JP2007320108A - Manufacturing method for inkjet recording head and inkjet recording head - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a temporary fixing adhesive and a circumference sealing agent from being unable to fulfill the original functions, or occurrence of nozzle contamination/defective printing due to an unset substance because an incompletely set region due to insufficient irradiation of ultraviolet rays or the like causes a setting obstruction through mixing with the circumference sealing agent and the adhesive of a recording element substrate in a post process when an ultraviolet curing type adhesive is adopted for the temporary fixing adhesive. <P>SOLUTION: In the manufacturing method for the inkjet recording head, the temporary fixing adhesive is a thermosetting adhesive and is set by a non-contact heat source. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an ink jet recording head manufacturing method and an ink jet recording head, and more particularly to a method for joining recording element substrates in an ink jet recording head having a recording element substrate fixed to a resin molded part.

  In recent years, high quality images have been demanded of ink jet printers, and ink jet recording heads have a very fine structure.

  Therefore, an adhesive is often used for bonding between different materials of the ink jet recording head.

  In the above-described ink jet recording head, there is a portion where the adhesive which is a constituent member contacts the ink.

  In such a case, an ink jet recording head should be used to prevent ink contamination such as changes in ink physical properties caused by the eluent from the adhesive, and to prevent a decrease in adhesive strength or decomposition due to the influence of the ink. It is necessary to devise the structure of.

  FIG. 2 shows an ink supply holding member-integrated ink jet head, and the ink supply holding member including the ink storage portion of the ink jet head is formed by molding a resin material.

  A configuration relating to ink ejection of the head is shown in FIG.

  The recording element substrate having the ink discharge function is fixed to the mounting surface of the ink supply holding member via the adhesive on the recording element substrate mounting surface.

  Since the ink supply holding member is a resin molded product, the flatness of the mount surface has a swell of several tens of microns, and it is impossible to closely bond the recording element substrate to the mount surface. It is.

  Accordingly, the height of the recording element substrate that is applied with a thickness that can absorb the waviness of the mount surface and is not in contact with the mount surface is aligned with a desired positional accuracy with respect to the ink supply holding member. Mounted on the adhesive in position.

  Thereafter, the mount adhesive is completely cured.

The role of the mount adhesive is
Fixing the recording element substrate to the ink supply holding member Sealing between the ink supply port of the ink supply holding member and the ink inlet of the recording element substrate.

  In the production of the inkjet head, it is necessary to finish one processing step in a very short time from the viewpoint of manufacturing cost, and the mounting step of the recording element substrate is no exception.

  The adhesive used for mounting the recording element substrate is generally a heat curing type.

  As an ideal form of the mounting process in production, after the recording element substrate is mounted on the mounting adhesive, the adhesive is cured within a desired processing time, and the recording element substrate and the ink supply holding member can be fixed. It is preferable.

  However, with respect to the ink supply holding member-integrated ink jet head by resin molding as shown in FIGS. 2 and 3, the curing characteristics and ink contact resistance that cure in a very short time at a temperature at which the molding material does not deform. It is very difficult to realize an adhesive having a property.

  Therefore, the mounting position of the recording element substrate is not shifted by disturbances such as vibrations and shocks caused by conveyance of the production apparatus until the molding material is heated at a temperature that can be allowed by the molding material and the mounting adhesive is completely cured. The process of temporarily fixing temporarily is required.

  As such a temporary fixing method, a method using an ultraviolet curable adhesive is generally used.

  In Patent Document 1, in order to reliably and easily cure the ultraviolet curable adhesive used for temporary fixing, an application portion of the ultraviolet curable adhesive used for temporary fixing is provided on the outer peripheral portion of the liquid chamber forming member of the recording element substrate. It has a structure in which ultraviolet rays are reliably applied to the ultraviolet curable adhesive.

As described above, when the recording element substrate or the component member is temporarily fixed using the ultraviolet curable adhesive, it is necessary to provide a structure in which the temporary fixing portion is reliably irradiated with ultraviolet rays.
JP 2003-170604 A

  In the ink jet head as shown in FIGS. 2 and 3 in the present invention, it is necessary to seal the periphery of the recording element substrate for the purpose of improving electrical reliability. Therefore, the recording element substrate has a structure in which the periphery of the recording element substrate is sealed by being temporarily fixed in the concave shape on the surface of the ink supply holding member.

  In such a structure, when an ultraviolet curable adhesive is used for temporarily fixing the recording element substrate, ultraviolet rays are shielded against the concave opening of the ink supply holding member with respect to the applied ultraviolet curable adhesive. This is a problem in that the size of the concave opening and the ultraviolet optical axis of the processing apparatus and the irradiation range are restricted.

The problem to be solved by the present invention is an inkjet head in which it is necessary to temporarily fix the recording element substrate to a resin base member in terms of production process and structure, and an ultraviolet curable adhesive is employed as the temporary fixing adhesive. In the case of an inkjet recording head having a structure that cannot effectively irradiate the adhesive with ultraviolet rays,
・ Incompletely cured areas due to insufficient UV irradiation, etc. are mixed with the surrounding sealant or adhesive of the recording element substrate in the subsequent process, causing curing inhibition. Unsatisfactory function ・ Nozzle contamination / printing failure due to uncured material generated due to inhibition of curing.

  The present invention can solve the above problems by providing the following configuration.

(1) a recording element substrate comprising: an ejection port from which an ink droplet is ejected; and an ejection energy generation unit that generates ejection energy for ejecting the ink droplet from the ejection port;
A resin base member having a joint surface with the recording element substrate, an ink supply port for supplying ink from the ink storage unit, and
A first adhesive that bonds and fixes the recording element substrate and the base member and seals an ink flow path portion between the recording element substrate and the base member;
In the manufacturing method of an ink jet recording head comprising:
(Step 1) applying the first adhesive to the base member;
(Step 2) Place the recording element substrate in a predetermined position on the first adhesive applied on the base member,
(Step 3) Applying a thermosetting adhesive which is a second adhesive different from the first adhesive so as to contact the recording element substrate and the base member;
(Step 4) The second adhesive is cured by heating means,
(Step 5) After the second adhesive is cured, the first adhesive is cured.
A method of manufacturing an ink jet recording head, characterized by being manufactured in stages.

(2) In the method for manufacturing an ink jet recording head according to (1),
Means for curing the thermosetting adhesive which is the second adhesive,
It is a heat source that heats in a non-contact manner by the action of heat radiation or convective heat transfer, and the thermosetting adhesive is cured by bringing the heat source close to the thermosetting adhesive. A method for manufacturing an inkjet recording head.

(3) In the method of manufacturing an ink jet recording head according to (1),
Means for curing the thermosetting adhesive which is the second adhesive,
A method of manufacturing an ink jet recording head, comprising: a light source that is heat-curable by irradiating the thermosetting resin; and the thermosetting adhesive is cured by irradiating light from the light source. .

  (4) In the ink jet recording head manufacturing method according to any one of (1) to (3), the recording element substrate is heated during the steps 2 to 4. Production method.

  (5) In the method for manufacturing an ink jet recording head according to (4), the finger for placing the recording element substrate on the adhesive on the base member heats the recording element substrate. Manufacturing method of the head.

(6) a recording element substrate comprising: an ejection port from which an ink droplet is ejected; and an ejection energy generation unit that generates ejection energy for ejecting the ink droplet from the ejection port;
A resin base member having a joint surface with the recording element substrate, an ink supply port for supplying ink from the ink storage unit, and
A thermosetting adhesive that adheres and fixes the recording element substrate and the base member and seals an ink flow path between the recording element substrate and the base member;
In the manufacturing method of an ink jet recording head comprising:
(Step 1) Applying a thermosetting adhesive on the base member,
(Step 2) Place the recording element substrate in a predetermined position on the thermosetting adhesive applied on the base member,
(Step 3) A portion of the thermosetting adhesive is cured using a first heating means,
(Step 4) The uncured portion of the thermosetting adhesive is cured by a second heating means.
A method of manufacturing an ink jet recording head, characterized by being manufactured in stages.

  (7) In the method for manufacturing an ink jet recording head according to (6), the first heating means is a heat source that heats by the action of heat radiation or convection heat transfer, and the heat source is the thermosetting adhesive. A method for manufacturing an ink jet recording head, wherein only a part of the thermosetting adhesive is cured by approaching the vicinity of a portion to be cured.

  (8) In the method of manufacturing an ink jet recording head according to (6), the first heating means is a light source that can be heat-cured by irradiating the thermosetting resin, and the light is emitted from the light source to the heat source. A method for manufacturing an ink jet recording head, wherein only a part of the thermosetting adhesive is cured by irradiating only a part of the curable adhesive.

  (9) In the inkjet recording head manufacturing method according to any one of (6) to (8), the recording element substrate is heated during the steps 2 to 3. Production method.

  (10) In the ink jet recording head manufacturing method according to (9), the finger for placing the recording element substrate on the adhesive on the base member heats the recording element substrate. Manufacturing method of the head.

  (11) An ink jet recording head manufactured by the method for manufacturing an ink jet recording head according to any one of (1) to (10).

  The present invention uses a thermosetting temporary fixing adhesive or a thermosetting mount adhesive to temporarily fix a recording element substrate, and propagates heat in a non-contact manner to cure the thermosetting adhesive. It is.

According to the present invention, when an ultraviolet curable adhesive is used for temporary fixing, an ultraviolet non-irradiated region occurs in a part of the ultraviolet curable adhesive.
・ Incompletely cured areas due to defective UV irradiation, etc., will dissolve with the surrounding sealant and adhesive of the recording element substrate in the subsequent process to cause curing inhibition. ・ No-contaminated nozzle contamination / printing defects due to curing inhibition. Issues such as occurrence can be avoided.

  Also, in the present invention, since a thermosetting adhesive is used unlike an ultraviolet curable adhesive that cures only the region irradiated with ultraviolet light, the curing reaction is accelerated by the propagation of heat inside the thermosetting adhesive. This is advantageous.

  As a result, it is possible to improve the stability and reliability of the temporary fixing process portion of the recording element substrate.

  In the ink jet recording head to which the present invention is applied, the portion and the number of temporary fixing of the recording element substrate can be appropriately selected as long as the strength required for temporary fixing and the productivity with respect to processing time, part shape, etc. are not impaired. is there.

  In the ink jet recording head to which the present invention is applied, the heating means for curing the thermosetting temporary fixing adhesive or the thermosetting mount adhesive performs non-contact heating and adversely affects the recording element substrate that ejects ink. Any method may be used as long as it does not reach.

  In the ink jet recording head to which the present invention is applied, it is preferable that the thermosetting adhesive used for temporary fixing has a smaller curing shrinkage rate and shrinkage stress in heat curing, but the relationship with the above-described temporary fixing portions and the number thereof. If the mounting accuracy of the recording element substrate is not adversely affected, it can be selected as appropriate.

  Examples will be described below using an example of an ink jet recording head to which the present invention is applied.

  FIG. 2 is an external view of an ink jet head having an ink storage portion to which the present invention is applied. The basic configuration relating to ink ejection in the head is the ink supply holding member 6, the recording element substrate 1, and the casing shown in FIG. In addition, an electric wiring board 8 that supplies electricity as ink discharge energy from the printer body to the recording element substrate 1 is formed.

  The present invention relates to a manufacturing method related to temporary fixing of the recording element substrate 1 of the head.

  FIG. 1B is a schematic view of the head of the present invention viewed from the ink ejection surface side.

  A conceptual diagram of the fixing structure of the recording element substrate 1 in FIG. 3 is shown in FIG.

  The recording element substrate 1 of the ink jet head in the present invention is fixed on the recording element substrate mounting surface of the ink supply holding member 6 via a thermosetting mount adhesive 2.

  The recording element substrate 1 is temporarily fixed to the recording element substrate mounting surface with the temporary fixing adhesive 3 until the mount adhesive 2 is completely cured.

  In addition, in order to protect the recording element substrate 1 from ink and suppress waste ink accumulation after ink cleaning on the surface of the recording element substrate, a space around the recording element substrate is filled with a peripheral sealing agent 5.

  The temporary fixing adhesive 3 described above is covered with a surrounding sealant 5 with respect to the external atmosphere, and is a portion represented by a broken line in FIG.

Regarding the configuration in the present invention shown in FIG. 1a, the manufacturing method is roughly as follows.
(1) A predetermined amount of the mount adhesive 2 is applied to the recording element substrate mounting surface of the ink supply holding member 6.
(2) The recording element substrate 1 is aligned with a predetermined positional accuracy with respect to the recording element substrate mounting surface, and is placed on the mount adhesive 2 so as to have a predetermined height from a certain reference.
(3) The thermosetting temporary fixing adhesive 3 is applied to a predetermined portion of the recording element substrate 1.
(4) The thermosetting temporary fixing adhesive 3 is heated and cured to temporarily fix the recording element substrate 1.
(5) The mount adhesive 2 is cured.

  In the vicinity of the ejection portion of the ink jet recording head in the present invention, as shown in FIG. 1a, the recording element substrate mounting surface has a concave shape from the surface to which the electric wiring substrate 8 is bonded. In the method using an ultraviolet curable adhesive as the agent 3, in order to completely cure the ultraviolet curable adhesive, the irradiation angle is sufficiently set so that ultraviolet light is not radiated on the device hole end face of the electric wiring board 8. It is necessary to consider.

  Therefore, when the ultraviolet curable type is selected as the temporary fixing adhesive 3, a great restriction is imposed on the degree of freedom of the optical axis angle in order to prevent the ultraviolet light from being kicked.

  On the other hand, the present invention uses the thermosetting adhesive for the temporary fixing adhesive 3 and cures the temporary fixing adhesive by non-contact heating, thereby limiting the above-described ultraviolet curable adhesive. Regardless of, it is possible to ensure stable curing of the adhesive and reliability after curing.

  The configuration of the present invention will be described in detail below.

  In the present invention, a thermosetting adhesive used for temporary fixing that achieves a practical processing time is used with a gel time at 100 ° C. of 10 seconds or less.

  If the mount adhesive 2 satisfies the ink contact resistance and can be cured within the in-process distribution time until the completion of the ink jet recording head, the mount adhesive 2 can be a moisture curable adhesive or 2 There are no particular restrictions on the type of liquid-reactive adhesive.

  After the mount adhesive 2 is applied on the recording element substrate mounting surface, the recording element substrate 1 adsorbed by the mounting fingers 9 is aligned within the required position accuracy with respect to the mounting surface (not shown) to obtain a predetermined height. Keep the mount adhesive in a position where it will be crushed.

  At this time, the mounting finger 9 keeps adsorbing the recording element substrate 1, and in this state, the temporary fixing thermosetting adhesive is brought into contact with both the recording element substrate 1 and the mounting surface and the required adhesive force. Apply an amount that can generate (not shown).

  In this example, as shown by the broken line portion in FIG. 1b, two places, ie, a total of four places, were supplied in the vicinity of both ends of both long side portions of the recording element substrate 1.

  The application position and the number of the temporary fixing adhesive 3 are not particularly limited as long as sufficient temporary fixing strength can be generated according to the size and aspect ratio of the recording element substrate 1 and the required processing time can be satisfied. No.

  After the temporary fixing adhesive 3 is applied, in the present invention, the temporary fixing adhesive 3 is heated and cured in a non-contact manner to generate a strength that can withstand impact and vibration during conveyance on the production line apparatus.

  The non-contact heating of the temporary fixing adhesive 3 is cost-effective due to the technical aspect that the mounting accuracy is required and the improvement of the initial investment amount as a device having the simplest possible configuration. This is to satisfy the surface.

  For example, when it is sought to cure the adhesive in as short a time as possible, indirect contact heating is considered to be most effective.

  In this case, the surface is heated by indirect contact via a very thin Teflon (registered trademark) tape having poor adhesion.

However, when such a method is used in the manufacture of the inkjet head unit in the present invention,
・ Technically, touching the adhesive may affect temporary fixing with high accuracy. ・ Introducing auxiliary materials such as Teflon (registered trademark) tape from the viewpoint of cost, as well as equipment. Therefore, there is a concern that the apparatus becomes complicated and expensive due to the necessity of providing a tape supply mechanism.

  Accordingly, the present inventor has determined that a non-contact heat propagation method is advantageous over a contact heating method as a heating means for a thermosetting adhesive used for temporary fixing.

The heat source and method used to cure the temporary fixing adhesive are:
(1) Heat block proximity heating that brings about effects of heat radiation and convection heat transfer in the air (2) Light source (visible light, ultraviolet light, etc.) that can heat the irradiated part
Can be used.

  Hereinafter, two heating methods of the temporary fixing adhesive will be described.

  A schematic diagram of the heat block proximity heating method is shown in FIG.

  In this example, the adhesive used for temporary fixing was selected such that the curing reaction starts at about 100 ° C.

  The inventor has a surface temperature of about 300 ° C. at a position of 0.5 mm to 1.0 mm above the temporary fixing adhesive 3 that has already been applied to the recording element substrate 1 that is adsorbed to the mounting fingers 9. By bringing the heat block 10 close, it was able to be cured within a desired processing time by the action of heat radiation and convective heat transfer via air.

  In the present invention, the heating temperature and heating time of the heat block 10 depend on the reaction start temperature and curing characteristics of the thermosetting adhesive used for temporary fixing, the heat resistance characteristics of the material forming the ink supply holding member 6 and the required processing time. And the distance between the temporary fixing adhesive 3 and the heat source can be arbitrarily set.

  As another heating method, a method using irradiation light capable of heating an irradiation object will be described.

  One of the irradiating light is ultraviolet light, but it is not sensitive to ultraviolet light like an ultraviolet curable adhesive, but is irradiated with ultraviolet light to a temporary fixing thermosetting adhesive. It propagates the thermal energy of ultraviolet light.

  In this case, the same light source and irradiation fiber as the ultraviolet curable adhesive can be used in terms of apparatus.

  Further, if an irradiation fiber 11 with a condensing lens or the like is used, it is possible to irradiate only the temporary fixing adhesive 3 with the thermal energy of the light source as shown in FIG. This is effective in that the resin portion forming the supply holding member 6 is not adversely affected.

  Also, unlike UV curable adhesives, it is advantageous that the curing reaction is accelerated by the propagation of heat inside the thermosetting adhesive, even if the entire surface of the thermosetting adhesive cannot be irradiated with UV light effectively. is there.

  Accordingly, there is no particular limitation as long as the light can propagate heat energy to the temporarily fixed thermosetting adhesive, and general-purpose equipment such as a halogen light source can be used.

  Depending on the thermal conductivity of the recording element substrate 1, it takes time for the thermal energy transmitted to the temporary fixing adhesive 3 to be transmitted to the recording element substrate 1 and to reach the curing start temperature of the temporary fixing adhesive 3. There is a possibility that it will take.

  In such a case, the mounting finger 9 is provided with a heating mechanism to heat the recording element substrate 1, so that the temperature gradient between the recording element substrate 1 and the temporary fixing adhesive 3 is substantially eliminated in a very short time. Allow curing.

  This is particularly effective when the recording element substrate 1 is excellent in thermal conductivity such as a silicon semiconductor.

  In this example, a sufficient effect was obtained by heating the recording element substrate 1 to about 90 ° C. with respect to the temporarily fixing adhesive that starts the curing reaction at about 100 ° C.

  The temperature of the mount finger 9 can be set high to reduce the processing time.

  In this example, as a result of heating the recording element substrate 1 with the mount fingers 9, the temporary fixing adhesive 3 could be efficiently cured by heating.

  That is, it was confirmed that the processing method is such that excess heat energy does not propagate to the molding resin material, the ink supply holding member 6 is hardly damaged, and the heat curing time can be shortened.

  In this embodiment, a thermosetting adhesive is used for the mount adhesive 2, and the mount adhesive 2 is locally cured in a non-contact manner without using a temporary fixing adhesive. The configuration of the fixing method will be described in detail below.

  When a thermosetting adhesive is employed for the mount adhesive 2, the adsorbed recording element substrate 1 is heated by the mount finger 9 having a built-in heating mechanism described in the first embodiment, and recording in a heated state is performed. A method of fixing the recording element substrate 1 to the ink supply holding member 6 that is a resin molded component by mounting the element substrate 1 on the mount adhesive, thereby heating and curing the mount adhesive 2 via the recording element substrate 1. Can be considered.

  In this case, since the amount of the adhesive to be cured is larger than that of the temporary fixing adhesive in Example 1, the amount of heat required for the curing is also increased.

  In order to conduct the amount of heat required for curing to the mount adhesive through the recording element substrate 1 within a practical processing time, it is necessary to set the temperature of the mount finger 9 to a high temperature.

  This inventor examined using the thermosetting type adhesive which has the hardening characteristic whose gel time in 100 degreeC is 10 second.

  However, as a high temperature setting that satisfies the practical processing time, the recording element substrate 1 was heated to about 190 ° C. with the mount finger 9 and the present inventor examined mounting, but the ink on the recording element substrate 1 was ejected. The nozzle arrangement surface that is the opening to be damaged may be damaged.

  In addition, the recording element substrate 1 was examined by extending the heating time at about 160 ° C. with a mount finger so as to shorten the processing time as much as possible while avoiding damage to the nozzle arrangement surface. Deformation of the mounting surface of the ink supply holding member 6 that is a molded part occurred, which adversely affected the mounting accuracy of the recording element substrate 1.

  Although there is room for improvement of the curing temperature specification of the mount adhesive 2 and the heat resistance temperature of the resin molded part, it is difficult to achieve a combination that satisfies all of them from the viewpoint of ink resistance to ink contact.

  Therefore, the present inventor studied a method of locally curing the mounting adhesive 2 in a non-contact manner after mounting the recording element substrate 1 on the mounting adhesive 2.

  As a means of local heating of the mount adhesive 2, the present inventor approaches a heat block capable of propagating heat energy in a non-contact manner as in Example 1 close to the vicinity of a desired position where the mount adhesive is to be locally cured. Thus, a method of temporarily fixing the recording element substrate 1 was devised.

  The method of this example is shown in FIG.

  In this embodiment, after the mounting adhesive 2 is applied on the recording element substrate mounting surface, the recording element substrate 1 adsorbed by the mounting fingers 9 is aligned with respect to the mounting surface within the required position accuracy (not shown). ), And rest at a position where the mount adhesive is crushed to a predetermined height.

  At this time, the mounting finger 9 remains adsorbing the recording element substrate 1, and in this state, the mount adhesive 9 is located at a position in the vicinity of 0.5 mm to 1.0 mm above the desired position where the mount adhesive is to be locally cured. By bringing the heat block 10 having a surface temperature of about 300 ° C. closer, it was possible to cure within a desired processing time by the effect of convection heat transfer via heat radiation and air.

  In the present invention, the heating temperature and heating time of the heat block 10 are set according to the reaction start temperature and curing characteristics of the thermosetting mount adhesive, the heat resistance characteristics of the material forming the ink supply holding member 6 and the required processing time. It is possible to arbitrarily set the distance between the fixed adhesive 3 and the heat source.

  In addition, as a method of locally curing the mount adhesive, a method that is easier and more efficient than the method of approaching the heat block described above is to propagate heat to a desired location where the mount adhesive is to be cured. This is a method of irradiating the light to enable and curing the irradiated part and its vicinity.

  Since heat transfer to the mounting adhesive by the heat block method is thermal radiation and convective heat transfer, heat to the part other than the temporary fixing part in the mounting adhesive until the temporary fixing part reaches the curing start temperature. There is concern about loss due to conduction.

  Therefore, in order to intensively heat the vicinity of the temporarily fixed part of the mount adhesive, a method of locally irradiating an irradiation light, which can be a heat source, to an arbitrary curing site is more efficient and effective than the heat block method. is there.

  In particular, by focusing the irradiation light to the temporarily fixed part by a condensing lens or the like, local heating at the temporarily fixed part of the mount adhesive is further facilitated, and is not easily affected by the heat conduction action inside the mount adhesive. It can be cured in a short time.

  In this embodiment, after the mounting adhesive 2 is applied on the recording element substrate mounting surface, the recording element substrate 1 adsorbed by the mounting fingers 9 is aligned with respect to the mounting surface within the required position accuracy (not shown). ), And rest at a position where the mount adhesive is crushed to a predetermined height.

  At this time, the mounting finger 9 remains adsorbing the recording element substrate 1, and in this state, light that enables local heat propagation is irradiated to a desired position of the mounting adhesive, The neighborhood is cured.

  The locally cured portion maintains the fixed state of the ink supply holding member 6 and the recording element substrate 1 until the entire mount adhesive 2 is completely cured.

  In this method, only the local portion of the mount adhesive is heated and cured, so that the recording element substrate 1 is not damaged by heating to the ink supply holding member 6 and the nozzle surface of the recording element substrate 1 which are resin molded parts. Can be temporarily fixed.

  Further, by heating the recording element substrate 1 to such an extent that the recording element substrate 1 and the ink supply holding member 6 are not damaged by the mount fingers 9, the temporary fixing process in this embodiment is performed as in the first embodiment. It is also possible to shorten the time.

  After the mounting adhesive 2 described above is locally cured, a process such as batch heating is performed to completely heat and cure the entire mounting adhesive, and the fixing of the recording element substrate 1 is completed.

Further, as another effect of the present embodiment, when the ultraviolet curable adhesive is adopted as the temporary fixing adhesive by using the temporary fixing method of the recording element substrate according to the present invention described in the first and second embodiments. Occurs in an inkjet recording head having a structure in which the adhesive cannot be effectively irradiated with ultraviolet rays.
・ Incompletely cured areas due to insufficient UV irradiation, etc. are mixed with the surrounding sealant or adhesive of the recording element substrate in the subsequent process, causing curing inhibition. Unsatisfactory function ・ Recording element substrate as a structure in which UV curing adhesive is sufficiently irradiated with UV to prevent occurrence of nozzle contamination / printing defect due to uncured material generated by curing inhibition There were restrictions on the size of the surrounding device hole opening.

  However, with the recording element substrate temporary fixing method according to the present invention, it is not necessary to take into account almost all the adverse effects of the irradiation light “kake”.

With this, it becomes possible to reduce the filling volume compared to the conventional by reducing the opening of the device hole,
・ Reducing the filling amount of the surrounding sealant ・ Achieving a further effect that realizes shortening of the filling processing time by reducing the filling amount, and also enables reduction of the processing cost from the viewpoint of material and productivity. I can do it.

Schematic sectional view showing a fixing structure of a recording element substrate according to the present invention. Schematic diagram of the inkjet head of the present invention External view of inkjet head unit with ink supply holding member to which the present invention is applied The figure which shows the structure regarding the ink discharge part of the inkjet head unit with an ink supply holding member in FIG. Schematic diagram showing non-contact heating of temporary fixing adhesive by heat source in the present invention Schematic diagram showing non-contact heating of temporary fixing adhesive by a light source in the present invention The schematic diagram showing the local non-contact heating of the mount adhesive by a light source in this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Recording element board | substrate 2 Mount adhesive 3 Temporary fixing adhesive 4 Ink inlet of a recording element board | substrate 5 Periphery sealing agent 6 Ink supply holding member 7 Ink supply opening of an ink supply holding member 8 Electrical wiring board 9 Mount finger 10 Heat block 11 Irradiation fiber 12 Irradiation light

Claims (11)

A recording element substrate comprising: an ejection port from which an ink droplet is ejected; and an ejection energy generation unit that generates ejection energy for ejecting the ink droplet from the ejection port;
A resin base member having a joint surface with the recording element substrate, an ink supply port for supplying ink from the ink storage unit, and
A first adhesive that bonds and fixes the recording element substrate and the base member and seals an ink flow path portion between the recording element substrate and the base member;
In the manufacturing method of an ink jet recording head comprising:
(Step 1) applying the first adhesive to the base member;
(Step 2) Place the recording element substrate in a predetermined position on the first adhesive applied on the base member,
(Step 3) Applying a thermosetting adhesive which is a second adhesive different from the first adhesive so as to contact the recording element substrate and the base member;
(Step 4) The second adhesive is cured by heating means,
(Step 5) After the second adhesive is cured, the first adhesive is cured.
A method of manufacturing an ink jet recording head, characterized by being manufactured in stages. In the manufacturing method of the ink-jet recording head according to claim 1,
Means for curing the thermosetting adhesive which is the second adhesive,
It is a heat source that heats in a non-contact manner by the action of heat radiation or convective heat transfer, and the thermosetting adhesive is cured by bringing the heat source close to the thermosetting adhesive. A method for manufacturing an inkjet recording head. In the manufacturing method of the ink-jet recording head according to claim 1,
Means for curing the thermosetting adhesive which is the second adhesive,
A method of manufacturing an ink jet recording head, comprising: a light source that is heat-curable by irradiating the thermosetting resin; and the thermosetting adhesive is cured by irradiating light from the light source. .   4. The method of manufacturing an ink jet recording head according to claim 1, wherein the recording element substrate is heated during the steps 2 to 4. 5.   5. The method of manufacturing an ink jet recording head according to claim 4, wherein a finger for placing the recording element substrate on an adhesive on the base member heats the recording element substrate. . A recording element substrate comprising: an ejection port from which an ink droplet is ejected; and an ejection energy generation unit that generates ejection energy for ejecting the ink droplet from the ejection port;
A resin base member having a joint surface with the recording element substrate, an ink supply port for supplying ink from the ink storage unit, and
A thermosetting adhesive that adheres and fixes the recording element substrate and the base member and seals an ink flow path between the recording element substrate and the base member;
In the manufacturing method of an ink jet recording head comprising:
(Step 1) Applying a thermosetting adhesive on the base member,
(Step 2) Place the recording element substrate in a predetermined position on the thermosetting adhesive applied on the base member,
(Step 3) A portion of the thermosetting adhesive is cured using a first heating means,
(Step 4) The uncured portion of the thermosetting adhesive is cured by a second heating means.
A method of manufacturing an ink jet recording head, characterized by being manufactured in stages.   7. The method of manufacturing an ink jet recording head according to claim 6, wherein the first heating means is a heat source for heating by the action of heat radiation or convective heat transfer, and the heat source is cured by the thermosetting adhesive. A method for manufacturing an ink jet recording head, wherein only a part of the thermosetting adhesive is cured by approaching the vicinity of the ink.   7. The method of manufacturing an ink jet recording head according to claim 6, wherein the first heating means is a light source that can be heated and cured by irradiating the thermosetting resin, and the light is emitted from the light source to the thermosetting adhesive. A method of manufacturing an ink jet recording head, wherein only a part of the thermosetting adhesive is cured by irradiating only a part of the thermosetting adhesive.   9. The method of manufacturing an ink jet recording head according to claim 6, wherein the recording element substrate is heated during the steps 2 to 3.   10. The method of manufacturing an ink jet recording head according to claim 9, wherein a finger for placing the recording element substrate on an adhesive on the base member heats the recording element substrate. .   An ink jet recording head manufactured by the method for manufacturing an ink jet recording head according to claim 1.