JP2005320491A - Adhesive composition, film-like adhesive and circuit connecting material using the same, connecting structure of circuit member and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an adhesive composition having a satisfactory low temperature rapid curability and restrained in the curing reaction immediately after the irradiation of active rays; to provide a film-like adhesive and a circuit connecting material using it; to provide a connecting structure of a circuit member using the circuit connecting material; and to provide its manufacturing method. <P>SOLUTION: The adhesive composition contains an oxetane compound, a curing agent and a compound having a chain transfer group. <P>COPYRIGHT: (C)2006,JPO&amp;NCIPI

Description

  The present invention relates to an adhesive composition, a film adhesive and a circuit connecting material using the same, a circuit member connection structure, and a method for manufacturing the same.

  In recent years, in the fields of semiconductors and liquid crystal displays, various adhesive materials are used for fixing electronic components and making circuit connections.

  For example, an adhesive is used to connect a liquid crystal display and a TCP (Tape Carrier Package), an FPC (Flexible Printed Circuit) and a TCP, or an FPC and a printed wiring board in order to more reliably connect the circuits. An anisotropic conductive adhesive having conductive particles dispersed therein is used. In addition, when mounting a semiconductor silicon chip on a substrate, so-called flip chip mounting is performed in which the semiconductor silicon chip is directly mounted on the substrate face down instead of the conventional wire bond. Application has begun.

  In the field of such precision electronic equipment, the density of circuits is increasing, and the electrode width and electrode interval are extremely narrow. For this reason, in the connection conditions of the conventional adhesive for circuit connection using an epoxy resin, there are problems such as dropping, peeling, and positional deviation of the wiring. In addition, shortening of the connection time (specifically, connection within 10 seconds or less) has been strongly demanded in order to improve production efficiency, and low temperature rapid curability is indispensable.

  From such a background, Patent Documents 1 to 3 disclose an adhesive composition containing an epoxy resin, an organometallic complex, and a compound having a ligand having a nitrogen atom.

JP-A-4-227625 JP-T 8-511570 JP-T 8-511572

  However, in the above conventional adhesive composition, the curing reaction starts immediately after the irradiation with the actinic ray, so that the adherend can be adhered when a relatively long time has passed after the irradiation with the actinic ray. There wasn't. Furthermore, when trying to improve the low temperature fast curability of the adhesive composition, the curing reaction immediately after irradiation with actinic rays is more likely to proceed, so that it has sufficient low temperature fast curability, and It was very difficult to obtain an adhesive composition in which the curing reaction immediately after irradiation with actinic rays was suppressed.

  The present invention has been made in view of the above-described problems of the prior art, and has an adhesive composition that has sufficient low-temperature rapid curability and suppresses the curing reaction immediately after irradiation with actinic rays, and uses the same. It is an object of the present invention to provide a film-like adhesive and a circuit connection material, a circuit member connection structure using the circuit connection material, and a manufacturing method thereof.

  In order to solve the above problem, the adhesive composition of the present invention is characterized by containing an oxetane compound, a curing agent, and a compound having a chain transfer group. When the oxetane compound has a chain transfer group, the adhesive composition of the present invention may contain an oxetane compound having a chain transfer group and a curing agent.

  Here, the chain transfer group refers to a substituent that generates a cation by a chain transfer reaction during cationic polymerization in a curing reaction, and specifically includes a hydroxyl group.

  The adhesive composition of the present invention is a combination of the above-mentioned specific constituent materials, so that it has sufficient low-temperature rapid curability and the curing reaction immediately after irradiation with actinic rays is sufficiently suppressed. . Therefore, the adhesive composition of the present invention is excellent in workability because it can adhere an adherend even when a relatively long time has elapsed after irradiation with actinic rays and is cured in a short time by heating. .

  In addition, the adhesive composition of the present invention has the above-described properties, has sufficient adhesive strength, and is excellent in long-term reliability after curing.

［式（１）中、Ｒ^１は水素原子又は１価の置換基を、Ｒ^２は水素原子又はｎ価の置換基を、ｎは１〜４の整数を示す。］ In the adhesive composition of the present invention, the oxetane compound is preferably a compound represented by the following general formula (1).

[In Formula (1), R ¹ represents a hydrogen atom or a monovalent substituent, R ² represents a hydrogen atom or an n-valent substituent, and n represents an integer of 1 to 4. ]

  In the adhesive composition of the present invention, the compound having a chain transfer group is preferably a compound having a hydroxyl group, more preferably an alcohol, and further preferably a polyhydric alcohol.

［式（２）中、Ｒ^３及びＲ^４はそれぞれ独立に水素原子又は１価の置換基を示す。］

［式（３）中、Ｒ^５及びＲ^７はそれぞれ独立に水素原子又は１価の置換基を、Ｒ^６は２価の置換基を示す。］

［式（４）中、Ｒ^８、Ｒ^９、Ｒ^１０及びＲ^１１はそれぞれ独立に水素原子又は１価の置換基を、ｍはそれぞれ独立に０〜２０の整数を示す。］ In the adhesive composition of the present invention, the oxetane compound having a chain transfer group is preferably at least one of the compounds represented by the following general formulas (2), (3) and (4). .

[In Formula (2), R ³ and R ⁴ each independently represent a hydrogen atom or a monovalent substituent. ]

[In Formula (3), R ⁵ and R ⁷ each independently represent a hydrogen atom or a monovalent substituent, and R ⁶ represents a divalent substituent. ]

[In Formula (4), R ⁸ , R ⁹ , R ¹⁰ and R ¹¹ each independently represent a hydrogen atom or a monovalent substituent, and m independently represents an integer of 0 to 20. ]

  In the adhesive composition of the present invention, the curing agent is preferably a photolatent cationic polymerization initiator. When a photolatent cationic polymerization initiator is used as the curing agent, the storage stability of the adhesive composition is improved and the curability at low temperature is improved.

  In addition, the adhesive composition of the present invention preferably further contains a binder resin from the viewpoint of facilitating thickening and film formation.

  The adhesive composition of the present invention is suitably cured by being heated (preferably at 40 to 140 ° C. for 0.5 to 50 seconds) after being irradiated with actinic rays.

  The film adhesive of this invention forms the adhesive composition of the said invention in a film form. According to this film adhesive, it is easy to handle, can be easily installed on the adherend, and can be easily connected.

  The circuit connection material of the present invention includes a first circuit member in which a first circuit electrode is formed on the main surface of the first circuit board, and a second circuit electrode on the main surface of the second circuit board. A circuit connection material for connecting the formed second circuit member in a state where the first circuit electrode and the second circuit electrode are arranged opposite to each other, wherein the adhesive composition of the present invention is It is characterized by containing. Since this circuit connecting material contains the adhesive composition of the present invention, it is suitable for bonding circuit members.

The circuit member connection structure of the present invention includes a first circuit member in which a first circuit electrode is formed on the main surface of the first circuit board, and a second circuit on the main surface of the second circuit board. Provided between the second circuit member on which the electrode is formed and the main surface of the first circuit board and the main surface of the second circuit board, the first circuit electrode and the second circuit electrode are opposed to each other A circuit connection member that connects the first and second circuit members in a state of being arranged, and a circuit member connection structure comprising:
A circuit connection member consists of hardened | cured material of the circuit connection material of this invention, and the 1st circuit electrode and the 2nd circuit electrode are electrically connected, It is characterized by the above-mentioned. In this circuit member connection structure, since the circuit connection member is made of a cured product of the circuit connection material of the present invention, the connection resistance is sufficiently reduced, and the reliability of the adhesive strength is excellent.

The method for manufacturing a circuit member connection structure according to the present invention includes a first circuit member in which a first circuit electrode is formed on a main surface of a first circuit board, and a first circuit member on a main surface of a second circuit board. A first circuit electrode and a second circuit electrode provided between the second circuit member on which the second circuit electrode is formed and the main surface of the first circuit board and the main surface of the second circuit board; And a circuit connection member that connects the first and second circuit members in a state of facing each other, and a manufacturing method of a circuit member connection structure comprising:
The circuit connection material of the present invention is disposed between the main surface of the first circuit board and the main surface of the second circuit board, and the circuit connection material is heated and pressurized via the first and second circuit members. Then, a circuit member connection structure is manufactured by connecting the first circuit member and the second circuit member by curing. According to this method for manufacturing a circuit member connection structure, by using the circuit connection material of the present invention, low-temperature rapid curing is possible, and thus throughput can be improved.

  ADVANTAGE OF THE INVENTION According to this invention, it can provide the adhesive composition which has sufficient low-temperature quick curing property, and the hardening reaction immediately after irradiation of actinic light was fully suppressed.

  Moreover, the circuit connection material using the adhesive composition of the present invention is suitable for bonding circuit members (for example, semiconductor elements and liquid crystal display elements), and the circuit members produced using such circuit connection materials This connection structure has a sufficiently reduced connection resistance and is excellent in reliability of adhesive strength. In addition, according to the method for manufacturing a circuit member connection structure using such a circuit connection material, low temperature rapid curing is possible, so that throughput can be improved.

  Preferred embodiments of the present invention will be described below with reference to the accompanying drawings as the case may be. In addition, the same code | symbol shall be used for the same element and the overlapping description is abbreviate | omitted.

(Adhesive composition)
The adhesive composition of the present invention contains an oxetane compound, a curing agent, and a compound having a chain transfer group. In addition, when the said oxetane compound has a chain transfer group, the adhesive composition of this invention should just contain the oxetane compound which has a chain transfer group, and a hardening | curing agent.

  First, the oxetane compound will be described. The main component in the adhesive composition of the present invention is an oxetane compound. Such an oxetane compound is a compound having an oxetanyl group in the molecule, as long as it is cured by ring-opening polymerization by irradiation with active light or heating in the presence of a curing agent.

The oxetane compound is preferably a compound represented by the following general formula (1).

Here, in Formula (1), R ¹ represents a hydrogen atom or a monovalent substituent, R ² represents a hydrogen atom or an n-valent substituent, and n represents an integer of 1 to 4. The monovalent substituent is more preferably a halogen atom (more preferably a fluorine atom) or a monovalent hydrocarbon group. The monovalent hydrocarbon group is preferably an alkyl group (preferably having 1 to 10 carbon atoms) and an aryl group (preferably having 6 to 20 carbon atoms). Examples of the n-valent substituent include 1 to 4 valent substituents, and examples of the monovalent substituent include those described above. Examples of the divalent substituent include an alkylene group (preferable carbon number is 1-10) and arylene groups (preferably having 6 to 20 carbon atoms), and trivalent or tetravalent substituents are hydrocarbon (preferably having 1 to 10 carbon atoms) to 3 or 4 hydrogen atoms. Missing (group) is mentioned.

  Next, the oxetane compound having a chain transfer group will be described. The oxetane compound having a chain transfer group is a compound containing a chain transfer group in the skeleton of the oxetane compound. Such a compound is preferable because a crosslinking density when a compound having two or more oxetanyl groups and one or more hydroxyl groups is cured is increased. Furthermore, an aliphatic or alicyclic compound having 2 to 6 oxetanyl groups and 1 to 6 hydroxyl groups in the molecule is particularly preferable because of excellent curability.

More specifically, the oxetane compound having a chain transfer group is preferably at least one of the compounds represented by the following general formulas (2), (3) and (4).

Here, R ^{3 to} R ⁵ and R ^{7 to} R ¹¹ are each independently a hydrogen atom or a monovalent substituent, R ⁶ is a divalent substituent, and m is each independently an integer of 0 to 20. Show. The monovalent substituent is preferably an alkyl group (preferably having 1 to 12 carbon atoms).

R ⁶ is preferably — (CH ₂ ) _x — (wherein x represents an integer of 1 to 20), —O — {(CH ₂ ) ₂ —O} _y — (provided that y represents an integer of 2 to 20.), or a divalent substituent represented by the following general formula (5).

Here, the alkyl group of said ^{R 12} and ^{R 13} 1 to 12 hydrogen or carbon atoms are each independently.

  The curing agent may be a curing agent that causes ring-opening polymerization of the oxetane compound. Examples of such curing agents include cationic polymerization initiators and photolatent cationic polymerization initiators. These can be used alone or in combination of two or more.

  When a cationic polymerization initiator is used as the curing agent, the adhesive composition is cured in a short time, and a cured product having a higher crosslinking density is obtained. Such cationic polymerization initiators include proton acids such as sulfuric acid, phosphoric acid, perchloric acid, trifluoromethanesulfonic acid, or Lewis acids such as boron trifluoride, aluminum chloride, titanium tetrachloride, tin tetrachloride. Are preferably used. These can be used alone or in combination of two or more.

  Among cationic polymerization initiators, so-called "photolatent cationic polymerization initiators" that form cationic polymerization initiators by irradiation or heating with actinic rays are as long as they are blended with oxetane compounds having an oxetanyl group and stored at room temperature. A cationic polymerization initiator that is stable over a long period of time is immediately formed by the action of actinic rays, and is then preferably used because it initiates and accelerates the curing reaction when heated.

  Examples of such photolatent cationic polymerization initiators include sulfonium salts represented by the following general formulas (6) to (8), iodonium salts represented by the following general formula (9), quaternary ammonium salts, phosphonium salts, And diazonium salts. Among these, at least one selected from the group consisting of sulfonium salts represented by the following general formulas (6) to (8) and iodonium salts represented by the following general formula (9) is preferable. In addition, these photolatent cationic polymerization initiators can be used individually by 1 type or in combination of 2 or more types.

In the above formulas (6) to (9), R ^{14 to} R ²² are each independently an alkyl group (preferably having 1 to 20 carbon atoms), an alkenyl group (preferably having 3 to 12 carbon atoms), aryl Group (preferably 6-20 carbon atoms), alkaryl group (preferably 7-20 carbon atoms), alkylaryl group (preferably 7-20 carbon atoms), alkanol group (preferably 1-20 carbon atoms) or cyclo An alkyl group (preferably having 5 to 10 carbon atoms) is shown, and these may have a substituent.

X ⁻ represents BF ₄ ⁻ , PF ₆ ⁻ , AsF ₆ ⁻ , SbF ₆ ⁻ , SbCl ₆ ⁻ , (C ₆ F ₅ ) ₄ B ⁻ , SbF ₅ (OH) ⁻ , HSO ₄ ⁻ , p-CH. _A monovalent anion selected from the group consisting of ₃ C ₆ H ₄ SO ₃ ⁻ , HCO ₃ ⁻ , H ₂ PO ₄ ⁻ , CH ₃ COO ⁻ and a halogen anion is shown. The halogen anion is a monovalent monoatomic anion of a halogen atom.

Ar ¹ represents an optionally substituted aryl group (preferably having 6 to 20 carbon atoms), Ar ² represents an optionally substituted arylene group (preferably having 6 to 20 carbon atoms). , Ar ³ and Ar ⁴ each independently represent an aryl group (preferably having 6 to 20 carbon atoms) which may have a substituent.

  As the sulfonium salt represented by the general formulas (6) to (8), more specifically, triphenylsulfonium boron tetrafluoride, triphenylsulfonium hexafluoride antimony, triphenylsulfonium hexafluoroarsenide, Examples thereof include tri (4-methoxyphenyl) sulfonium arsenic hexafluoride, diphenyl (4-phenylthiophenyl) sulfonium hexafluoroarsenic, and the like.

These sulfonium salts are commercially available. For example, Adekaoptomer SP-150 (manufactured by Asahi Denka Kogyo Co., Ltd., counter ion: PF ₆ ⁻ ), Adeka optomer SP-170 (manufactured by Asahi Denka Kogyo Co., Ltd., counter ion: SbF) ₆ ^-), Adekaoptomer CP-66 (Asahi Denka Co., counterion: SbF ₆ ^-), Adekaoptomer CP-77 (Asahi Denka Co., counterion: SbF ₆ ^-), San-Aid SI-60L (Manufactured by Sanshin Chemical Industry Co., Ltd., counter ion: SbF ₆ ⁻ ), sun aid SI-80L (manufactured by Sanshin Chemical Industry Co., Ltd., counter ion: SbF ₆ ⁻ ), sun aid SI-100L (manufactured by Sanshin Chemical Industry Co., Ltd., counter ion : SbF ₆ ^-), San-Aid SI-0.99 (Sanshin Chemical Industry Co., ^{_{counterion: SbF 6 -), CYRACUREUVI-}} 6974 ( Union carbide Corporation, counterion: S ^{_{F 6 -), CYRACURE UVI-}} 6990 ( Union Carbide Corporation, ^{_{counterion: PF 6 -), UVI-}} 508 ( manufactured by General Electric Company), UVI-509 (manufactured by General Electric Company), FC-508 ( Minnesota Mining & Manufacturing), FC-509 (Minnesota Mining & Manufacturing), CD-1010 (Sartomer), CD-1011 (Sartomer) and CI series (Japan) Soda Co., Ltd., counter ion: PF ₆ ⁻ , SbF ₆ ⁻ ) and the like.

  More specifically, examples of the iodonium salt represented by the general formula (9) include diphenyliodonium hexafluoroarsenide, di-4-chlorophenyliodonium hexafluoroarsenide, and di (4-bromophenyl) iodonium hexafluoride. And arsenic phosphide, phenyl (4-methoxyphenyl) iodonium arsenic hexafluoride, and the like.

These iodonium salts are commercially available. For example, UVE series manufactured by General Electric Co., FC series manufactured by Minnesota Mining & Manufacturing Co., Ltd., UV-9310C manufactured by Toshiba Silicone Co. (counter ion: SbF ₆ ⁻ And Photoinitiator 2074 (counter ion: (C ₆ F ₅ ) ₄ B ⁻ ) manufactured by Rhône Poulin.

  The amount of the curing agent used in the adhesive composition is preferably 0.01 to 20 parts by mass, more preferably 0.1 to 100 parts by mass of the oxetane compound (or oxetane compound having a chain transfer group). 1 to 10 parts by mass. If the amount of the curing agent used is less than 0.01 parts by mass, the curability tends to be insufficient. On the other hand, if the amount exceeds 20 parts by mass, the adhesive composition is formed into a film and stored before use. There is a tendency that the stability tends to decrease.

  Moreover, the usage-amount of the hardening | curing agent which addition-reacts with an oxetane compound, such as bifunctional or higher carboxylic acid, bifunctional or higher polythiol, bifunctional or higher carboxylic acid anhydride, and bifunctional or higher phenol, The amount is preferably 2 to 500 parts by mass, and more preferably 50 to 300 parts by mass. If the amount of the curing agent used is less than 2 parts by mass, the curability tends to be insufficient. On the other hand, if the amount exceeds 500 parts by mass, the adhesive composition is formed into a film before use. Storage stability tends to decrease.

  Although it does not specifically limit as a compound (chain transfer agent) which has a chain transfer group, The compound which has a hydroxyl group is preferable, alcohol is more preferable and polyhydric alcohol is further more preferable.

  Such compounds include allyl alcohol, 1,4-butanediol, butyl alcohol, ethyl alcohol, ethylene glycol, diethylene glycol, triethylene glycol, isobutyl alcohol, isopropyl alcohol, methanol, 1,2-propanediol, propyl alcohol, 2-Propin-1-ol, glycerin, glucose, polyvinyl alcohol, poly (2-hydroxyethyl methacrylate) and the like can be mentioned. These compounds can be used individually by 1 type or in mixture of 2 or more types.

  In the adhesive composition of the present invention, the amount of the chain transfer group is preferably 0.05 to 200 chemical equivalents and preferably 0.1 to 100 chemical equivalents with respect to 1 chemical equivalent of the oxetanyl group. More preferred. When the amount of the chain transfer group relative to one chemical equivalent of the oxetanyl group is less than 0.05 chemical equivalent, high adhesive strength tends to be difficult to obtain. On the other hand, when it exceeds 200 chemical equivalents, chain transfer may occur excessively, resulting in a low crosslinking density. Therefore, in the adhesive composition of the present invention, the amount of the chain transfer group used is adjusted so that the amount of the chain transfer group relative to one chemical equivalent of the oxetanyl group satisfies the above conditions, or the chain transfer satisfying the above conditions. It is preferable to use an oxetanyl compound having a group and optionally using a compound having a chain transfer group.

  To the adhesive composition of the present invention, a binder resin may be appropriately added for the purpose of thickening or forming a film. The binder resin is not particularly limited as long as it does not adversely affect the oxetane compound, the curing agent, the chain transfer agent, and the conductive particles added when used as a circuit connecting material.

  Examples of such binder resins include polyimides, polyamides, phenoxy resins, polymethacrylates, polyacrylates, polyurethanes, polyesters, polyvinyl butyrals, SBS and its epoxy modified products, SEBS and its modified products, and the like. Can be used. These polymers can be used individually by 1 type or in mixture of 2 or more types. Furthermore, these polymers may contain a siloxane bond or a fluorine atom-containing substituent.

  These can be suitably used as a constituent material of the adhesive composition as long as the resins to be mixed are completely compatible with each other or microphase separation occurs and the liquid becomes cloudy.

  The larger the molecular weight of the polymer, the easier it is to form a film, and the melt viscosity that affects the fluidity as an adhesive can be set in a wide range. The molecular weight of the polymer is not particularly limited, but the weight average molecular weight is preferably 5,000 to 150,000, particularly preferably 10,000 to 80,000. If this value is less than 5,000, film formability tends to be inferior. On the other hand, if it exceeds 150,000, compatibility with other components tends to be poor.

  It is preferable that the usage-amount of binder resin shall be 20-320 mass parts with respect to 100 mass parts of oxetane compounds (or oxetane compound which has a chain transfer group). When this usage-amount is less than 20 mass parts or exceeds 320 mass parts, there exists a tendency for fluidity | liquidity and adhesiveness to fall.

  Moreover, you may add various well-known additives to the adhesive composition of this invention if it is in the range which does not impair the effect in use. Examples of additives include inorganic fillers, reinforcing materials, colorants, stabilizers (thermal stabilizers, weather resistance improvers, etc.), extenders, viscosity modifiers, flame retardants, ultraviolet absorbers, antioxidants, and discoloration. An inhibitor, an antibacterial agent, an antifungal agent, an anti-aging agent, an antistatic agent, a plasticizer, a lubricant, a foaming agent, a release agent, and the like can be added and mixed.

  Examples of the colorant include direct dyes, acid dyes, basic dyes, dyes such as metal complex dyes, inorganic pigments such as carbon black, titanium oxide, zinc oxide, iron oxide, and mica, coupling azo series, condensed azo series, And organic pigments such as anthraquinone, thioindigo, dioxazone, and phthalocyanine.

  Examples of the stabilizer include compounds such as hindered phenol, hydrazine, phosphorus, benzophenone, benzotriazole, and oxalic acid anilide.

  Examples of the inorganic filler include glass fiber, asbestos fiber, carbon fiber, silica fiber, alumina fiber, silica / alumina fiber, zirconia fiber, boron nitride fiber, silicon nitride fiber, basic magnesium sulfate fiber, boron fiber, and stainless steel fiber. Inorganic and metal fibers such as aluminum, titanium, copper, brass and magnesium, metal powder such as copper, iron, nickel, zinc, tin, lead, stainless steel, aluminum, gold and silver, wood powder, magnesia, calcia, etc. Oxides, aluminum silicate, diatomaceous earth, quartz powder, talc, clay, hydroxides of various metals, carbonates, sulfates, phosphates, borates, borosilicates, aluminosilicates, titanates, bases Sulfates, basic carbonates and other basic salts, glass materials such as glass hollow spheres and glass flakes, silicon carbide, aluminum nitride Mullite, ceramic, such as cordierite, and waste such as fly ash and micro silica.

  Next, processing conditions for curing the adhesive composition of the present invention will be described. When curing, it is preferable to cure the adhesive composition by combining irradiation treatment with actinic rays and heat treatment, ring-opening polymerization of the oxetanyl group.

  Here, the purpose of irradiating actinic rays is to generate an acid component from the curing agent. Examples of the active light used include ultraviolet light, visible light, and infrared light. Among these actinic rays, ultraviolet rays and visible light are preferable from the viewpoint of polymerization curing rate, and ultraviolet rays are particularly preferable. The wavelength range of ultraviolet rays is preferably 300 nm or more, and particularly preferably 350 nm or more. In addition, it is preferable that the wavelength range of an ultraviolet-ray is 400 nm or less.

In addition to actinic rays, energy rays such as electron beams, X-rays, γ rays, or microwaves can also be used. When irradiating with ultraviolet light, various light sources can be used, for example, curing by irradiation light from mercury arc lamp, xenon arc lamp, fluorescent lamp, carbon arc lamp, tungsten-halogen copying lamp and ambient sunlight. Can be made. The irradiation amount of actinic rays should just irradiate to the extent that a sufficient hardening reaction advances by heating after generating an acid (proton) from a hardening | curing agent. ^Generally, it is ^{1mJ / cm 2 ~500,000mJ / cm 2} . Furthermore, the irradiation of actinic rays can be performed once or twice or more, and the irradiation conditions of each actinic ray may be the same or different. Further, different light sources may be used in combination.

  The temperature during irradiation with actinic rays is preferably 40 ° C. or lower, more preferably 35 ° C. or lower, and particularly preferably 30 ° C. or lower. When the temperature exceeds 40 ° C., the polymerization reaction tends to proceed at the time of actinic ray irradiation, and in the case where adherends (for example, circuit members) are bonded to each other after irradiation with actinic rays, the working time is long. Tend to decrease.

  The heating treatment may be performed together with the irradiation treatment with actinic rays, but is preferably performed after the irradiation with actinic rays. Thereby, the polymerization / crosslinking reaction of the adhesive composition proceeds. The heating temperature is preferably 40 ° C to 200 ° C, more preferably 40 ° C to 150 ° C, still more preferably 40 ° C to 140 ° C. When the heating temperature is less than 40 ° C., the curing reaction hardly proceeds, and when it exceeds 200 ° C., unwanted side reactions tend to proceed.

  The heating time is preferably 0.1 seconds to 50 hours, more preferably 0.5 seconds to 30 hours, and still more preferably 0.5 seconds to 50 seconds. When the heating time is less than 0.1 seconds, the curing reaction does not end. When the heating time exceeds 50 hours, the productivity of the cured product is lowered, and undesired side reactions tend to proceed. The irradiation with the actinic ray and the heating can be repeated, but each is preferably completed once.

  In the curing method, a predetermined holding time may be sandwiched between the irradiation process with actinic rays and the process with heating. The holding time is preferably 0 second to 24 hours, more preferably 0.05 seconds to 12 hours, further preferably 0.1 seconds to 6 hours, and most preferably 0.2 seconds to 1 hour. When this holding time exceeds 24 hours, the productivity of the cured product decreases.

  In the above-mentioned method, actinic rays are irradiated at 40 ° C. or lower, then held for 0.01 seconds to 24 hours, and then heated at 40 to 200 ° C. for 0.1 seconds to 50 hours to irradiate actinic rays. The substantial curing reaction hardly progresses during and after that, and the polymerization / crosslinking reaction proceeds promptly by the subsequent heating. Therefore, when adhering adherends that do not transmit actinic rays, the adhesive composition is applied to one or both surfaces of the adherends, and after applying actinic rays and heating, Since the curing reaction does not proceed until heating (ie, holding time), highly accurate alignment can be easily performed during that time.

  The pressure of the reaction in the above method is not particularly limited and may be any of reduced pressure, normal pressure or increased pressure, but is preferably normal pressure in terms of simplification of the apparatus. Moreover, it is not necessary to stir in the case of reaction, but you may stir as needed.

  The use form of the adhesive composition of the present invention is not particularly limited, but can be used in the form of a paste if it is liquid at room temperature, and if it is solid at room temperature, it can be used by heating or using a solvent. And may be made into a paste. Solvents that can be used are not particularly limited as long as they are not reactive with the adhesive composition and additives and exhibit sufficient solubility, but those having a boiling point of 50 to 150 ° C. at normal pressure. preferable. When the boiling point is 50 ° C. or lower, there is a risk of volatilization if left at room temperature, which limits the use in an open system. On the other hand, when the boiling point is 150 ° C. or higher, it is difficult to volatilize the solvent, which may adversely affect the reliability after bonding.

  Moreover, the solvent can be removed from a solution in which each of the above components is dissolved and / or dispersed in a predetermined organic solvent and used as a molded body (for example, a film-like adhesive described later) formed into a predetermined shape.

  FIG. 1 is a cross-sectional view showing an embodiment of a film adhesive. The film adhesive 1 shown in FIG. 1 is formed by forming the above-described adhesive composition into a film. According to this film adhesive, it is easy to handle, can be easily installed on the adherend, and can be easily connected.

  In addition, the film adhesive 1 is good also as a multilayer structure (not shown) which consists of 2 or more types of layers from which Tg (glass transition temperature) when hardening adhesive composition differs 5 degreeC or more.

  The film adhesive 1 is, for example, a temperature at which an adhesive composition is dissolved in a solvent and applied on a support (PET (polyethylene terephthalate) film or the like) using a coating apparatus, and the adhesive composition is not cured. And can be produced by drying with hot air for a predetermined time. Moreover, it is preferable that the thickness of the film adhesive 1 is 5-50 micrometers.

  The adhesive composition of the present invention described above can be used as an adhesive for different types of adherends having different thermal expansion coefficients. Further, it can be used as a semiconductor element adhesive material typified by an anisotropic conductive adhesive, a silver paste, a circuit connection material typified by a silver film, a CSP elastomer, a CSP underfill material, a LOC tape or the like.

(Circuit member connection structure)
FIG. 2 is a schematic cross-sectional view showing an embodiment of the circuit member connection structure of the present invention. As shown in FIG. 2, the circuit member connection structure of the present embodiment includes a first circuit member 20 and a second circuit member 30 that are opposed to each other. A circuit connection member 10 is provided between the circuit member 30 and the circuit member 30.

  The first circuit member 20 includes a circuit board (first circuit board) 21 and a circuit electrode (first circuit electrode) 22 formed on the main surface 21 a of the circuit board 21. Note that an insulating layer (not shown) may be formed on the main surface 21a of the circuit board 21 in some cases.

  On the other hand, the second circuit member 30 includes a circuit board (second circuit board) 31 and a circuit electrode (second circuit electrode) 32 formed on the main surface 31 a of the circuit board 31. In addition, an insulating layer (not shown) may be formed on the main surface 31a of the circuit board 31 according to circumstances. Examples of the circuit boards 21 and 31 include semiconductors, glass, ceramics, and other inorganic substances, polyimides, polycarbonates, and other organic substances, and those made of a composite of these inorganic substances and organic substances.

  The first and second circuit members 20 and 30 are not particularly limited as long as electrodes that require electrical connection are formed. Specific examples include glass substrates or plastic substrates on which electrodes are formed of ITO or the like used for liquid crystal displays, printed wiring boards, ceramic wiring boards, flexible wiring boards, semiconductor silicon chips, and the like. It is used in combination according to.

  The circuit connecting member 10 contains an insulating material 11 and conductive particles 7. The conductive particles 7 are disposed not only between the circuit electrode 22 and the circuit electrode 32 facing each other but also between the principal surfaces 21a and 31a. In the circuit member connection structure, the circuit electrodes 22 and 32 are electrically connected via the conductive particles 7. That is, the conductive particles 7 are in direct contact with both the circuit electrodes 22 and 32.

  Here, the conductive particles 7 are not particularly limited as long as they have conductivity capable of obtaining electrical connection, but there are metal particles such as Au, Ag, Ni, Cu, Co, and solder, carbon, and the like. . In addition, non-conductive glass, ceramics, plastics, or the like coated with a conductive material such as the metal can be used. At this time, the thickness of the metal layer to be coated is preferably 10 nm or more in order to obtain sufficient conductivity. Moreover, it is preferable that the average particle diameter of the electrically-conductive particle 7 is 1-18 micrometers from the point of a dispersibility and electroconductivity.

  In the circuit member connection structure, as described above, the opposing circuit electrode 22 and circuit electrode 32 are electrically connected via the conductive particles 7. For this reason, the connection resistance between the circuit electrodes 22 and 32 is sufficiently reduced. Therefore, the flow of current between the circuit electrodes 22 and 32 can be made smooth, and the functions of the circuit can be fully exhibited. In addition, when the circuit connection member 10 does not contain the conductive particles 7, the circuit electrode 22 and the circuit electrode 32 are in direct contact with each other to be electrically connected.

  As will be described later, since the circuit connection member 10 is made of a cured product of a circuit connection material containing the adhesive composition, the adhesive strength of the circuit connection member 10 to the circuit member 20 or 30 is sufficiently high. In the circuit member connection structure, a sufficiently high adhesive strength is maintained for a long period of time. Therefore, the change with time of the distance between the circuit electrodes 22 and 32 is sufficiently prevented, and the long-term reliability of the electrical characteristics between the circuit electrodes 22 and 32 can be sufficiently increased.

(Method for manufacturing circuit member connection structure)
Next, a method for manufacturing a circuit member connection structure will be described.

  First, the first circuit member 20 and the film-like circuit connecting material 40 described above are prepared (see FIG. 3A). The film-like circuit connection material 40 is formed by forming a circuit connection material into a film shape. The circuit connection material contains an adhesive composition 5 and conductive particles 7. Here, as the adhesive composition 5, those containing the above-described constituent materials are used. Even when the circuit connecting material does not contain the conductive particles 7, the circuit connecting material can be used for anisotropic conductive bonding as an insulating adhesive, and is sometimes called NCP (Non-Conductive Paste). When the circuit connecting material contains the conductive particles 7, the circuit connecting material may be called ACP (Anisotropic Conductive Paste).

  Moreover, it is preferable that it is 0.1-30 volume% with respect to the whole quantity of a circuit connection material, and, as for content of the electrically-conductive particle 7 in a circuit connection material, it is more preferable that it is 1.0-20 volume%. When the content is less than 0.1% by volume, it tends to be difficult to obtain good conduction. On the other hand, if it exceeds 30% by volume, there is a possibility of causing a short circuit (short circuit) of the adjacent circuit.

  The content (volume%) of the conductive particles 7 is determined based on the volume of each component before curing at 23 ° C., and the volume of each component is converted from mass to volume using specific gravity. Can do. Also, do not dissolve or swell the component in a graduated cylinder, etc., and put the appropriate solvent (water, alcohol, etc.) that wets the component well, and add the component to increase the volume as the volume You can ask for it.

  The thickness of the film-like circuit connecting material 40 is preferably 5 to 50 μm. If the thickness of the film-like circuit connection material 40 is less than 5 μm, the circuit connection material tends to be insufficiently filled between the circuit electrodes 22 and 32. On the other hand, when it exceeds 50 μm, the adhesive composition between the circuit electrodes 22 and 32 cannot be sufficiently removed, and it is difficult to ensure conduction between the circuit electrodes 22 and 32.

  Next, the film-like circuit connecting material 40 is placed on the surface of the first circuit member 20 on which the circuit electrodes 22 are formed. When the film-like circuit connecting material 40 is attached on a support (not shown), the film-like circuit connecting material 40 side is directed to the first circuit member 20 so that the first circuit is connected. Place on member 20. At this time, the film-like circuit connecting material 40 is film-like and easy to handle. For this reason, the film-like circuit connecting material 40 can be easily interposed between the first circuit member 20 and the second circuit member 30, and the first circuit member 20 and the second circuit member 30 Connection work can be performed easily.

  Then, the film-like circuit connecting material 40 is pressurized in the directions of arrows A and B in FIG. 3A to temporarily connect the film-like circuit connecting material 40 to the first circuit member 20 (see FIG. 3B). . At this time, you may pressurize, heating. However, the heating temperature is a temperature at which the adhesive composition in the film-like circuit connecting material 40 is not cured.

  Subsequently, the film-like circuit connecting material 40 is irradiated with actinic rays. Next, as shown in FIG. 3C, the second circuit member 30 is placed on the film-like circuit connection material 40 with the second circuit electrode facing the first circuit member 20. In addition, when the film-form circuit connection material 40 has adhered on the support body (not shown), after peeling a support body, the 2nd circuit member 30 is mounted on the film-form circuit connection material 40. FIG.

  And it heats through the 1st and 2nd circuit members 20 and 30 to the arrow A and B direction of FIG.3 (c), heating the film-form circuit connection material 40. FIG. The heating temperature at this time is a temperature at which the adhesive composition of the present invention can be cured. In this way, the film-like circuit connecting material 40 is cured, and the main connection is performed, so that a circuit member connection structure as shown in FIG. 2 is obtained. The connection conditions are appropriately selected depending on the application to be used, the adhesive composition, and the circuit member.

  When the circuit member connection structure is manufactured as described above, in the circuit member connection structure obtained, the conductive particles 7 can be brought into contact with both of the circuit electrodes 22 and 32 facing each other. The connection resistance between them can be sufficiently reduced.

  Further, in the above production method, since the curing reaction of the adhesive composition is suppressed immediately after irradiation with active light, even when a relatively long time has elapsed after irradiation with active light, Circuit members can be connected to each other.

  Further, by heating the film-like circuit connecting material 40, the adhesive composition 5 is cured to become the insulating substance 11 in a state where the distance between the circuit electrode 22 and the circuit electrode 32 is sufficiently small, and the first circuit member is obtained. 20 and the second circuit member 30 are firmly connected via the circuit connection member 10. That is, in the circuit member connection structure obtained, the circuit connection member 10 is made of a cured product of the circuit connection material containing the adhesive composition, so that the circuit connection member 10 is connected to the circuit member 20 or 30. Adhesive strength is sufficiently high, and in particular, the adhesive strength is sufficiently high under high temperature and high humidity conditions. In the circuit member connection structure, a sufficiently high adhesive strength is maintained for a long period of time. Therefore, the circuit member connection structure obtained is sufficiently prevented from changing with time in the distance between the circuit electrodes 22 and 32 and is excellent in long-term reliability of the electrical characteristics between the circuit electrodes 22 and 32.

  In the above embodiment, the circuit member connection structure is manufactured using the film-like circuit connection material 40, but a circuit connection material may be used instead of the film-like circuit connection material 40. Even in this case, if the circuit connection material is dissolved in a solvent and the solution is applied to either the first circuit member 20 or the second circuit member 30 and dried, the first and second circuit members 20 are used. , 30 can interpose a circuit connecting material.

  Further, instead of the conductive particles 7, other conductive materials may be used. Other conductive materials include particulate or short fiber carbon, metal wires such as Au-plated Ni wire, and the like.

  Hereinafter, the content of the present invention will be described more specifically with reference to examples, but the present invention is not limited to these examples.

(Example 1)
As the oxetane compound having a chain transfer group, 3,3,16,16-bis (3-oxacyclobutylidene) -7,12-dihydroxy-5,14-dioxaoctadecane was prepared. Adekaoptomer SP-170 (trade name, counter ion: SbF ₆ ⁻ ) manufactured by Asahi Denka Kogyo Co., Ltd. was used as a curing agent, and anthracene was prepared as a sensitizer. As the binder resin, phenoxy resin (ZX-1356-2, product name manufactured by Toto Kasei Co., Ltd.) and acrylic rubber (HTR860P-3, product name manufactured by Teikoku Chemical Industry Co., Ltd.) were prepared.

  Further, a nickel layer having a film thickness of 0.2 μm is provided on the surface of particles having polystyrene as a nucleus, and a gold layer having a film thickness of 0.02 μm is provided outside the nickel layer, with an average particle diameter of 10 μm and a specific gravity of 2.5. The conductive particles were prepared.

  Each of the prepared constituent materials was blended as shown in Table 1 in terms of solid content weight ratio, and the prepared conductive particles were further mixed and dispersed by 1.5% by volume to obtain a circuit connection material. The obtained circuit connecting material was applied to a fluororesin film having a film thickness of 80 μm using a coating apparatus, and a film-like circuit connecting material was obtained by hot air drying at 70 ° C. for 10 minutes. The film thickness of the film-like circuit connecting material on the fluororesin film was 10 μm.

(Example 2)
As the oxetane compound, 3,3,16,16-bis (3-oxacyclobutylidene) -5,14-dioxaoctadecane was prepared. Adekaoptomer SP-170 (trade name, counter ion: SbF ₆ ⁻ ) manufactured by Asahi Denka Kogyo Co., Ltd. was used as a curing agent, and anthracene was prepared as a sensitizer. Glycerin was prepared as a compound having a chain transfer group. As the binder resin, phenoxy resin (ZX-1356-2, trade name manufactured by Toto Kasei Co., Ltd.) and acrylic rubber (HTR860P-3, trade name manufactured by Teikoku Chemical Industry Co., Ltd.) were prepared.

  Further, conductive particles were produced in the same manner as in Example 1. Each of the prepared constituent materials was blended as shown in Table 1 in terms of solid content weight ratio, and the prepared conductive particles were further mixed and dispersed by 1.5% by volume to obtain a circuit connection material. The obtained circuit connecting material was applied to a fluororesin film having a film thickness of 80 μm using a coating apparatus, and a film-like circuit connecting material was obtained by hot air drying at 70 ° C. for 10 minutes. The film thickness of the film-like circuit connecting material on the fluororesin film was 10 μm.

(Comparative Example 1)
As the oxetane compound, 3,3,16,16-bis (3-oxacyclobutylidene) -5,14-dioxaoctadecane was prepared. Adekaoptomer SP-170 (trade name, counter ion: SbF ₆ ⁻ ) manufactured by Asahi Denka Kogyo Co., Ltd. was used as the curing agent, and anthracene was prepared as the sensitizer. As the binder resin, phenoxy resin (ZX-1356-2, product name manufactured by Toto Kasei Co., Ltd.) and acrylic rubber (HTR860P-3, product name manufactured by Teikoku Chemical Industry Co., Ltd.) were prepared.

  Further, conductive particles were produced in the same manner as in Example 1. Each of the prepared constituent materials was blended as shown in Table 1 in terms of solid content weight ratio, and the prepared conductive particles were further mixed and dispersed by 1.5% by volume to obtain a circuit connection material. The obtained circuit connecting material was applied to a fluororesin film having a film thickness of 80 μm using a coating apparatus, and a film-like circuit connecting material was obtained by hot air drying at 70 ° C. for 10 minutes. The film thickness of the film-like circuit connecting material on the fluororesin film was 10 μm.

(Comparative Example 2)
In place of the oxetane compound, an epoxy compound bisphenol A diglycidyl ether was prepared. Adekaoptomer SP-170 (trade name, counter ion: SbF ₆ ⁻ ) manufactured by Asahi Denka Kogyo Co., Ltd. was used as the curing agent, and anthracene was prepared as the sensitizer. As the binder resin, phenoxy resin (ZX-1356-2, trade name manufactured by Toto Kasei Co., Ltd.) and acrylic rubber (HTR860P-3, product name manufactured by Teikoku Chemical Industry Co., Ltd.) were prepared.

  Further, conductive particles were produced in the same manner as in Example 1. Each of the prepared constituent materials was blended as shown in Table 1 in terms of solid content weight ratio, and the prepared conductive particles were further mixed and dispersed by 1.5% by volume to obtain a circuit connection material. The obtained circuit connecting material was applied to a fluororesin film having a film thickness of 80 μm using a coating apparatus, and a film-like circuit connecting material was obtained by hot air drying at 70 ° C. for 10 minutes. The film thickness of the film-like circuit connecting material on the fluororesin film was 10 μm.

(Circuit member connection structure)
The film-like circuit connecting materials of Examples 1-2 and Comparative Examples 1-2 were transferred from a fluororesin film in a size of 2 × 20 mm on a glass substrate (thickness 0.7 mm). This was irradiated with ultraviolet rays at 25 ° C. and an illuminance of 17 mW / cm ² for 3 minutes using an ultraviolet irradiation device equipped with a high-pressure mercury lamp, and left for 5 minutes. This was covered with another glass substrate, and heated and pressed at 120 ° C. for 10 seconds using a thermocompression bonding apparatus (heating method: contact heat type, manufactured by Toray Engineering Co., Ltd.). Examples 1-2 and Comparative Examples The connection structure of 1-2 circuit members was manufactured.

(Evaluation of adhesive strength)
Using a bond tester (BT2400, Arctec Co., Ltd.), the shear strength between the glass substrates of the circuit member connection structures of Examples 1-2 and Comparative Examples 1-2 was measured. ), When it was less than 20 MPa, it was judged as defective (x). The obtained results are shown in Table 2.

(Measurement of curing rate)
The film-like circuit connecting materials of Examples 1 and 2 and Comparative Examples 1 and 2 were irradiated with ultraviolet rays at 25 ° C. and an illuminance of 17 mW / cm ² for 3 minutes using an ultraviolet irradiation device equipped with a high-pressure mercury lamp and left for 5 minutes. did. The infrared absorption spectrum of the film-like circuit connecting material after being allowed to stand was measured, and the decrease in the peak derived from the oxetane ring or the epoxy ring was followed to determine the curing rate immediately after exposure. The obtained results are shown in Table 2. Further, the exposed film-like circuit connecting material was allowed to stand for 5 minutes, heated at 120 ° C. for 10 seconds, and the curing rate after heating was determined by an infrared absorption spectrum. The obtained results are shown in Table 2.

  From the above results, the circuit connection materials of Examples 1 and 2 have excellent adhesive strength, the curing reaction immediately after the exposure hardly proceeds, and the curing reaction proceeds at the time of low-temperature thermocompression bonding and has a high curing rate. It was confirmed that the workability was excellent. On the other hand, an adhesive composition of Comparative Example 1 using an oxetane compound having no chain transfer group in the molecule and not containing a compound having a chain transfer group, and Comparative Example 2 using an epoxy compound instead of an oxetane compound In this adhesive composition, the curing reaction proceeded substantially immediately after exposure, so that the adhesion of the adhesive composition was impaired before connection by thermocompression bonding, resulting in poor adhesion.

It is sectional drawing which shows one Embodiment of the film adhesive of this invention. It is a schematic sectional drawing which shows one Embodiment of the connection structure of the circuit member of this invention. (A)-(c) is a series of process drawings which connect a circuit member, respectively.

Claims (17)

  An adhesive composition comprising an oxetane compound, a curing agent, and a compound having a chain transfer group. The adhesive composition according to claim 1, wherein the oxetane compound is a compound represented by the following general formula (1).

[In Formula (1), R ¹ represents a hydrogen atom or a monovalent substituent, R ² represents a hydrogen atom or an n-valent substituent, and n represents an integer of 1 to 4. ]   The adhesive composition according to claim 1 or 2, wherein the compound having a chain transfer group is a compound having a hydroxyl group.   The adhesive composition according to any one of claims 1 to 3, wherein the compound having a chain transfer group is an alcohol.   The adhesive composition according to any one of claims 1 to 4, wherein the compound having a chain transfer group is a polyhydric alcohol.   An adhesive composition comprising an oxetane compound having a chain transfer group and a curing agent.   The adhesive composition according to claim 6, wherein the chain transfer group is a hydroxyl group. The adhesive according to claim 6 or 7, wherein the oxetane compound having a chain transfer group is at least one of compounds represented by the following general formulas (2), (3) and (4). Composition.

[In Formula (2), R ³ and R ⁴ each independently represent a hydrogen atom or a monovalent substituent. ]

[In Formula (3), R ⁵ and R ⁷ each independently represent a hydrogen atom or a monovalent substituent, and R ⁶ represents a divalent substituent. ]

[In Formula (4), R < ⁸ >, R < ⁹ >, R < ¹⁰ > and R < ¹¹ > each independently represent a hydrogen atom or a monovalent substituent, and m independently represents an integer of 0-20. ]   The adhesive composition according to claim 1, wherein the curing agent is a photolatent cationic polymerization initiator.   Furthermore, binder resin is contained, The adhesive composition as described in any one of Claims 1-9 characterized by the above-mentioned.   The adhesive composition according to any one of claims 1 to 10, wherein the adhesive composition is cured by being heated after being irradiated with an actinic ray.   The adhesive composition according to any one of claims 1 to 11, which is cured by being heated at 40 to 140 ° C for 0.5 to 50 seconds after being irradiated with actinic rays.   A film adhesive comprising the adhesive composition according to any one of claims 1 to 12 formed into a film. A first circuit member having a first circuit electrode formed on the main surface of the first circuit board, and a second circuit member having a second circuit electrode formed on the main surface of the second circuit board And a circuit connection material for connecting the first circuit electrode and the second circuit electrode in a state of facing each other,
A circuit connection material comprising the adhesive composition according to claim 1.   The circuit connection material according to claim 14, further comprising conductive particles and containing 0.1 to 30% by volume of the conductive particles with respect to the total amount of the circuit connection material. A first circuit member having a first circuit electrode formed on the main surface of the first circuit board;
A second circuit member having a second circuit electrode formed on the main surface of the second circuit board;
The first circuit board is provided between the main surface of the first circuit board and the main surface of the second circuit board, and the first circuit electrode and the second circuit electrode are arranged to face each other. And a circuit connecting member for connecting the second circuit members,
A circuit member connection structure comprising:
The circuit connection member comprises a cured product of the circuit connection material according to claim 14 or 15,
The circuit member connection structure, wherein the first circuit electrode and the second circuit electrode are electrically connected. A first circuit member having a first circuit electrode formed on the main surface of the first circuit board;
A second circuit member having a second circuit electrode formed on the main surface of the second circuit board;
The first circuit board is provided between the main surface of the first circuit board and the main surface of the second circuit board, and the first circuit electrode and the second circuit electrode are arranged to face each other. And a circuit connecting member for connecting the second circuit members,
A circuit member connection structure manufacturing method comprising:
The circuit connection material according to claim 14 or 15 is disposed between a main surface of the first circuit board and a main surface of the second circuit board,
A circuit member connection structure by connecting the first circuit member and the second circuit member by heating and pressurizing and curing the circuit connection material through the first and second circuit members. The manufacturing method of the connection structure of the circuit member characterized by manufacturing this.

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