JP2011062963A - Manufacturing method of liquid discharging head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a liquid discharging head capable of alleviating deformation caused by thermal expansion upon the bonding of an ink feed member with a recording element substrate and capable of alleviating misalignment upon the bonding of the recording element substrate. <P>SOLUTION: In the method, the recording element substrate 002 for discharging liquid and the liquid feed member for feeding the liquid to the recording element substrate 002 are coupled with an adhesive agent which contains at least an infrared ray absorbing agent and is hardened by an ion polymerization reaction mechanism, and the recording element substrate 002 includes a silicon substrate 008 to make the adhesive agent irradiated with light including at least an ultraviolet region to an infrared region pass through a filter composed of silicon. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a liquid discharge head that discharges liquid. Specifically, the present invention relates to a method for manufacturing an ink jet recording head that performs recording by discharging ink onto a recording medium.

  In general, as a recording method of an ink jet recording apparatus, a so-called non-impact recording method is adopted in which recording is performed by discharging ink to a recording medium from an ink discharge port of an ink jet recording head.

  An ink jet recording head employed in an ink jet recording apparatus employing this non-impact recording method and a method for manufacturing the same are disclosed in Patent Document 1. This is as follows.

  First, a recording element substrate provided with an energy generating element that generates energy used for ejecting ink and an ink ejection port is prepared. Next, an adhesive is applied in advance to a predetermined position of the recording element substrate. Next, after aligning the ink supply member made by resin molding for supplying ink to the recording element substrate and the recording element substrate, the recording element substrate and the ink supply member are bonded together with an adhesive. . Then, the adhesive is temporarily cured with UV light and is completely cured by thermal curing.

JP 2009-61710 A

  Since the ink supply member is generally made of a thermoplastic resin, if the curing temperature of the adhesive is experienced, the recording element substrate is deformed or the mounting accuracy is reduced due to the difference in the linear expansion coefficient between the recording element substrate and the ink supply member. There is a case.

  More specifically, the heating temperature for curing the adhesive varies depending on the type of the adhesive, but is generally about 80 to 120 ° C. The heating causes the adhesive to contract when the adhesive is cured, the recording element substrate to expand, and further the ink supply member to expand. For this reason, for example, when the length of the recording element substrate is 1 inch, it is conceivable that the recording element substrate is relatively expanded or contracted by about 7 to 30 μm from the position where the recording element substrate is aligned with the ink supply member. Due to such expansion and contraction due to heating, the position of the recording element substrate of the ink jet recording head may deviate from the position aligned in the vertical and horizontal directions. When this deviation becomes large, the assembly accuracy is lowered when the ink jet recording head is mounted on the printer body, the landing position of the ink droplet is affected, and the print quality may be lowered.

  Accordingly, it is an object of the present invention to provide a method of manufacturing a liquid discharge head that can reduce deformation due to thermal expansion during adhesion of an ink supply member and a recording element substrate, and can reduce positional deviation when the recording element substrate is attached. .

Therefore, the present invention provides
In this method, a recording element substrate that discharges a liquid and a liquid supply member that supplies the liquid to the recording element substrate are connected using an adhesive that contains at least an infrared absorber and is cured by an ion polymerization reaction mechanism. And
The recording element substrate includes a silicon substrate;
A method of manufacturing a liquid discharge head, wherein the adhesive is irradiated with light including at least ultraviolet to infrared regions through a filter made of silicon.

  In the prior art, when irradiating light to an adhesive containing an infrared absorber to promote curing, ultraviolet light contained in the irradiated light or light in a part of the wavelength region of the infrared light heats the recording element substrate. In some cases, a pasting error due to expansion may increase. In particular, when the recording element substrate includes a silicon substrate, silicon mainly has a property of absorbing light in the ultraviolet light or a part of the wavelength region of infrared light, and thus the recording element substrate is easily heated.

  Therefore, in the present invention, light obtained by passing light including at least ultraviolet to infrared region through a filter made of silicon is used for the curing reaction of the adhesive. As shown in FIG. 4, silicon mainly has a property of reducing ultraviolet light, so that ultraviolet light can be reduced by passing light through a filter made of silicon. By using light with reduced ultraviolet light and containing infrared light, the curing reaction can be promoted by irradiating the adhesive with infrared light while preventing heating of the recording element substrate including the silicon substrate. Therefore, according to the present invention, expansion due to heating of the recording element substrate can be reduced, and the recording element substrate and the liquid supply member can be effectively bonded using the adhesive containing the infrared absorber.

  According to the present invention, it is possible to provide a method for manufacturing a liquid discharge head that can reduce deformation due to thermal expansion when the liquid supply member and the recording element substrate are bonded, and can reduce positional deviation when the recording element substrate is attached.

  More specifically, at the time of bonding and fixing between the recording element substrate and the liquid supply member, by irradiating light with reduced ultraviolet light by a filter made of silicon, not the recording element substrate and the liquid supply member but bonding The agent can be heated effectively. Therefore, the deformation amount due to thermal expansion of the recording element substrate and the liquid supply member can be reduced, and the bonding accuracy of the recording element substrate is excellent. Therefore, the required bonding accuracy can be obtained even when the recording element substrate is lengthened and the nozzle density is increased.

It is a schematic diagram explaining the structural example of the inkjet recording head manufactured by this invention. It is a schematic diagram explaining the structural example (ink supply joined body, recording element board | substrate) of the inkjet recording head manufactured by this invention. It is a schematic diagram explaining the method of performing adhesive agent hardening with a xenon flash lamp. It is a graph which shows the relationship of absorption with respect to the wavelength of the light of a silicon plate.

  Hereinafter, the configuration requirements of the present invention will be described.

(filter)
The filter used in the present invention is made of silicon. Silicon has an absorption curve as shown in FIG. 4, and mainly absorbs light in the ultraviolet region. FIG. 4 is a graph showing the relationship of absorption with respect to the wavelength of light in a crystalline silicon plate (thickness: about 50 μm). The wavelength of ultraviolet light is generally said to be about 10 to 400 nm. The wavelength of infrared light (hereinafter also referred to as infrared light) is generally said to be about 0.7 μm (or 770 nm) to 1 mm. As shown in FIG. 4, silicon absorbs light having a wavelength of 1.3 μm or less, and particularly effectively absorbs light of 1.0 μm or less. Therefore, it is possible to effectively reduce ultraviolet light (hereinafter also referred to as ultraviolet light) included in the irradiation light for promoting the curing of the adhesive. The filter is preferably a silicon plate, and preferably has a certain thickness. In the present invention, the recording element substrate includes a silicon substrate. For example, a coating resin layer and an orifice plate are formed on the silicon substrate.

  The temperature of the silicon substrate irradiated with light rises, and this temperature rise causes expansion. Therefore, by using silicon as a filter, infrared light for curing the adhesive is effectively reduced while effectively reducing a part of ultraviolet light and infrared light that cause heating of silicon contained in the recording element substrate. The adhesive containing the infrared absorbing agent can be effectively heated by permeation.

  The thickness of the silicon plate used as a filter is preferably 50 to 200 μm. By setting it within this range, the adhesive can be heated more selectively, the temperature rise of the recording element substrate can be prevented, and the difference in linear expansion between the liquid supply member and the recording element substrate and the stress distortion due to the temperature rise and fall can be preferably suppressed. .

(adhesive)
The adhesive used in the present invention is an adhesive that contains an infrared absorber and is cured by an ionic polymerization reaction mechanism. By including an infrared absorber in the adhesive, the absorption efficiency of infrared light (infrared rays) can be increased, and the adhesive can be cured in a short time. In addition, if an adhesive that cures by an ion polymerization reaction mechanism is used as the adhesive, adhesion in a short time becomes possible. As an adhesive that cures by an ion polymerization reaction mechanism, for example, a UV cationic epoxy adhesive can be preferably exemplified. Among UV cationic epoxy adhesives, a delayed curing type UV cationic epoxy adhesive is effective. Since the UV cationic epoxy adhesive is cured by an ion polymerization reaction mechanism, the UV cationic epoxy adhesive is quickly cured at a predetermined temperature and can be bonded in a short time.

  The content of the infrared absorber (including the near infrared absorber) is preferably in the range of 0.01 to 5% by mass. By setting the content within this range, infrared absorption efficiency can be increased.

  The infrared absorber is not particularly limited as long as it is a material that absorbs infrared light. Further, from the relationship with the absorption wavelength region of the filter made of silicon, those that absorb infrared light of 1.0 μm or more are preferable, and those that absorb infrared light of 1.3 μm or more are more preferable. Examples of infrared absorbers include cyanine compounds, phthalocyanine compounds, naphthalocyanine compounds, naphthoquinone compounds, anthraquinone compounds, onium compounds, nickel complexes, and diimoniums. Moreover, these can be used 1 type or in mixture of 2 or more types.

(light source)
In the present invention, the light source is not particularly limited, but at least a light source that emits infrared light can be used. In particular, a halogen lamp or a xenon lamp capable of giving large energy instantaneously and shortening the curing reaction is preferable. These lamps emit infrared light and ultraviolet light.

  Infrared light (or infrared light) is a type of electromagnetic wave having a wavelength longer than that of visible light, and refers to light having a wavelength range of about 1,000 μm (1 mm) from the visible light end (about 770 nm). In the present invention, the curing reaction is promoted by irradiating the adhesive with this infrared light. Infrared rays are classified into near infrared rays, middle infrared rays, and far infrared rays depending on the wavelength, but in the present invention, near infrared rays and middle infrared rays having a wide light distribution range are preferable, although depending on the type of infrared absorber contained in the adhesive. .

  In particular, since long wave infrared rays having a wavelength of 1.3 μm or more are transmitted through a silicon substrate constituting at least a part of the recording element substrate, if the infrared rays in the wavelength region are used, the adhesive hardly raises the temperature of the recording element substrate. Can be cured. In order to prevent the recording element substrate from warming due to the temperature rise of the adhesive, it is desirable that the infrared light source be an extremely strong light source. In general, a lamp that can reach a predetermined temperature at several tens of mSEC to several hundreds of mSEC, such as a halogen flash lamp or a xenon flash lamp, can be suitably used.

  The present invention is particularly effective when such a lamp having a high light emission output is used. Ultraviolet rays generated from the lamp are reduced by a filter to prevent the temperature rise of the recording element substrate.

  In the case of such a high output lamp, when an infrared ray or ultraviolet ray having a wavelength absorbed by the recording element substrate is cut using a short wavelength cut filter, the filter is instantaneously destroyed. In the case of a silicon plate, since it has a heat resistance of 800 ° C. or higher and has a high thermal conductivity, it is not destroyed even if it absorbs infrared rays from a high-power lamp. In addition, since infrared rays having a short wavelength of 1.3 μm or less that are not desired to be irradiated on the recording element substrate are effectively absorbed, the temperature rise of the recording element substrate can be effectively prevented. By optimizing the lamp output and light emission conditions, the thickness of the silicon plate, and the amount of infrared absorber added to the adhesive, it becomes possible to cure the adhesive with almost no heating of the recording element substrate. The accuracy can be greatly improved. In addition, when performing a method of irradiating light from a lamp continuously for a long time so that the irradiated object is replaced, it is necessary to pay attention to the temperature rise of the silicon plate. Therefore, if it is difficult to prepare a thick silicon substrate, a plurality of thin silicon plates may be prepared, and the thin silicon plate may be replaced when the temperature of the silicon plate becomes high. In addition, the silicon plate can be cooled by air cooling, water cooling, or other cooling tools during irradiation.

(Recording element substrate)
As a configuration of the recording element substrate, for example, a structure in which a liquid flow path including a heating element, a metal wiring pattern, and a photosensitive resin necessary for liquid discharge in a semiconductor process is formed on a silicon substrate can be used.

  When the recording element substrate is raised to the curing temperature of the adhesive, as described above, the mounting accuracy is lowered. In the present invention, the wavelength of the light for heating the silicon substrate included in the recording element substrate is effectively reduced using silicon, so that the temperature of the adhesive is set to the curing temperature without heating the silicon substrate. It is said. Infrared rays are electromagnetic waves, and the adhesive can be cured without heating the recording element substrate by directly exciting the infrared absorbing material added to the adhesive, rather than heating the adhesive by heat transfer. it can.

(Liquid supply member)
The liquid supply member is a tank member that supplies a liquid such as ink to the recording element substrate, and can be an organic or inorganic material. A material that does not swell, dissolve, or elute organic or inorganic substances even when in contact with a liquid such as ink is desirable. In addition, a thermoplastic resin can be preferably used because of the cost of raw materials and ease of processing. For example, general-purpose resins such as polypropylene and modified PPE (modified polyphenylene ether) can be mainly used as a liquid supply member. In order to increase the mechanical strength, silica, alumina or the like may be used as a filler.

(Support member)
A support member may be provided as a support portion on the surface of the liquid supply member to be bonded to the recording element substrate. The material of the support member for forming the support part is preferably the same as that of the liquid supply member, and an ink-resistant substance is used.

  Further, it is desirable that the support member has excellent flatness as a surface to which the recording element substrate is attached. Moreover, it is desirable that it is excellent in attachment property with the main body. Further, in order to determine the positional relationship from the paper surface to the head, it is desirable to have excellent dimensional accuracy and rigidity.

  Therefore, in order to improve the dimensional accuracy, planarity, and rigidity of the liquid supply member, it is preferable to use a support member added with a filler such as silica, carbon, alumina, mica, mica. In particular, a PPS resin (polyphenylene sulfide resin) is preferable because it can be easily molded even if it contains a large amount of filler capable of reducing the linear expansion coefficient. Further, particularly when modified PPE is used for the liquid supply member, it is preferable to integrally form the liquid supply member and the support member using a polymer alloy of a mixture of PPS and modified PPE for the support member. . In particular, the use of a polymer alloy containing 70% or more of a spherical filler is preferable because the linear expansion coefficient can be sufficiently lowered. The liquid supply member and the support member are joined by insert molding or two-color molding, and when both are formed integrally, a supply member provided with a support portion is obtained.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, an inkjet recording head will be described as an example of application of the present invention. However, the scope of the present invention is not limited to this, and is applicable to biochip manufacturing and electronic circuit printing. It can also be applied to a liquid discharge head. As the liquid discharge head, in addition to the ink jet recording head, for example, a head for producing a color filter can be cited.

(Embodiment 1)
FIG. 1 is a schematic diagram illustrating the configuration of the ink jet recording head according to the present embodiment. The ink jet recording head 001 according to this embodiment includes a recording element substrate 002, an ink supply member 005, an electric wiring tape 003, and a support member 004. The recording element substrate 002 has an ejection port for ejecting ink. The ink supply member 005 supplies ink to the recording element substrate 002 and stores ink. The support member 004 is interposed between the recording element substrate 002 and the ink supply member 005, includes an ink passage for supplying ink from the ink supply member 005 to the recording element substrate 002, and is a joint that supports and fixes at least the recording element substrate 002. Has a surface. However, in the present embodiment, the support member 004 is formed integrally with the ink supply member 005 to form the ink supply assembly 006. In FIG. 2, for convenience, a schematic diagram showing the support member 004 separated from the ink supply member 005 and an ink supply assembly 006 in which the support member 004 and the ink supply member 005 are integrated are shown. is doing. In the present invention, the support member can be regarded as a part of the ink supply member. Whether the support member is regarded as a part of the ink supply member or whether the support member and the ink supply member are regarded as separate members. It ’s just a difference in expression.

  In the present invention, it is preferable to use a support member. Generally, when manufacturing an ink jet recording head, a mechanism is employed in which stress due to the difference in linear expansion coefficient between the recording element substrate and the ink supply member is canceled by curing shrinkage of the adhesive. However, as the recording element substrate becomes longer and thinner, there may be a case where the stress of the recording element substrate cannot be suppressed by the adhesive. In order to reduce the stress due to the difference in linear expansion coefficient, it is conceivable that the linear expansion coefficient of the ink supply member is set to 10 ppm or less so as to approach the value of the recording element substrate. However, in order to use a resin material having a linear expansion coefficient of 10 ppm or less, 80% or more of filler is included, and the complicated shape of the ink supply member cannot be injection molded. For this reason, it is desirable that the support member is made of a member that can be molded with a low coefficient of linear expansion, and the recording element substrate and the ink supply member are bonded via the support member.

  The resin used for the support member is not particularly limited, but any of general-purpose engineer plastic and super engineer plastic can be blended. Since it is a member that comes into contact with the ink liquid, it preferably has alkali resistance and heat resistance. Since inkjet products are mass production and consumables business, it is preferable to use general-purpose engineer plastics. Therefore, as general-purpose engineer plastics, for example, polystyrene, acrylic resin, HIPS (high impact (impact resistance) polystyrene), PP (polypropylene), PE (polyethylene), nylon, PSF (polysulfone), or the like, or the above-mentioned Compounds such as polymer blends of resins and polymer alloys can be mentioned as candidates.

  Further, the support member has a liquid passage (ink passage) inside and is in contact with the ink liquid. Therefore, as a material for the support member, it is preferable that organic and inorganic components are not extracted into the ink liquid by contact with the ink liquid, and a material having high heat resistance and high injection moldability is preferable. From these viewpoints, the material of the support member is preferably a modified PPE which is a polymer alloy or a polymer alloy composed of a modified PPE and PPS.

  Moreover, as a filler added to a supporting member, the glass filler which is an inorganic filler, a carbon filler, a silica, an alumina, a mica, a talc, mica etc. are mentioned, for example. It is not particularly limited to these, and any material that reduces the linear expansion coefficient of the resin can be used. The shape of the filler is preferably spherical. By using a spherical filler, it is possible to fill the modified PPE or the like with a high content. Further, it is possible to reduce the wear of the material contact portion of the apparatus in the kneading step and the molding step, and to eliminate the anisotropy of the linear expansion coefficient.

  When the filler content of the polymer alloy composition is 50% by mass or more, it is preferable to apply a strong shear force at high temperature during kneading. As an apparatus capable of such kneading, for example, an open roll continuous extruder “NEDEX” (trade name, manufactured by Mitsui Mining Co., Ltd.) can be used. In the said apparatus, it can carry out continuously from kneading | mixing to pelletization by supplying the modification | denaturation PPE and filler which were grind | pulverized with the centrifugal mill to the said apparatus.

  Next, the pellets are poured into a mold having a predetermined shape using a molding machine, and a support member is obtained by injection molding. At this time, when the filler content of the polymer alloy composition is 50% by mass or more, since the fluidity of the composition is low, it is preferable to use a molding machine capable of pouring the polymer alloy composition at a high speed. A high-speed and high-pressure molding machine can be used as the molding machine. A normal molding machine has an injection speed of about 500 mm / sec, whereas a high-speed and high-pressure molding machine can obtain an injection speed of 1500 to 2000 mm / sec.

  The molding temperature at the time of injection molding of the support member is preferably 320 ° C. or lower. A molding temperature of 320 ° C. or lower is preferable because decomposition of the resin component of the modified PPE does not occur. Moreover, when using the polymer alloy of PPE and polystyrene for modified PPE, it is preferable that it is 100 degrees C or less as mold temperature at the time of injection molding. It is preferable that the temperature is not higher than the glass transition temperature (100 ° C.) of polystyrene, which is a constituent component of the modified PPE, because deformation of the molded product and reduction in flatness do not occur. For example, using a high-speed / high-pressure molding machine, a support member is obtained by injection molding into a mold having a predetermined shape at an injection speed of 1500 mm / sec, an injection pressure of 340 MPa, a molding temperature of 300 ° C., and a mold temperature of 80 ° C. be able to.

  Further, the manufactured support member is preferably fixed to the ink supply member by insert molding. For example, it is preferable to place the molded support member in advance in a mold of the ink supply member, and to pour the resin composition as the ink supply member material into the mold to perform insert molding. Thereby, an ink supply assembly (liquid supply assembly) in which the support member and the ink supply member are integrally bonded can be obtained.

  In order to connect the recording element substrate to the obtained ink supply assembly, an adhesive is applied to a predetermined area of a support member to which the recording element substrate is bonded, and then cured and fixed.

  In the conventional method, generally, as a curing mechanism, thermosetting, ultraviolet curing, heat, ultraviolet combined use, moisture curing, or the like is used. However, since a lot of plastic is used for the head member, the curing temperature cannot be set too high. For example, when a thermosetting adhesive is used, the curing time becomes long, and the recording element substrate and the ink supply member may be deformed due to thermal expansion during curing. When the recording element substrate or ink supply member deformed due to thermal expansion is returned to room temperature, the recording element substrate contracts and stress deformation occurs through the adhesive.

  Therefore, in the present invention, an adhesive that contains an infrared absorber and is cured by an ionic polymerization reaction mechanism is used. By using this adhesive, it is possible to bond in a short time, and the thermal expansion of the ink supply member and the silicon substrate due to the transfer of heat of the adhesive can be reduced. A delayed cure UV cationic epoxy adhesive is preferably effective for such applications.

  Examples of the adhesive using an ionic polymerization reaction include a cured material obtained by polymerizing epoxy, oxetane, vinyl ether, etc. by generating an acid when a photoacid generator receives light energy. Examples include an epoxy UV cationic adhesive (trade name “KR-827”, manufactured by ADEKA), an epoxy UV cationic adhesive (trade name “KR-826”, manufactured by ADEKA), an epoxy UV cationic adhesive ( Trade name "KS-820", manufactured by ADEKA).

  The ionic polymerization reaction will be described by taking as an example the case where a monosulfonium salt and an epoxy monomer are used as a photocationic polymerization initiator.

  The photoacid generator is an ionic sulfonium salt-based onium salt composed of a cation portion and an anion portion, which is absorbed and decomposed when irradiated with ultraviolet light, and the anion portion becomes a source of acid. Then, hydrogen is extracted from the solvent or the acid generator itself to generate an acid. The acid is coordinated to the epoxy and is subjected to the attack of the next epoxy to generate an oxonium cation, and sequential ring-opening polymerization of the oxonium cation and the epoxy proceeds.

  In the present invention, it is preferable to use a short arc lamp or a long arc lamp of a halogen lamp, which is a light source capable of giving a large energy instantaneously.

  In particular, a xenon flash lamp, which is a long arc lamp, can be heated to a high temperature of 100 to 150 ° C. or higher in a time on the order of msec to several tens of msec.

  Further, by adding 0.01 to 5% by mass of an infrared absorber (near infrared absorber) in advance to the adhesive, the infrared absorption efficiency is increased, and the member to be heated can be selectively cured in a short time. it can.

  Moreover, the adhesive agent used by this invention contains an infrared absorber. The type of the infrared absorber is not particularly limited as long as it is a material that absorbs light in the infrared region. The infrared region includes the near infrared region. Examples of the infrared absorber include cyanine compounds, phthalocyanine compounds, naphthalocyanine compounds, naphthoquinone compounds, anthraquinone compounds, onium compounds, nickel complexes, and diimonium compounds. Moreover, these can be used 1 type or in mixture of 2 or more types.

  Furthermore, as an organic infrared absorber, specifically, “THX0113” (trade name, manufactured by Tosco Corporation), “NIR-IM1” or “NIR-AM1” (trade name, manufactured by Nagase ChemteX Corporation) Or “IRG-002” or “IRG-003” (trade name, manufactured by Nippon Kayaku Co., Ltd.). A carbon compound can be used as the inorganic infrared absorber, graphitized carbon is preferable, and graphitized carbon having an arithmetic particle diameter of 70 nm or less is more preferable.

  Another example of the light source used in the present invention is a halogen heater. There is a spectrum distribution from the ultraviolet region to the infrared region, the power density is high, and the temperature of the irradiated object can be rapidly increased and decreased. Also, the filament has a long life in the halogen cycle. The output has the advantage of being easily controllable with a thyristor. The heating of about 100 ° C. necessary for curing the adhesive also reaches on the order of 100 msec to several seconds. Uniform surface irradiation with the halogen heater unit and the shape of the attached mirror depending on the adhesive application range and application thickness, or focusing the light with a focus type to heat only the necessary part, or free irradiation conditions There is a degree.

If a filter made of silicon (preferably a silicon substrate (for example, about 50 to 200 μm)) is provided between a light source such as a halogen lamp or a xenon flash lamp, the adhesive can be heated more selectively. Therefore, the temperature rise of the recording element substrate can be prevented, and the stress distortion due to the difference in linear expansion between the ink supply assembly and the recording element substrate and the temperature rise and fall can be suppressed.
In order to perform this process continuously in the ink jet recording head production line, it is necessary to cool the silicon filter that has reached a high temperature to about room temperature.
Therefore, it is preferable to mount a plurality of silicon filters on the apparatus, and to install a mechanism for cooling and a mechanism for exchanging the silicon filter after processing the head a predetermined number of times.

Example 1
Examples will be described below.

  In this embodiment, the configuration of the ink jet recording head shown in FIG. 1 is adopted. The ink jet recording head 001 shown in FIG. 1 includes a recording element substrate 002, an electric wiring tape 003, a support member 004, and an ink supply member 005. The support member 004 and the ink supply member are integrally formed by insert molding and used as the ink supply assembly 006.

  As a polymer alloy used as a material for the support member, a modified PPE (trade name “SE-1X”, manufactured by SABIC) and spherical silica (trade name “S-430”, manufactured by Micron) are used in a mass ratio of 25:75. Kneaded and pelletized. The obtained pellets are injection-molded (injection speed 1500 mm / sec, injection pressure 340 MPa, molding temperature 300 ° C., mold temperature 80 ° C.) using a high-speed and high-pressure molding machine and a mold having a predetermined shape, and a support member Got.

  The support member was placed in advance in the mold of the ink supply member, and modified PPE (PCN-2910 (trade name, manufactured by SABIC)) was poured into the mold to perform insert molding. At this time, the injection speed was 70 mm / sec, the injection pressure was 150 MPa, the molding temperature was 300 ° C., and the mold temperature was 80 ° C. As a result, an ink supply joined body was obtained in which the support member and the ink supply member were joined together.

  An adhesive was applied to the bonding position of the recording element substrate of the support member in the manufactured ink supply assembly so that the film thickness after curing was 10 μm. As an adhesive, 2.5% by mass of an infrared absorber (trade name “SDA3610”, manufactured by Tosco Corporation) was uniformly mixed with an epoxy UV cationic adhesive (trade name “KR-827”, manufactured by ADEKA). A thing was used.

Then, the surface to which the adhesive is applied is irradiated with UV light at 120 mW / cm ² for 3 seconds, and the black recording element substrate of the recording element substrate (width 1.5 mm, length 19.06 mm, thickness 0.3 mm) is used as a support member. Affixed to a predetermined position with a mounting device (temporary fixing).

  Then, a 120 μm silicon plate is installed as a filter between the halogen flash lamp light source (output 60 w) and the ink supply assembly unit on which the recording element substrate is mounted, and the entire surface of the recording element substrate is irradiated with halogen lamp light for 2.0 sec. And the adhesive was cured.

  An ink absorber, ink, an ink supply lid, and the like were incorporated into the manufactured ink supply assembly unit to obtain a printable ink jet recording head.

  In this embodiment, the black ink jet recording head has been described. However, the present invention is not limited to this, and can be applied to a color ink jet recording head.

(Example 2)
An ink jet recording head was produced under the same conditions as in Example 1 except that the thickness of the silicon substrate placed between the light source and the irradiated object was 55 μm.

(Example 3)
An ink jet recording head was manufactured under the same conditions as in Example 1 except that the thickness of the silicon substrate placed between the light source and the irradiated object was 195 μm.

Example 4
An ink jet recording head was produced under the same conditions as in Example 1 except that the content of the infrared absorber in the adhesive was 1.2% by mass.

(Example 5)
An ink jet recording head was produced under the same conditions as in Example 1 except that the content of the infrared absorber in the adhesive was 4.8% by mass.

(Example 6)
As the resin composition of the support member, PPS (trade name: “B-060P”, manufactured by Tosoh Steel Corporation), modified PPE (trade name “SE-1X”, manufactured by SABIC), spherical silica (trade name “S-430”). ", Manufactured by Micron Corporation) and kneaded and pelletized at a mass ratio of 8:12:80. An ink jet recording head was produced under the same conditions as in Example 1 except that the content of the infrared absorber (trade name “Toka Black # 3855” manufactured by Tokai Carbon Co., Ltd.) was 0.5 mass%.

(Comparative Example 1)
An ink jet recording head was prepared in the same manner as in Example 1 except that a silicon substrate as a filter was not placed between the halogen flash lamp light source (output 60 w) and the ink supply assembly unit on which the recording element substrate was placed.

(Printed image quality after physical distribution test)
The ink jet recording heads produced in Examples 1 to 6 and Comparative Examples 1 to 4 were evaluated by the following print test (image quality after test) and observation of the head nozzle surface. The head was observed after being left in a packaged form for 360 hours in an environment of temperature 60 ° C. and humidity 20%.

  The print quality of the head after storage under the above conditions was compared with actual images.

"Evaluation criteria"
○: No warpage or crack of the recording element substrate after the test. No ink color mixing due to peeling of the joint surface. The print quality was good.
Δ: Minor warpage is observed on the recording element substrate after the test. The print quality was within the allowable range.

[Bonding accuracy]
The distance between the reference position of the ink supply assembly and the alignment mark of the recording element substrate was measured before and after bonding.

"Evaluation criteria"
A: The amount of deviation is less than 3 μm in both the longitudinal and lateral directions of the recording element substrate.
A: The displacement amount is 3 μm or more and less than 5 μm in both the longitudinal direction and the short direction of the recording element substrate.
Δ: A shift amount of 5 μm or more in both the long and short X and Y directions of the recording element substrate.

  The results are shown in Table 1.

001 Inkjet recording head (Bk)
002 Recording element substrate 003 Electrical wiring tape 004 Support member 005 Ink supply member 006 Ink supply assembly 007 Flash lamp 008 Silicon substrate 009 Reflector 010 Light 011 Adhesive layer

Claims (10)

In this method, a recording element substrate that discharges a liquid and a liquid supply member that supplies the liquid to the recording element substrate are connected using an adhesive that contains at least an infrared absorber and is cured by an ion polymerization reaction mechanism. And
The recording element substrate includes a silicon substrate;
A method of manufacturing a liquid discharge head, wherein the adhesive is irradiated with light including at least an ultraviolet to infrared region through a filter made of silicon.   The method for manufacturing a liquid discharge head according to claim 1, wherein the filter is a silicon plate having a thickness of 50 to 200 μm.   3. The method of manufacturing a liquid discharge head according to claim 1, wherein the content of the infrared absorber in the adhesive is 0.01 to 5 mass%.   The method of manufacturing a liquid discharge head according to claim 1, wherein the adhesive is a UV cationic epoxy adhesive.   5. The method of manufacturing a liquid discharge head according to claim 1, wherein the light source that emits light including the ultraviolet to infrared region is a xenon flash lamp or a halogen lamp. (1) arranging the adhesive on the recording element substrate or the liquid supply member;
(2) bonding the recording element substrate and the liquid supply member together;
(3) irradiating the adhesive with the light through the filter;
The method of manufacturing a liquid discharge head according to claim 1, comprising: A support member is interposed between the recording element substrate and the liquid supply member,
The liquid supply member and the support member form a joined body joined by insert molding,
The method of manufacturing a liquid discharge head according to claim 1, wherein the recording element substrate is bonded to the support member with the adhesive.   8. The method of manufacturing a liquid discharge head according to claim 7, wherein the resin composition constituting the support member is a polymer alloy containing 70% or more of a spherical filler.   9. The method of manufacturing a liquid discharge head according to claim 8, wherein the polymer alloy contains at least modified PPE as a constituent component.   The method of manufacturing a liquid ejection head according to claim 1, wherein the filter is cooled after irradiating the filter with light.

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