific value before curing and the calorific value after curing using DSC (differential scanning thermal analysis). It is preferable that hardening reaction rate is 80% or more from a viewpoint of connecting a circuit member with sufficient connection reliability.

On the other hand, when content of a near-infrared absorbing dye exceeds 10 mass%, the light of a near-infrared region is not irradiated uniformly to the whole circuit connection material, and there exists a tendency for a nonuniformity to generate | occur | produce in a hardened state. In this case, there exists a tendency for the part which hardening does not fully advance generate | occur | produce. In addition, the "resin solid content" in this specification means the component which does not melt | dissolve in toluene at normal temperature (20 degreeC).

The conductive particles 1 are dispersed in the conductive adhesive layer 40 for the purpose of actively providing anisotropic conductivity. Thus, by disperse | distributing the electroconductive particle 1, even if the height of bumps, a board | substrate electrode, etc. of a chip connected by the circuit connection material 110 changes, the circuit electrodes which oppose with high reliability can be electrically connected. .

As the electroconductive particle 1, the particle | grains which have electroconductivity containing metals, such as Au, Ag, Ni, Cu, solder, can be illustrated, for example. The conductive particles 1 are preferably particles having a spherical nucleus material containing a polymer such as polystyrene and a conductive layer containing metal such as Au, Ag, Ni, Cu, and solder on the surface of the nuclear material. Moreover, the electrically-conductive particle 1 may further have surface layers, such as Sn, Au, and a solder, on the surface of an electroconductive conductive layer.

The particle diameter of the electrically-conductive particle 1 needs to be smaller than the minimum space | interval (space | interval of the electrode which adjoins on the same circuit member) provided in the same circuit member. Moreover, when the particle diameter of the electroconductive particle 1 has a fluctuation | variation in the height of these circuit electrodes, it is preferable that it is larger than the height fluctuation. From this viewpoint, it is preferable that it is 1-10 micrometers, and, as for the average particle diameter of the electroconductive particle 1, it is more preferable that it is 2-5 micrometers. If the average particle diameter is less than 1 µm, it is difficult to sufficiently cope with the height variation of the circuit electrodes, and there is a tendency for sufficient conductivity between circuit electrodes to be impaired.

It is preferable that content of the electroconductive particle 1 in the conductive adhesive layer 40 is 0.1-30 volume% based on the total volume of the adhesive composition 30. As shown in FIG. If the content is less than 0.1% by volume, the number of conductive particles on the circuit electrode to be connected is reduced, so that the contact point is insufficient, and there is a tendency that sufficient conductivity between the circuit electrodes to be connected is impaired. On the other hand, when the content is more than 30% by volume, the surface area of the conductive particles is significantly increased, the conductive particles are easily connected by secondary aggregation, and there is a tendency that sufficient insulation between adjacent circuit electrodes on the same circuit member is impaired. .

The insulating adhesive layer 50 constituting the circuit connection material 110 is an insulating layer. The insulating adhesive layer 50 ensures sufficient insulation between adjacent circuit electrodes on the same substrate when the circuit members arranged opposite to each other (preferably, have insulation resistance values between adjacent electrodes of 1 × 10 ⁸ Ω or more). The composition is not specifically limited as long as it is possible, For example, it can be set as the composition similar to the composition remove | excluding the electroconductive particle 1 from the above-mentioned conductive adhesive layer 40. FIG.

In the conductive adhesive layer 40 and the insulating adhesive layer 50, an inorganic filler and rubber particles can be mixed and dispersed further. These can be mixed and dispersed together with the electrically-conductive particle 1 and the near-infrared absorbing dye 3. Moreover, although these can mix and disperse | distribute these to the insulating adhesive bond layer 50 which does not contain the electroconductive particle 1, it is preferable to mix and disperse | distribute to the electrically conductive adhesive bond layer 40 which has the electroconductive particle 1. By adding an inorganic filler or rubber particles to the adhesive composition 30, the melt viscosity of the conductive adhesive layer 40 when the opposing circuit members are connected to each other can be easily and sufficiently higher than the melt viscosity of the insulating adhesive layer 50. have. Thereby, when connecting the circuit members arrange | positioned opposingly, it can suppress that the electroconductive particle on the electrode provided on the main surface of a circuit member flows out. Therefore, high resolution and long term connection reliability can be achieved at a high level.

The inorganic filler is not particularly limited, and examples thereof include powders such as fused silica, crystalline silica, calcium silicate, alumina and calcium carbonate. It is preferable that the average particle diameter of an inorganic filler is 3 micrometers or less from a viewpoint of preventing the conduction defect in a connection part.

When using an inorganic filler, the compounding quantity is 5-100 mass as a reference | standard (100 mass parts) as the reference | standard (100 mass parts) in the whole adhesive composition 30 and 32 in both of the conductive adhesive layer 40 and the insulating adhesive layer 50, respectively. It is desirable to disclaim. Moreover, the melt viscosity of the conductive adhesive layer 40 and the insulating adhesive layer 50 can be made high by increasing the compounding quantity of an inorganic filler.

As rubber particles dispersed in the conductive adhesive layer 40 and the insulating adhesive layer 50, the glass transition temperature is preferably 25 ° C. or less. Specifically, butadiene rubber, acrylic rubber, styrene-butadiene-styrene rubber, nitrile-butadiene rubber, silicone rubber and the like can be preferably used. It is preferable to have an average particle diameter of 0.1-10 micrometers as a rubber particle, and it is more preferable that the particle | grains below an average particle diameter occupy 80% or more of particle size distribution. Moreover, as a rubber particle, it is more preferable to have an average particle diameter of 0.10-5 micrometers. In addition, from the viewpoint of improving the dispersibility in the adhesive composition, the surface of the rubber particles is preferably treated with a silane coupling agent.

Among the rubber particles, the silicone rubber particles are not only excellent in solvent resistance but also excellent in dispersibility, and thus can be preferably used. In addition, the silicone rubber particles are hydrolyzed and polycondensed by adding a silane compound, methyltrialkoxysilane and / or partial hydrolysis condensate thereof to an aqueous solution of alcohol adjusted to pH 9 or higher with a basic substance such as caustic soda or ammonia. It can obtain by the method, copolymerization of organosiloxane, etc. Moreover, a silicone particle can improve dispersibility in an adhesive composition by having functional groups, such as a hydroxyl group, an epoxy group, a ketimine, a carboxyl group, and a mercapto group, in a molecular terminal or an intramolecular side chain. For this reason, such silicon particles are preferably used.

When using rubber particle, it is preferable that the compounding quantity is 5-50 mass parts with respect to the whole adhesive component 2 as a reference | standard (100 mass parts) also in both the conductive adhesive layer 40 and the insulating adhesive layer 50.

In the circuit connection material 110, it is preferable that it is 3-15 micrometers, and, as for the thickness of the conductive adhesive layer 40, it is more preferable that it is 5-10 micrometers. When this thickness is less than 3 micrometers, when the electrically-conductive particle which is a preferable average particle diameter is applied, there exists a tendency for the formability of a conductive adhesive layer to fall. On the other hand, when this thickness exceeds 15 micrometers, the outflow of the electroconductive particle on a circuit electrode will increase, and it exists in the tendency to become difficult to fully ensure the insulation between adjacent circuit electrodes and the electroconductivity between circuit electrodes to be connected.

The thickness of the insulating adhesive layer 50 is preferably equal to or less than the sum of the thickness of the first circuit electrode formed on the main surface of the first substrate and the thickness of the second circuit electrode formed on the main surface of the second substrate. If the thickness of the insulating adhesive layer 50 is larger than the sum of the thickness of the first circuit electrode and the thickness of the second circuit electrode, the outflow of conductive particles on the circuit electrode is increased, and the insulation between adjacent circuit electrodes should be connected. It tends to be difficult to make the conductivity between circuit electrodes (between opposing circuit electrodes) compatible at a high level.

In the circuit connection material 110, it is preferable that the electrically conductive adhesive layer 40 has a higher melt viscosity at the time of connecting the circuit members arrange | positioned opposingly than the insulating adhesive layer 50. FIG. The melt viscosity at the time of connecting here is melt viscosity in the heating temperature at the time of connecting the circuit members arrange | positioned opposingly using the circuit connection material 110. FIG. Moreover, although the temperature of the circuit connection material 110 at the time of connecting mutually arrange | positioned circuit members is adjusted suitably according to the hardenability of an adhesive agent, etc. in the circuit connection material 110, it is the range of 120 degreeC-250 degreeC, for example. Therefore, it is preferable that the melt viscosity of the conductive adhesive layer 40 is higher than the melt viscosity of the insulating adhesive layer 50 in the temperature range.

Next, an example of the manufacturing method of the circuit connection material 110 is demonstrated.

First, the coating liquid for forming the conductive adhesive layer 40 is manufactured. Specifically, the adhesive component (2), the conductive particles (1), and the near infrared absorbing dye (3) are dissolved or dispersed in an organic solvent, and liquefied to prepare a coating liquid. The solvent used at this time is preferably a mixed solvent of an aromatic hydrocarbon system and an oxygen-containing system from the viewpoint of improving the solubility of the material. The adhesive component (2) may contain a curing agent such as a latent curing agent, a film-forming polymer, or the like in addition to the thermosetting resin.

Subsequently, this coating liquid is applied onto a normal peelable base material (support film), and heated to below the active temperature of the curing agent to remove the solvent, thereby forming a conductive adhesive layer 40 containing the adhesive composition 30 on the support film. ) Can be formed. Moreover, as a peelable base material, the PET film etc. surface-treated so that it may have releasability is used preferably.

The insulating adhesive layer 50 can be formed in the same manner as the method for forming the conductive adhesive layer 40 except that the conductive particles 1 are not blended.

The conductive adhesive layer 40 containing the conductive particles by a known method such as a method of laminating the conductive adhesive layer 40 and the insulating adhesive layer 50 formed as described above, or a method of sequentially coating each layer; The circuit connection material 110 in which the insulating adhesive layer 50 containing no conductive particles is laminated can be manufactured.

The connection structure of the circuit member formed using the circuit connection material 110 which concerns on the said embodiment is demonstrated.

4: is a schematic cross section which shows preferable one Embodiment of the bonded structure of the circuit member which concerns on this invention. The connection structure 200 includes a first circuit member 10 having a first substrate 11 and a first circuit electrode 12, and a second circuit having a second substrate 21 and a second circuit electrode 22. The member 20 is connected by the circuit connection part 150. The first circuit electrode 12 is formed on one surface (main surface) of the first substrate 11, and the second circuit electrode 22 is formed on one surface (main surface) of the second substrate 21. have. The first circuit member 10 and the second circuit member 20 are connected so that the first circuit electrode 12 and the second circuit electrode 22 face each other. The circuit connection part 150 contains the resin cured material of the resin compositions 30 and 32, and this resin cured product contains the resin component 5, the electrically-conductive particle 1, and the near-infrared absorbing dye 3 .

That is, in the circuit connection part 150 of the connection structure 200, the some resin cured material from which content of the electroconductive particle 1 differs in the direction which the 1st circuit member 10 and the 2nd circuit member 20 oppose. The layers are stacked.

In the bonded structure 200, the opposing first circuit electrodes 12 and the second circuit electrodes 22 are electrically connected through the conductive particles 1. In addition, when a circuit connection part does not contain electroconductive particle, the opposingly arranged circuit member is electrically connected by directly contacting opposing circuit electrodes.

The 1st circuit member 10 and the 2nd circuit member 20 have the surface (main surface) in which the circuit electrodes 12 and 22 were formed, respectively. Although there is no restriction | limiting in particular in a material, It is preferable that at least one of the 1st circuit member 10 and the 2nd circuit member 20 is 50% or more in the spectral transmittance of the light of wavelength 800-1200 nm.

As a specific example of the 1st circuit member 10 and the 2nd circuit member 20, the glass substrate in which an electrode is formed by ITO etc. used for a liquid crystal display, a plastic substrate, a printed wiring board, a ceramic wiring board, a flexible wiring board, a semiconductor silicon Chips etc. are mentioned. Among them, glass substrates and plastic substrates are preferred from the viewpoint of having high spectral transmittance with respect to light having a wavelength of 800 to 1200 nm. These board | substrates can also be used in combination as needed. In addition, the first circuit member 10 and the second circuit member 20 may include metals such as copper and aluminum, ITO (indium tin oxide), silicon nitride (SiNx), and silicon dioxide (SiO _2). Inorganic material layers, such as), may be provided.

An example of the manufacturing method of the bonded structure 200 is demonstrated below.

First, the circuit connection material 110 is interposed between the first circuit member 10 and the second circuit member 20 so that the first circuit electrode 12 and the second circuit electrode 22 are opposed to each other. Specifically, the circuit connection material 110 formed on the peelable base material is bonded to the surface in which the 2nd circuit electrode 22 of the 2nd circuit member 20 is formed, for example. It heats and pressurizes in this state, and the circuit connection material 110 is press-bonded on the 2nd circuit member 20. FIG. Thereafter, the peelable base material is peeled from the circuit connection material 110, and the circuit connection material 110 is positioned while the first circuit member 10 is aligned with the first circuit electrode 12 and the second circuit electrode 22. ), And the laminated body in which the 2nd circuit member 20, the circuit connection material 110, and the 1st circuit member 10 were laminated | stacked in this order is manufactured.

Subsequently, light in the near infrared region is irradiated on the lower side of the second circuit member 20, that is, on the side opposite to the circuit connection material 110 side of the second circuit member 20, and the first circuit member 10 is turned on the second side. Pressing toward the circuit member 20. Thereby, the circuit connection material 110 is hardened | cured, the 1st circuit member 10 and the 2nd circuit member 20 are connected, and the 1st circuit electrode 12 and the 2nd circuit electrode 22 are electrically connected. It can be connected and the connection structure 200 can be obtained. Moreover, it is preferable that the spectral transmittance of the light in the range of the wavelength 800-1200 nm of the 2nd circuit member 20 is 50% or more. Therefore, it is preferable that the 2nd board | substrate 21 is a glass substrate or a plastic substrate.

The conditions under which the laminate is irradiated with light in the near infrared region and pressurized can be appropriately adjusted so that the circuit connection material 110 is cured to obtain sufficient adhesive strength. In addition, the viewpoint of pressurization and light irradiation of a near-infrared region is not necessarily limited, When the light of a near-infrared region is irradiated, the 1st circuit member 10 and the 2nd circuit member may be in close contact with the circuit connection material 110. FIG. Can be. In addition, when irradiating light of a near-infrared region, it is preferable to use a crimping tool together and heat a laminated body, for example to 120-250 degreeC. Thereby, the circuit members mutually arrange | positioned in a short time can be connected reliably further.

In addition, although the case where the circuit connection material 110 was used was demonstrated in description of the connection structure 200 and its manufacturing method, you may use the circuit connection material 100 or 120 instead of the circuit connection material 110. FIG. have.

As mentioned above, although preferred embodiment of this invention was described, this invention is not limited to the said embodiment. For example, the circuit connection material of the present invention may be in the form of a film as shown in Figs. 1 to 3 or may be in the form of a paste. In addition, the circuit connection material which concerns on this embodiment can be used suitably for the connection of circuit boards, the connection of electronic components, such as an IC chip, and a wiring board.

Hereinafter, although this invention is demonstrated further more concretely based on an Example and a comparative example, this invention is not limited to a following example.

(Example 1)

Acrylic particle containing resin (20 mass%, average particle diameter 0.2 micrometer) is disperse | distributed in 32 mass parts of phenoxy resins (The Union Carbide company make, brand name PKHC) and bisphenol-A epoxy resin (Nippon Shokubai, Japan) Manufacture, Brand name: BPA328) 10 parts by mass, bisphenol A type epoxy resin (Yuka Shell Epoxy Co., Ltd. make, brand name: YL980) 20 parts by mass, imidazole series curing agent (Asahi Kasei Co., Ltd. make, product name: Novacure HX- 3941) 34 mass parts, 1-part by weight of a near-infrared absorption pigment | dye (The Nippon Shokubai company make, brand name: EX Color HA-1) which is a phthalocyanine-type compound, and a silane coupling agent (The Nippon Unika Kabuki Shokai Co. make, brand name: A187) 3 mass parts was melt | dissolved in toluene which is a solvent, and the coating liquid A for insulating adhesive layer formation of 50 mass% of resin solid content was obtained. The mixing ratio of each raw material is shown in Table 1 below.

Subsequently, this coating liquid A for insulating adhesive layer formation was apply | coated to 50-micrometer-thick PET film by which the mold release process was performed to one side (surface to apply | coat a coating liquid) using a coating apparatus, and hot air drying at 70 degreeC for 10 minutes. By this, an insulating adhesive layer (a) having a thickness of 13 µm was formed on the PET film.

Subsequently, acrylic particle containing resin (20 mass%, average particle diameter 0.2 micrometer) is disperse | distributed in 32 mass parts of phenoxy resins (made by Union Carbide, brand name: PKHC), and a bisphenol-A epoxy resin (BKK) Nippon Shokubai Co., Ltd., brand name: BPA328) 20 parts by mass, imidazole-based curing agent (Asahi Kasei Chemical Co., Ltd. make, brand name: Novacure HX-3941) 34 parts by mass, a near-infrared absorbing dye (Kabushiki Kaisha Nippon Sho) 1 part by mass of KUBAi, HA-1), 3 parts by mass of a silane coupling agent (manufactured by Nippon Unicar Chemical Industries, Ltd., brand name: A187) and 30 parts by mass of a silicone rubber (manufactured by Toray Dow Corning, Ltd., trade name: EP2100) It melt | dissolved in toluene and adjusted the adhesive liquid B of 50 mass% of solid content. The mixing ratio of each raw material is shown in Table 1.

Electroconductive particle (The Sekisui Chemical Co., Ltd. make, brand name: micropearl AU, average particle diameter: 3.2 micrometers) in which Ni and Au layer were formed in the surface of the polystyrene-type nucleus body (diameter: 3 micrometers) in 100 mass parts of this adhesive liquid B. And outermost layer: Au) 20 mass parts was disperse | distributed and the coating liquid for conductive adhesive layer formation was obtained.

The coating liquid for forming the conductive adhesive layer is applied to a PET film having a thickness of 50 µm on which one side (the surface on which the coating liquid is to be applied) is applied using a coating apparatus and dried by hot air at 70 ° C for 10 minutes, A conductive adhesive layer (b) having a thickness of 10 μm was formed on the PET film.

The insulating adhesive layer (a) and the conductive adhesive layer (b) respectively formed on the PET film were laminated with a roll laminator while heating at 40 ° C. such that the insulating adhesive layer (a) and the conductive adhesive layer (b) contacted each other. The circuit connection material of the two-layered structure whose thickness of (a) is 13 micrometers, and whose thickness of a conductive adhesive layer (b) is 10 micrometers was obtained. This circuit connection material has a structure in which an adhesive layer containing conductive particles and an adhesive layer containing no conductive particles are laminated.

On the one side of the glass substrate and the chip (1.2 × 19 mm, thickness: 500 μm) equipped with gold bumps (area: 30 × 50 μm, bump height: 15 μm, bump number: 300) using the circuit connection material The connection with the glass substrate (ITO circuit thickness: 0.15 micrometer, glass substrate thickness: 0.5 mm) with the ITO circuit in which the ITO circuit was formed was performed as follows.

The circuit connecting material of the two-layer structure cut out to the predetermined size (1.5 × 20 mm) was bonded to the glass substrate with ITO circuit by heating and pressing for 1 second under conditions of 0.98 MPa (10 kgf / cm 2) at 80 ° C. Got. At this time, the PET film on the conductive adhesive layer (b) is peeled off, and then the conductive adhesive layer (b) of the circuit connection material of the two-layer structure is bonded to the ITO circuit so that the circuit connection material is attached to the glass substrate with the ITO circuit. Adhered to.

Subsequently, the PET film on the insulating adhesive layer (a) side of a circuit connection material is peeled off, and after alignment of the bump of the chip | tip with a gold bump and the glass substrate with an ITO circuit, the ITO circuit of the said laminated body is carried out. The laminate and the gold bumps were adhered by pressing the surface having the bumps of the chip with the crimping tool toward the insulating adhesive layer (a) of the circuit connection material while irradiating the light in the near infrared region from the glass substrate side with This connection with the chip was made. This obtained the bonded structure with which the chip | tip and the glass substrate with an ITO circuit were connected through the circuit connection material. The conditions of this connection were made into heating temperature: 230 degreeC, pressurization pressure: 40g / bump, and heating pressurization time: 3 second. Near-infrared irradiation was performed using near-infrared light with a light quantity of 2.5 W / mm 2 using a semiconductor laser having a wavelength of 904 nm as a light source. In addition, the said heating temperature (230 degreeC) is the temperature of the circuit connection material at the time of heat pressurization, and is the temperature reached by near-infrared irradiation.

[Measurement of Curing Reaction Rate]

The hardening reaction rate of the circuit connection material at the time of the said connection was calculated | required as follows. First, each calorific value before and after the main connection was measured using DSC (differential scanning thermal analysis), and it calculated by the following formula (1) using this measurement result. The calculation results are shown in Table 3 below. In addition, the heat generation amount after this connection was measured by taking the sample from the circuit connection part of the connected structure.

Curing Reaction Rate (%) = (Q _O -Q _T ) / Q _O × 100

In the above formula, Q _O represents the calorific value before the main connection and Q _T represents the calorific value after the main connection.

Subsequently, the obtained bonded structure was preserve | saved for 1000 hours in 85 degreeC and 85% RH environment. After storage, the connection resistance and the amount of warpage were measured as follows. The results are shown in Table 3.

[Measurement of connection resistance value]

The connection resistance value per bump of the bonded structure after storing in the said environment using the digital multimeter was measured by the 4-probe method, and the conduction was evaluated whether it was good. "A" was evaluated as the case where the connection resistance value of all the bumps was 20 ohm or less, and "B" when the connection resistance value included the bump which exceeds 20 ohms.

[Measurement of warpage amount]

With the circuit connection part side of the glass substrate back surface (glass substrate with an ITO circuit) in the bonded structure after storing in the said environment using a surface shape measuring device (made by Kosaka Co., Ltd. make, brand name: surface roughness measuring instrument / SE3500) Measured the maximum amount of warpage of the opposite side). The results are shown in Table 3.

(Example 2)

Two layers were carried out similarly to Example 1 except having set the compounding quantity of the near-infrared absorbing dye (The Nippon Shokubai company make, brand name: EX Color HA-1) in coating liquid A and adhesive liquid B to 0.1 mass part, respectively. The circuit connection material of the structure was manufactured, and the bonded structure was produced. And it evaluated similarly to Example 1. The mixing | blending ratio of each raw material is shown in Table 1, and the evaluation result is shown in Table 3.

(Example 3)

The near-infrared absorption pigment (Novon Nippon Shokubai Co., Ltd. make, brand name: EX Color HA-1) in coating liquid A is set to 9.6 parts by mass, and the near-infrared absorption pigment (Nippon Shaw Co., Ltd.) in adhesive liquid B is used. A circuit connection material having a two-layer structure was produced in the same manner as in Example 1 except that the compounding amount of Qubai manufactured under the trade name EX Color HA-1) was 8.6 parts by mass, to prepare a bonded structure. And it evaluated similarly to Example 1. The mixing | blending ratio of each raw material is shown in Table 1, and the evaluation result is shown in Table 3.

(Comparative Example 1)

A two-layer structure in the same manner as in Example 1 except that the compounding amount of the near-infrared absorbing dye (Nipbon Shokubai, trade name: EX Color HA-1) manufactured by Coating Liquid A and Adhesive Liquid B was 0.03 parts by mass. Circuit connection material was manufactured and the bonded structure was produced. And it evaluated similarly to Example 1. Table 2 shows the blending ratios of the respective raw materials and Table 3 shows the evaluation results.

(Comparative Example 2)

A two-layer structure in the same manner as in Example 1 except that the compounding quantity of the near-infrared absorbing dye (Nishbon Shokubai, trade name: EX Color HA-1) manufactured by Coating Liquid A and Adhesive Liquid B was 15 parts by mass. The circuit connection material of was obtained. Subsequently, this connection was performed on the same conditions using the same circuit member as Example 1. FIG. And it evaluated similarly to Example 1. Table 2 shows the blending ratios of the respective raw materials and Table 3 shows the evaluation results.

(Comparative Example 3)

In the same manner as in Example 1, a circuit connection material having a two-layer structure was manufactured to obtain a laminate. The main connection between the laminate and the chip with gold bumps was carried out by heating and pressing using a crimping tool without irradiating light in the near infrared region during the main connection between the laminate and the chip with gold bumps. This connection was carried out in the same manner as in Example 1 except for the above. This obtained the bonded structure with which the chip | tip and the glass substrate with an ITO circuit were connected through the circuit connection material. The conditions of this connection were made into heating temperature: 230 degreeC, pressurization pressure: 40g / bump, and heating pressurization time: 3 second. And it evaluated similarly to Example 1. Table 2 shows the blending ratios of the respective raw materials and Table 3 shows the evaluation results.

(Comparative Example 4)

Coating liquid A and adhesive liquid were carried out similarly to Example 1 except not having mix | blended the near-infrared absorbing dye and setting the compounding quantity of the imidazole series hardening | curing agent (Asahi Kasei Kogyo make, brand name: Novacure HX-3941) to 35 mass parts. B was prepared. And it carried out similarly to Example 1, produced the circuit connection material of a two-layer structure, manufactured the connection structure, and evaluated. Table 2 shows the blending ratios of the respective raw materials and Table 3 shows the evaluation results.

As is clear from the results shown in Table 3, the near-infrared light is absorbed by using a circuit connecting material containing 0.1 to 10 mass% of the near-infrared absorbing dye having the maximum absorption wavelength within the wavelength range of light from 800 to 1200 nm with respect to the entire resin solid content. As for the bonded structure hardened | cured by irradiation, the connection resistance value after hardening test and the hardening reaction rate were also favorable. Moreover, it was confirmed that the curvature amount of a bonded structure is also small.

On the other hand, when the circuit connection material (comparative example 4) which does not contain a near-infrared absorbing dye was used, it was confirmed that the connection resistance value after a moisture resistance test, and hardening reaction rate fall. Moreover, also in the circuit connection material (comparative example 1) whose content of a near-infrared absorbing dye is less than 0.1 mass%, it was confirmed that the connection resistance value after a moisture resistance test, and hardening reaction rate are inferior. Moreover, in the circuit connection material (comparative example 2) with content of a near-infrared absorbing pigment more than 10 mass%, it was confirmed that the connection resistance value after a moisture proof test falls.

In addition, only heating of the crimping tool using a circuit connecting material containing a thermosetting resin, conductive particles, and 0.1 to 10% by mass of a near infrared absorbing dye having a maximum absorption wavelength within a wavelength range of 800 to 1200 nm of light. As for the bonded structure (comparative example 3) which hardened the adhesive composition, the connection resistance value after a moisture resistance test fell and it was confirmed that the amount of curvature of a bonded body is also large. Thus, since the heating is performed from the circuit member side (chip with gold bumps) using the crimping tool, the amount of warpage of the connecting body is increased.

As mentioned above, it was confirmed that by using the circuit connection material of this invention, circuit members can reliably connect in a short time, the connection reliability of the obtained bonded structure is excellent, and the curvature of a bonded structure can be fully reduced.

According to the present invention, it is possible to connect the electrodes arranged opposite to each other for a short time and with high resolution, and to provide a circuit connection material that is sufficiently excellent in connection reliability. Moreover, by connecting using such a circuit connection material, the highly reliable connection structure and the manufacturing method of the connection structure provided with such a characteristic can be provided. That is, according to the circuit connection material of this invention, the circuit member or an electronic component, such as an IC chip, and a circuit member can be connected in a short time, and the connection structure by which generation | occurrence | production of thermal expansion and thermal contraction was fully suppressed can be obtained. Thereby, generation | occurrence | production of the curvature of a bonded structure can fully be reduced, and the bonded structure excellent in connection reliability can be provided sufficiently.

Claims (7)

A first circuit member having a first circuit electrode formed on a main surface of a first substrate and a second circuit member having a second circuit electrode formed on a main surface of a second substrate. A circuit connecting material comprising an adhesive composition having a maximum absorption wavelength of light in a range of 800 to 1200 nm for connecting in an opposed state. The circuit connecting material according to claim 1, wherein the adhesive composition comprises a near infrared absorbing dye having a maximum absorption wavelength of light in a range of 800 to 1200 nm. The circuit connection material of Claim 2 whose content of the said near-infrared absorbing dye with respect to the whole resin solid content of the said adhesive composition is 0.1-10 mass%. The circuit connection material of Claim 1 in which the said adhesive composition contains electroconductive particle. The circuit connection material of Claim 1 in which the said adhesive composition contains a film formation polymer. A first circuit member having a first circuit electrode formed on a main surface of the first substrate, A second circuit member formed on a main surface of a second substrate, the second circuit member disposed so that the second circuit electrode and the first circuit electrode face each other, and A circuit connecting portion provided between the first substrate and the second substrate to connect the first circuit member and the second circuit member. The bonded structure which comprises a resin hardened | cured material which hardened the said adhesive composition by providing the said circuit connection part to the circuit connection material of Claim 1, and irradiating light of a near-infrared region. The first circuit member and the second circuit electrode may include the first circuit member having the first circuit electrode formed on the main surface of the first substrate and the second circuit member having the second circuit electrode formed on the main surface of the second circuit. Arranging to face each other, and The light of a near-infrared region is irradiated in the state which contact | connected the said 1st circuit member, the said 2nd circuit member, and the said circuit connection material through the circuit connection material in any one of Claims 1-5. The step of connecting the first circuit member and the second circuit member by curing the adhesive composition of the circuit connection material. The manufacturing method of the bonded structure provided with.

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