CN102382594A - Application of adhesive compond - Google Patents
Application of adhesive compond Download PDFInfo
- Publication number
- CN102382594A CN102382594A CN2011102225114A CN201110222511A CN102382594A CN 102382594 A CN102382594 A CN 102382594A CN 2011102225114 A CN2011102225114 A CN 2011102225114A CN 201110222511 A CN201110222511 A CN 201110222511A CN 102382594 A CN102382594 A CN 102382594A
- Authority
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- China
- Prior art keywords
- circuit
- near infrared
- connection material
- adhesive layer
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000853 adhesive Substances 0.000 title claims abstract description 42
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 42
- 239000000463 material Substances 0.000 claims abstract description 126
- 239000000203 mixture Substances 0.000 claims abstract description 64
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 27
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 19
- 239000003822 epoxy resin Substances 0.000 claims abstract description 14
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 14
- 239000007787 solid Substances 0.000 claims abstract description 11
- 150000001875 compounds Chemical class 0.000 claims abstract description 9
- 230000031700 light absorption Effects 0.000 claims abstract description 5
- 239000002245 particle Substances 0.000 claims description 67
- 238000004040 coloring Methods 0.000 claims description 42
- 239000000126 substance Substances 0.000 claims description 9
- 150000002460 imidazoles Chemical class 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 abstract description 7
- -1 phthalocyanine compound Chemical class 0.000 abstract description 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract 3
- 239000012790 adhesive layer Substances 0.000 description 73
- 239000010410 layer Substances 0.000 description 32
- 238000010438 heat treatment Methods 0.000 description 22
- 238000000034 method Methods 0.000 description 21
- 239000011248 coating agent Substances 0.000 description 16
- 238000000576 coating method Methods 0.000 description 16
- 239000011521 glass Substances 0.000 description 15
- 239000012530 fluid Substances 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 13
- 238000005054 agglomeration Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 12
- 229920001971 elastomer Polymers 0.000 description 11
- 239000005060 rubber Substances 0.000 description 11
- 239000011230 binding agent Substances 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 229920002799 BoPET Polymers 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 238000003825 pressing Methods 0.000 description 8
- 239000002994 raw material Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 230000008602 contraction Effects 0.000 description 7
- 239000000155 melt Substances 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 238000011049 filling Methods 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000005764 inhibitory process Effects 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical compound OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000000113 differential scanning calorimetry Methods 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000004945 silicone rubber Substances 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920006287 phenoxy resin Polymers 0.000 description 3
- 239000013034 phenoxy resin Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 229940042795 hydrazides for tuberculosis treatment Drugs 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000007601 warm air drying Methods 0.000 description 2
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical compound [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 1
- NRZZLYODXDSLEK-UHFFFAOYSA-N (6-ethoxy-6-oxohexyl) 3,5-diacetamido-2,4,6-triiodobenzoate Chemical compound CCOC(=O)CCCCCOC(=O)C1=C(I)C(NC(C)=O)=C(I)C(NC(C)=O)=C1I NRZZLYODXDSLEK-UHFFFAOYSA-N 0.000 description 1
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 150000001896 cresols Chemical class 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- RAABOESOVLLHRU-UHFFFAOYSA-N diazene Chemical compound N=N RAABOESOVLLHRU-UHFFFAOYSA-N 0.000 description 1
- 229910000071 diazene Inorganic materials 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical group 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 235000012204 lemonade/lime carbonate Nutrition 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000000176 photostabilization Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000004439 roughness measurement Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229960001866 silicon dioxide Drugs 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 1
- 239000002512 suppressor factor Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Adhesive Tapes (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
Abstract
The invention relates to application of an adhesive compound, specifically to application of an adhesive compound serving as a circuit connecting material. The circuit connecting material is used for connecting a first circuit member obtained by forming a first circuit electrode on a major surface of a first substrate with a second circuit member obtained by forming a second circuit electrode on a major surface of a second substrate in such a manner that the first circuit electrode and the second circuit electrode face each other. This circuit connecting material contains an adhesive composition having a maximum light absorption wavelength within the range of 800-1200 nm. The near-infrared absorption color agent is phthalocyanine compound, and the content of the phthalocyanine compound relative to the total resin solid matter of the adhesive compound is 0.1-10 mass%. The adhesive compound is a mixture containing epoxy resin and imidazole type latent curing agent.
Description
The application is to be on September 26th, 2008 applying date of original application, and application number is 200880110198.1, and denomination of invention is divided an application for the one Chinese patent application of " circuit connection material, syndeton body and method of manufacture thereof ".
Technical field
The present invention relates to a kind of circuit connection material, syndeton body and method of manufacture thereof.
Background technology
Make circuit member each other or electronic unit such as IC chip and circuit member when being electrically connected, use the anisotropic conductive sticker that in sticker, has disperseed conducting particles as required and formed.This sticker is disposed between the electrode of opposed circuit member, through heating and pressurization circuit member is interconnected, and can between the maintenance adjacent electrode, make between the electrode of opposite in the insulativity thus to be electrically connected.As this anisotropic conductive sticker, having proposed is the circuit connection material (for example, referring to patent documentation 1) of matrix with epoxy resin.
Patent documentation 1: japanese kokai publication hei 3-16147 communique
Summary of the invention
Invent problem to be solved
Use the method for attachment of the circuit member of such as stated circuit connection material; Be under the state of clamping anisotropic conductive sticker between the circuit member or between electronic unit such as IC chip and the circuit member; Circuit member is superimposed with each other or electronic unit such as IC chip and circuit member is superimposed, uses the pressing instrument to implement hot pressing through heating and pressurization.The heating and pressurizing condition that carry out this moment is for example 150～220 ℃, and 1～5MPa is about 15～4 seconds.
Along with miniaturized, the precise treatment of electronics in recent years, the anisotropic conductive sticker also need have high de-agglomeration can so that it can connect the circuit member with micro-electrode structure with enough safeties.
In order to satisfy above-mentioned requirements, the inventor is conceived to utilize the short period of time heating to connect, and reduces the influence of material coefficient of thermal expansion and thermal contraction.Usually, in order to connect at short notice, need be heated to higher temperature.But; If in the past anisotropic conductive sticker is applied heat and connects; Then exist the connection resistance value of the syndeton body that obtains to rise, or the tendency of the rising of the connection resistance value in the reliability tests such as shock test or high temperature and humidity test.Above-mentioned tendency will form obstacle to the circuit connection material that needs the high de-agglomeration ability when realizing that the short period of time connects.
For example, when using epoxy resin and imidazoles to be in the past circuit connection material such as mixture, the condition of carrying out heating and pressurizing is generally 170～220 ℃, about 15～4 seconds.In order connection can in the short period of time below 4 seconds, to be formed, need be heated to temperature here, above 220 ℃.Under this high temperature; If through the anisotropic conductive sticker IC chip being connected substrate with polymeric membrane base materials such as polyimide or polyester, polycarbonate or glass substrate etc. connects; The coefficient of thermal expansion difference that then connects back IC chip and substrate causes internal stress, thereby the increase of connection resistance, the sticker of connecting portion are peeled off.In addition, the coefficient of thermal expansion difference that connects back IC chip and substrate causes the generation of warpage, for the liquid crystal panel of the narrow frame of needs etc., possibly make the display quality variation.
On the other hand, can in the short period of time below 4 seconds, form the means that connect below 220 ℃ in Heating temperature, can consider the latent curing agent that uses the sulfonium salt isoreactivity high as being used for.But the curing reaction of circuit connection material carries out rapidly under the Heating temperature more than 180 ℃, insufficient, the low inferior problem of electrically conducting property of resin flows when therefore pressing occurring easily.
The present invention makes in view of above situation, purpose provide can be at short notice with high de-agglomeration can interconnect the electrode that is relative to the configuration, connection reliability is very excellent circuit connection material.Another object of the present invention is to use sort circuit connection material to connect, thereby the generation that can fully suppress warpage, the syndeton body that connection reliability is very high are provided, and the method for manufacture that this syndeton body is provided.The means of dealing with problems
In order to achieve the above object; The present invention provides a kind of circuit connection material; It is used at first circuit member that has formed first circuit electrode on the interarea of first substrate with on the interarea of second substrate, formed the second circuit member of second circuit electrode; According to first circuit electrode state relative with the second circuit electrode direction is connected, this circuit connection material contains the adhesive composition of maximum light absorption wavelength in 800～1200nm scope.
Sort circuit connect material can through wavelength be 800～1200nm the near infrared ray irradiation and at short notice can the junction circuit electrode with high de-agglomeration.That is owing to promoted the curing reaction of adhesive composition through near infrared ray irradiation, even if for need high de-agglomeration can the interconnecting of the circuit member with microtexture, also can accomplish at short notice.Thermal expansion and thermal contraction take place in electronic units such as the shortening of the reduction of Heating temperature and heat-up time in the time of in addition, can also realizing connecting, inhibition circuit member and IC chip etc.Thus, just suppressed to connect the generation of back warpage and the generation of unrelieved stress, can circuit member interconnected and improve the connection reliability between the circuit member simultaneously.
Above-mentioned adhesive composition among the present invention preferably contains the near infrared absorbing coloring matter of maximum light absorption wavelength in 800～1200nm scope.
Because sort circuit connects material and contains the near infrared absorption pigment, can utilize the near infrared ray irradiation to make the near infrared absorbing coloring matter heating, thereby promote the curing reaction of adhesive composition.Therefore, can be at short notice can the junction circuit electrode with high de-agglomeration, can accomplish at short notice need high de-agglomeration can the interconnecting of the circuit member with microtexture.
In the present invention, the content of preferred above-mentioned near infrared absorbing coloring matter is 0.1～10 quality % with respect to all resins solid substance of adhesive composition.Thus, can at low temperatures with in the short period of time circuit connection material be solidified, more effectively mutually connecting circuit member and the further simultaneously connection reliability that improves.
In the present invention, the preferred binder compsn contains conducting particles.Thus, can easily make the direction circuit electrode mutual conduction of configuration relatively.The operation property that sort circuit connects material is excellent.
In the present invention, the preferred binder compsn contains the film-forming properties polymer.Thus, can make circuit connection material have very good film-forming properties.In addition, containing under the situation of conducting particles, can make this conducting particles keep dispersion state more uniformly.Sort circuit connects material more easily makes the direction circuit electrode mutual conduction of configuration relatively through conducting particles, can make simultaneously to reach insulation effectively between circuit electrode adjacent on the same substrate.The operation property that sort circuit connects material is just more excellent.
In addition; The present invention also provides a kind of syndeton body; It possess first circuit member that has formed first circuit electrode on the interarea of first substrate, forming on the interarea of second substrate second circuit electrode and according to make the second circuit electrode and first circuit electrode second circuit member that relative mode disposes with direction and be arranged at first substrate and second substrate between and connect the circuit connecting section of first circuit member and second circuit member, the light that circuit connecting section contains through connect irradiation near infrared range on the material at foregoing circuit makes above-mentioned adhesive composition solidify formed resin cured matter.
Because the light that this syndeton body possesses through the circuit connection material with above-mentioned characteristic being shone near infrared range solidifies formed resin cured matter, can suppress distortion and residual stress that thermal expansion and thermal contraction cause fully.Therefore, reduced the generation of warpage etc., connection reliability is very excellent.In addition, this syndeton body is particularly useful for the liquid crystal panel of the narrow frame of needs etc., and display quality is excellent.
The present invention also provides a kind of method of manufacture of syndeton body; It possesses following operation: will and on the interarea of second substrate, form the second circuit member of second circuit electrode at first circuit member that has formed first circuit electrode on the interarea of first substrate; First circuit electrode and second circuit electrode are configured with the relative mode of direction; Make foregoing circuit connect material between between them; The light of irradiation near infrared range under the state that makes first circuit member, above-mentioned second circuit member and circuit connection material driving fit solidifies the adhesive composition of circuit connection material, thereby connects first circuit member and second circuit member.
In this method of manufacture, through connect the light of irradiation near infrared range on the material at foregoing circuit, first circuit electrode and second circuit electrode are electrically connected, therefore can connect with high de-agglomeration at short notice.The syndeton body that obtains through this method of manufacture is because distortion and residual stress that thermal expansion and thermal contraction cause have received inhibition, so the generation of warpage etc. just is able to abundant reduction.Therefore, can circuit member be interconnected.In addition, connection reliability is also very excellent.This method of manufacture is useful especially for the liquid crystal panel of the narrow frame of needs, can obtain the excellent syndeton body of display quality.
The invention effect
According to the present invention, can provide: can make the direction circuit connection material that electrode is interconnective, connection reliability is very excellent of configuration relatively with high de-agglomeration at short notice.In addition, can also provide through using sort circuit to connect material and carry out high reliability of connecting syndeton body, and the method for manufacture that possesses the syndeton body of above-mentioned characteristic.That is, connect material in a circuit according to the invention, can circuit member interconnected or electronic units such as IC chip are connected with circuit member, can obtain the syndeton body that is fully suppressed of thermal expansion and thermal contraction.Thus, the warpage that can reduce the syndeton body fully takes place, and obtains the very excellent syndeton body of connection reliability.
Description of drawings
Fig. 1 is the schematic cross-section of a preferred implementation of expression circuit connection material of the present invention.
Fig. 2 is the schematic cross-section of another embodiment of expression circuit connection material of the present invention.
Fig. 3 is the schematic cross-section of the another embodiment of expression circuit connection material of the present invention.
Fig. 4 is the schematic cross-section of a preferred implementation of the syndeton body of expression circuit member of the present invention.
Nomenclature
1... conducting particles, 2... sticker composition, 3... near infrared absorbing coloring matter, 5... resinous principle; 40... the conductive adhesive layer, 50... insulativity adhesive layer, 10... first circuit member, 11... first substrate; 12... first circuit electrode, 20... second circuit member, 21... second substrate, 22... second circuit electrode; 30,32... adhesive composition, 100,110, the 120... circuit connection material, 150... circuit connecting section, 200... syndeton body
Embodiment
Followingly preferred implementation of the present invention is elaborated with reference to accompanying drawing.Also have, identical or considerable part is given same-sign in the accompanying drawing, saves repeat specification.In addition, dimensional ratios is not limited to the ratio of accompanying drawing.
Fig. 1 is the schematic cross-section of a preferred embodiment of expression circuit connection material of the present invention.Membranaceous circuit connection material 100 as one of embodiment of the present invention is made up of the adhesive composition 30 that contains conducting particles 1, sticker composition 2 and near infrared absorbing coloring matter 3.As shown in Figure 1, it is in the adhesive composition 30 of principal constituent that conducting particles 1 and near infrared absorbing coloring matter 3 are evenly dispersed in sticker composition 2.
Fig. 2 is the schematic cross-section of another embodiment of expression circuit connection material of the present invention.Membranaceous circuit connection material 110 has conductive adhesive layer 40 and the insulativity adhesive layer 50 layer structure of closing successively.Promptly; Circuit connection material 110 has the insulativity adhesive layer 50 of conductive adhesive layer 40 and insulativity; Conductive adhesive layer 40 is made up of the adhesive composition 30 that contains conducting particles 1, sticker composition 2 and near infrared absorbing coloring matter 3, and insulativity adhesive layer 50 forms according to the mode that contacts with a face of conductive adhesive layer 40 and is made up of the adhesive composition 32 that contains sticker composition 2 and near infrared absorbing coloring matter 3.
Fig. 3 is the schematic cross-section of the another embodiment of expression circuit connection material of the present invention.Membranaceous circuit connection material 120 has by insulativity adhesive layer 50, conductive adhesive layer 40 and insulativity adhesive layer 50 layer successively and closes the laminate structures that forms.Promptly; Circuit connection material 120 has conductive adhesive layer 40 and is formed at the insulativity adhesive layer 50 on two faces of this conductive adhesive layer 40 with the mode of this conductive adhesive layer 40 of clamping respectively; Conductive adhesive layer 40 is made up of the adhesive composition 30 that contains conducting particles 1, sticker composition 2 and near infrared absorbing coloring matter 3, and insulativity adhesive layer 50 is made up of the adhesive composition 32 that contains sticker composition 2 and near infrared absorbing coloring matter 3.
Also have, in Fig. 2 and Fig. 3, all layers that constitute membranaceous circuit connection material all contain near infrared absorbing coloring matter 3, but circuit connection material also can have the layer that does not contain near infrared absorbing coloring matter 3.
In addition, though not shown among Fig. 1, Fig. 2 and Fig. 3, membranaceous circuit connection material 100,110 and 120 can have the separability base material (supporting film) that is used to improve operation property or prevents to adhere to dust, can peel off at least one side's surface.
The circuit connection material 100,110 and 120 that above-mentioned each embodiment relates to contains the near infrared absorbing coloring matter of maximum absorption wavelength in 800～1200nm scope.This near infrared absorbing coloring matter absorbs the light that sends from the near infrared luminescence source.The luminous energy rejected heat that is absorbed promotes the curing of circuit connection material, can obtain resin cured matter.Thus, for example when circuit connection material interconnects, use pressing instrument etc., can obtain the resin cured matter that adhesive composition solidify to form without heating.So the circuit connection material that this embodiment relates to can make circuit electrode interconnect at short notice and with high de-agglomeration.Utilize sort circuit to connect material junction circuit member and can obtain the syndeton that thermal expansion and thermal contraction receive the circuit member of abundant inhibition.In this syndeton, warpage received abundant inhibition, can circuit electrode be interconnected.And connection reliability is also very excellent.
Also have, circuit connection material of the present invention also can not contain conducting particles.In this case, directly contact between the circuit electrode that direction is disposed relatively, thereby reach electrically conducting.
Below close the circuit connection material 110 that forms for 50 layers by conductive adhesive layer 40 and insulativity adhesive layer and be elaborated shown in Figure 2.
The adhesive composition 30 that constitutes conductive adhesive layer 40 contains conducting particles 1, sticker composition 2 and near infrared absorbing coloring matter 3.Conducting particles 1 and near infrared absorbing coloring matter 3 are dispersed in the sticker composition 2.When a pair of circuit member of configuration connected relatively with direction, conductive adhesive layer 40 can carry out electrically conducting each other through the circuit electrode that conducting particles 1 makes on the interarea that is arranged on each circuit member and direction is relative.That is make in the insulativity between the circuit electrode that, conductive adhesive layer 40 is can be on keeping same circuit member adjacent direction relatively the circuit electrode of configuration carry out electrically conducting each other.
As above-mentioned epoxy resin; Can use a kind of or combination in the following material to use below two kinds separately: by deutero-bisphenol-type epoxy resins such as Epicholorohydrin and dihydroxyphenyl propane or F, AD; By Epicholorohydrin and phenol novolak or cresols novolak deutero-novolac-type epoxy resin; Having the naphthalene that contains the naphthalene nucleus skeleton is epoxy resin, and contains various epoxy compoundss that have two above glycidyls in the per molecules such as glycidyl amine, glycidyl ether, biphenyl, ester ring type etc.
For these epoxy resin, consider from preventing the electronic migration aspect, preferably use foreign ion (Na+, Cl-etc.), hydrolysis chlorine etc. to be reduced to the high purity product below the 300ppm.
Consider that from making adhesive composition 30 have better film-forming properties aspect preferred binder compsn 30 contains the film-forming properties polymer as sticker composition 2.As the film-forming properties polymer, can enumerate thermoplastic resins such as phenoxy resin, vibrin, polyamide resin.These film-forming properties polymers have the effect of slowing down the stress that produces when thermosetting resin cured.In addition, consider that from improving the cementability aspect preferred film-forming properties polymer contains functional groups such as hydroxyl.
For adhesive composition 30,, preferably contain solidifying agent such as latent curing agent as sticker composition 2.As solidifying agent, for example can use hardener for epoxy resin.As above-mentioned solidifying agent, can enumerate amine system, phenol system, acid anhydrides system, imidazoles system, hydrazides system, Dyhard RU 100, boron trifluoride-amine complex, sulfonium salt, salt compounded of iodine, aminimide etc.These solidifying agent can use a kind of separately, also can make up and use more than 2 kinds, can also sneak into decomposition accelerating agent, suppressor factor etc. and use.
As the near infrared absorbing coloring matter of maximum light absorption wavelength in 800～1200nm scope, can enumerate azo system, amine (aminium) and be, anthraquinone system, cyanine system, diimine system, side's acid system, naphthalene phthalocyanine system, phthalocyanine based compound etc.Can use a kind of or combination in these materials to use more than 2 kinds separately.At this moment, the maximum absorption wavelength of near infrared absorbing coloring matter can use commercially available spectrophotometer, measures through measuring spectrophotometric transmittance.
As the object lesson of near infrared absorbing coloring matter, can enumerate " YKR " series that Yamamoto Chemicals Co., Ltd makes, " EX Color " series that Nippon Shokubai Co., Ltd makes, " IRG " series that Nippon Kayaku K. K makes, " Epolight " series of EPOLIN manufactured etc.In these products; From high to the solvability of all kinds of SOLVENTS, have thermotolerance and photostabilization and near infrared ray absorbing and can consider excellent aspect, " YKR " series of especially preferably making, " EX Color " series that Nippon Shokubai Co., Ltd makes as the Yamamoto Chemicals Co., Ltd of phthalocyanine based compound.
The content of preferred near infrared absorbing coloring matter is 0.1～10 quality % based on all resins solid substance contained in the adhesive composition 30.If it contains quantity not sufficient 0.1 quality %, then the abundant irradiates light of absorption near infrared ray photogen causes easily solidifying and can not fully carry out.Also have, solidifying the degree of carrying out can judge through obtaining the curing reaction rate.For the curing reaction rate, can use DSC (differential scanning calorimetry), through measuring the thermal value before circuit connection material solidifies, the thermal value after the curing, obtain from both differences.From considering that with sufficient safety junction circuit member aspect the preferred consolidation reactivity is more than 80%.
On the other hand, if the content of near infrared absorbing coloring matter surpasses 10 quality %, then the light of near infrared range shines whole circuit connection materials unevenly, causes producing on the solid state inhomogeneous easily.In this case, be easy to generate the part that curing is not fully carried out.Also have, " the resin solid substance " in this specification sheets is meant the composition that under normal temperature (20 ℃), is insoluble to toluene.
In conductive adhesive layer 40, disperse to be used for giving energetically the conducting particles 1 of anisotropic conductive.Like this, through the dispersion of conducting particles 1,, also can make between the relative circuit electrode of direction and carry out electrically conducting with high reliability even existence such as the projection of the chip that is connected by circuit connection material 110 and electrode of substrate highly differ.
As conducting particles 1, for example can enumerate the particle with electroconductibility of metals such as containing Au, Ag, Ni, Cu, solder.Preferred conduction particle 1 has by molecular globose nucleus material of high scores such as PS and the lip-deep conductive layer of being made up of metals such as Au, Ag, Ni, Cu, solders of this nuclear matter.In addition, also can further have upper layers such as Sn, Au, solder on the conductive layer surface with electroconductibility of conducting particles 1.
The particle diameter of conducting particles 1 must be less than the minimum interval that is arranged at the circuit electrode on the same circuit member (on the same circuit member adjacent electrode space).In addition, under the height of these circuit electrodes situation devious, the particle diameter of preferred conduction particle 1 is greater than this height tolerance.Consider that from above-mentioned aspect the median size of preferred conduction particle 1 is 1～10 μ m, more preferably 2～5 μ m.If median size less than 1 μ m, then can not fully solve the height tolerance of circuit electrode, damage the sufficient conductivity between circuit electrode easily, if surpass 10 μ m, then damage the interelectrode abundant insulativity of adjacent circuit easily.
Conducting particles 1 content in the preferred conduction cohesive agent layer 40 is 0.1～30 volume % based on the TV of adhesive composition 30.If this containing ratio less than 0.1 volume %, the conducting particles number on the circuit electrode that is then connected reduces, and therefore contacts the deficiency of counting, and damages the sufficient conductivity between the circuit electrode that is connected easily.On the other hand, if this containing ratio surpasses 30 volume %, then the surface-area of conducting particles significantly increases, and conducting particles connects because of the secondary aggegation easily, damages the interelectrode abundant insulativity of adjacent circuit on the same circuit member easily.
The insulativity adhesive layer 50 that forming circuit connects material 110 is the layers with insulativity.For insulativity adhesive layer 50,, guarantee to have between the circuit electrode adjacent on the same substrate sufficient insulativity and (preferably make the insulating resistance value between adjacent electrode reach 1 * 10 as long as when making direction relatively the circuit member of configuration interconnecting
8More than the Ω), its composition has no particular limits, for example can be set at above-mentioned conductive adhesive layer 40 in the composition removed behind the conducting particles 1 identical.
Can further sneak into, disperse inorganic filling material and rubber particles in conductive adhesive layer 40 and the insulativity adhesive layer 50.These compositions can sneak into, disperse with conducting particles 1 and near infrared absorbing coloring matter.Also have, can in not containing the insulativity adhesive layer 50 of conducting particles 1, sneak into, disperse these compositions, but preferably in having the conductive adhesive layer 40 of conducting particles, sneak into, disperse these compositions.Through in adhesive composition 30, adding inorganic filling material and rubber particles; Can be so that the melt viscosity of the conductive adhesive layer 40 when relatively the circuit member of configuration interconnects; Compared with the melt viscosity of insulativity adhesive layer 50, can be improved more easily and fully.Thus, with the circuit member of configuration relatively when interconnecting, can suppress to be arranged on the electrode on the interarea of circuit member and flow out conducting particles.Therefore, can take into account high de-agglomeration ability and long-term connection reliability high-levelly.
As inorganic filling material, have no particular limits, for example can enumerate powders such as fused silica, crystalline silica, Calucium Silicate powder, aluminum oxide, lime carbonate.Consider that from preventing connecting portion poor flow aspect the median size of inorganic filling material is preferably below the 3 μ m.
When using inorganic filling material, its use level, in conductive adhesive layer 40 and insulativity adhesive layer 50 each layers, all reaching 32 all (100 mass parts) with adhesive composition 30 respectively is benchmark, is preferably 5～100 mass parts.Also have,, can improve the melt viscosity of conductive adhesive layer 40 and insulativity adhesive layer 50 through increasing the use level of inorganic filling material.
As the rubber particles that is scattered in conductive adhesive layer 40 and the insulativity adhesive layer 50, the preferred glass transition temperature is at the particle below 25 ℃.Specifically, preferably use divinyl rubber, acrylic rubber, styrene-butadiene-styrene rubber, nitrile-divinyl rubber, organo-silicone rubber etc.As rubber particles, preferably it has the median size of 0.1～10 μ m, and more preferably the particle below the median size accounts for more than 80% of size distribution.In addition, as rubber particles, more preferably it has the median size of 0.10～5 μ m.In addition, aspect improving dispersed adhesive composition, consider that the surface of preferred rubber particle is through the processing of silane coupling agent.
Organo-silicone rubber particle in the rubber particles also has excellent dispersiveness except that the solvent resistance excellence, therefore preferred the use.Also have; The organo-silicone rubber particle can be adjusted in the aqueous solution that pH is the alcohol more than 9 through adding silane compound or methyl trialkoxysilane and/or its partly hydrolysed condenses alkaline matters such as to using caustic soda, ammonia; Be hydrolyzed, the method for polycondensation, or the copolymerization of organo-siloxane etc. obtains.In addition, have functional groups such as hydroxyl, epoxy group(ing), ketoimine base, carboxyl, sulfydryl on the molecular end of organosilicon particle or the intramolecularly side chain, can improve its dispersiveness in adhesive composition thus.Therefore, preferably use this organosilicon particle.
When using rubber particles, its use level, in any one deck of conductive adhesive layer 40 and insulativity adhesive layer 50, with sticker composition 2 all be benchmark (100 mass parts), be preferably 5～50 mass parts.
In circuit connection material 110, the thickness of conductive adhesive layer 40 is preferably 3～15 μ m, more preferably 5～10 μ m.If this thickness less than 3 μ m then adopt when having the conducting particles of preferred median size, cause the formation property variation of conductive adhesive layer easily.On the other hand, if this thickness surpasses 15 μ m, then effusive conducting particles is many from the circuit electrode, cause being difficult to guarantee insulativity enough between the adjacent circuit electrode easily and the circuit electrode that connected between enough electroconductibility.
The thickness of preferred insulativity adhesive layer 50 is to be formed at below the summation of the thickness of first circuit electrode on the first substrate interarea and the thickness that is formed at the second circuit electrode on the second substrate interarea.If the thickness of insulativity adhesive layer 50 is greater than the summation of the thickness of the thickness of first circuit electrode and second circuit electrode; Then effusive conducting particles is many from the circuit electrode, cause being difficult to take into account the interelectrode insulativity of adjacent circuit easily high-levelly and the circuit electrode that connected between the electroconductibility of (direction relative circuit electrode between).
Preferably in circuit connection material 110, the melt viscosity of conductive adhesive layer 40 was higher than insulativity adhesive layer 50 when the circuit member of configuration interconnected relatively with direction.Melt viscosity when here, what is called connects is meant the melt viscosity under the Heating temperature when the circuit member that uses 110 pairs of directions of circuit connection material to dispose relatively connects.Also have, the temperature of the circuit connection material 110 the when circuit member that disposes is relatively interconnected can suitably be regulated according to the solidified nature of the sticker in the circuit connection material 110, for example in 120 ℃～250 ℃ scope.Therefore, in this TR, the melt viscosity of preferred conduction cohesive agent layer 40 is higher than the melt viscosity of insulativity adhesive layer 50.
Below, one of the method for manufacture of circuit connection material 110 example is described.
At first, preparation is used to form the coating fluid of conductive adhesive layer 40.Specifically, with sticker composition 2, conducting particles 1 and near infrared absorbing coloring matter 3 dissolvings or be dispersed in the organic solvent, carry out liquid stateization and be mixed with coating fluid.Consider that from the solvability aspect that improves material the solvent that uses this moment is preferably aromatic series hydrocarbon system and the mixed solvent that contains oxygen system.As sticker composition 2, except thermosetting resin, can also contain solidifying agent, film-forming properties polymers etc. such as latent curing agent.
Then, this coating fluid is coated on the common separability base material (supporting film), following the removing of activation temperature that is heated to solidifying agent desolvated, thereby on supporting film, forms the conductive adhesive layer of being made up of adhesive composition 30 40.Also have,, preferably use and passed through surface-treated PET film etc. in order to have release property as the separability base material.
For insulativity adhesive layer 50,, can form according to the mode identical with the formation method of conductive adhesive layer 40 except not allocating into the conducting particles.
Through will be according to the method described above formed conductive adhesive layer 40 and insulativity adhesive layer 50 carry out method that layer closes or the known methods such as method that apply each layer successively, can make by conductive adhesive layer 40 and the insulativity adhesive layer that do not contain conducting particles and close the circuit connection material 110 that forms for 50 layers.
Syndeton to using the circuit member that circuit connection material 110 that above-mentioned embodiment relates to forms describes.
Fig. 4 is the schematic cross-section of a preferred implementation of the syndeton body of the circuit member that the present invention relates to of expression.As syndeton body 200, first circuit member 10 with first substrate 11 and first circuit electrode 12 is connected through circuit connecting section 150 with the second circuit member 20 with second substrate 21 and second circuit electrode 22.First circuit electrode 12 is formed on the face (interarea) of first substrate 11, and second circuit electrode 22 is formed on the face (interarea) of second substrate 21.Like this, for first circuit member 10 and second circuit member 20, first circuit electrode 12 is connected with the relative mode of direction with second circuit electrode 22.Circuit connecting section 150 is made up of the resin cured matter of resin combination 30,32, and this resin cured matter contains resinous principle 5, conducting particles 1 and near infrared absorbing coloring matter 3.
That is, in the circuit connecting section 150 of syndeton body 200, on the relative direction of first circuit member 10 and second circuit member 20, carry out layer by the mutually different a plurality of resin cured matter layers of the content of conducting particles 1 and close.
In syndeton body 200, the first relative circuit electrode 12 is electrically connected through conducting particles 1 with second circuit electrode 22.Also have, do not contain in circuit connecting section under the situation of conducting particles, the circuit electrode directly contact each other that direction is relative, thus the circuit member that direction is disposed relatively is electrically connected.
As the object lesson of first circuit member 10 and second circuit member 20, can enumerate glass substrate that ITO of using in the liquid-crystal display etc. formed electrode, plastic base, PC board, ceramic wiring board, FPC, semiconductor wafers etc.There is high spectrophotometric transmittance aspect to consider from light, preferred glass substrate and plastic base wherein to wavelength 800～1200nm.Also can make up as required and use these substrates.In addition, the surface of first circuit member 10 and second circuit member 20 also can have metals such as copper, aluminium or ITO (indium tin oxide, tin indium oxide), silicon nitride (SiNx), silicon-dioxide (SiO
2) wait the inorganic layer.
One of the method for manufacture of syndeton body 200 example is described.
At first, first circuit electrode 12 is opposed each other with second circuit electrode 22, make circuit connection material 110 between first circuit member 10 and second circuit member 20.Specifically, for example will be formed at circuit connection material 110 on the separability base material is fitted on the face that the second circuit electrode 22 of second circuit member 20 forms.Heating and pressurizing is pressed together on circuit connection material 110 on the second circuit member 20 temporarily in this state.Then; Peel off the separability base material from circuit connection material 110; Second circuit member 10 is loaded on the circuit connection material 110, makes by second circuit member 20, circuit connection material 110 and first circuit member 10 and carry out the laminate that layer closes in this order in that first circuit electrode 12 and second circuit electrode position 22 are put under the situation of alignment.
Then, from the below of second circuit member 20, the light of promptly opposite with circuit connection material 110 1 sides of second circuit member 20 side irradiation near infrared range pressurizes to second circuit member 20 directions to first circuit member 10.Thus, circuit connection material 110 solidifies, and first circuit member 10 forms with second circuit member 20 and is connected, and first circuit electrode 12 forms with second circuit electrode 22 and is electrically connected simultaneously, can obtain syndeton body 200.Also have, the spectrophotometric transmittance of the light in preferred 20 couples of wavelength 800～1200nm of second circuit member scope is more than 50%.Therefore, preferred second substrate 21 is glass substrate or plastic base.
Can suitably regulate with the above-mentioned laminate of the rayed of near infrared range and the condition of pressurizeing, so that circuit connection material 110 solidifies and obtains enough bonding strengths.Also have, the time of pressurization and irradiation near infrared range light needn't limit, as long as in the light time of irradiation near infrared range, first circuit member 10 gets final product on circuit connection material 110 with the driving fit of second circuit member.In addition, the light time of irradiation near infrared range, preferably use pressing instrument etc. simultaneously, laminate is heated to for example 120～250 ℃.Thus, the circuit member of relative configuration is connected more effectively.
Also have, when syndeton body 200 and method of manufacture thereof are described, though the situation that is to use circuit connection material 110 of explanation also can be used circuit connection material 100 or 120 replacement circuit connection materials 110.
More than preferred implementation of the present invention is illustrated, but the present invention does not receive the qualification of above-mentioned embodiment.For example, circuit connection material of the present invention can be the membranaceous form shown in Fig. 1～3, also can be paste-like.Also have, the circuit connection material that this embodiment relates to is applicable to being connected of electronic units such as the connection between the circuit substrate, IC chip and wiring substrate etc.
Embodiment
Below the present invention is explained more specifically that but the present invention never receives the qualification of following examples based on embodiment and comparative example.
Embodiment 1
With phenoxy resin (Union Carbide Corporation's system; Trade(brand)name PKHC) 32 mass parts, in bisphenol A type epoxy resin, disperse vinylformic acid (ア Network リ Le) particle (20 quality %; Median size 0.2 μ m) resin that contains acrylic particles (the Nippon Shokubai Co., Ltd's system that forms; Trade(brand)name: BPA328) 10 mass parts, bisphenol A type epoxy resin (oiling Shell Epoxy Co., Ltd. system; Trade(brand)name: YL980) 20 mass parts, imidazoles are solidifying agent (Asahi Kasei Corporation's system; Trade(brand)name: NOVACURE HX-3941) 34 mass parts, as near infrared absorbing coloring matter (Nippon Shokubai Co., Ltd's system of phthalocyanine based compound; Trade(brand)name: EX Color HA-1) 1 mass parts and silane coupling agent (Japan Unicar Co., Ltd. system, trade(brand)name: A187) 3 mass parts are dissolved in the toluene as solvent, the insulativity adhesive layer that obtains the resin solid substance and be 50 quality % forms uses coating fluid A.The proportioning of each raw material is illustrated in the table 1.
Then; With apparatus for coating this insulativity adhesive layer formation being coated on the thickness that has applied demoulding processing on the single face (applying the face of coating fluid) with coating fluid A is on the PET film of 50 μ m; 70 ℃ of following warm air dryings 10 minutes, be the insulativity adhesive layer (a) of 13 μ m thereby on the PET film, form thickness.
Then; With phenoxy resin (Union Carbide Corporation's system; Trade(brand)name PKHC) 32 mass parts, in bisphenol A type epoxy resin, disperse acrylic particles (20 quality %; Median size 0.2 μ m) resin that contains acrylic particles that forms (Nippon Shokubai Co., Ltd's system, trade(brand)name: BPA328) 20 mass parts, imidazoles be solidifying agent (Asahi Kasei Corporation's system, trade(brand)name: NOVACURE HX-3941) 34 mass parts, as near infrared absorbing coloring matter (Nippon Shokubai Co., Ltd's system of phthalocyanine based compound; Trade(brand)name: HA-1) 1 mass parts, silane coupling agent (Japan Unicar Co., Ltd. system; Trade(brand)name: A187) 3 mass parts and organo-silicone rubber (Toray Dow Corning Co., Ltd. system, trade(brand)name: EP2100) 30 mass parts are dissolved in the toluene as solvent, being mixed with solid substance is the binder liquid B of 50 quality %.The proportioning of each raw material is illustrated in the table 1.
With conducting particles (the Sekisui Chemical Co., Ltd's system that has formed Ni and Au layer on PS karyoid (the diameter 3 μ m) surface; Trade(brand)name: Micropearl AU; Median size: 3.2 μ m; Outermost layer: AU) 20 mass parts are dispersed among this binder liquid B of 100 mass parts, obtain the formation of conductive adhesive layer and use coating fluid.
With apparatus for coating this conductive adhesive layer formation being coated on the thickness that has applied demoulding processing on the single face (applying the face of coating fluid) with coating fluid is on the PET film of 50 μ m; 70 ℃ of following warm air dryings 10 minutes, be the conductive adhesive layer (b) of 10 μ m thereby on the PET film, form thickness.
With the insulativity adhesive layer (a) and the conductive adhesive layer (b) that are formed at respectively on the PET film; Mode according to insulativity adhesive layer (a) is contacted with conductive adhesive layer (b) is heated to 40 ℃; Carry out lamination with the roll-type laminating machine simultaneously; The thickness that obtains insulativity adhesive layer (a) is 13 μ m, and the thickness of conductive adhesive layer (b) is the circuit connection material of 2 layers of structure of 10 μ m.This circuit connection material has by adhesive layer that contains conducting particles and the sticker that do not contain conducting particles and closes the structure that forms layer by layer.
Use this circuit connection material; Connect by the following stated mode and to have golden projection (area: 30 * 50 μ m; Bump height: 15 μ m; 500 μ m) and on a face of glass substrate, formed band ITO circuit glass substrate (the ITO circuit thickness: 0.15 μ m, thickness of glass substrate: 0.5mm) of ITO circuit number of lugs: chip 300) (1.2 * 19mm, thickness:.
Through at 80 ℃, 0.98MPa (10kgf/cm
2) condition under heating and pressurizing 1 second, (circuit connection material of 2 layers of structure of 1.5 * 20mm) sticks on the glass substrate of band ITO circuit, obtains laminate will to cut into predetermined size.Also have, after this moment the PET film on the conductive adhesive layer (b) being peeled off, be bonded in the mode on the ITO circuit, circuit connection material is sticked on the glass substrate of band ITO circuit according to the conductive adhesive layer (b) of the circuit connection material that makes 2 layers of structure.
Then; Stripper circuit connects the PET film of insulativity adhesive layer (a) side of material; Make with the projection of golden projection chip glass substrate aligned in position, from the light of the glass substrate one side irradiation near infrared range of the band ITO circuit of above-mentioned laminate, make the insulativity adhesive layer (a) of the face with projection of chip simultaneously then towards circuit connection material with band ITO circuit; Pressurize with the pressing instrument, thereby laminate is connected with the chip that has golden projection fully.Thus, can obtain the syndeton body that the glass substrate of chip and band ITO circuit is connected to form through circuit connection material.The condition that connects fully is a Heating temperature: 230 ℃, and moulding pressure: 40g/ projection, heating and pressurizing time: 3 seconds.It is the semiconductor laser of 904nm that near infrared irradiation is to use wavelength, and the employing light quantity is 2.5W/mm
2Near infrared light implement.Also have, above-mentioned Heating temperature (230 ℃) temperature of circuit connection material when being heating and pressurizing is the temperature that reaches through the near infrared ray irradiation.
[mensuration of curing reaction rate]
According to the method for the following stated, obtain the above-mentioned curing reaction rate of circuit connection material when connecting fully.At first, use DSC (differential scanning calorimetry) to measure the thermal value before and after connecting fully respectively, use this mensuration result and utilize following formula (1) to calculate.Calculation result is shown in Table 3.Also have, the thermal value after connecting fully is the circuit connecting section branch of the syndeton body after connecting to be taken a sample measure.
Curing reaction rate (%)=(Q
0-Q
T)/Q
0* 100 (1)
[in the formula (1), Q
0Be the thermal value before connecting fully, Q
TIt is the thermal value after connecting fully.]
Then, at 85 ℃, the environment of 85%RH was preserved 1000 hours down with the syndeton body that obtains.After the preservation, measure connection resistance value and amount of warpage like the following stated.The result is shown in Table 3.
[mensuration that connects resistance value]
Whether use digital multimeter, adopt 4 terminal methods to be determined at the connection resistance value of per 1 projection of the syndeton body after preserving under the above-mentioned environment, it is good to estimate conduction.The connection resistance value of all projections is that 20 Ω are evaluated as " A " when following, is evaluated as " B " when resistance value surpasses the projection of 20 Ω if include to connect.
[mensuration of amount of warpage]
Use surface shape measuring machine ((strain) little Ban Yanjiusuoshe system; Trade(brand)name: surface roughness measurement machine/SE3500), be determined at the maximum amount of warpage at the syndeton body top glass substrate back side (dividing the surface of that opposite side of a side) after preserving under the above-mentioned environment with the circuit connecting section of the glass substrate of being with ITO.Its result is shown in Table 3.
With near infrared absorbing coloring matter (the Nippon Shokubai Co., Ltd's system among coating fluid A and the binder liquid B; Trade(brand)name: use level EX Color HA-1) is set at 0.1 mass parts respectively; In addition by preparing the circuit connection material of 2 layers of structure, make the syndeton body with embodiment 1 identical mode.Then by estimating with embodiment 1 identical mode.The proportioning of each raw material is illustrated in the table 1, and evaluation result is shown in Table 3.
With (the Nippon Shokubai Co., Ltd's system of the near infrared absorbing coloring matter among the coating fluid A; Trade(brand)name: use level EX Color HA-1) is set at 9.6 mass parts; With (the Nippon Shokubai Co., Ltd's system of the near infrared absorbing coloring matter among the binder liquid B; Trade(brand)name: use level EX Color HA-1) is set at 8.6 mass parts, in addition by preparing the circuit connection material of 2 layers of structure with embodiment 1 identical mode, makes the syndeton body.Then by estimating with embodiment 1 identical mode.The proportioning of each raw material is illustrated in the table 1, and evaluation result is shown in Table 3.
Comparative example 1
With near infrared absorbing coloring matter (the Nippon Shokubai Co., Ltd's system among coating fluid A and the binder liquid B; Trade(brand)name: use level EX ColorHA-1) is set at 0.03 mass parts; In addition by preparing the circuit connection material of 2 layers of structure, make the syndeton body with embodiment 1 identical mode.Then by estimating with embodiment 1 identical mode.The proportioning of each raw material is illustrated in the table 2, and evaluation result is shown in Table 3.
Comparative example 2
With near infrared absorbing coloring matter (the Nippon Shokubai Co., Ltd's system among coating fluid A and the binder liquid B; Trade(brand)name: use level EX Color HA-1) is set at 15 mass parts; In addition by preparing the circuit connection material of 2 layers of structure, make the syndeton body with embodiment 1 identical mode.Then, use the circuit member identical, under same condition, connect with embodiment 1.Then by estimating with embodiment 1 identical mode.The proportioning of each raw material is illustrated in the table 2, and evaluation result is shown in Table 3.
Comparative example 3
By preparing the circuit connection material of 2 layers of structure and obtain laminate with embodiment 1 identical mode.Then with laminate when chip with golden projection is connected fully; Do not shine the light of near infrared range, use the pressing instrument to carry out heating and pressurizing, thereby carry out laminate and being connected fully with the chip of golden projection; In addition, by connecting fully with embodiment 1 identical mode.Thus, obtained connecting the syndeton body that the glass substrate of chip and band ITO circuit forms through circuit connection material.The condition that connects fully is a Heating temperature: 230 ℃, and moulding pressure: 40g/ projection, heating and pressurizing time: 3 seconds.Then by estimating with embodiment 1 identical mode.The proportioning of each raw material is illustrated in the table 2, and evaluation result is shown in Table 3.
Comparative example 4
Except not allocating near infrared absorbing coloring matter into, be that (Asahi Kasei Corporation's system, trade(brand)name: use level NOVACURE HX-3941) is set at outside 35 mass parts solidifying agent, by preparing coating fluid A and binder liquid B with embodiment 1 identical mode with imidazoles.Then, by preparing the circuit connection material of 2 layers of structure, make the syndeton body, and estimate with embodiment 1 identical mode.The proportioning of each raw material is illustrated in the table 2, and evaluation result is shown in Table 3.
Table 1
※ 1: the expression near infrared absorbing coloring matter is with respect to the ratio (quality %) of resin solid substance.
Table 2
※ 1: the expression near infrared absorbing coloring matter is with respect to the ratio (quality %) of resin solid substance.
Table 3
| Connect resistance value (peak) | Curing reaction rate (%) | Maximum amount of warpage (μ m) | |
| Embodiment 1 | A(10Ω) | 90 | ?3 |
| Embodiment 2 | A(13Ω) | 81 | ?2 |
| Embodiment 3 | A(12Ω) | 98 | ?3 |
| Comparative example 1 | B (open circuit) | 58 | ?3 |
| Comparative example 2 | B(35Ω) | 86 | ?3 |
| Comparative example 3 | B(28Ω) | 90 | ?11 |
| Comparative example 4 | B (open circuit) | 35 | ?2 |
In the table, so-called open circuit is more than expression 1000 Ω (the mensuration upper limit).
The result shows shown in the table 3, use with respect to all resins solid substance contain 0.1～10 quality % in 800～1200nm optical wavelength range, have the circuit connection material of the near infrared absorbing coloring matter of maximum absorption wavelength, connection resistance value and the curing reaction rate of solidified syndeton body after humidity test is well through the irradiation of near infrared light.In addition, can confirm that the syndeton body also has little amount of warpage.
On the other hand, use when not containing the circuit connection material (comparative example 4) of near infrared absorbing coloring matter, can confirm connection resistance value, curing reaction rate variance after the humidity test.In addition, for the circuit connection material that contains quantity not sufficient 0.1 quality % (comparative example 1) of near infrared absorbing coloring matter, also can confirm connection resistance value, curing reaction rate variance after the humidity test.And, for the content of near infrared absorbing coloring matter circuit connection material (comparative example 2), also can confirm connection resistance value, curing reaction rate variance after the humidity test more than 10 quality %.
In addition; Contain the syndeton body (comparative example 3) that in 800～1200nm optical wavelength range, has the circuit connection material of the near infrared absorbing coloring matter of maximum absorption wavelength, only adhesive composition is solidify to form of thermosetting resin, conducting particles and 0.1～10 quality % for use, can confirm that connection resistance value difference, the linker amount of warpage after humidity test is also big through pressing instrument heating.Owing to use the pressing instrument from circuit member one side (with the chip of golden projection) heating, the amount of warpage of linker is big like this.
Can be confirmed that by above result the circuit connection material of the application of the invention can make between the circuit member to connect effectively at short notice, the connection reliability of resulting syndeton body is excellent, has reduced the amount of warpage of syndeton body fully.
Industrial applicibility
According to the present invention, can with high de-agglomeration the electrode of relative configuration be interconnected at short notice, can provide connection reliability very excellent circuit connection material.In addition, connect, the syndeton body of high reliability can be provided and possess the method for manufacture of the syndeton body of above-mentioned characteristic through using sort circuit to connect material.That is, connect material in a circuit according to the invention, can circuit member interconnected or electronic units such as IC chip are connected with circuit member, can obtain the syndeton body that receives abundant inhibition of thermal expansion and thermal contraction.Thus, can provide fully being reduced of warpage, connection reliability very excellent syndeton body.
Claims (3)
1. an adhesive composition is as the application of circuit connection material; This circuit connection material is used at first circuit member that has formed first circuit electrode on the interarea of first substrate with on the interarea of second substrate, formed the second circuit member of second circuit electrode; Be connected making under above-mentioned first circuit electrode state relative with above-mentioned second circuit electrode
Above-mentioned adhesive composition comprises the near infrared absorbing coloring matter of maximum light absorption wavelength in 800～1200nm scope;
Above-mentioned near infrared absorbing coloring matter is the phthalocyanine based compound;
The content of above-mentioned near infrared absorbing coloring matter is 0.1～10 quality % with respect to all resins solid substance of above-mentioned adhesive composition;
Above-mentioned adhesive composition contains epoxy resin and imidazoles is the mixture of latent curing agent.
2. the application of adhesive composition according to claim 1, above-mentioned adhesive composition contains conducting particles.
3. the application of adhesive composition according to claim 1, above-mentioned adhesive composition contains the film-forming properties polymer.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-261994 | 2007-10-05 | ||
| JP2007261994 | 2007-10-05 | ||
| JP2008-026731 | 2008-02-06 | ||
| JP2008026731A JP4978493B2 (en) | 2007-10-05 | 2008-02-06 | Circuit connection material, connection structure and manufacturing method thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801101981A Division CN101816221B (en) | 2007-10-05 | 2008-09-26 | Circuit connecting material, circuit connection structure, and method for producing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102382594A true CN102382594A (en) | 2012-03-21 |
Family
ID=40706735
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102225114A Pending CN102382594A (en) | 2007-10-05 | 2008-09-26 | Application of adhesive compond |
| CN2008801101981A Expired - Fee Related CN101816221B (en) | 2007-10-05 | 2008-09-26 | Circuit connecting material, circuit connection structure, and method for producing the same |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801101981A Expired - Fee Related CN101816221B (en) | 2007-10-05 | 2008-09-26 | Circuit connecting material, circuit connection structure, and method for producing the same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4978493B2 (en) |
| KR (1) | KR20090052303A (en) |
| CN (2) | CN102382594A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111094486A (en) * | 2017-09-11 | 2020-05-01 | 日立化成株式会社 | Adhesive film housing module and method for manufacturing same |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011062963A (en) * | 2009-09-18 | 2011-03-31 | Canon Inc | Manufacturing method of liquid discharging head |
| CN102905473B (en) * | 2011-07-29 | 2017-06-06 | 富泰华工业（深圳）有限公司 | The preparation method of circuit board and circuit board |
| CN203134782U (en) * | 2011-10-26 | 2013-08-14 | 日立化成株式会社 | Circuit component |
| CN105144422B (en) | 2013-03-25 | 2019-05-10 | 大日本印刷株式会社 | Battery use packing material |
| JP6425899B2 (en) * | 2014-03-11 | 2018-11-21 | デクセリアルズ株式会社 | ANISOTROPIC CONDUCTIVE ADHESIVE, METHOD FOR MANUFACTURING CONNECTION AND METHOD FOR CONNECTING ELECTRONIC COMPONENTS |
| CN107001865B (en) * | 2014-11-12 | 2020-08-21 | 迪睿合株式会社 | Photocurable anisotropic conductive adhesive, method for producing connected body, and method for connecting electronic component |
| JP2017179128A (en) * | 2016-03-30 | 2017-10-05 | Jnc株式会社 | Cured article of thermosetting resin composition, substrate having cured article and manufacturing method of electronic component |
| JP2017185086A (en) * | 2016-04-07 | 2017-10-12 | オリンパス株式会社 | Medical device and thermosetting type adhesive for medical device |
| JP6428841B2 (en) * | 2017-04-26 | 2018-11-28 | 大日本印刷株式会社 | Battery packaging materials |
| CN109082262B (en) * | 2018-08-13 | 2020-11-03 | 广东泰强化工实业有限公司 | Infrared fast-curing water-based organic adhesive based on CuS photo-thermal conversion mechanism and coating method |
| WO2024070436A1 (en) * | 2022-09-28 | 2024-04-04 | 綜研化学株式会社 | Anisotropic conductive material, anisotropic conductive sheet, anisotropic conductive paste, connection structure, and method for producing connection structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4867069B2 (en) * | 2000-12-28 | 2012-02-01 | 日立化成工業株式会社 | Adhesive composition, circuit terminal connection method using the same, and circuit terminal connection structure |
| JP4788038B2 (en) * | 2000-12-28 | 2011-10-05 | 日立化成工業株式会社 | Adhesive composition, circuit terminal connection method using the same, and circuit terminal connection structure |
| JP2004160676A (en) * | 2002-11-08 | 2004-06-10 | Hitachi Chem Co Ltd | Electromagnetic wave shielding laminate having near infrared shielding property and its manufacturing method |
| JP4389471B2 (en) * | 2003-05-19 | 2009-12-24 | パナソニック株式会社 | Electronic circuit connection structure and connection method |
| JP2005320491A (en) * | 2004-05-11 | 2005-11-17 | Hitachi Chem Co Ltd | Adhesive composition, film-like adhesive and circuit connecting material using the same, connecting structure of circuit member and its manufacturing method |
| JP2006199778A (en) * | 2005-01-19 | 2006-08-03 | Hitachi Chem Co Ltd | Adhesive composition, adhesive for use in circuit connection, method for connecting circuits using the same, and connected body |
| EP1907498A1 (en) * | 2005-05-10 | 2008-04-09 | Nippon Shokubai Co.,Ltd. | Pressure-sensitive adhesive composition comprising near infrared ray absorption agent |
| WO2007023834A1 (en) * | 2005-08-23 | 2007-03-01 | Bridgestone Corporation | Adhesive composition |
-
2008
- 2008-02-06 JP JP2008026731A patent/JP4978493B2/en not_active Expired - Fee Related
- 2008-09-26 CN CN2011102225114A patent/CN102382594A/en active Pending
- 2008-09-26 KR KR1020087029026A patent/KR20090052303A/en not_active Application Discontinuation
- 2008-09-26 CN CN2008801101981A patent/CN101816221B/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111094486A (en) * | 2017-09-11 | 2020-05-01 | 日立化成株式会社 | Adhesive film housing module and method for manufacturing same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101816221A (en) | 2010-08-25 |
| KR20090052303A (en) | 2009-05-25 |
| JP4978493B2 (en) | 2012-07-18 |
| JP2009105361A (en) | 2009-05-14 |
| CN101816221B (en) | 2011-09-21 |
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Application publication date: 20120321 |