CN102837501B - For the formation of the equipment of ink jet-print head - Google Patents
For the formation of the equipment of ink jet-print head Download PDFInfo
- Publication number
- CN102837501B CN102837501B CN201210204469.8A CN201210204469A CN102837501B CN 102837501 B CN102837501 B CN 102837501B CN 201210204469 A CN201210204469 A CN 201210204469A CN 102837501 B CN102837501 B CN 102837501B
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- Prior art keywords
- shim
- piezoelectric element
- flexible roof
- flexible
- formation
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- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
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- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/015—Ink jet characterised by the jet generation process
- B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
- B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14362—Assembling elements of heads
Abstract
The present invention relates to the method using the calking of flexible flat polymeric planarizing.For the formation of the method and structure of ink jet-print head with dielectric shim.The flexible roof being attached to press may be used for uncured dielectric shim applying pressure.To contact with flexible roof making uncured dielectric shim and while using press applying pressure, uncured dielectric shim is cured.Find that using flexible roof instead of rigid panel to be formed above array of piezoelectric elements has evenly or the solidification shim of more smooth upper surface.The shim of formation like this can cause in the processing time reduced, being in use communicated with the problem of relevant reduction and the manufacturing cost of reduction to the ink of ink jet-print head.
Description
Technical field
This instruction relates to inkjet-printing device field, more particularly, relates to the method for the printer making high density piezoelectric ink jet printing head and comprise high density piezoelectric ink jet printing head.
Background technology
Drop-on-demand (dropondemand) ink-jet technology is widely used in and prints in industry.The printer of Drop-on-demand ink-jet technology is used to use or hot ink-jet technology or piezo technology.Both made specific heat ink-jet manufacture costly, piezoelectric ink jet is generally more welcome, because they can use the ink of more wide range of types and reduce or eliminate the problem relevant to fouling.
Piezoelectric ink jet printing head typically comprises flexible baffle and is attached to the array of piezoelectric element (i.e. transducer or PZT) of dividing plate.When typically via when being connected to piezoelectric element applied voltage with the electrode electricity that electricity is coupled to voltage source, the bending or deflection of piezoelectric element, cause dividing plate warpage, this impels the ink of some to be discharged from chamber by nozzle.Ink is also drawn into chamber from main black storage to replace the ink be discharged by opening by warpage.
The print resolution increasing the ink-jet printer of employing piezo inkjet technology is the target of design engineer.The spout density increasing piezoelectric ink jet printing head can increase print resolution.A kind of mode increasing spout density eliminates to spray stacking interior manifold (manifold).Use this design, preferably there is the single port by the stacking back side of the injection for each injection.Port is used as each ejection chamber transferred to by ink path from storage.Because a large amount of spouts in high density printing head, a large amount of port (each spout one) must pass perpendicularly through dividing plate and between piezoelectric element.
Can to be included between each piezoelectric element for the formation of spraying stacking technique and to form the shim from polymeric material in the over top of each piezoelectric element in some techniques.If shim is distributed in the over top of each piezoelectric element, it is removed to expose conduction piezoelectric element.Next, the supporting layer (standofflayer) wherein with the patterning of opening can be applied to shim, and its split shed exposes the top of each piezoelectric element.The conductor of the some (such as droplet) of such as conducting ring oxygenate, conductive paste or other conductive material and so on is independently dispensed on the top of each piezoelectric element.The electrode of flexible print circuit (i.e. flexible circuit) or printed circuit board (PCB) (PCB) and each conductor droplet to place with the electrode promoting each piezoelectric element and flexible circuit or PCB between electric communication.Supporting layer for comprising the flowing of desired locations in conductive droplets to piezoelectric element top, and is also used as the adhesive between shim and flexible circuit or PCB.
Spraying between stacking Formation period, it is important for keeping the injection stack layer spraying such as shim on stacking surface to have uniform thickness.Consistency of thickness is favourable, because this can help to alleviate the problem of spraying stack thickness change, PZT varied in thickness or attached varied in thickness and causing.Shim is formed as problem that such as bad ink in printhead that uniform thickness reduced is communicated with and so on and the incidence that in printhead, ink is revealed can be reduced.
Summary of the invention
In one embodiment, the method for the formation of ink jet-print head can comprise: above the array of piezoelectric element, distribute uncured dielectric shim; Flexible roof and knock-outs will is inserted between uncured dielectric shim and top board; Uncured dielectric shim is contacted with knock-outs will; And while maintaining the contact between uncured dielectric shim and knock-outs will, use top board to uncured dielectric shim applying pressure, wherein flexible roof is at warpage during uncured dielectric shim applying pressure.And, use top board to solidification dielectric shim while uncured dielectric shim applying pressure in the contact maintained between uncured dielectric shim and knock-outs will.
According to the method for the formation of ink jet-print head, this flexible roof has about 25 μm to about 12 during the warpage of top board, the thickness of 700 μm.
Method for the formation of ink jet-print head also comprises use knock-outs will coating flexible top board.
Method for the formation of ink jet-print head also comprises the flexible roof providing the bending modulus with about 1MPa to about 300MPa.
In another embodiment, equipment for the formation of ink jet-print head can comprise the press (press), knock-outs will and the flexible roof of at least one that comprises in glass, silicon, quartz, sapphire and metal that have and press down box and top board, wherein glass, silicon, quartz, one of sapphire and metal have about 25 μm to about 12, the thickness of 700 μm, wherein knock-outs will and flexible roof are configured to be interposed between uncured shim and top board.
According to this equipment, this presses down box and is configured to be heated.
According to this equipment, this flexible roof has the bending modulus of about 1MPa to about 300MPa.Preferably, this flexible roof has the bending modulus of about 10MPa to about 50MPa.
In another embodiment, method for the formation of ink-jet printer can comprise use following methods and form at least one ink jet-print head, the method comprises: above the array of piezoelectric element, distribute uncured dielectric shim, between uncured dielectric shim and top board, insert flexible roof and knock-outs will; Uncured dielectric shim is contacted with knock-outs will; And while maintaining the contact between uncured dielectric shim and knock-outs will, use top board to uncured dielectric shim applying pressure, wherein flexible roof is at warpage during uncured dielectric shim applying pressure.And, use top board to solidification dielectric shim while uncured dielectric shim applying pressure in the contact maintained between uncured dielectric shim and knock-outs will.The method can also comprise and being installed in printer casing by least one printhead.
Method for the formation of ink-jet printer is also included in one deck silicon rubber inserting the thickness with about 1mm to about 25 between flexible roof and top board; And during solidification shim, this layer of silicon rubber is contacted with top board with flexible roof.
Method for the formation of ink-jet printer also comprises use knock-outs will coating flexible top board.
Method for the formation of ink-jet printer also comprises the Part I of the dielectric shim removing solidification to expose the array of piezoelectric element and to leave the Part II of the dielectric shim of the solidification between adj acent piezoelectric element.
Method for the formation of ink-jet printer also comprises the flexible roof providing the bending modulus with about 1MPa to about 300MPa.
Accompanying drawing explanation
Fig. 1 and 2 is the perspective view of the middle piezoelectric element of device in the technique according to the embodiment of this instruction;
Fig. 3-8 and 11-19 is the profile that signal comprises the formation of the ink jet-print head that the injection of device is stacking in technique;
Fig. 9 and 10 is diagrams of the thickness of the shim illustrating to use respectively rigid panel and flexible roof to be formed;
Figure 20 comprises the profile spraying stacking printhead; And
Figure 21 is the printing equipment of the printhead of the embodiment comprised according to this instruction.
It should be noted that some details of figure may be simplified and draw to promote the understanding of the embodiment of the present invention instead of for keeping strict structure precision, details and yardstick.
Detailed description of the invention
When using at this, word " printer " is contained and is performed for the arbitrary equipment of the printout function of any object, such as digital copier, make book machine, facsimile machine, multi-purpose machine, eletrophotography device etc.Word " polymer " contain from long-chain molecule formed broad sense carbon group compound wherein any one, comprise Thermocurable polyimide, thermoplastic, resin, Merlon, epoxy material and related compound known in the art.
In perspective view in figure 1, piezoelectric element layer 10 uses adhesive 14 removably to join transfer vector 12 to.Piezoelectric element layer 10 such as can comprise about 25 μm to about 150 μm thick lead zirconate titanate layers to be used as interior dielectric.Dielectric layer such as can use electroless plating on two sides equal plating with nickel to provide conducting element in every one side of dielectric layer.The dielectric medium structure 10 of nickel plating is used as plane-parallel capacitor substantially, and it forms the difference in the voltage potential of crossing over interior dielectric material.Carrier 12 can comprise metal sheet, plastic sheet or other transfer vectors.Attached piezoelectric element layer 10 can comprise cutting belt, thermoplastic or other adhesives to the adhesive layer 14 of transfer vector 12.In another embodiment, transfer vector 12 can be the material of such as autoadhesion thermoplastic layer, and making does not need independent adhesive layer 14.
After the structure forming Fig. 1, piezoelectric element layer 10 is cut with the multiple separate piezoelectric elements 20 formed as Fig. 2 signal.Should recognize, although Fig. 2 illustrates 4 × 3 arrays of piezoelectric element, larger array can be formed.Such as, current printhead can have 344 × 20 arrays of piezoelectric element.Mechanical technique (such as using saw (as wafer cast-cutting saw)) can be used, use dry method etch technology, use laser-ablation processes etc. to perform cutting.In order to ensure the separation completely of each adj acent piezoelectric element 20, cutting technique can removed a part for adhesive 14 and stop after stopping or after cutting through adhesive 14 and partly enter in carrier 12 on transfer vector 12.
As Fig. 3 profile illustrated, after each piezoelectric element 20 of formation, the assembly of Fig. 2 can be attached to and spray stacking sub-component 30.The profile of Fig. 3 be the amplification of the structure of Fig. 2 to illustrate the details of improvement, and the profile of a signal part and two complete piezoelectric elements 20.Known technology manufacture can be used to spray stacking sub-component 30.Spray stacking sub-component 30 such as can comprise entrance/exit plate 32, body plate 34 and use adhesive separator attach material 38 to be attached to the dividing plate 36 of body plate 34.As described below, dividing plate 36 can comprise multiple opening 40, for passing through of the device China and Mexico that complete.The structure of Fig. 3 also comprises multiple room 42, and at this place of technique, room 42 can be filled with surrounding air.Dividing plate attach material 38 can be the solid sheet material of the material of such as single polymer, makes to be capped by the opening 40 of dividing plate 36.
In one embodiment, the structure of Fig. 2 can use the adhesive between dividing plate 36 and piezoelectric element 20 to be attached to the stacking sub-component 30 of injection.Such as, certain adhesive (independent signal) measuring quantity can be assigned with, serigraphy, rolling (etc.) to the upper surface of piezoelectric element 20 or on dividing plate 36 or on the two.In one embodiment, single adhesive can be placed on dividing plate for each independently piezoelectric element 20.Application adhesive after, spray stacking sub-component 30 and piezoelectric element 20 aligned with each other, then piezoelectric element 20 uses adhesive to be mechanically connected to dividing plate 36.Adhesive is by being suitable for the technical cure of adhesive to draw the structure of Fig. 3.
Subsequently, transfer vector 12 and adhesive 14 are removed from the structure of Fig. 3 with the structure drawing Fig. 4.
Next, as schematically shown in Figure 5, uncured dielectric shim 50 is assigned to the superstructure of Fig. 4.Shim can be polymer, such as, from Danbury, Miller-StephensonChemicalCo. commercially available Epon 828 epoxy resin (parts by weight of 100) of CT and the combination from the HexionSpecialtyChemicals of Columbus, OH commercially available Epikure 3277 curing agent (parts by weight of 49).Shim 50 can be enough to cover dividing plate 36 upper surface 52 exposed portion and after solidification encapsulate piezoelectric element 20 quantity distribute.As shown in the figure, shim 50 can fill the opening 40 in dividing plate 36 further.The dividing plate attach material 38 covering the opening 40 in dividing plate 36 prevents dielectric filler material through opening 40.
Before solidification shim 50, perform levelling process to provide the shim 50 with uniform thickness.Levelling process performs as distributing shim 50, makes it use identical material thickness to cover each piezoelectric element 20.If shim 50 is not leveled or by bad leveling, it may than thicker on other piezoelectric elements on some piezoelectric elements 20.Because shim 50 has relatively low etching speed in its removal during exposing piezoelectric element 20, both having made the obvious increase that the little increase of the thickness coming from bad leveling may cause for guaranteeing the processing time that each piezoelectric element 20 exposes, and having this reduced production output and adding cost.Etching period for exposing the shim 50 of piezoelectric element 20 can more than 30 minutes to remove 4 μm of thick polymeric interstitial layers.And, the black connectivity problem in the device that non-homogeneous shim thickness can cause.
In an embodiment of the levelling process of this instruction, as Fig. 6 signal, the device of Fig. 5 can be placed on a support surface.In another embodiment, before distribution shim 50, the device of Fig. 4 can be placed on a support surface, and then deposits shim 50.Stayed surface can comprise heap laminate heater 60, such as conventional press down box substrate 62, can again with or disposable pad 64 and release coating 66.Liner 64 can comprise the material of such as a slice polymer, polyimides or plastics and so on.Release coating 66 can comprise one deck fluoropolymer be coated on liner 64, and its thickness is enough to prevent part from spraying stacking 30 and is adhered to liner 64.Release coating 66 can by such as spraying or use the various technology application of squeegee and so on.
Levelling process can also comprise top board 68, flexible Intermediate substrate 70, flexible flat (top board) 72 and knock-outs will 74.Knock-outs will 74 can be the coating on the surface being applied to flexible roof 72; or knock-outs will 74 can be coated with the parting compounds of such as fluoropolymer and the liner (such as, polymer, polyimides, plastics, metal) be interposed between flexible roof 72 and shim 50.Flexible Intermediate substrate 70 can be such as the silastic-layer that about 1mm to about 25mm is thick.Flexible roof 72 can be such as enough thin to be flexible glass or silicon wafer.In one embodiment, flexible roof 72 can be the chip glass of the Borofloat that can buy from the SchottNorthAmerica of Louisville, KY, Inc..In other embodiments, flexible roof can from material manufactures such as such as quartz, sapphire, metals and can be electrical conductivity body or electrical insulation body.Flexible roof 72 between about 25 microns (μm) to about 12, between 700 μm or between about 500 μm to about 900 μm, or between about 650 μm to about 750 μm, such as, can be about 700 μm.
In one embodiment, " flexibility " top board can be enough thin to allow bending or deflection a little and top board that is not broken or permanent deformation from rigid material." flexibility " top board can be formed by such material, this material have about 1 MPa (Mpa) and about between 300MPa or about 5MPa and about between 100MPa or about 10MPa to about between 50MPa, the bending strength (such as flexible strength or modulus of rupture) of such as about 25MPa.In another embodiment, flexible roof has and is not less than 10Mpa and the bending strength being not more than 50Mpa.Too rigidity or too flexible material will be not enough to flatten shim.Flexible roof can have the flatness (peak is to paddy) of about 1.0 nanometers (nm) to about 5.0 μm.
In order to perform leveling, flexible Intermediate substrate 70, flexible roof 72 and knock-outs will 74 are interposed between top board 68 and shim 50.This can by by knock-outs will 74, flexible roof 72 and flexible Intermediate substrate 70 with spray stacking aim at and then place them on shim 50 perform.In another embodiment, flexible Intermediate substrate 70 can be attached to top board 68 alternatively, and flexible roof 72 can be attached to flexible Intermediate substrate 70 alternatively, and knock-outs will 74 alternatively can be coated or be attached in flexible roof 72.
Subsequently, top board 68 moves towards the shim 50 covering piezoelectric element 20.As schematically shown in Figure 7, set up physical contact down force pressure between knock-outs will 74 and shim 50 after, this press can keep flexible roof 72 with the pressure of about 10psi to about 500psi or about 100psi to about 300psi or about 225psi to about 275psi contact shim 50.Heap laminate temperature that heater 60 can be heated to about 50 DEG C to about 250 DEG C with by the stacking sub-component 30 of injection to the transfer of the heat of shim 50 rapid curing shim 50.Shim 50 is heated about 10 minutes to about 120 minutes or is enough to suitably solidify the duration of shim 50 under stress.
At distribution and the setting up period of shim 50, liner 64 prevent sealant its be extruded smooth after flow on lower box.After completing levelling process, liner 64 can be dropped and replace, or it can cleaned and recycling.Liner 64 is optional, and in another embodiment, and pressing down box 62 can be cleaned and do not use heavy liner 64 after solidification shim.
After removing from press, reserved category can be similar to the stacking sub-component of injection shown in Fig. 8.
Compare the use of rigid panel and flexible roof in pressure and curing process at test period, find, compared with using the technique of rigid panel, use foregoing flexible roof to be formed and have evenly the shim 50 of upper surface.Find that the shim using rigid panel to be formed above the array of piezoelectric electrode during pressure and curing process has hat or convex shape.Fig. 9 illustrates to use the result of rigid panel and depends on the row and column of piezoelectric-array, draws the varied in thickness from about 0 μm (that is, the piezoelectric electrode exposed) to about 4 μm.Comparatively, Figure 10 illustrates to use the result of flexible roof, and wherein the change of the thickness of the shim of gained is about the half of the change of the shim using rigid panel to be formed.
Be not intended bound by theory, when flexible roof adapts to PZT array and substrate, the flexibility of top board creates the compliance in accumulation.During use press applying pressure, flexible roof can warpage, makes any uneven profile of substrate 62 be through counteracting.Because some rigidity of plate, does not occur to the distortion in interstitial regions or around PZT array.Although the reason of calking hat is unknown when using rigid panel, it may be that surface-supported substrate 62 does not provide suitable across PZT array and/or supports uniformly when polymer is cured, and whole PZT array (center of such as array) during pressure and curing process is extruded unevenly against rigid panel.The optics flat bed being provided for substrate 62 can improve the uniformity of shim, but will reduce to be applied to the heat of shim by being used as thermal barrier properties during curing process, thereby increases calking hardening time.Although thermally conductive substrate shifts improving setting up period from pressing down the heat of box to shim, the optics flat bed (such as, the aluminium of polishing or molybdenum optics flat bed) being enough to be used in this object is difficult to manufacture and is expensive.Along with the printhead size (it can comprise PZT array up to 12 inches or longer) increased, cost becomes more factors (moreofafactor) that will consider.
After formation of the structure of fig. 8, such as, by removing the Part I of shim 50 from the upper surface of piezoelectric element 20, and leave the Part II of the shim between adj acent piezoelectric element 20, printhead process can continue.In one embodiment, as shown in figure 11, the pattern mask 110 of such as patterned photo glue mask and so on can use known photoetching technique to be formed with opening 112.As shown, opening 112 exposes shim 50 and covers the part of each piezoelectric element 20 and also expose the part of each piezoelectric element 20.
In another example, the mask 110 of patterning can be one deck TPI.Such as, the mask 110 of patterning can be the DuPont 100ELJ layer using the patternings such as laser ablation, Sheet Metal Forming Technology, etching.DuPont100ELJ typically with the thickness manufacture of 25 μm (0.001 inches) with provide, if but feasible, such as other thickness of about 20 μm to about 40 μm are also applicable.In one embodiment, TPI mask can use heat-laminator to be attached to the surface of polymeric interstitial layer 50.In one embodiment, can between about 180 DEG C and about 200 DEG C, the temperature of such as about 190 DEG C occurs attached.In one embodiment, can about 90psi to about 110psi, such as about 100psi pressure under occur attached.Attach process can perform the duration of about 5 minutes to about 15 minutes, such as about 10 minutes.
In one embodiment, mask can be the material that can enough easily discharge not promote or otherwise damage shim 50, piezoelectric element 20 or other structures after removing the shim 50 exposed from shim 50.The temperature of the etching of such as plasma etching and so on can reach 150 DEG C, it can solidify when being not intended to bound by theory, harden, densified mask material and/or carry out degasification to mask material, makes it more be difficult to remove from shim 50.
The opening 112 of mask can orientate the upper surface only exposing polymer and each piezoelectric element 20 as, such as will use the electrical connection being prepared into it with the silver-colored epoxy material of printed circuit board (PCB) (PCB) electrode contact subsequently.Opening 112 should have enough sizes, makes the resistance between the electrode of piezoelectric element 20 and follow-up formation be in admissible restriction, and this provides acceptable reliability for functional device.Opening itself can be circular, oval, square, rectangle etc.
Subsequently, being etched with of such as plasma etching is performed to the structure of Figure 11 and remove the shim 50 that exposes.In one embodiment, plasma etching can be performed under the condition fully reducing the processing time.Such as, active ions trapping Plasma mode can use with oxygen process gas composition.Such as, oxygen can be enough to provide about 100mTorr to about between 200mTorr, the delivery rate of the equalizing chamber pressure of such as about 150mTorr is introduced in plasma etch chamber.Plasma can about between 800W and 1000W, radio frequency (RF) energetic start up of such as about 900W.In active ions etch plasma bulk-mode, the assembly of Figure 11 can be placed between two Adjacent active electrodes.Two Adjacent active electrodes can be placed between two earth electrodes.Depend on sealant, etching period can from about 1 second to about 1 hour, such as, between about 5 minutes to 15 minutes between, and more specifically, between about 5 minutes and 10 minutes.Use 25 μm of thick-layers of DuPont100ELJ, the processing time can between about 1 second to about 15 minutes, such as, between about 1 second to about 10 minutes.Depend on sealant, the Plasma mode being different from active ions trapping pattern can be used, comprise such as reactive ion etching, without electronics etching, active etching, pattern without electronic and ionic trapping and so on, wherein pattern depends on the configuration (such as, active, ground connection and floating) of the shelf in plasma chamber.
Plasma etching can effectively from the surface removal shim 50 of nickel plating PZT piezoelectric element 20.Have been found that the surface of nickel plating PZT piezoelectric element 20 has high surface roughness, this makes to remove shim 50 from the groove of relatively dark and narrow (that is, high aspect ratio) and becomes difficulty.The dielectric substance retained in nickel plating in the trench can increase the resistance between piezoelectric element 20 and PCB electrode, and this PCB electrode is coupled with piezoelectric element 20 electricity subsequently.Sealant 50 will reduce resistance and the electrology characteristic of improving device from effective removal of the etched surfaces of piezoelectric element 20.The described herein use of the plasma etching of mask that has more effectively removes dielectric substance from these grooves than conventional minimizing technology.Sealant 50 is less than the etching speed of the sealant 50 between the piezoelectric element 20 of adjacent to and opposite wide interval from the etching speed of the relatively narrow groove in piezoelectric element 20.Maskless plasma etching can cause the excessive loss of the sealant 50 between adj acent piezoelectric element 20, thus exposes sealant 50 and the mask plasma etching that has of guarded by location sealant 50 between piezoelectric element 20 may be used for preventing this loss covering the position of piezoelectric element 20.
After etching shim 50, remove the mask 110 of patterning to draw the structure of Figure 12.If the mask of patterning 110 is photoresist masks of patterning, then standard technique can be used to remove the mask 110 of patterning.If the mask of patterning 110 thermoplastic polymer that to be such as DuPont100ELJ such, then such as can by peeling off the mask removing patterning.
In another embodiment, the maskless that can perform Fig. 8 structure is etched with and show that being similar to Figure 12 illustrates and structure general utility functions being equivalent to the structure of Figure 12.Above-mentioned plasma etching can be timed, and makes just when all piezoelectric elements fully expose, etch stop, makes it possible to prepare the electrical contact with each piezoelectric element.The etching of this maskless will remove the shim thickness between a part of piezoelectric element 20, but stop before being etched in the excessive shim 50 of removal, and device performance is not affected adversely.
In another embodiment, mask or maskless laser-ablation processes can be had to remove the shim 50 of covering piezoelectric element 20 to draw the structure of Figure 12 to the structure execution of Fig. 8.
As Figure 13 signal, after use has mask or maskless removal technique exposes piezoelectric element 20, the assembly comprising the adhesive layer 130 of patterning and the liner removed 132 of patterning is aligned and is attached to the structure of Figure 12.Adhesive 130 is such as thermosetting or thermoplastic sheets.Can remove liner 132 can be polyimide material, or the other material can removed from adhesive 130.The assembly comprising adhesive layer 130 and can remove liner 132 comprises the pattern of pre-formed members 134 wherein, and it exposes piezoelectric element 20.Opening 134 in adhesive 130 and liner 132 can such as use the formation such as laser ablation, Sheet Metal Forming Technology, etching before attachment.The size of opening 134 can set the goal the size for mating the opening 112 in shim 50 as shown, but they can be slightly large or slightly little, as long as dimensional mismatch not adverse effect subsequent processes.Adhesive 130 will partly determine the quantity of the conductor be retained in after subsequent treatment on piezoelectric element 20 with the combination thickness can removing liner 132.Adhesive 130 and the combination thickness can removing liner 132 can, between about 15 μm to about 100 μm, can be maybe thickness suitable in addition.
Next, as schematically shown in Figure 14, such as, use silk-screen printing technique, use can remove liner 132 as masterplate, and the conductor 140 of such as conductive paste is applied to the assembly of Figure 13.Alternatively, adhesive can be assigned on assembly.
Subsequently, such as can remove liner 132 by peeling off from the structure removal of Figure 14, the structure being similar to Figure 15 signal is retained.
Next, the PCB160 with multiple through hole 162 and multiple PCB electrode 164 uses adhesive 130 to be attached to the assembly of Figure 10, to draw the structure of Figure 16.Conductor 140 electricity coupled piezoelectric elements 20, to PCB electrode 164, makes conductive path extend to piezoelectric element 20 by conductor 140 from PCB electrode 164.
Next, can be eliminated to allow ink through dividing plate by the opening 40 of dividing plate 36.Remove the part that opening comprises the dividing plate attach material 38 removed adhesive 130, shim 50 and cover opening 40.In various embodiments, chemistry or mechanical removal technology can be used.In one embodiment, autoregistration removal technique can comprise use laser beam 170 as shown in figure 17, when especially wherein inlet/outlet plate 32, body plate 34 and dividing plate 36 are formed by metal.Inlet/outlet plate 32, body plate 34 and the dividing plate 36 depending on design alternatively can shield the laser beam for autoregistration laser-ablation processes.In this embodiment, such as CO can be used
2the laser instrument of laser instrument, excimer laser, solid-state laser, copper-vapor laser and optical fiber laser and so on.CO
2laser instrument and excimer laser can typically melt the polymer comprising epoxy material.CO
2laser instrument can have lower operational cost and high manufacture output.Although illustrate two laser beams 170 in fig. 17, use one or more laser pulse, single laser beam can open each hole successively.In another embodiment, two or more openings can be formed in single operation.Such as, mask can be applied to surface, and then use the one or more pulses coming from single wide laser beam, single wide laser beam can open two or more openings or all openings.The CO that the mask provided by inlet/outlet plate 32, body plate 34 and possible dividing plate 36 is provided can be crossed
2laser beam can subsequently each opening 40 of Continuous irradiation with formed by dividing plate attach material 38, shim 50 and adhesive 130 extend opening to draw the structure of Figure 18.
Subsequently, as schematically shown in Figure 19, orifice plates 190 can use adhesive (not illustrating separately) to be attached to inlet/outlet plate 32.Orifice plates 190 can comprise multiple nozzle 192, and during printing, ink is discharged by the plurality of nozzle.Once orifice plates 190 is attached, just completes and spray stacking 194.
Subsequently, such as use the connection 201 of the fluid-tight of such as adhesive, manifold 200 is engaged to PCB160, to draw the ink jet-print head 202 as Figure 20 signal.Ink jet-print head 202 can comprise the ink of the storage 204 in manifold for storage certain capacity.Ink from storage 204 is delivered to the port 206 sprayed in stacking 194 by the through hole 162 in PCB160.Should be appreciated that Figure 20 is reduced graph, and additional structure can be had on the left side of figure and the right.Such as, although Figure 20 illustrates two ports 206, typical spray stacking such as can have 344 × 20 array of ports.
In use, the storage 204 in the manifold 200 of printhead 202 comprises the ink of certain capacity.The initial perfusion (priming) of printhead may be used for impelling ink from storage 204 by the through hole 162 PCB160, to be flowed by the port 206 sprayed in stacking 194 and to flow into the chamber 208 sprayed in stacking 194.In response to the voltage 210 be placed on each electrode 164, each PZT piezoelectric element 20 deflects or distortion at reasonable time in response to data signal.The deflection of piezoelectric element 20 causes dividing plate 36 warpage, this results in the pressure pulse in chamber 208, impels drops out from nozzles 192 to discharge.
Said method and structure are formed thus for the injection of ink-jet printer stacking 194.In one embodiment, as shown in figure 20, the parts that stacking 194 can be used as ink jet-print head 202 are sprayed.
Figure 21 signal comprises the printer of printer casing 212, and at least one printhead 202 is installed in this printer casing.According to the embodiment of this instruction, during operation, ink 214 sprays from one or more nozzle 192.Printhead 202 operates according to digital command with the image forming expectation on the such as print media such as sheet of paper, plastics 216.Printhead 202 can move around relative to print media 216 image producing printing line by line in scanning motion.Alternatively, printhead 202 can keep fixing and print media 216 moves relative to it, forms the image equally wide with printhead 202 in single pass.Printhead 202 can be narrower than print media 216 or equally wide with it.
Should recognize, except specific embodiment discussed above, during other structures of formation, the plasma etching removing epoxy material as mentioned above from piezoelectric element can be performed.Such as, PZT piezoelectric structure can be encapsulated as and prevent gas or liquid comes into contact piezoelectric structure, in case stop loss evil and the physical contact of solid structure, with to piezoelectric structure supply decay etc.Use plasma etching as above can expose the PZT piezoelectric structure of panelized or non-panelized to provide physics or electrical contact points.
Claims (5)
1., for the formation of an equipment for ink jet-print head, comprise:
Press, comprises and presses down box and top board;
Knock-outs will;
Flexible roof, comprises at least one in glass, silicon, quartz, sapphire and metal, and wherein glass, silicon, quartz, one of sapphire and metal have at about 25 μm and about 12, the thickness between 700 μm, and
Printhead sprays stacking sub-component, comprise stacked and cover the uncured shim of multiple piezoelectric element, wherein this knock-outs will and this flexible roof are sandwiched between described uncured shim and described top board, described knock-outs will only sprays stacking sub-component physical contact at described uncured shim place and described printhead, and described multiple piezoelectric element is not exposed by described uncured shim.
2. equipment according to claim 1, the wherein said box that presses down is configured to be heated.
3. equipment according to claim 1, wherein said flexible roof comprises glass, silicon, one of quartz and sapphire, and described flexible roof has the thickness between about 500 μm and about 900 μm.
4. equipment according to claim 1, wherein said flexible roof has in about 1MPa and the bending modulus about between 300MPa.
5. equipment according to claim 1, wherein said flexible roof has in about 10MPa and the bending modulus about between 50MPa.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/165785 | 2011-06-21 | ||
| US13/165,785 US8556611B2 (en) | 2011-06-21 | 2011-06-21 | Method for interstitial polymer planarization using a flexible flat plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102837501A CN102837501A (en) | 2012-12-26 |
| CN102837501B true CN102837501B (en) | 2016-02-24 |
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| CN201210204469.8A Expired - Fee Related CN102837501B (en) | 2011-06-21 | 2012-06-20 | For the formation of the equipment of ink jet-print head |
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| Country | Link |
|---|---|
| US (1) | US8556611B2 (en) |
| JP (1) | JP5939898B2 (en) |
| KR (1) | KR101988870B1 (en) |
| CN (1) | CN102837501B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE102010001023A1 (en) * | 2010-01-19 | 2011-07-21 | Robert Bosch GmbH, 70469 | sensor device |
| KR101827070B1 (en) | 2013-02-28 | 2018-02-07 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | Molding a fluid flow structure |
| US9656469B2 (en) | 2013-02-28 | 2017-05-23 | Hewlett-Packard Development Company, L.P. | Molded fluid flow structure with saw cut channel |
| US9895888B2 (en) | 2014-04-22 | 2018-02-20 | Hewlett-Packard Development Company, L.P. | Fluid flow structure |
| US10038267B2 (en) | 2014-06-12 | 2018-07-31 | Palo Alto Research Center Incorporated | Circuit interconnect system and method |
| US10714361B2 (en) * | 2017-12-21 | 2020-07-14 | Foundation For Research And Business, Seoul National University Of Science And Technology | Method of fabricating a semiconductor package using an insulating polymer layer |
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| JP4012307B2 (en) * | 1998-04-02 | 2007-11-21 | イビデン株式会社 | Manufacturing method of multilayer printed wiring board |
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| JP2003283138A (en) * | 2002-03-22 | 2003-10-03 | Taiyo Yuden Co Ltd | Three-dimensional laminated module |
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- 2012-06-12 JP JP2012133324A patent/JP5939898B2/en not_active Expired - Fee Related
- 2012-06-20 KR KR1020120066078A patent/KR101988870B1/en active IP Right Grant
- 2012-06-20 CN CN201210204469.8A patent/CN102837501B/en not_active Expired - Fee Related
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| GB1254716A (en) * | 1967-12-01 | 1971-11-24 | Gen Electric | A method of embedding electronic components in a dielectric layer |
| GB1266968A (en) * | 1968-05-15 | 1972-03-15 | ||
| US4806195A (en) * | 1987-09-28 | 1989-02-21 | Edmond Namysl | Printed circuit board laminating machine |
| US5578159A (en) * | 1993-06-29 | 1996-11-26 | Hitachi Techno Engineering Co., Ltd. | Hot press for producing multilayer circuit board |
| US6100114A (en) * | 1998-08-10 | 2000-08-08 | International Business Machines Corporation | Encapsulation of solder bumps and solder connections |
Also Published As
| Publication number | Publication date |
|---|---|
| US8556611B2 (en) | 2013-10-15 |
| JP5939898B2 (en) | 2016-06-22 |
| JP2013001119A (en) | 2013-01-07 |
| KR101988870B1 (en) | 2019-06-14 |
| US20120328784A1 (en) | 2012-12-27 |
| KR20130012107A (en) | 2013-02-01 |
| CN102837501A (en) | 2012-12-26 |
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